CN103426868B - A kind of encapsulating structure and method for packing thereof - Google Patents

A kind of encapsulating structure and method for packing thereof Download PDF

Info

Publication number
CN103426868B
CN103426868B CN201210156082.XA CN201210156082A CN103426868B CN 103426868 B CN103426868 B CN 103426868B CN 201210156082 A CN201210156082 A CN 201210156082A CN 103426868 B CN103426868 B CN 103426868B
Authority
CN
China
Prior art keywords
metal
substrate
wound wire
groove hole
surrounds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201210156082.XA
Other languages
Chinese (zh)
Other versions
CN103426868A (en
Inventor
李冠华
江京
彭勤卫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sky Chip Interconnection Technology Co Ltd
Original Assignee
Shennan Circuit Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shennan Circuit Co Ltd filed Critical Shennan Circuit Co Ltd
Priority to CN201210156082.XA priority Critical patent/CN103426868B/en
Publication of CN103426868A publication Critical patent/CN103426868A/en
Application granted granted Critical
Publication of CN103426868B publication Critical patent/CN103426868B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Coils Or Transformers For Communication (AREA)

Abstract

The embodiment of the invention discloses a kind of encapsulating structure and method for packing, by directly inductance being integrated in the process within substrate to save encapsulated space, thus improve the effect of level of integrated system and encapsulation.Embodiment of the present invention encapsulating structure includes: substrate；It is provided with the first metal on described substrate and surrounds structure, and the second metal surrounds structure；Described first metal is surrounded structure and is connected by the connecting hole on substrate, to form spiral winding with described second metal encirclement structure.The embodiment of the present invention can be effectively improved the effect of level of integrated system and encapsulation.

Description

A kind of encapsulating structure and method for packing thereof
Technical field
The present invention relates to mechanical encapsulation field, particularly relate to a kind of encapsulating structure and method for packing.
Background technology
System in package (SiP, System in Package) be a kind of by multiple electronic component (such as micro-place Reason device, memorizer, MEMS, optics, passive electronic component etc.) it is integrated in when encapsulation System structure dress mode together.
Along with user is more and more higher to the requirement of electronic component integration degree, SiP technology have also been obtained widely should With, in prior art, when system in package needs some passive electronic component integrated, can by this first The passive electronic component made is welded on substrate (substrate) by the way of surface patch (SMT), An entirety it is packaged into the most again with other device.
Such as, when system needs integrated inductor, can directly according to the demand of user, inductance value be fixed Inductance is inserted in substrate and is packaged.
But, the size range that sometimes inductance can bear beyond packaging body, or user is in reality May require that during use and use different inductance values, to this end, in the SiP mode of prior art, often need It is forced to increase package body sizes, or encapsulates the different inductance of multiple inductance value to meet the demand of user, But so but can take substantial amounts of space, have impact on the effect of level of integrated system and encapsulation.
Summary of the invention
Embodiments provide a kind of encapsulating structure and method for packing thereof, it is possible to save encapsulated space, Thus improve the effect of level of integrated system and encapsulation.
The encapsulating structure that the embodiment of the present invention provides, including substrate；
It is provided with the first metal on described substrate and surrounds structure and the second metal encirclement structure；
Described first metal surrounds structure and described second metal surrounds structure by the connecting hole phase on substrate Connect, to form spiral winding.
Alternatively, described substrate is further opened with groove hole；
Described first metal surrounds structure and is positioned at the top in described groove hole, and described second metal surrounds structure position In the bottom that described groove is cheated；
Described spiral winding is formed at described groove and cheats around.
Alternatively, described second metal encirclement structure includes some metal wound wire and several metallic bonds Conjunction portion；
Described metal wound wire is layed in bottom described groove hole；
Described metal bonding portion is cheated from described groove by the connecting hole on described substrate by described metal wound wire Side extends to the surface of described substrate and is formed, and described metal bonding part is distributed in the two of surface, described groove hole Side；
Described first metal surrounds structure and includes some metal lead wires；
The metal bonding portion of the both sides on surface, described groove hole is connected by described metal lead wire so that connected Path is formed between any two metal bonding portion.
Alternatively, the metal wound wire laid bottom described groove hole belongs to same spiral winding；
The two ends of described every metal wound wire respectively from two sides that described groove is cheated to the surface of described substrate Extend, form symmetrical two metal bonding portion with the both sides on surface, described groove hole.
Alternatively, the metal wound wire laid bottom described groove hole belongs to different spiral windings；
The two ends of described every metal wound wire respectively from two sides that described groove is cheated to the surface of described substrate Extend, form symmetrical two metal bonding portion with the both sides on surface, described groove hole.
Alternatively, the two ends of described every metal wound wire respectively from two sides that described groove is cheated to described base The surface of plate extends, and forms 2N symmetrical metal bonding portion with the both sides on surface, described groove hole, Described N is the positive integer more than 1；
The N number of metal bonding part being positioned at the same side, surface, described groove hole is distributed in same surface, or divides respectively It is distributed in different step surfaces.
Alternatively, described substrate comprises the first ink layer, the second ink layer, first line layer, the second line Road floor and core layer；
Described groove hole is positioned at described core layer, and described core layer is insulating barrier；
Described metal wound wire is positioned at the second line layer bottom described core layer, and described metal bonding portion is positioned at The first line layer at described core layer top；
The through described core layer of described connecting hole is to connect described metal wound wire and metal bonding portion；
The surface-coated of described first line layer has the first ink layer, the surface-coated of described second line layer There is the second ink layer.
Alternatively, described first metal encirclement structure includes some metal wound wire and several metallic bonds Conjunction portion；
Described metal wound wire is layed in top, described groove hole；
Described metal bonding portion is cheated from described groove by the connecting hole on described substrate by described metal wound wire Side extends to the surface of described substrate and is formed, and described metal bonding part is distributed in the two of surface, described groove hole Side；
Described second metal surrounds structure and includes some metal lead wires；
The metal bonding portion of the both sides on surface, described groove hole is connected by described metal lead wire so that connected Path is formed between any two metal bonding portion.
Alternatively, described first metal encirclement structure includes upper surface metal wound wire, upper surface metal bonding Portion and upper surface metal lead wire；
Described upper surface metal wound wire is layed in the side in described groove hole；
Described upper surface metal bonding portion is passed through the connecting hole on described substrate by described upper surface metal wound wire Extending to the upper surface of described substrate and formed, described upper surface metal bonding part is distributed in table on described substrate The both sides in face；
The upper surface metal bonding portion of the both sides of described upper surface of base plate is by described upper surface metal lead wire even Connect；
Described second metal surround structure include lower surface metal coiling, lower surface metal bonding part and under Surface metal goes between；
Described lower surface metal coiling is layed in the side in described groove hole；
Described lower surface metal bonding part is passed through the connecting hole on described substrate by described lower surface metal coiling Extending to the lower surface of described substrate and formed, described lower surface metal bonded portion is distributed in described substrate following table The both sides in face；
The lower surface metal bonding part of the both sides of described base lower surface is by described lower surface metal lead-in wire even Connect.
Alternatively, described first metal encirclement structure includes first group of metal wound wire；
Described first group of metal wound wire is layed in top, described groove hole, and surrounds described groove hole from the first half；
Described second metal surrounds structure and includes second group of metal wound wire；
Described second group of metal wound wire is layed in bottom described groove hole, and surrounds described groove hole from lower half；
Described first group of metal wound wire and second group of metal wound wire are suitable so that first group of metal wound wire and Around described groove hole, spiral winding is formed when second group of metal wound wire connects.
Alternatively, described first group of metal wound wire and second group of metal wound wire form same spiral when connecting Coil, or form at least two spiral winding.
Alternatively, described first metal surrounds structure and the most also includes the 3rd group of metal wound wire, and the described 3rd Group metal wound wire is positioned at different line layers from described first group of metal wound wire；
Described 3rd group of metal wound wire is layed in top, described groove hole, and surrounds described groove hole from the first half；
Described second metal surround structure the most also include the 4th group of metal wound wire, described 4th group of metal around Line is positioned at different line layers from described second group of metal wound wire；
Described 4th group of metal wound wire is layed in bottom described groove hole, and surrounds described groove hole from lower half；
Described 3rd group of metal wound wire and the 4th group of metal wound wire are suitable so that the 3rd group of metal wound wire and Around described groove hole, another spiral winding is formed when 4th group of metal wound wire connects.
Alternatively, described substrate comprises the first ink layer, the second ink layer, first line layer, the second line Road floor, core layer and packed layer；
Described groove hole is positioned at described core layer, and described core layer is insulating barrier；
Described packed layer is positioned at top, described groove hole, and described packed layer is insulating barrier；
Described first group of metal wound wire is positioned at the first line layer at described core layer top, described second group of gold Belong to coiling and be positioned at the second line layer bottom described core layer；
The through described core layer of described connecting hole is to connect described first group of metal wound wire and second group of metal Coiling；
The surface-coated of described first line layer has the first ink layer, the surface-coated of described second line layer There is the second ink layer.
Alternatively, described substrate surface is provided with electrically connect with described spiral winding some and is connected metal Portion.
Alternatively, described encapsulating structure also includes:
The control equipment being arranged on described substrate；
Described control equipment is connected with described metallic connection parts, in order to control the electricity of described spiral winding output Sensibility reciprocal.
Alternatively, described encapsulating structure also includes:
It is positioned at the inductance core body in described groove hole.
The method for packing that inventive embodiments provides, including:
Process substrate on substrate, form connecting hole；
First metal is set on the substrate and surrounds structure and the second metal encirclement structure；
Make described first metal surround structure and described second metal surrounds structure by described substrate Connecting hole is connected, to form spiral winding；
Other device on described substrate and substrate is completely or partially encapsulated and obtains packaging body.
Alternatively, described method for packing also includes:
Process described substrate on substrate, form groove hole；
Described first metal that arranges on the substrate surrounds structure and the second metal and surrounds structure and include:
Second metal is set bottom described groove hole and surrounds structure, and the first gold medal is set at top, described groove hole Belong to and surround structure；
Described spiral winding is formed at described groove and cheats around.
Alternatively, described second metal encirclement structure includes some metal wound wire and several metallic bonds Conjunction portion, described first metal surrounds structure and includes some metal lead wires；
Described second metal that arranges bottom described groove hole surrounds structure, and arranges the at top, described groove hole One metal surrounds structure and includes:
Bottom described groove hole, lay some metal wound wire, and make described metal wound wire by substrate Connecting hole from the side that described groove is cheated to the surface of described substrate extend formed several metal bonding portions, Described metal bonding part is distributed in the both sides on surface, described groove hole；
Metal lead wire is used to connect the metal bonding portion that described groove cheats the both sides on surface, to form spiral winding, Make to be formed between any two metal bonding portion being connected path.
Alternatively, described first metal encirclement structure includes some metal wound wire and several metallic bonds Conjunction portion, described second metal surrounds structure and includes some metal lead wires；
Described second metal that arranges bottom described groove hole surrounds structure, and arranges the at top, described groove hole One metal surrounds structure and includes:
Lay some metal wound wire at top, described groove hole, and make described metal wound wire by substrate Connecting hole from the side that described groove is cheated to the surface of described substrate extend formed several metal bonding portions, Described metal bonding part is distributed in the both sides on surface, described groove hole；
Metal lead wire is used to connect the metal bonding portion that described groove cheats the both sides on surface, to form spiral winding, Make to be formed between any two metal bonding portion being connected path.
Alternatively, described first metal encirclement structure includes upper surface metal wound wire, upper surface metal bonding Portion and upper surface metal lead wire, described second metal surrounds structure and includes lower surface metal coiling, following table Metal bonding portion, face and lower surface metal lead-in wire；
Described second metal that arranges bottom described groove hole surrounds structure, and arranges the at top, described groove hole One metal surrounds structure and includes:
Lay described upper surface metal wound wire in side that described groove is cheated, and make described upper surface metal around Line extends the described upper surface metallic bond of formation by the connecting hole on described substrate to the upper surface of described substrate Conjunction portion, described upper surface metal bonding part is distributed in the both sides of described upper surface of base plate；
Use the upper surface metal bonding of the both sides of the described upper surface metal lead wire described upper surface of base plate of connection Portion；
Lay described lower surface metal coiling in side that described groove is cheated, and make described lower surface metal around Line extends the described lower surface metal key of formation by the connecting hole on described substrate to the lower surface of described substrate Conjunction portion, described lower surface metal bonded portion is distributed in the both sides of described base lower surface；
Use the lower surface metal bonding of the both sides of the described lower surface metal lead-in wire described base lower surface of connection Portion.
Alternatively, described first metal encirclement structure includes first group of metal wound wire, described second metal bag Closed structure includes second group of metal wound wire；
Described second metal that arranges bottom described groove hole surrounds structure, and arranges the at top, described groove hole One metal surrounds structure and includes:
Described groove hole top lay described first group of metal wound wire so that described first group of metal wound wire from The first half surrounds described groove hole, and lays described second group of metal wound wire bottom described groove hole so that institute State second group of metal wound wire and surround described groove hole from lower half；
Described first group of metal wound wire and second group of metal wound wire are suitable so that first group of metal wound wire and Around described groove hole, spiral winding is formed when second group of metal wound wire connects.
Alternatively, described method also includes:
Described substrate surface arrange electrically connect with described spiral winding some to metallic connection parts.
Alternatively, described method also includes:
Control equipment is set on the substrate, and described control equipment is connected with described metallic connection parts, Described control equipment is made to control the inductance value of described spiral winding output.
Alternatively, described method also includes:
Inductance core body is fixed in described groove hole.
As can be seen from the above technical solutions, the embodiment of the present invention has the advantage that
In the embodiment of the present invention, substrate is provided with the first metal and surrounds structure and the second metal encirclement knot Structure, and described first metal surrounds structure and described second metal surrounds structure by the connecting hole on substrate It is connected, to form spiral winding, thus realizes the function of inductance.
After forming spiral winding, user just can determine the spiral winding connecting into circuit according to the actual requirements Length with obtain meet require inductance value, owing to the embodiment of the present invention can meet the multiple electricity of user Sensibility reciprocal demand, therefore, it is possible to save encapsulated space, thus improves the effect of level of integrated system and encapsulation.
Accompanying drawing explanation
Fig. 1 is encapsulating structure first embodiment schematic diagram of the present invention；
Fig. 2 is encapsulating structure of the present invention second embodiment schematic diagram；
Fig. 3 is encapsulating structure the 3rd embodiment schematic diagram of the present invention；
Fig. 4 is encapsulating structure the 4th embodiment schematic diagram of the present invention；
Fig. 5 is encapsulating structure the 5th embodiment schematic diagram of the present invention；
Fig. 6 is encapsulating structure sixth embodiment schematic diagram of the present invention；
Fig. 7 is encapsulating structure the 7th embodiment schematic diagram of the present invention；
Fig. 8 is encapsulating structure the 7th embodiment packaging effect schematic diagram of the present invention；
Fig. 9 is encapsulating structure the 8th embodiment schematic diagram of the present invention；
Figure 10 is encapsulating structure the 9th embodiment schematic diagram of the present invention；
Figure 11 is that encapsulating structure the 9th of the present invention implements packaging effect illustration intention；
Figure 12 is one embodiment schematic diagram of method for packing of the present invention；
Figure 13 is another embodiment schematic diagram of method for packing of the present invention；
Figure 14 is encapsulation process first stage schematic diagram of the present invention；
Figure 15 is encapsulation process second stage schematic diagram of the present invention；
Figure 16 is the first application scenarios schematic diagram of encapsulating structure of the present invention；
Figure 17 is the second application scenarios schematic diagram of encapsulating structure of the present invention；
Figure 18 is the 3rd application scenarios schematic diagram of encapsulating structure of the present invention；
Figure 19 is the 4th application scenarios schematic diagram of encapsulating structure of the present invention.
Detailed description of the invention
Embodiments provide a kind of encapsulating structure and method for packing thereof, it is possible to encapsulation parameter is variable Passive electronic component, saves encapsulated space, improves level of integrated system and the effect of encapsulation.
Encapsulating structure in the present embodiment can include substrate；
It is provided with the first metal on described substrate and surrounds structure and the second metal encirclement structure；
Described first metal surrounds structure and described second metal surrounds structure by the connecting hole phase on substrate Connect, to form spiral winding, thus realize the function of inductance.
In the present embodiment, substrate can be provided with the groove hole for accommodating inductance core body, it is also possible to do not set Put groove hole.
When being not provided with groove hole, described first metal surrounds structure and the second metal surrounds structure position respectively Top and bottom in described substrate.
When arrange groove hole time, first metal surround structure may be located at described groove hole top, described second Metal surrounds structure and may be located at the bottom in described groove hole.
In actual applications, can determine the need for according to demand offering groove hole, so that it is determined that the first gold medal Belong to the position relationship surrounded between structure and the second metal encirclement structure.
In actual applications, the first metal surrounds specific implementation and the second metal encirclement knot of structure The specific implementation of structure can have multiple, illustrates with two examples below:
One, the first metal surrounds structure is substrate external link structure, in the second metal encirclement structure is substrate Attachment structure.
In the manner, the second metal surrounds structure and surrounds the lower half metal that groove hole is formed is at base Realize by the way of laying metal wound wire in plate, and the first metal surrounds what groove hole was formed by structure It is to realize by the way of metal lead wire is bonded at substrate surface that first half metal surrounds.
Concrete, the second metal surrounds structure can include some metal wound wire and several metallic bonds Conjunction portion；Described metal wound wire is layed in bottom described groove hole；Described metal bonding portion is by described metal wound wire Formed from the side that described groove is cheated to the extension of the surface of described substrate by the connecting hole on described substrate, institute State metal bonding part and be distributed in the both sides on surface, described groove hole；
Accordingly, the first metal encirclement structure can include some metal lead wires；Surface, described groove hole The metal bonding portion of both sides is connected by described metal lead wire so that connected any two metal bonding portion Between formed path.
It is described in detail below in conjunction with the accompanying drawings, refers to Fig. 1, encapsulating structure first embodiment bag of the present invention Include:
Substrate 101；
Groove hole 102 is offered on described substrate 101；
Being equipped with some metal wound wire 104 bottom described groove hole 102, described metal wound wire 104 passes through base If the connecting hole on plate 101 extends to the surface of described substrate 101 from the side in described groove hole 102 and is formed Dry metal bonding portion 105, described metal bonding portion 105 is distributed in described groove and cheats the both sides on 102 surfaces；
Described groove is cheated the metal bonding portion 105 of the both sides on 102 surfaces and is connected by metal lead wire 106, with shape Become spiral winding so that between connected any two metal bonding portion 105, form path.
It should be noted that in order to improve inductance value, the encapsulating structure in the present embodiment can also include electricity Sense core body 103, this inductance core body 103 can be arranged in groove hole 102, it is to be understood that in reality In application, it is also possible to be not provided with inductance core body 103, do not limit.
In order to form the spiral winding of inductance, when using metal lead wire to connect metal bonding portion, metal draws Line can misplace connection, or metal wound wire can shift to install, and accordingly, metal wound wire 104 then may be used To use multiple arrangement mode, indicating one therein in Fig. 1, every metal wound wire can be near Seemingly it is perpendicular to described inductance core body 103, it is to be understood that in actual applications, it is also possible to have other Arrangement mode, such as, refer to Fig. 2, and the embodiment shown in Fig. 2 is encapsulating structure the second embodiment of the present invention, Compared to the first embodiment shown in Fig. 1, the arrangement mode and the metal that differ only in metal wound wire draw The connected mode of line is different.
In the scheme that above-mentioned Fig. 1 and Fig. 2 describes, metal wound wire and metal lead wire are single line coiling knot Structure, say, that the coil that whole metal wound wire and metal lead wire are formed is same section of coil, In this winding structure, the metal wound wire laid bottom groove hole belongs to same spiral winding；Then every The two ends of metal wound wire extend from two sides that described groove is cheated to the surface of described substrate respectively, with in institute The both sides stating surface, groove hole form symmetrical two metal bonding portion.
It is understood that in actual applications, in addition to single line winding structure, it is also possible to have multi-thread And around structure, or multilayer winding structure, it is concrete,
When metal wound wire and metal lead wire are parallel winding of multiple coils structures, referring to Fig. 3, Fig. 3 is that the present invention seals Assembling structure the 3rd embodiment:
The metal wound wire laid bottom groove hole belongs to different spiral windings, then when belonging to different spiral winding The two ends of metal wound wire when extending to the surface of described substrate from two sides that described groove is cheated respectively, shape The metal bonding portion become falls within different spiral windings, i.e. as shown in Figure 3 metal bonding portion 301 And metal bonding portion 302 is belonging respectively to different spiral windings, thus make groove hole around actual around There are two sections of different coils, it is to be understood that the most only illustrate as a example by two sections, should in reality Can also is that more multistage in, do not limit.
When metal wound wire and metal lead wire are multilayer winding structure, referring to Fig. 4 and Fig. 5, Fig. 4 is Encapsulating structure the 4th embodiment of the present invention, Fig. 5 is encapsulating structure the 5th embodiment of the present invention:
In the manner, the two ends of every metal wound wire respectively from two sides that described groove is cheated to described substrate Surface extend, with described groove hole surface both sides form 2N symmetrical metal bonding portion, institute Stating N is the positive integer more than 1, say, that N number of gold can be extended in one end of every metal wound wire Belong to bonding part, thus realize multilayer winding.
It should be noted that the N number of metal bonding portion being positioned at the same side, surface, groove hole can be distributed in same In surface, such as embodiment illustrated in fig. 4, N is 2, and i.e. every metal wound wire extends 4 metal bondings Portion, i.e. metal bonding portion 401, metal bonding portion 402, metal bonding portion 403 and metal bonding portion 404, Every 2 metal bonding portions are positioned at the same side, surface, groove hole, and are generally aligned in the same plane.
It is understood that the N number of metal bonding portion being positioned at the same side, surface, groove hole can also be distributed in not Same step surface, such as in embodiment illustrated in fig. 5, N is 2, and i.e. every metal wound wire extends 4 gold Belong to bonding part, i.e. metal bonding portion 501, metal bonding portion 502, metal bonding portion 503 and metallic bond Conjunction portion 504, wherein, metal bonding portion 501 and metal bonding portion 502 are positioned at the same side, surface, groove hole, Metal bonding portion 503 and metal bonding portion 504 are positioned at the same side, surface, groove hole, and metal bonding portion 501 And metal bonding portion 502 is positioned at different step surfaces, metal bonding portion 503 and metal bonding portion 504 It is positioned at different step surfaces.
The present embodiment is only to illustrate as a example by 2 by N, it is to be understood that in actual applications, N can also be other numerical value, such as 3,4,5 etc., and the most every metal wound wire extends 6 Individual, 8,10 metal bonding portions, concrete structure is similar to, and here is omitted.
For ease of understanding, with an instantiation, encapsulating structure of the present invention is described in detail below, please join Readding Fig. 6, encapsulating structure sixth embodiment of the present invention includes:
Substrate 601 and inductance core body 602；
The groove hole 603 for accommodating described inductance core body 602 is offered on described substrate 601；
Being equipped with some metal wound wire 604 bottom described groove hole 603, described metal wound wire 604 passes through base Connecting hole 605 on plate 601 extends shape from the side in described groove hole 603 to the surface of described substrate 601 Several metal bonding portions 606, described metal bonding portion 606 is become to be distributed in described groove and cheat the two of 603 surfaces Side.
In the present embodiment, the two ends of every metal wound wire 604 can be respectively from two of described groove hole 603 Side extends to the surface of described substrate 601, forms symmetrical point cheating the both sides on 603 surfaces at described groove Two metal bonding portions 606 of cloth.
Groove hole 603 in the present embodiment can fire by described substrate 601 is carried out laser or etch Obtain, it is to be understood that can also obtain in other way, not limit.
Inductance core body 602 in the present embodiment can be magnetic core or ferrite, or the core of other materials Body, this inductance core body 602 can use the non-conductive adhesives (example of wafer attachment (Die Attach) Such as glue or film etc.) implant, to be fixed in described groove hole 603, or can also be in other way It is fixed in described groove hole 603, does not limits.
Above-mentioned set-up mode makes metal wound wire 604 can surround described groove hole from bottom surface and two sides 603, i.e. form the lower half metal to the inductance core body 602 in groove hole 603 and surround structure, in order to obtain The spiral winding of inductance, in addition it is also necessary to arrange metal lead wire on described substrate 601, cheats 603 to be formed to groove In inductance core body 602 first half metal surround structure, concrete:
Described groove is cheated the metal bonding portion 606 of the both sides on 603 surfaces and can be carried out by metal lead wire 610 Connect, to form spiral winding so that between connected any two metal bonding portion, form path.
Substrate in the present embodiment can be substrate or the multilayer line layer of Double-side line layer in actual applications Substrate, concrete, the structure of the substrate of this Double-side line layer may include that
First ink layer 607a, the second ink layer 607b, first line layer 608a, the second line layer 608b And core layer 609, described core layer 609 is insulating barrier；
Described groove hole 603 is positioned at described core layer 609；
Described metal wound wire 604 is positioned at the second line layer 608b bottom described core layer 609, described gold Belong to bonding part 606 and be positioned at the first line layer 608a at described core layer 609 top；
The through described core layer 609 of described connecting hole 605 is to connect described metal wound wire 604 and metal Bonding part 606；
The surface-coated of described first line layer 608a has the first ink layer 607a, described second line layer The surface-coated of 608b has the second ink layer 607b.
It should be noted that chip or equipment automatically control the inductance value of inductance for convenience, it is also possible to It is provided with some to metallic connection parts, then with what described metal bonding portion 606 was connected on described substrate 601 Control equipment can electrically connect with this metallic connection parts, to realize the electrical connection with spiral winding, then this control Control equipment can control the length of used spiral winding, thus controls the electricity of described spiral winding output Sensibility reciprocal.
In the present embodiment, it is equipped with some gold for accommodating the bottom in the groove hole 603 of inductance core body 602 Belong to coiling 604, and metal wound wire 604 cheats the side of 603 by the connecting hole 605 on substrate 601 from groove Extend several metal bonding portions 606 of formation to the surface of substrate 601 and cheat 603 to surround groove, so working as groove When the metal bonding portion 606 of the both sides cheating 603 surfaces is electrically connected, then can form spiral winding, from And realize the function of inductance.
And metal bonding portion 606 has multiple, when connecting different metal bonding portions 606, the gold of conducting The length belonging to coiling 604 is also the most different, and inductance value is also the most different, and user can connect difference with actual demand Metal bonding portion 606 with obtain meet require inductance value, owing to the embodiment of the present invention can meet use The multiple inductance value demand at family, therefore, it is possible to save encapsulated space, thus improves level of integrated system and encapsulation Effect.
Two, the first metal surrounds structure is substrate interconnection structure, and it is outside substrate that the second metal surrounds structure Attachment structure.
In the manner, the first metal surrounds structure and surrounds the first half metal that groove hole is formed is at base Realize by the way of laying metal wound wire in plate, and the second metal surrounds what groove hole was formed by structure It is to realize by the way of metal lead wire is bonded at substrate surface that lower half metal surrounds.
Concrete, the first metal surrounds structure and includes some metal wound wire and several metal bonding portions； Described metal wound wire is layed in top, described groove hole；Described metal bonding portion is passed through institute by described metal wound wire State the connecting hole on substrate and extend formation, described metal from the side that described groove is cheated to the surface of described substrate Bonded portion is distributed in the both sides on surface, described groove hole；
Accordingly, the second metal encirclement structure includes some metal lead wires；The both sides on surface, described groove hole Metal bonding portion connected by described metal lead wire so that between connected any two metal bonding portion Form path.
Three, the first metal surrounds structure is substrate external link structure, and it is outside substrate that the second metal surrounds structure Attachment structure.
In the manner, the first metal surrounds structure and surrounds the first half metal that groove hole is formed is at base Plate surface realizes by the way of metal lead wire is bonded, and the second metal surrounds structure and formed groove hole Lower half metal to surround also be to realize by the way of metal lead wire is bonded at substrate surface.
Concrete, the first metal surround structure include upper surface metal wound wire, upper surface metal bonding portion with And upper surface metal lead wire；Described upper surface metal wound wire is layed in the side in described groove hole；Described upper table Metal bonding portion, face is passed through the connecting hole on described substrate to described substrate by described upper surface metal wound wire Upper surface extends and is formed, and described upper surface metal bonding part is distributed in the both sides of described upper surface of base plate；Institute The upper surface metal bonding portion of the both sides stating upper surface of base plate is connected by described upper surface metal lead wire；
Accordingly, second metal surround structure include lower surface metal coiling, lower surface metal bonding part with And lower surface metal lead-in wire；Described lower surface metal coiling is layed in the side in described groove hole；Described following table Metal bonding portion, face is passed through the connecting hole on described substrate to described substrate by described lower surface metal coiling Lower surface extends and is formed, and described lower surface metal bonded portion is distributed in the both sides of described base lower surface；Institute The lower surface metal bonding part of the both sides stating base lower surface is connected by described lower surface metal lead-in wire.
Four, the first metal surrounds structure is substrate interconnection structure, in the second metal encirclement structure is substrate Attachment structure.
In the manner, the second metal surrounds structure and surrounds the lower half metal that groove hole is formed is at base Realize by the way of laying metal wound wire in plate, and the first metal surrounds what groove hole was formed by structure It is also realizing by laying by the way of metal wound wire in substrate that first half metal surrounds.
Concrete, the first metal surrounds structure and includes first group of metal wound wire；
Described first group of metal wound wire is layed in top, described groove hole, and surrounds described groove hole from the first half；
Accordingly, the second metal encirclement structure includes second group of metal wound wire；
Described second group of metal wound wire is layed in bottom described groove hole, and surrounds described groove hole from lower half；
Described first group of metal wound wire and second group of metal wound wire are suitable so that first group of metal wound wire and Around described groove hole, spiral winding is formed when second group of metal wound wire connects.
It is described in detail below in conjunction with the accompanying drawings, refers to Fig. 7, encapsulating structure the 7th embodiment bag of the present invention Include:
Substrate 701；
Groove hole 702 is offered on described substrate 701；
Described groove is cheated 702 tops and is equipped with first group of metal wound wire 703, described first group of metal wound wire 703 Described groove hole 702 is surrounded from the first half；
It is equipped with second group of metal wound wire 704, described second group of metal wound wire 704 bottom described groove hole 702 Described groove hole 702 is surrounded from lower half；
Described first group of metal wound wire 703 and second group of metal wound wire 704 are suitable so that first group of gold In institute when genus coiling 703 and second group of metal wound wire 704 are connected by the connecting hole 705 on substrate 701 State groove and cheat 702 surroundings formation spiral windings.
Can also include inductance core body to improve inductance value in the present embodiment, this inductance core body can be Magnetic core or ferrite, or the core body of other materials, this inductance core body can use wafer to mount (Die Attach) non-conductive adhesives (such as glue or film etc.) is implanted, to be fixed on described groove hole 702 In, or can also be fixed in other way in described groove hole 702, do not limit.
It should be noted that this substrate 701 can be the substrate of Double-side line layer or many in actual applications The substrate of sandwich circuit layer, concrete, the structure of the substrate of this Double-side line layer may include that
First ink layer 706a, the second ink layer 706b, first line layer 707a, the second line layer 707b, Core layer 708 and packed layer 709；
Described groove hole 702 is positioned at described core layer 708, and described core layer 708 is insulating barrier；
Described packed layer 709 is positioned at described groove and cheats 702 tops, and described packed layer 709 is insulating barrier；
Described first group of metal wound wire 703 is positioned at the first line layer 707a at described core layer 708 top, Described second group of metal wound wire 704 is positioned at the second line layer 707b bottom described core layer 708；
The through described core layer 708 of described connecting hole 705 with connect described first group of metal wound wire 703 with And second group of metal wound wire 704；
The surface-coated of described first line layer 707a has the first ink layer 706a, described second line layer The surface-coated of 707b has the second ink layer 706b.
In the present embodiment the concrete encapsulating structure formed can as shown in Figure 8, it should be noted that in order to Chip or equipment is facilitated to automatically control the inductance value of inductance, it is also possible to be provided with on the substrate and spiral It is some to metallic connection parts 801 that coil electrically connects, then controlling equipment can be with this metallic connection parts 801 electricity Connecting, to realize the electrical connection with spiral winding, then this control equipment can control used helix The length of circle, thus control the inductance value of described spiral winding output.
In the present embodiment, the top in groove hole 702 is provided with first group of metal wound wire 703, described groove hole 702 Bottom be provided with second group of metal wound wire 704, and described first group of metal wound wire 703 and described second group Metal wound wire 704 is connected by the connecting hole 705 on substrate 701, with around described groove hole 702 Form spiral winding, thus realize the function of inductance.
After forming spiral winding, user just can determine the spiral winding connecting into circuit according to the actual requirements Length with obtain meet require inductance value, owing to the embodiment of the present invention can meet the multiple electricity of user Sensibility reciprocal demand, therefore, it is possible to save encapsulated space, thus improves the effect of level of integrated system and encapsulation.
In the scheme that above-mentioned Fig. 7 describes, first group of metal wound wire and second group of metal wound wire are single line coiling Structure, say, that the spiral winding of first group of metal wound wire and second group of metal wound wire formation is same Section coil.
It is understood that in actual applications, in addition to single line winding structure, it is also possible to have multi-thread And around structure, or multilayer winding structure, it is concrete,
When for parallel winding of multiple coils structure, referring to Fig. 9, Fig. 9 is encapsulating structure the 8th embodiment of the present invention:
First group of metal wound wire and second group of metal wound wire form two spiral windings, the most as shown in Figure 9 Spiral winding 901 and spiral winding 902.Thus make groove hole around actual be wound with two sections different Coil, it is to be understood that the most only illustrate as a example by two sections, can also is that in actual applications More multistage, does not limits.
Chip or equipment automatically control the inductance value of inductance for convenience, it is also possible to arrange on the substrate Have electrically connect with spiral winding some to metallic connection parts 903, then controlling equipment can be connected with this metal Portion 903 electrically connects, and to realize the electrical connection with spiral winding, then this control equipment can control to be used The length of spiral winding, thus control the inductance value of described spiral winding output.
When for multilayer winding structure, referring to Figure 10, Figure 10 is encapsulating structure the 9th embodiment of the present invention:
Encapsulating structure the 9th embodiment of the present invention includes:
Substrate 1001；
Groove hole 1002 is offered on described substrate 1001；
Described groove is cheated 1002 tops and is equipped with first group of metal wound wire 1003 and the 3rd group of metal wound wire 1004, described first group of metal wound wire 1003 and the 3rd group of metal wound wire 1004 surround institute from the first half State groove hole 1002；
The 3rd group of metal wound wire 1004 in the present embodiment is positioned at not with described first group of metal wound wire 1003 Same line layer.
It is equipped with second group of metal wound wire 1005 and the 4th group of metal wound wire bottom described groove hole 1002 1006, described second group of metal wound wire 1005 and the 4th group of metal wound wire 1006 surround institute from lower half State groove hole 1002；
The 4th group of metal wound wire 1006 in the present embodiment is positioned at not with described second group of metal wound wire 1005 Same line layer.
Described first group of metal wound wire 1003 and second group of metal wound wire 1005 are suitable so that first group Metal wound wire 1003 and second group of metal wound wire 1005 are by the first connecting hole 1007 on substrate 1001 Formation spiral winding around 1002 is cheated at described groove during connection.
Described 3rd group of metal wound wire 1004 and the 4th group of metal wound wire 1006 are suitable so that the 3rd group Metal wound wire 1004 and the 4th group of metal wound wire 1006 are by the second connecting hole 1008 on substrate 1001 Cheat at described groove during connection and around 1002, form another spiral winding.
Can also include inductance core body to improve inductance value in the present embodiment, this inductance core body can be Magnetic core or ferrite, or the core body of other materials, this inductance core body can use wafer to mount (Die Attach) non-conductive adhesives (such as glue or film etc.) is implanted, to be fixed on described groove hole 1002 In, or can also be fixed in other way in described groove hole 1002, do not limit.
Substrate 1001 in the present embodiment can be the substrate of multilayer line layer, and the structure of this substrate specifically may be used To include:
First ink layer 1009a, the second ink layer 1009b, first line layer 1010a, the second line layer 1010b, tertiary circuit layer 1010c, the 4th line layer 1010d, core layer the 1011, first packed layer 1012 And second packed layer 1013；
Described groove hole 1002 is positioned at described core layer 1011, and described core layer 1011 is insulating barrier；
Described first packed layer 1012 is positioned at described groove and cheats 1002 tops, and described first packed layer 1012 is Insulating barrier；
Described second packed layer 1013 is positioned at around described groove hole 1002, and described second packed layer 1013 is Insulating barrier；
Described first group of metal wound wire 1003 is positioned at the first line layer at described core layer 1011 top 1010a, described second group of metal wound wire 1005 is positioned at the second line layer bottom described core layer 1011 1010b；
Described 3rd group of metal wound wire 1004 is positioned at the tertiary circuit layer at described core layer 1011 top 1010c, described 4th group of metal wound wire 1006 is positioned at the 4th line layer bottom described core layer 1011 1010d；
The described first through described core layer 1011 of connecting hole 1007 is to connect described first group of metal wound wire 1003 and second group of metal wound wire 1005；
Described second through described core layer the 1011, first packed layer 1012 and second of connecting hole 1008 Packed layer 1013 is to connect described 3rd group of metal wound wire 1004 and the 4th group of metal wound wire 1006；
The surface-coated of described tertiary circuit layer 1010c has the first ink layer 1009a, described 4th line layer The surface-coated of 1010d has the second ink layer 1010b.
In the present embodiment the concrete encapsulating structure formed can as shown in figure 11, it should be noted that in order to Chip or equipment is facilitated to automatically control the inductance value of inductance, it is also possible to be provided with on the substrate and spiral It is some to metallic connection parts 1101 that coil electrically connects, then controlling equipment can be with this metallic connection parts 1101 Electrical connection, to realize the electrical connection with spiral winding, then this control equipment can control used spiral The length of coil, thus control the inductance value of described spiral winding output.
It should be noted that in above-described embodiment, when metal wound wire and metal lead wire are parallel winding of multiple coils structures Or during multilayer winding structure, multiple spiral winding can be formed, and each spiral winding comprises One metal surrounds structure and the second metal and surrounds structure, be previously mentioned the first metal surround structure and Second metal surrounds four kinds of specific implementations of structure, it is to be understood that in actual applications, no With spiral winding can use identical implementation, it would however also be possible to employ different implementations.
In parallel winding of multiple coils structure, such as there are four different spiral windings, then these four different helixes Circle can all use " first metal surround structure be substrate external link structure, second metal surround structure be Substrate interconnection structure ", or all use " first metal surround structure be substrate interconnection structure, the second gold medal Belonging to encirclement structure is substrate interconnection structure ", it is also possible to it is other implementations, or, these four are not Same spiral winding can be respectively adopted different implementations, such as first spiral winding and second " it is substrate external link structure that the first metal surrounds structure, and the second metal surrounds structure and is in spiral winding employing Substrate interconnection structure ", the 3rd spiral winding and the 4th spiral winding use " the first metal encirclement knot Structure is substrate interconnection structure, and it is substrate interconnection structure that the second metal surrounds structure " etc., implement Mode does not limits.
Above the encapsulating structure in the embodiment of the present invention is described, below in the embodiment of the present invention Method for packing be described, refer to Figure 12, one embodiment of method for packing of the present invention includes:
1201, process substrate on substrate, form connecting hole；
In the present embodiment, so that the first metal on substrate surrounds structure and the second metal surrounds knot Structure can connect, and substrate can carry out process and form connecting hole.
Concrete, described substrate can be carried out boring and obtain described connecting hole, it is to be understood that In actual application, it is also possible to use other mode that substrate is carried out process and obtain connecting hole, the most herein Do not limit.
If it should be noted that need to accommodate inductance core body, then can be provided for accommodating on substrate Inductance core body groove hole, specifically described substrate can be carried out laser fire or etch obtain described groove hole.
It is understood that in actual applications, this groove hole can be set, it is also possible to be not provided with this groove hole.
1202, first metal is set on substrate and surrounds structure and the second metal encirclement structure；
In the present embodiment, the first metal can be set on substrate and surround structure and the second metal encirclement knot Structure so that described first metal surrounds structure and described second metal surrounds structure by described substrate Connecting hole is connected, and to form spiral winding, thus realizes the function of inductance.
In the present embodiment, when being not provided with groove hole, described first metal surrounds structure and the second metal bag Closed structure lays respectively at top and the bottom of described substrate.
When arrange groove hole time, first metal surround structure may be located at described groove hole top, described second Metal surrounds structure and may be located at the bottom in described groove hole, and spiral winding is formed at described groove hole around.
In actual applications, can determine the need for according to demand offering groove hole, so that it is determined that the first gold medal Belong to the position relationship surrounded between structure and the second metal encirclement structure.
1203, other device on substrate and substrate is completely or partially encapsulated obtain packaging body.
Formed after spiral winding, then can be by substrate and be packaged in other devices of substrate and carry out all Or part encapsulating obtains packaging body, or plastic packaging (molding) becomes one together with the whole system on substrate Individual packaging body.
In actual applications, the first metal surrounds specific implementation and the second metal encirclement knot of structure The specific implementation of structure can have multiple, and therefore, the method for packing in the present embodiment is also the most Difference:
One, the first metal surrounds structure is substrate external link structure, in the second metal encirclement structure is substrate Attachment structure.
In the manner, the second metal surrounds structure and surrounds the lower half metal that groove hole is formed is at base Realize by the way of laying metal wound wire in plate, and the first metal surrounds what groove hole was formed by structure It is to realize by the way of metal lead wire is bonded at substrate surface that first half metal surrounds.
Concrete, the second metal surrounds structure can include some metal wound wire and several metallic bonds Conjunction portion；Described metal wound wire is layed in bottom described groove hole；Described metal bonding portion is by described metal wound wire Formed from the side that described groove is cheated to the extension of the surface of described substrate by the connecting hole on described substrate, institute State metal bonding part and be distributed in the both sides on surface, described groove hole；
Accordingly, the first metal encirclement structure can include some metal lead wires；Surface, described groove hole The metal bonding portion of both sides is connected by described metal lead wire so that connected any two metal bonding portion Between formed path.
The present embodiment arranges bottom groove hole the second metal and surrounds structure, and arrange at top, described groove hole First metal surrounds the detailed process of structure and includes:
Bottom described groove hole, lay some metal wound wire, and make described metal wound wire by substrate Connecting hole from the side that described groove is cheated to the surface of described substrate extend formed several metal bonding portions, Described metal bonding part is distributed in the both sides on surface, described groove hole；
Metal lead wire is used to connect the metal bonding portion that described groove cheats the both sides on surface, to form spiral winding, Make to be formed between any two metal bonding portion being connected path.
Two, the first metal surrounds structure is substrate interconnection structure, and it is outside substrate that the second metal surrounds structure Attachment structure.
In the manner, the first metal surrounds structure and surrounds the first half metal that groove hole is formed is at base Realize by the way of laying metal wound wire in plate, and the second metal surrounds what groove hole was formed by structure It is to realize by the way of metal lead wire is bonded at substrate surface that lower half metal surrounds.
Concrete, the first metal surrounds structure and includes some metal wound wire and several metal bonding portions； Described metal wound wire is layed in top, described groove hole；Described metal bonding portion is passed through institute by described metal wound wire State the connecting hole on substrate and extend formation, described metal from the side that described groove is cheated to the surface of described substrate Bonded portion is distributed in the both sides on surface, described groove hole；
Accordingly, the second metal encirclement structure includes some metal lead wires；The both sides on surface, described groove hole Metal bonding portion connected by described metal lead wire so that between connected any two metal bonding portion Form path.
The present embodiment arranges bottom groove hole the second metal and surrounds structure, and arrange at top, described groove hole First metal surrounds the detailed process of structure and includes:
Lay some metal wound wire at top, described groove hole, and make described metal wound wire by substrate Connecting hole from the side that described groove is cheated to the surface of described substrate extend formed several metal bonding portions, Described metal bonding part is distributed in the both sides on surface, described groove hole；
Metal lead wire is used to connect the metal bonding portion that described groove cheats the both sides on surface, to form spiral winding, Make to be formed between any two metal bonding portion being connected path.
Three, the first metal surrounds structure is substrate external link structure, and it is outside substrate that the second metal surrounds structure Attachment structure.
In the manner, the first metal surrounds structure and surrounds the first half metal that groove hole is formed is at base Plate surface realizes by the way of metal lead wire is bonded, and the second metal surrounds structure and formed groove hole Lower half metal to surround also be to realize by the way of metal lead wire is bonded at substrate surface.
Concrete, the first metal surround structure include upper surface metal wound wire, upper surface metal bonding portion with And upper surface metal lead wire；Described upper surface metal wound wire is layed in the side in described groove hole；Described upper table Metal bonding portion, face is passed through the connecting hole on described substrate to described substrate by described upper surface metal wound wire Upper surface extends and is formed, and described upper surface metal bonding part is distributed in the both sides of described upper surface of base plate；Institute The upper surface metal bonding portion of the both sides stating upper surface of base plate is connected by described upper surface metal lead wire；
Accordingly, second metal surround structure include lower surface metal coiling, lower surface metal bonding part with And lower surface metal lead-in wire；Described lower surface metal coiling is layed in the side in described groove hole；Described following table Metal bonding portion, face is passed through the connecting hole on described substrate to described substrate by described lower surface metal coiling Lower surface extends and is formed, and described lower surface metal bonded portion is distributed in the both sides of described base lower surface；Institute The lower surface metal bonding part of the both sides stating base lower surface is connected by described lower surface metal lead-in wire.
The present embodiment arranges bottom groove hole the second metal and surrounds structure, and arrange at top, described groove hole First metal surrounds the detailed process of structure and includes:
Lay described upper surface metal wound wire in side that described groove is cheated, and make described upper surface metal around Line extends the described upper surface metallic bond of formation by the connecting hole on described substrate to the upper surface of described substrate Conjunction portion, described upper surface metal bonding part is distributed in the both sides of described upper surface of base plate；
Use the upper surface metal bonding of the both sides of the described upper surface metal lead wire described upper surface of base plate of connection Portion；
Lay described lower surface metal coiling in side that described groove is cheated, and make described lower surface metal around Line extends the described lower surface metal key of formation by the connecting hole on described substrate to the lower surface of described substrate Conjunction portion, described lower surface metal bonded portion is distributed in the both sides of described base lower surface；
Use the lower surface metal bonding of the both sides of the described lower surface metal lead-in wire described base lower surface of connection Portion.
Four, the first metal surrounds structure is substrate interconnection structure, in the second metal encirclement structure is substrate Attachment structure.
In the manner, the second metal surrounds structure and surrounds the lower half metal that groove hole is formed is at base Realize by the way of laying metal wound wire in plate, and the first metal surrounds what groove hole was formed by structure It is also realizing by laying by the way of metal wound wire in substrate that first half metal surrounds.
Concrete, the first metal surrounds structure and includes first group of metal wound wire；
Described first group of metal wound wire is layed in top, described groove hole, and surrounds described groove hole from the first half；
Accordingly, the second metal encirclement structure includes second group of metal wound wire；
Described second group of metal wound wire is layed in bottom described groove hole, and surrounds described groove hole from lower half；
Described first group of metal wound wire and second group of metal wound wire are suitable so that first group of metal wound wire and Around described groove hole, spiral winding is formed when second group of metal wound wire connects.
The present embodiment arranges bottom groove hole the second metal and surrounds structure, and arrange at top, described groove hole First metal surrounds the detailed process of structure and includes:
Described groove hole top lay described first group of metal wound wire so that described first group of metal wound wire from The first half surrounds described groove hole, and lays described second group of metal wound wire bottom described groove hole so that institute State second group of metal wound wire and surround described groove hole from lower half；
Described first group of metal wound wire and second group of metal wound wire are suitable so that first group of metal wound wire and Around described groove hole, spiral winding is formed when second group of metal wound wire connects.
For ease of understanding, below as a example by manner described above one, encapsulation process of the present invention is retouched in detail Stating, refer to Figure 13, another embodiment of encapsulation process of the present invention includes:
1301, substrate is processed the groove hole to be formed on substrate for accommodating inductance core body and connects Connect hole；
In the present embodiment, in order to accommodate inductance core body and be easy to cabling formation metal bonding portion, so needing To process substrate on substrate, form groove hole and connecting hole.
Concrete, described substrate can be carried out laser and fire or etch and obtain described groove hole, to described Substrate carries out boring and obtains described connecting hole, it is to be understood that in actual applications, it is also possible to use Other mode carries out process and obtains groove hole and connecting hole substrate, does not limits.
1302, bottom described groove hole, lay some metal wound wire, and described metal wound wire is passed through Connecting hole on substrate extends to the surface of described substrate from the side that described groove is cheated and forms several metallic bonds Conjunction portion is to surround groove hole；
In the present embodiment, when formed groove hole after, can described groove hole bottom lay some metals around Line so that described metal wound wire by the connecting hole on substrate from the side that described groove is cheated to described substrate Surface extends several metal bonding portions of formation and cheats to surround groove, and described metal bonding part is distributed in described groove The both sides on surface, hole.
The encapsulating structure that this step has performed to be formed afterwards can specifically include as shown in figure 14:
First ink layer 1406a, the second ink layer 1406b, first line layer 1407a, the second line layer 1407b and core layer 1408；
Described groove hole 1402 is positioned at described core layer 1408, and described core layer 1408 is insulating barrier；
Described metal wound wire 1403 is positioned at the second line layer 1407b bottom described core layer 1408, described Metal bonding portion 1405 is positioned at the first line layer 1407a at described core layer 1408 top；
The through described core layer 1408 of described connecting hole 1404 is to connect described metal wound wire 1403 and gold Belong to bonding part 1405；
The surface-coated of described first line layer 1407a has the first ink layer 1406a, described second line layer The surface-coated of 1407b has the second ink layer 1406b.
Metal wound wire and metal lead wire in the present embodiment can be single line winding structures, it is also possible to be multi-thread And around structure, it is also possible to it is multilayer winding structure, concrete:
When metal wound wire and metal lead wire are single line winding structure:
The metal wound wire laid bottom described groove hole belongs to same spiral winding；Then every metal wound wire Two ends respectively from two sides that described groove is cheated to the surface of described substrate extend, with described groove cheat table The both sides in face form symmetrical two metal bonding portion, whole metal wound wire and metal lead wire institute The coil of composition is same section of coil.
When metal wound wire and metal lead wire are parallel winding of multiple coils structure:
The metal wound wire laid bottom described groove hole belongs to different spiral windings；Then every metal wound wire Two ends extend from two sides that described groove is cheated to the surface of described substrate respectively, to cheat surface at described groove Both sides form symmetrical two metal bonding portion, say, that groove hole is actual around is wound with two sections not Same coil, it is to be understood that the most only illustrate as a example by two sections, the most also may be used To be more multistage, do not limit.
When metal wound wire and metal lead wire are multilayer winding structure:
Two sides that the two ends of every metal wound wire are cheated from described groove respectively are prolonged to the surface of described substrate Stretching, form 2N symmetrical metal bonding portion with the both sides on surface, described groove hole, described N is Positive integer, and the N number of metal bonding part being positioned at the same side, surface, groove hole is distributed in same surface, or respectively It is distributed in different step surfaces, say, that N number of metal can be extended in one end of every metal wound wire Bonding part, thus realize multilayer winding.
1303, described inductance core body is fixed in described groove hole；
After substrate manufacture completes, then described inductance core body can be fixed in described groove hole, this reality Executing the inductance core body in example can be magnetic core or ferrite, or the core body of other materials, this inductance core Body can use the non-conductive adhesives (such as glue or film etc.) of wafer attachment (Die Attach) to plant Enter, to be fixed in described groove hole, or can also be fixed in other way in described groove hole, Specifically do not limit.
Encapsulating structure after inductance core body has been fixed can as shown in figure 15, and concrete structure is the most superfluous State.
It is understood that insert inductance core body can improve inductance value, if in actual applications without Excessive inductance value, it is also possible to be not inserted into inductance core body, then can not perform step 1303.
1304, metal lead wire is used to connect the metal bonding portion that described groove cheats the both sides on surface, to form spiral shell Spin line circle；
In the present embodiment, metal lead wire can be used to connect the metal bonding portion that described groove cheats the both sides on surface, To form spiral winding so that form path between connected any two metal bonding portion, obtain Encapsulating structure can as shown in Figure 6, and here is omitted for concrete structure.
1305, described substrate and inductance core body are carried out encapsulating and obtain packaging body.
After metal lead wire has connected, then inductance part can be carried out glue envelope protection, or and substrate On whole system plastic packaging together (molding) become a packaging body.
If it should be noted that be not inserted into inductance core body, then can be by substrate and be packaged in substrate Other devices carry out encapsulating and obtain packaging body, or plastic packaging (molding) together with the whole system on substrate Become a packaging body.
Chip or equipment automatically control the inductance value of inductance for convenience, it is also possible to arrange on the substrate Have some to metallic connection parts with what described metal bonding portion was connected, then controlling equipment can with this metal even Connecing portion's electrical connection, to realize and the electrical connection of spiral winding, then this control equipment can control to be used The length of spiral winding, thus control the inductance value of described spiral winding output.
In the present embodiment, it is equipped with some metal wound wire for accommodating the bottom in the groove hole of inductance core body, And metal wound wire forms several by the connecting hole on substrate from the side that groove is cheated to the extension of the surface of substrate Metal bonding portion cheats to surround groove, so when the metal bonding portion of the both sides on surface, groove hole is electrically connected, Then can form spiral winding, thus realize the function of inductance.
And metal bonding portion has multiple, when connecting different metal bonding portions, the metal wound wire of conducting Length is also the most different, and inductance value is also the most different, and user can connect different metal bonding portions with actual demand The inductance value required is met, owing to the embodiment of the present invention can meet the multiple inductance value need of user to obtain Ask, therefore, it is possible to save encapsulated space, thus improve the effect of level of integrated system and encapsulation.
In order to make it easy to understand, the following application with several concrete application examples to the encapsulating structure of the present invention It is described:
Refer to Figure 16, the scene that the first application scenarios is manual adjusting inductance of encapsulating structure of the present invention:
In the present embodiment, the metal lead wire on surface, groove hole uses the mode that dislocation connects.
When needs certain electric inductance value, user can connect different metal lead wires, the metal of connection voluntarily Number of leads is the most, then inductance value is the biggest, and the metal lead wire number of connection is the fewest, then inductance value is the least, Wherein, metal bonding portion 1601 and metal bonding portion 1602 are respectively two terminals of inductance.
Referring to Figure 17, the second application scenarios of encapsulating structure of the present invention is the scene being automatically adjusted inductance value:
In the present embodiment, the metal lead wire on surface, groove hole uses the mode that dislocation connects.
Every a pair metal bonding portion is all connected by metal lead wire, and metal bonding portion 1702 is of inductance Terminal.
Each metal bonding portion in left side is connected to control device 1701 by golden finger or pad, controls device 1701 another as inductance of which metal bonding portion that can determine left side according to current desired inductance value One terminal, the distance metal bonding portion 1702 of metal bonding portion of selection is the most remote, then inductance value is the biggest, choosing The distance metal bonding portion 1702 of metal bonding portion selected is the nearest, then inductance value is the least.
Refer to Figure 18, the scene that the 3rd application scenarios is manual adjusting inductance of encapsulating structure of the present invention:
In the present embodiment, the metal wound wire bottom groove hole uses the mode shifted to install.
When needs certain electric inductance value, user can connect different metal lead wires, the metal of connection voluntarily Number of leads is the most, then inductance value is the biggest, and the metal lead wire number of connection is the fewest, then inductance value is the least, Wherein, metal bonding portion 1801 and metal bonding portion 1802 are respectively two terminals of inductance.
Referring to Figure 19, the 4th application scenarios of encapsulating structure of the present invention is the scene being automatically adjusted inductance value:
In the present embodiment, the metal wound wire bottom groove hole uses the mode shifted to install.
Every a pair metal bonding portion is all connected by metal lead wire, and metal bonding portion 1902 is of inductance Terminal.
Each metal bonding portion in left side is connected to control device 1901 by golden finger or pad, controls device 1901 another as inductance of which metal bonding portion that can determine left side according to current desired inductance value One terminal, the distance metal bonding portion 1902 of metal bonding portion of selection is the most remote, then inductance value is the biggest, choosing The distance metal bonding portion 1902 of metal bonding portion selected is the nearest, then inductance value is the least.
By above-mentioned each application scenarios it can be seen that in the present embodiment, metal bonding portion has multiple, when even When meeting different metal bonding portions, the length of the metal wound wire of conducting is also the most different, and inductance value is also the most different, User can connect different metal bonding portions with actual demand and meet, to obtain, the inductance value required, due to this Inventive embodiments can meet the multiple inductance value demand of user, therefore, it is possible to save encapsulated space, thus Improve level of integrated system and the effect of encapsulation.
The above, above example only in order to technical scheme to be described, is not intended to limit； Although being described in detail the present invention with reference to previous embodiment, those of ordinary skill in the art should Work as understanding: the technical scheme described in foregoing embodiments still can be modified by it, or to it Middle part technical characteristic carries out equivalent；And these amendments or replacement, do not make appropriate technical solution Essence depart from various embodiments of the present invention technical scheme spirit and scope.

Claims (23)

1. an encapsulating structure, it is characterised in that include substrate；
It is provided with the first metal on described substrate and surrounds structure, and the second metal surrounds structure；
Described first metal surrounds structure and described second metal surrounds structure by the connecting hole phase on substrate Connect, to form spiral winding；
Wherein, described substrate is further opened with groove hole；
Described first metal surrounds structure and is positioned at the top in described groove hole, and described second metal surrounds structure position In the bottom that described groove is cheated；
Described spiral winding is formed at described groove and cheats around；
Wherein, it is substrate external link structure that described first metal surrounds structure, and described second metal surrounds knot Structure is substrate interconnection structure；It is by laying metal wound wire in substrate that described second metal surrounds structure Mode groove hole formed lower half metal surround, it is to lead at substrate surface that described first metal surrounds structure The mode crossing metal lead wire bonding forms the encirclement of first half metal to groove hole；
Or, it is substrate interconnection structure that described first metal surrounds structure, and described second metal surrounds structure For substrate external link structure；Described first metal surrounds structure in substrate by laying metal wound wire Mode forms first half metal to groove hole and surrounds, and it is to pass through at substrate surface that described second metal surrounds structure The mode of metal lead wire bonding forms lower half metal to groove hole and surrounds；
Or, it is substrate external link structure that described first metal surrounds structure, and described second metal surrounds structure For substrate external link structure；It is to be bonded by metal lead wire at substrate surface that described first metal surrounds structure Mode to groove hole formed first half metal surround, described second metal surround structure be substrate surface lead to The mode crossing metal lead wire bonding forms lower half metal encirclement to groove hole；
Or, it is substrate interconnection structure that described first metal surrounds structure, and described second metal surrounds structure For substrate interconnection structure；Described second metal surrounds structure in substrate by laying metal wound wire Mode forms lower half metal to groove hole and surrounds, and it is by paving in substrate that described first metal surrounds structure If the mode of metal wound wire forms first half metal to groove hole and surrounds.
Encapsulating structure the most according to claim 1, it is characterised in that
Described second metal surrounds structure and includes some metal wound wire and several metal bonding portions；
Described metal wound wire is layed in bottom described groove hole；
Described metal bonding portion is cheated from described groove by the connecting hole on described substrate by described metal wound wire Side extends to the surface of described substrate and is formed, and described metal bonding part is distributed in the two of surface, described groove hole Side；
Described first metal surrounds structure and includes some metal lead wires；
The metal bonding portion of the both sides on surface, described groove hole is connected by described metal lead wire so that connected Path is formed between any two metal bonding portion.
Encapsulating structure the most according to claim 2, it is characterised in that
The metal wound wire laid bottom described groove hole belongs to same spiral winding；
The two ends of every described metal wound wire respectively from two sides that described groove is cheated to the surface of described substrate Extend, form symmetrical two metal bonding portion with the both sides on surface, described groove hole.
Encapsulating structure the most according to claim 2, it is characterised in that
The metal wound wire laid bottom described groove hole belongs to different spiral windings；
The two ends of every described metal wound wire respectively from two sides that described groove is cheated to the surface of described substrate Extend, form symmetrical two metal bonding portion with the both sides on surface, described groove hole.
Encapsulating structure the most according to claim 2, it is characterised in that
The two ends of every described metal wound wire respectively from two sides that described groove is cheated to the surface of described substrate Extend, form 2N symmetrical metal bonding portion, described N with the both sides on surface, described groove hole For the positive integer more than 1；
The N number of metal bonding part being positioned at the same side, surface, described groove hole is distributed in same surface, or divides respectively It is distributed in different step surfaces.
6. according to the encapsulating structure according to any one of claim 2 to 5, it is characterised in that
Described substrate comprise the first ink layer, the second ink layer, first line layer, the second line layer and Core layer；
Described groove hole is positioned at described core layer, and described core layer is insulating barrier；
Described metal wound wire is positioned at the second line layer bottom described core layer, and described metal bonding portion is positioned at The first line layer at described core layer top；
The through described core layer of described connecting hole is to connect described metal wound wire and metal bonding portion；
The surface-coated of described first line layer has the first ink layer, the surface-coated of described second line layer There is the second ink layer.
Encapsulating structure the most according to claim 1, it is characterised in that
Described first metal surrounds structure and includes some metal wound wire and several metal bonding portions；
Described metal wound wire is layed in top, described groove hole；
Described metal bonding portion is cheated from described groove by the connecting hole on described substrate by described metal wound wire Side extends to the surface of described substrate and is formed, and described metal bonding part is distributed in the two of surface, described groove hole Side；
Described second metal surrounds structure and includes some metal lead wires；
The metal bonding portion of the both sides on surface, described groove hole is connected by described metal lead wire so that connected Path is formed between any two metal bonding portion.
Encapsulating structure the most according to claim 1, it is characterised in that
Described first metal surround structure include upper surface metal wound wire, upper surface metal bonding portion and on Surface metal goes between；
Described upper surface metal wound wire is layed in the side in described groove hole；
Described upper surface metal bonding portion is passed through the connecting hole on described substrate by described upper surface metal wound wire Extending to the upper surface of described substrate and formed, described upper surface metal bonding part is distributed in table on described substrate The both sides in face；
The upper surface metal bonding portion of the both sides of described upper surface of base plate is by described upper surface metal lead wire even Connect；
Described second metal surround structure include lower surface metal coiling, lower surface metal bonding part and under Surface metal goes between；
Described lower surface metal coiling is layed in the side in described groove hole；
Described lower surface metal bonding part is passed through the connecting hole on described substrate by described lower surface metal coiling Extending to the lower surface of described substrate and formed, described lower surface metal bonded portion is distributed in described substrate following table The both sides in face；
The lower surface metal bonding part of the both sides of described base lower surface is by described lower surface metal lead-in wire even Connect.
Encapsulating structure the most according to claim 1, it is characterised in that
Described first metal surrounds structure and includes first group of metal wound wire；
Described first group of metal wound wire is layed in top, described groove hole, and surrounds described groove hole from the first half；
Described second metal surrounds structure and includes second group of metal wound wire；
Described second group of metal wound wire is layed in bottom described groove hole, and surrounds described groove hole from lower half；
Described first group of metal wound wire and second group of metal wound wire are suitable so that first group of metal wound wire and Around described groove hole, spiral winding is formed when second group of metal wound wire connects.
Encapsulating structure the most according to claim 9, it is characterised in that
Described first group of metal wound wire and second group of metal wound wire form same spiral winding when connecting, or Form at least two spiral winding.
11. encapsulating structures according to claim 9, it is characterised in that
Described first metal surround structure the most also include the 3rd group of metal wound wire, described 3rd group of metal around Line is positioned at different line layers from described first group of metal wound wire；
Described 3rd group of metal wound wire is layed in top, described groove hole, and surrounds described groove hole from the first half；
Described second metal surround structure the most also include the 4th group of metal wound wire, described 4th group of metal around Line is positioned at different line layers from described second group of metal wound wire；
Described 4th group of metal wound wire is layed in bottom described groove hole, and surrounds described groove hole from lower half；
Described 3rd group of metal wound wire and the 4th group of metal wound wire are suitable so that the 3rd group of metal wound wire and Around described groove hole, another spiral winding is formed when 4th group of metal wound wire connects.
12. according to the encapsulating structure according to any one of claim 9 to 11, it is characterised in that
Described substrate comprises the first ink layer, the second ink layer, first line layer, the second line layer, core Flaggy and packed layer；
Described groove hole is positioned at described core layer, and described core layer is insulating barrier；
Described packed layer is positioned at top, described groove hole, and described packed layer is insulating barrier；
Described first group of metal wound wire is positioned at the first line layer at described core layer top, described second group of gold Belong to coiling and be positioned at the second line layer bottom described core layer；
The through described core layer of described connecting hole is to connect described first group of metal wound wire and second group of metal Coiling；
The surface-coated of described first line layer has the first ink layer, the surface-coated of described second line layer There is the second ink layer.
13. according to claim 1 to 5, encapsulating structure according to any one of 7 to 11, and its feature exists In,
Described substrate surface is provided with electrically connect with described spiral winding some to metallic connection parts.
14. encapsulating structures according to claim 13, it is characterised in that described encapsulating structure also wraps Include:
The control equipment being arranged on described substrate；
Described control equipment is connected with described metallic connection parts, in order to control the electricity of described spiral winding output Sensibility reciprocal.
15. according to claim 1 to 5, encapsulating structure according to any one of 7 to 11, and its feature exists In, described encapsulating structure also includes:
It is positioned at the inductance core body in described groove hole.
16. 1 kinds of method for packing, it is characterised in that including:
Process substrate on substrate, form connecting hole；
First metal is set on the substrate and surrounds structure and the second metal encirclement structure；
Make described first metal surround structure and described second metal surrounds structure by described substrate Connecting hole is connected, to form spiral winding；
Other device on described substrate and substrate is completely or partially encapsulated and obtains packaging body；
Wherein, described method also includes:
Process described substrate on substrate, form groove hole；
Described first metal that arranges on the substrate surrounds structure and the second metal and surrounds structure and include:
Second metal is set bottom described groove hole and surrounds structure, and the first gold medal is set at top, described groove hole Belong to and surround structure；
Described spiral winding is formed at described groove and cheats around；
Wherein, it is substrate external link structure that described first metal surrounds structure, and described second metal surrounds knot Structure is substrate interconnection structure；It is by laying metal wound wire in substrate that described second metal surrounds structure Mode groove hole formed lower half metal surround, it is to lead at substrate surface that described first metal surrounds structure The mode crossing metal lead wire bonding forms the encirclement of first half metal to groove hole；
Or, it is substrate interconnection structure that described first metal surrounds structure, and described second metal surrounds structure For substrate external link structure；Described first metal surrounds structure in substrate by laying metal wound wire Mode forms first half metal to groove hole and surrounds, and it is to pass through at substrate surface that described second metal surrounds structure The mode of metal lead wire bonding forms lower half metal to groove hole and surrounds；
Or, it is substrate external link structure that described first metal surrounds structure, and described second metal surrounds structure For substrate external link structure；It is to be bonded by metal lead wire at substrate surface that described first metal surrounds structure Mode to groove hole formed first half metal surround, described second metal surround structure be substrate surface lead to The mode crossing metal lead wire bonding forms lower half metal encirclement to groove hole；
Or, it is substrate interconnection structure that described first metal surrounds structure, and described second metal surrounds structure For substrate interconnection structure；Described second metal surrounds structure in substrate by laying metal wound wire Mode forms lower half metal to groove hole and surrounds, and it is by paving in substrate that described first metal surrounds structure If the mode of metal wound wire forms first half metal to groove hole and surrounds.
17. method for packing according to claim 16, it is characterised in that described second metal surrounds Structure includes that some metal wound wire and several metal bonding portions, described first metal surround structure bag Include some metal lead wires；
Described second metal that arranges bottom described groove hole surrounds structure, and arranges the at top, described groove hole One metal surrounds structure and includes:
Bottom described groove hole, lay some metal wound wire, and make described metal wound wire by substrate Connecting hole from the side that described groove is cheated to the surface of described substrate extend formed several metal bonding portions, Described metal bonding part is distributed in the both sides on surface, described groove hole；
Metal lead wire is used to connect the metal bonding portion that described groove cheats the both sides on surface, to form spiral winding, Make to be formed between any two metal bonding portion being connected path.
18. method for packing according to claim 16, it is characterised in that described first metal surrounds Structure includes that some metal wound wire and several metal bonding portions, described second metal surround structure bag Include some metal lead wires；
Described second metal that arranges bottom described groove hole surrounds structure, and arranges the at top, described groove hole One metal surrounds structure and includes:
Lay some metal wound wire at top, described groove hole, and make described metal wound wire by substrate Connecting hole from the side that described groove is cheated to the surface of described substrate extend formed several metal bonding portions, Described metal bonding part is distributed in the both sides on surface, described groove hole；
Metal lead wire is used to connect the metal bonding portion that described groove cheats the both sides on surface, to form spiral winding, Make to be formed between any two metal bonding portion being connected path.
19. method for packing according to claim 16, it is characterised in that described first metal surrounds Structure includes upper surface metal wound wire, upper surface metal bonding portion and upper surface metal lead wire, described Two metals surround structure and include that lower surface metal coiling, lower surface metal bonding part and lower surface metal are drawn Line；
Described second metal that arranges bottom described groove hole surrounds structure, and arranges the at top, described groove hole One metal surrounds structure and includes:
Lay described upper surface metal wound wire in side that described groove is cheated, and make described upper surface metal around Line extends the described upper surface metallic bond of formation by the connecting hole on described substrate to the upper surface of described substrate Conjunction portion, described upper surface metal bonding part is distributed in the both sides of described upper surface of base plate；
Use the upper surface metal bonding of the both sides of the described upper surface metal lead wire described upper surface of base plate of connection Portion；
Lay described lower surface metal coiling in side that described groove is cheated, and make described lower surface metal around Line extends the described lower surface metal key of formation by the connecting hole on described substrate to the lower surface of described substrate Conjunction portion, described lower surface metal bonded portion is distributed in the both sides of described base lower surface；
Use the lower surface metal bonding of the both sides of the described lower surface metal lead-in wire described base lower surface of connection Portion.
20. method for packing according to claim 16, it is characterised in that described first metal surrounds Structure includes that first group of metal wound wire, described second metal surround structure and include second group of metal wound wire；
Described second metal that arranges bottom described groove hole surrounds structure, and arranges the at top, described groove hole One metal surrounds structure and includes:
Described groove hole top lay described first group of metal wound wire so that described first group of metal wound wire from The first half surrounds described groove hole, and lays described second group of metal wound wire bottom described groove hole so that institute State second group of metal wound wire and surround described groove hole from lower half；
Described first group of metal wound wire and second group of metal wound wire are suitable so that first group of metal wound wire and Around described groove hole, spiral winding is formed when second group of metal wound wire connects.
21. according to the method for packing according to any one of claim 16 to 20, it is characterised in that institute Method of stating also includes:
Described substrate surface arrange electrically connect with described spiral winding some to metallic connection parts.
22. method for packing according to claim 21, it is characterised in that described method also includes:
Control equipment is set on the substrate, and described control equipment is connected with described metallic connection parts, Described control equipment is made to control the inductance value of described spiral winding output.
23. according to the method for packing according to any one of claim 16 to 20, it is characterised in that institute Method of stating also includes:
Inductance core body is fixed in described groove hole.
CN201210156082.XA 2012-05-18 2012-05-18 A kind of encapsulating structure and method for packing thereof Active CN103426868B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210156082.XA CN103426868B (en) 2012-05-18 2012-05-18 A kind of encapsulating structure and method for packing thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210156082.XA CN103426868B (en) 2012-05-18 2012-05-18 A kind of encapsulating structure and method for packing thereof

Publications (2)

Publication Number Publication Date
CN103426868A CN103426868A (en) 2013-12-04
CN103426868B true CN103426868B (en) 2016-12-14

Family

ID=49651391

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210156082.XA Active CN103426868B (en) 2012-05-18 2012-05-18 A kind of encapsulating structure and method for packing thereof

Country Status (1)

Country Link
CN (1) CN103426868B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107450037A (en) * 2017-06-28 2017-12-08 河南平高通用电气有限公司 A kind of transformer iron core excitation characteristic measuring device and its measurement frock

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2881955Y (en) * 2005-10-28 2007-03-21 威盛电子股份有限公司 Chip package
CN101847627A (en) * 2010-05-31 2010-09-29 锐迪科科技有限公司 Semiconductor chip of integrated passive element and power amplifier element
CN201994278U (en) * 2010-10-02 2011-09-28 利顺精密科技股份有限公司 Laminated substrate with inductor for chip packaging
CN202633289U (en) * 2012-05-18 2012-12-26 深南电路有限公司 Packaging structure

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7531893B2 (en) * 2006-07-19 2009-05-12 Texas Instruments Incorporated Power semiconductor devices having integrated inductor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2881955Y (en) * 2005-10-28 2007-03-21 威盛电子股份有限公司 Chip package
CN101847627A (en) * 2010-05-31 2010-09-29 锐迪科科技有限公司 Semiconductor chip of integrated passive element and power amplifier element
CN201994278U (en) * 2010-10-02 2011-09-28 利顺精密科技股份有限公司 Laminated substrate with inductor for chip packaging
CN202633289U (en) * 2012-05-18 2012-12-26 深南电路有限公司 Packaging structure

Also Published As

Publication number Publication date
CN103426868A (en) 2013-12-04

Similar Documents

Publication Publication Date Title
US20090167477A1 (en) Compact Inductive Power Electronics Package
US10396016B2 (en) Leadframe inductor
CN101814485B (en) Packaging and fabricating method for mini power semiconductor with stacked inductance IC chip
CN108573895A (en) Semiconductor encapsulation device and the method for manufacturing semiconductor encapsulation device
CN107210231A (en) Switching power stage with Integrated passive assembly
CN104078439A (en) Semiconductor device and manufacturing method thereof
US20200211760A1 (en) Molded inductor with magnetic core having mold flow enhancing channels
US9054088B2 (en) Multi-component chip packaging structure
CN106898607A (en) Semiconductor devices
TW200832670A (en) Electronic device with inductor and integrated componentry
CN207217523U (en) Complex electronic device, circuit module and DC-DC converter module
CN103426868B (en) A kind of encapsulating structure and method for packing thereof
US20160113141A1 (en) Inductor
CN202633289U (en) Packaging structure
US11270937B2 (en) Integrated inductor with magnetic mold compound
TWM406265U (en) Inductance IC chip packaging multi-layer substrate
CN109219859A (en) The manufacturing method of LC device and LC device
CN102592781A (en) Inducer
US11017934B2 (en) Electronic module
CN106449550A (en) Chip packaging module
US20100259350A1 (en) Inductor or transformer for microelectric system
CN104766712A (en) Surface mount coil unit and application thereof
CN206293435U (en) Semiconductor devices and semiconductor package part
CN105719785B (en) Electrical inductor assembly and its manufacture method
CN113972180A (en) Chip packaging structure, preparation method thereof and electronic equipment

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP03 Change of name, title or address

Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99

Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD.

Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99

Patentee before: Shenzhen Shennan Circuits Co., Ltd.

CP03 Change of name, title or address
TR01 Transfer of patent right

Effective date of registration: 20211208

Address after: 518000 101, No.3 huanping Road, Gaoqiao community, Pingdi street, Longgang District, Shenzhen City, Guangdong Province

Patentee after: Tianxin Internet Technology Co., Ltd

Address before: 518053, No. 99, East Road, overseas Chinese town, Shenzhen, Guangdong, Nanshan District

Patentee before: SHENNAN CIRCUITS Co.,Ltd.

TR01 Transfer of patent right