CN103433588A - Improved tin soldering wire support - Google Patents
Improved tin soldering wire support Download PDFInfo
- Publication number
- CN103433588A CN103433588A CN2013103757269A CN201310375726A CN103433588A CN 103433588 A CN103433588 A CN 103433588A CN 2013103757269 A CN2013103757269 A CN 2013103757269A CN 201310375726 A CN201310375726 A CN 201310375726A CN 103433588 A CN103433588 A CN 103433588A
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- China
- Prior art keywords
- circular
- modified
- guide frame
- scolding tin
- tin soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention relates to an improved tin soldering wire support which comprises a cylindrical plastic cylinder body and circular side plates which are distributed on the two sides of the cylinder body. At least one circular baffle is arranged on the cylinder body. Grooves are formed in the two sides of the position where the cylinder body makes contact with the baffle. A plurality of circular holes used for threading tin soldering wires are formed in side plates. The improved tin soldering wire support is simple in structure, reasonable in design and capable of effectively preventing the tin soldering wires from being wound together, and the knotting phenomenon is prevented from happening.
Description
Technical field
The present invention relates to a kind of scolding tin of the modified for wrapping wire guide frame.
Background technology
Solder stick is electronics, the requisite material in electro-engineering field.For the shelf that is wound around solder stick, be all to be " work " font structure now, manufacture process is simple, in use, by solder stick around on the top of the shelf, this shelf easily makes solder stick be intertwined mutually, is difficult for separately, the knotting phenomenon even likely occurs, when sealing off, often to the user, cause puzzlement.
Summary of the invention
The objective of the invention is in order to overcome the deficiencies in the prior art, a kind of modified scolding tin guide frame is provided.
The present invention is achieved through the following technical solutions:
A kind of modified scolding tin guide frame, comprise cylindric plastic cylinder and the circular side panel that is distributed in the cylindrical shell both sides, and described cylindrical shell is provided with at least one circular baffle plate, and the both sides of described cylindrical shell and baffle plate contact position are provided with groove.
Further, on described side plate, be provided with a plurality of for wearing the circular hole of solder stick.
Further, described circular hole circumferentially is uniformly distributed along circular side panel.
Further, described circular baffle plate is identical with the diameter of circular side panel.
Further, described cylindrical shell, circular side panel and circular baffle plate are one-body molded.
Compared with prior art, the invention has the beneficial effects as follows: a kind of modified scolding tin guide frame provided by the present invention, simple in structure, reasonable in design, can effectively prevent that solder stick is intertwined, the generation of the phenomenon of avoiding tiing a knot.
The accompanying drawing explanation
The front view that Fig. 1 is a kind of modified scolding tin of the present invention guide frame;
The left view that Fig. 2 is a kind of modified scolding tin of the present invention guide frame.
The specific embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Refer to Fig. 1 and Fig. 2, the front view that Fig. 1 is a kind of modified scolding tin of the present invention guide frame; The left view that Fig. 2 is a kind of modified scolding tin of the present invention guide frame.
Described a kind of modified scolding tin guide frame, comprise cylindric plastic cylinder 1 and the circular side panel 2 that is distributed in cylindrical shell 1 both sides, described cylindrical shell 1 is provided with at least one circular baffle plate 3, described circular baffle plate 3 is identical with the diameter of circular side panel 2, and described cylindrical shell 1 is provided with groove 4 with the both sides of baffle plate 3 contact positions.
Be provided with a plurality of circular holes 5 for wearing solder stick on described side plate 2, described circular hole 5 circumferentially is uniformly distributed along circular side panel 2, after wrapping wire is complete, the solder stick head is ridden in circular hole 5, then mucilage binding simultaneously.
Described cylindrical shell 1, circular side panel 2 and circular baffle plate 3 are one-body molded, are easy to manufacture processing.
The present invention is simple in structure, reasonable in design, can effectively prevent that solder stick is intertwined, the generation of the phenomenon of avoiding tiing a knot.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (5)
1. a modified scolding tin guide frame, the circular side panel (2) that comprises cylindric plastic cylinder (1) and be distributed in cylindrical shell (1) both sides, it is characterized in that, described cylindrical shell (1) is provided with at least one circular baffle plate (3), and described cylindrical shell (1) is provided with groove (4) with the both sides of baffle plate (3) contact position.
2. a kind of modified scolding tin guide frame according to claim 1, is characterized in that, is provided with a plurality of circular holes (5) for wearing solder stick on described side plate (2).
3. a kind of modified scolding tin guide frame according to claim 2, is characterized in that, described circular hole (5) circumferentially is uniformly distributed along circular side panel (2).
4. a kind of modified scolding tin guide frame according to claim 1, is characterized in that, described circular baffle plate (3) is identical with the diameter of circular side panel (2).
5. a kind of modified scolding tin guide frame according to claim 1, is characterized in that, described cylindrical shell (1), circular side panel (2) and circular baffle plate (3) are one-body molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103757269A CN103433588A (en) | 2013-08-27 | 2013-08-27 | Improved tin soldering wire support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103757269A CN103433588A (en) | 2013-08-27 | 2013-08-27 | Improved tin soldering wire support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103433588A true CN103433588A (en) | 2013-12-11 |
Family
ID=49687352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013103757269A Pending CN103433588A (en) | 2013-08-27 | 2013-08-27 | Improved tin soldering wire support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103433588A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103787153A (en) * | 2014-02-25 | 2014-05-14 | 昆山泰威尔电子科技有限公司 | Wire tray used for storing solder wires |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09272661A (en) * | 1996-04-02 | 1997-10-21 | Sony Corp | Bobbin for bobbin solder |
| CN2626958Y (en) * | 2003-07-19 | 2004-07-21 | 江苏法尔胜新日制铁缆索有限公司 | Compound taking up and drawing drum |
| CN1733409A (en) * | 2004-08-02 | 2006-02-15 | 株式会社神户制钢所 | Welding wire reel |
| CN201634279U (en) * | 2010-03-24 | 2010-11-17 | 成都顿威新型金属材料有限公司 | Multi-winding reel lithium belt |
| JP2011136346A (en) * | 2009-12-25 | 2011-07-14 | Kobe Steel Ltd | Pressing member for pail pack, container for pail pack and welding-wire-storing pail pack |
| CN103193113A (en) * | 2013-04-26 | 2013-07-10 | 余姚市浙润电器有限公司 | Wire reel |
| CN203448826U (en) * | 2013-08-27 | 2014-02-26 | 昆山市宏嘉焊锡制造有限公司 | Improved solder wire rack |
-
2013
- 2013-08-27 CN CN2013103757269A patent/CN103433588A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09272661A (en) * | 1996-04-02 | 1997-10-21 | Sony Corp | Bobbin for bobbin solder |
| CN2626958Y (en) * | 2003-07-19 | 2004-07-21 | 江苏法尔胜新日制铁缆索有限公司 | Compound taking up and drawing drum |
| CN1733409A (en) * | 2004-08-02 | 2006-02-15 | 株式会社神户制钢所 | Welding wire reel |
| JP2011136346A (en) * | 2009-12-25 | 2011-07-14 | Kobe Steel Ltd | Pressing member for pail pack, container for pail pack and welding-wire-storing pail pack |
| CN201634279U (en) * | 2010-03-24 | 2010-11-17 | 成都顿威新型金属材料有限公司 | Multi-winding reel lithium belt |
| CN103193113A (en) * | 2013-04-26 | 2013-07-10 | 余姚市浙润电器有限公司 | Wire reel |
| CN203448826U (en) * | 2013-08-27 | 2014-02-26 | 昆山市宏嘉焊锡制造有限公司 | Improved solder wire rack |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103787153A (en) * | 2014-02-25 | 2014-05-14 | 昆山泰威尔电子科技有限公司 | Wire tray used for storing solder wires |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131211 |