CN103426978B - Led芯片的制造方法 - Google Patents
Led芯片的制造方法 Download PDFInfo
- Publication number
- CN103426978B CN103426978B CN201210153362.5A CN201210153362A CN103426978B CN 103426978 B CN103426978 B CN 103426978B CN 201210153362 A CN201210153362 A CN 201210153362A CN 103426978 B CN103426978 B CN 103426978B
- Authority
- CN
- China
- Prior art keywords
- semiconductor layer
- ray structure
- layer
- photoresistance
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 230000004888 barrier function Effects 0.000 claims abstract description 32
- 239000004065 semiconductor Substances 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 238000000407 epitaxy Methods 0.000 claims abstract description 15
- 238000005137 deposition process Methods 0.000 claims description 3
- 238000004062 sedimentation Methods 0.000 claims 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910002601 GaN Inorganic materials 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000004134 energy conservation Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000007792 gaseous phase Substances 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N hydrofluoric acid Substances F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- GRPQBOKWXNIQMF-UHFFFAOYSA-N indium(3+) oxygen(2-) tin(4+) Chemical class [Sn+4].[O-2].[In+3] GRPQBOKWXNIQMF-UHFFFAOYSA-N 0.000 description 1
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Abstract
Description
10 | 基板 |
20 | 缓冲层 |
31 | 第一N型层 |
32 | 第二N型层 |
40 | 发光层 |
50 | P型层 |
60 | 导电层 |
71、72 | 电极 |
80 | 阻挡层 |
81 | 磊晶区域 |
90 | 光阻 |
100 | LED芯片 |
200 | 发光结构 |
Claims (3)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210153362.5A CN103426978B (zh) | 2012-05-17 | 2012-05-17 | Led芯片的制造方法 |
TW101119370A TWI497756B (zh) | 2012-05-17 | 2012-05-30 | Led晶片製造方法 |
US13/875,294 US20130309795A1 (en) | 2012-05-17 | 2013-05-02 | Method for manufacturing led chip with inclined side surface |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210153362.5A CN103426978B (zh) | 2012-05-17 | 2012-05-17 | Led芯片的制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103426978A CN103426978A (zh) | 2013-12-04 |
CN103426978B true CN103426978B (zh) | 2016-09-07 |
Family
ID=49581628
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210153362.5A Expired - Fee Related CN103426978B (zh) | 2012-05-17 | 2012-05-17 | Led芯片的制造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20130309795A1 (zh) |
CN (1) | CN103426978B (zh) |
TW (1) | TWI497756B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB201418810D0 (en) * | 2014-10-22 | 2014-12-03 | Infiniled Ltd | Display |
WO2022077254A1 (zh) * | 2020-10-14 | 2022-04-21 | 苏州晶湛半导体有限公司 | 微型led结构的制作方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4536421A (en) * | 1980-08-01 | 1985-08-20 | Hitachi, Ltd. | Method of forming a microscopic pattern |
CN102054912A (zh) * | 2009-11-04 | 2011-05-11 | 大连路美芯片科技有限公司 | 一种发光二极管及其制造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007324572A (ja) * | 2006-05-02 | 2007-12-13 | Sumitomo Electric Ind Ltd | 受光素子アレイ、その製造方法、および光計測システム |
JP4660453B2 (ja) * | 2006-11-13 | 2011-03-30 | 昭和電工株式会社 | 窒化ガリウム系化合物半導体発光素子 |
US8101447B2 (en) * | 2007-12-20 | 2012-01-24 | Tekcore Co., Ltd. | Light emitting diode element and method for fabricating the same |
JP5679869B2 (ja) * | 2011-03-07 | 2015-03-04 | スタンレー電気株式会社 | 光半導体素子の製造方法 |
WO2013077952A1 (en) * | 2011-11-23 | 2013-05-30 | Applied Materials, Inc. | Apparatus and methods for silicon oxide cvd photoresist planarization |
-
2012
- 2012-05-17 CN CN201210153362.5A patent/CN103426978B/zh not_active Expired - Fee Related
- 2012-05-30 TW TW101119370A patent/TWI497756B/zh not_active IP Right Cessation
-
2013
- 2013-05-02 US US13/875,294 patent/US20130309795A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4536421A (en) * | 1980-08-01 | 1985-08-20 | Hitachi, Ltd. | Method of forming a microscopic pattern |
CN102054912A (zh) * | 2009-11-04 | 2011-05-11 | 大连路美芯片科技有限公司 | 一种发光二极管及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI497756B (zh) | 2015-08-21 |
US20130309795A1 (en) | 2013-11-21 |
TW201349557A (zh) | 2013-12-01 |
CN103426978A (zh) | 2013-12-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20151207 Address after: 201424 Shanghai city Fengxian District Tuo Village barracks Lin Zhen No. 598 building ninth room 111 Applicant after: Shanghai Lirui Network Technology Co.,Ltd. Address before: 518109 Guangdong province Shenzhen city Longhua District Dragon Road No. 83 wing group building 11 floor Applicant before: SCIENBIZIP CONSULTING (SHEN ZHEN) Co.,Ltd. Effective date of registration: 20151207 Address after: 518109 Guangdong province Shenzhen city Longhua District Dragon Road No. 83 wing group building 11 floor Applicant after: SCIENBIZIP CONSULTING (SHEN ZHEN) Co.,Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Street tabulaeformis Industrial Zone tenth east two Ring Road No. two Applicant before: ZHANJING Technology (Shenzhen) Co.,Ltd. Applicant before: Advanced Optoelectronic Technology Inc. |
|
C41 | Transfer of patent application or patent right or utility model | ||
CB03 | Change of inventor or designer information |
Inventor after: Xi Fei Inventor after: Wang Yanyan Inventor before: Shen Jiahui Inventor before: Hong Zijian |
|
COR | Change of bibliographic data | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20160720 Address after: 1, 328A, room 98, 225300 East Spring Road, hailing Industrial Park, Jiangsu, Taizhou Applicant after: Taizhou Changrui Lighting Co.,Ltd. Address before: 201424 Shanghai city Fengxian District Tuo Village barracks Lin Zhen No. 598 building ninth room 111 Applicant before: Shanghai Lirui Network Technology Co.,Ltd. |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160907 Termination date: 20190517 |