CN103425309A

CN103425309A - Sensing circuit structure of touch panel

Info

Publication number: CN103425309A
Application number: CN2012101611291A
Authority: CN
Inventors: 张祐严; 黄长煌
Original assignee: PSD TECHNOLOGY Co Ltd
Current assignee: PSD TECHNOLOGY Co Ltd
Priority date: 2012-05-18
Filing date: 2012-05-18
Publication date: 2013-12-04

Abstract

The invention discloses a sensing circuit structure of a touch panel and aims to solve the problems that the existing sensing circuit is long and complex in production process and high in cost. The sensing circuit structure mainly comprises a sensing circuit layer and a transparent substrate having a glue layer, wherein the sensing circuit layer is composed of parallel carbon bundles. A conducting wire of each carbon bundle is covered with an insulating layer, so that during the production process, the sensing circuit structure of the touch panel can be produced by directly disposing the sensing circuit layer on the transparent substrate having the glue layer and solidifying the glue layer to integrate the sensing circuit layer (the carbon bundles) and the transparent substrate by UV irradiation. The sensing circuit needs no insulation treatment during the production process, so that the production steps are simplified and production cost is reduced.

Description

The sensor circuit structure of contact panel

Technical field

The present invention relates to contact panel, particularly relate to a kind of sensor circuit structure of contact panel.

Background technology

Contact panel (Touch Panel) mainly can be divided into the classifications such as condenser type and resistance-type according to principle of induction, and wherein capacitance type touch-control panel is the control mode of current main flow.

As Fig. 1, shown in Fig. 2, capacitance type touch-control panel mainly be take a clear glass as substrate 11, and be provided with the first line layer 12 with a plurality of X-axis induction electrodes 121 that be arranged in parallel in this substrate 11, and there is the second line layer 13 of a plurality of Y-axis induction electrodes 131 that be arranged in parallel, and respectively this X-axis induction electrode 121 is with respectively this Y-axis induction electrode 131 is interlaced with each other, to be the induction array of checkerboard configuration shape, and for guaranteeing respectively this X-axis induction electrode 121 and respectively these Y-axis induction electrode 131 crossover place normal operations, therefore sentencing an insulation course 14 in each crossover makes its electric insulation, use the electrostatic field utilized in this induction array and change to calculate contacting points position, certainly, capacitance type touch-control panel more includes other insulation course 15 and ground plane 16.

Yet, with regard to the processing procedure of the sensor circuit of this contact panel, form respectively the first line layer 12, and second line layer 13 of a plurality of Y-axis induction electrodes 131 of a plurality of X-axis induction electrodes 121 on the one side of single transparent substrate 11, because X, Y-axis induction electrode 121,131 are done the matrix arrangement, make respectively this X-axis induction electrode 121 and this Y-axis induction electrode 131 respectively have to intersect overlapping place, therefore isolation processing must be insulated, but the insulation isolation processing will increase fabrication steps again, and highlight the numerous and diverse defect of sensor circuit processing procedure of contact panel.

In addition, another kind of processing procedure sputter on substrate of the sensor circuit of existing contact panel have a plurality of X-axis induction electrodes of being linear and respectively between this X-axis induction electrode sputter have and the discontiguous Y-axis induction electrode of this X-axis induction electrode line segment, be coated with insulation course subsequently on the X-axis induction electrode, and this insulation course is positioned on the path of this Y-axis induction electrode segment link respectively, finally, see through sputter again respectively this line segment Y-axis induction electrode is electrically connected, this kind of processing procedure more highlights the complicated tediously long and defect that cost is high of processing procedure.

Summary of the invention

The technical problem to be solved in the present invention is to provide a kind of sensor circuit structure of contact panel, and it is mainly simplified fabrication steps and reduces the processing procedure cost.

Another technical matters that the present invention will solve is to provide a kind of sensor circuit structure of contact panel, and it mainly promotes the sensitivity of touch-control sensing.

For solving the problems of the technologies described above, the sensor circuit structure of contact panel of the present invention comprises: a transparency carrier, have a use end face, and one be in reverse to described use end face in conjunction with end face; One cementing layer, be located at described transparency carrier in conjunction with end face; One sensor circuit layer, be arranged at describedly in conjunction with end face and cemented by described cementing layer, and includes a plurality of carbon bundles that are parallel to each other, and each described carbon bundle has the dielectric film that a conductor wire and coats described conductor wire.

Preferably, described cementing layer is a ultraviolet-curing adhesive agent.

Preferably, described conductor wire is carbon fiber.

Preferably, each described carbon be parallel to each other is intrafascicular, makes carbon Shu Zuowei signal receiving end into odd number, is the carbon Shu Zuowei signal transmitting terminal of even number.

Preferably, each described carbon be parallel to each other is intrafascicular, makes carbon Shu Zuowei signal transmitting terminal into odd number, is the carbon Shu Zuowei signal receiving end of even number.

The sensor circuit structure of contact panel of the present invention can be simplified fabrication steps and reduce the processing procedure cost, can promote the sensitivity of touch-control sensing.

The accompanying drawing explanation

Below in conjunction with accompanying drawing and embodiment, the present invention is further detailed explanation:

Fig. 1 is existing contact panel three-dimensional exploded view.

Fig. 2 is the part sectioned view of the sensor circuit of existing contact panel.

Fig. 3 is three-dimensional exploded view of the present invention.

Fig. 4 is three-dimensional combination figure of the present invention.

Fig. 5 is the top view of Fig. 4.

Fig. 6 is the side view of Fig. 4.

Fig. 7 is the top view of the another kind of enforcement state of the present invention.

Description of reference numerals

The 11st, substrate 12 is first line layers

The 121st, X-axis induction electrode 13 is second line layers

The 131st, Y-axis induction electrode the 14, the 15th, insulation course

The 16th, ground plane

The 20th, transparency carrier 21 is to use end face

The 22nd, in conjunction with end face

The 30th, cementing layer

The 40th, sensor circuit layer the 41,42,46, the 47th, carbon bundle

411, the 421st, conductor wire

412, the 422nd, dielectric film

Embodiment

As shown in Figures 3 to 6, the sensor circuit structure of a kind of contact panel that the embodiment of the present invention provides, its mainly by a transparency carrier 20, a

cementing layer

30, and 40, a sensor circuit layer form, wherein:

This transparency carrier 20, have a use end face 21, and one be in reverse to this use end face 21 in conjunction with end face 22; This transparency carrier 20 can be glass or transparent polymer sheet material.

This cementing layer 30, be coated on this transparency carrier 20 in conjunction with end face 22; In the present embodiment, this cementing layer 30 is a ultraviolet-curing adhesive agent.

This sensor circuit layer 40, be arranged at this in conjunction with end face 22 and cemented by this cementing layer 30, this sensor circuit layer 40 includes a plurality of carbon bundles that are parallel to each other 41,42, and respectively this

carbon bundle

41,42 has the dielectric film 412,422 that a conductor wire 411,421 and coats this conductor wire 411,421; In the present embodiment, this conductor wire 41 is carbon fiber, and respectively in this carbon bundle be parallel to each other 41,42, make into the carbon bundle 41 of odd number as the signal receiving end, for the carbon bundle 42 of even number as the signal transmitting terminal.

The above is structure and the configuration explanation thereof of each main member of the embodiment of the present invention.As for effect of the present invention, make the following instructions.

Sensor circuit structure of the present invention is mainly by the carbon bundle 41 be parallel to each other, 42 are located on the transparency carrier 20 with cementing layer 30 and form, and due to this carbon bundle 41 respectively, 42 conductor wire (carbon fiber) 411, 421 by an

insulation course

412, 422 coat, therefore, this sensor circuit can directly be located at this sensor circuit layer 40 on the transparency carrier 20 with cementing layer 30 on processing procedure, finally by irradiation ultraviolet radiation (UV) solidifies this cementing layer 30 by this sensor circuit layer 40 (i.e. this carbon bundle 41 respectively, 42) with transparency carrier 20, the two is combined as a whole, complete the sensor circuit structure of this contact panel, be with, sensor circuit of the present invention is in the process of making, do not need the isolation processing that insulated, the two is combined as a whole by this sensor circuit layer 40 and transparency carrier 20 more not need to see through sputter process, therefore, really can reach the purpose of simplifying fabrication steps and reducing the processing procedure cost.

It is worth mentioning that, sensor circuit structure of the present invention is in the emission and reception of signal, except using the carbon bundle 41 of this odd number as transmitting terminal, using the carbon bundle 42 of this even number as receiving end, as shown in Figure 7, more visual demand and in this carbon bundle be parallel to each other 46,47 respectively, order for the carbon bundle 46 of odd number as the signal receiving end, be the carbon bundle 47 of even number as the signal transmitting terminal, and all can form fast-changing electric capacity on this sensor circuit layer 40, with the sensitivity of lifting touch-control sensing.

In sum, above-described embodiment and diagram are only preferred embodiment of the present invention, when can not with restriction scope of the invention process, the equalization of generally doing according to the present patent application the scope of the claims changes and modifies, and all should remain within the scope of the patent.

Claims

1. the sensor circuit structure of a contact panel comprises:

One transparency carrier, have a use end face, and one be in reverse to described use end face in conjunction with end face;

One cementing layer, be located at described transparency carrier in conjunction with end face;

One sensor circuit layer, be arranged at describedly in conjunction with end face and cemented by described cementing layer, and includes a plurality of carbon bundles that are parallel to each other, and each described carbon bundle has the dielectric film that a conductor wire and coats described conductor wire.

2. the sensor circuit structure of contact panel as claimed in claim 1, it is characterized in that: described cementing layer is a ultraviolet-curing adhesive agent.

3. the sensor circuit structure of contact panel as claimed in claim 1, it is characterized in that: described conductor wire is carbon fiber.

4. the sensor circuit structure of contact panel as claimed in claim 1, it is characterized in that: each described carbon be parallel to each other is intrafascicular, makes carbon Shu Zuowei signal receiving end into odd number, is the carbon Shu Zuowei signal transmitting terminal of even number.

5. the sensor circuit structure of contact panel as claimed in claim 1, it is characterized in that: each described carbon be parallel to each other is intrafascicular, makes carbon Shu Zuowei signal transmitting terminal into odd number, is the carbon Shu Zuowei signal receiving end of even number.