CN103409667B - Novel dedicated PCB aluminum-based foil produced by aluminum scraps and preparation process of novel dedicated PCB aluminum-based foil - Google Patents
Novel dedicated PCB aluminum-based foil produced by aluminum scraps and preparation process of novel dedicated PCB aluminum-based foil Download PDFInfo
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Abstract
The invention discloses a dedicated PCB aluminum-based foil produced by aluminum scraps and a preparation process of the novel dedicated PCB aluminum-based foil. The foil comprises the main following chemical components by weight: 0.49-0.65% of Fe, 0.36-0.49% of Si, 0.10-0.15% of Ce, 0.05-0.10% of Gd and the like. The foil has higher surface cleanliness, and is uniform in color, high in mechanical property, high in thermal conductivity, suitable for machining such as punching, shearing and cutting, and more suitable for the surface mount technology of power components; the technological process of the dedicated PCB aluminum-based foil solves the problem that the waste scraps in the production field are not recycled to the most extent, improves the production environment, shortens the waste scraps storage time, improves the production and management environment, reduces the production cost, and improves the economic benefits.
Description
Technical field
The invention belongs to aluminium foil processing technique field, be specifically related to the aluminium base foil of special PCB and the preparation method of the production of a kind of aluminium waste.
Background technology
Along with the develop rapidly of electronic industry, size and the volume of electronic product are more and more less, and power density is increasing, solve the continuous referred new height of heat dissipation problem, and this is a huge challenge concerning electronic industry design.One of effective means that the appearance of printed circuit board (pcb) aluminium base addresses this problem beyond doubt.PCB aluminium base is a kind of aluminum-based copper-clad plate of uniqueness, and it has good thermal conductivity, electrical insulation capability and machinability.PCB aluminum-based copper-clad plate is a kind of metal circuit board, material is made up of conductive layer, thermally conductive insulating layer and metal aluminum substrate, its aluminum base layer requires to have high thermal conductivity, is suitable for the conventional mechanical processing such as boring, punching and cutting, is applicable to (PCC) power surface mounting technology (SMT) technique.It is without the need to scatterer, and volume reduces greatly, good heat dissipation effect, has good insulating property and mechanical property.
At present, aluminium base obtains primarily of 1XXX system, 3XXX system, 5XXX system and 6XXX line aluminium alloy, has good thermal diffusivity, excellent dimensional stability, good machinability, excellent cost performance.But due to the continuous renewal to PCB aluminium base demand, also more and more higher to the requirement of its performance, existing advantage can not meet the demand of technology innovation gradually, produce a kind ofly have more easy welding, intensity is higher, resistance to elevated temperatures is better, erosion resistance is stronger, thermal diffusivity is better, cost performance is higher PCB aluminium base (paper tinsel) material has become those skilled in the art's research problem.
And, in prior art, in aluminium sheet, aluminium foil products production process, inevitably produce some technique geometry waste materials and Technology waste material, add production cost, cause the wasting of resources; Therefore, it is very necessary for how recycling solving and processing waste material in time to waste material; How farthest being reclaimed by waste material, carry out further rational proportion, make it farthest to turn waste into wealth, is the technical problem that those skilled in the art are badly in need of solving.
Summary of the invention
The use that an object of the present invention is to provide a kind of more easily welds, intensity is high, resistance to elevated temperatures good, erosion resistance is strong, thermal diffusivity is good, cost is low is the aluminium base special foil of novel PC B produced of aluminium waste at high proportion.
Two of object of the present invention is to provide a kind of and adopts continuous casting and rolling method, it is with short production cycle to have, tooling cost is low, the preparation technology producing the aluminium base special foil of PCB with aluminium mixing waste of aluminium waste utilization ratio advantages of higher.
The object of the present invention is achieved like this: the aluminium base foil of special PCB that a kind of aluminium waste is produced, and the chemical composition mass percent of the aluminium base special foil of described PCB is: Fe:0.49 ~ 0.65%, Si:0.36 ~ 0.49%, Ce:0.10 ~ 0.15%, Gd:0.05 ~ 0.10%, Mn:< 0.25%, Zn:< 0.15%, Ti:< 0.05%, Cu:< 0.045%, Mg:< 0.045%, surplus are Al.
Preferred technical scheme is, the mass ratio of described Fe and Si is between 1.12 ~ 1.35.
Above-mentioned element plays respective effect in casting, homogenizing annealing process.
Preferred technical scheme is, the tensile strength of the aluminium base foil of described special PCB is 180 ~ 220MPa.
The preparation technology of the aluminium base foil of special PCB produced with aluminium mixing waste, described technique comprises the steps:
S1: smelting furnace preparation → furnace charge preparation → shove charge → melt → stir with skim → adjusting component → stove in first time refining → converter and leaving standstill → second time refining → degasification tank degasification skim → filter cleaner → casting of strumbox two channels twin-stage ceramic filter plate becomes the casting of 8mm thickness to roll up;
S2: described casting is involved in row cold rolling, is first cold rolled to 3.0mm thickness by casting volume, then carries out process annealing, continue to be cold-rolled to 0.38mm thickness, then turn paper tinsel and roll, then be rolling to desired thickness;
Described intermediate annealing process adopts the annealing of furnace gas temperature control method, that is: furnace temperature≤100 DEG C shove charge, is warmed up to 480 DEG C through 2 hours furnace temperature, is incubated 16 hours; Again furnace temperature is cooled to 420 DEG C through 1 hour, be incubated 4 hours, air cooling of coming out of the stove.
Preferred technical scheme is, the charge composition of described casting volume is:
Waste material uses 1XXX system fine aluminium group, the alloyed scrap of 8XXX system iron content and silicon, total input amount≤25% of waste material, wherein secondary waste≤20%;
Waste material uses 3XXX system containing manganese waste material, total input amount≤10% of waste material, wherein secondary waste≤10%;
Waste material uses the magnesium and silicon contained alloyed scrap of 6XXX system, total input amount≤5% of waste material, wherein secondary waste≤5%;
Total input amount >=60% of virgin aluminium ingot.
Preferred technical scheme is, the charge composition of described casting volume is:
Waste material uses 1XXX system fine aluminium group, the alloyed scrap of 8XXX system iron content and silicon, total input amount≤30% of waste material, wherein secondary waste≤25%;
Waste material uses 3XXX system containing manganese waste material, total input amount≤10% of waste material, wherein secondary waste≤10%;
Total input amount >=60% of virgin aluminium ingot.
Preferred technical scheme is, the charge composition of described casting volume is:
Waste material uses 1XXX system fine aluminium group, the alloyed scrap of 8XXX system iron content and silicon, total input amount≤35% of waste material, wherein secondary waste≤30%;
Waste material uses the magnesium and silicon contained alloyed scrap of 6XXX system, total input amount≤5% of waste material, wherein secondary waste≤5%;
Total input amount >=60% of virgin aluminium ingot.
Preferred technical scheme is, the charge composition of described casting volume is:
Waste material uses the aluminium base foil alloyed scrap of described special PCB, total input amount≤30% of waste material, wherein secondary waste≤30%, virgin aluminium ingot >=70%.
Preferred technical scheme is, in described S2 step, the idiographic flow of rolling is: 8.0mm Casting Rolled Sheet → 5.0mm → 3.0mm → process annealing → 1.3mm → 0.7mm → rewind reel trimming → 0.38mm → turning paper tinsel rolls → and 0.25mm → be rolled down to finished product thickness → 0.2-0.1mm.
Preferred technical scheme is, the general working rate after described intermediate annealing process is 93.33-96.67%.
Beneficial effect of the present invention is as follows:
1, the present invention be Authorization Notice No. be the basis of CN102181642 is made improvement invention, on the basis of original technology, with high Fe, high Si for basic point, the chemical composition of pcb board base material is readjusted, add appropriate rare-earth element gadolinium (Gd), cerium (Ce), the aluminium base foil of new exclusive PCB is had more easily weld, intensity is higher, resistance to elevated temperatures is better, erosion resistance more by force, the better advantage of thermal diffusivity, be thus better than the PCB aluminum alloy base material described in CN102181642.
Rare earth element ce changes the crystal structure of alloy, improves the mechanical property of alloy; Along with the increase of Ce content, alloy grain refinement, but to a certain extent, crystal grain has the trend of alligatoring.Ce controls the best structural state that can ensure alloy in 0.10 ~ 0.15% scope.
Fe alloy tissue has two impacts, one, as long as there is appropriate Fe to exist, just significantly can reduces the solubleness of Mn in aluminium, grain segregation is reduced, and therefore improves after Fe content can prevent alloy from annealing and occurs texture of coarse crystal; They are two, MnAl years old
6in manganese atom can be replaced half by iron atom and form (Fe, Mn) Al
6, and (Fe, Mn) Al
6character is harder, and very crisp, appears in alloy structure in thick sheet, and alloy strength and plasticity are reduced, but due to the impact of rare earth element, is determined by the content of iron in the scope of 0.49 ~ 0.65, can ensure that alloy structure is optimum regime.
Si also reduces the solubleness of manganese in aluminium, and Si forms intermetallic compound T-phase (Al in the alloy
10mn
2si), distribute in square, alloy plasticity is reduced.When silicone content is not high (about more than 0.1%), can occur eutectic a+T+Si, goods crackle can be made to be inclined to be increased.But when Fe >=0.2% and Fe >=Si time, alloy crack proneness sharply declines.Therefore Si is set in 0.36 ~ 0.49% and gets final product effective control for product quality.
Mn has certain strengthening effect, and along with Fe content increases, alloy strength improves.Fe content controls below 0.25% by the present invention.
Zn can improve the dissolution potential of aluminium, and the aluminium sosoloid containing zinc has more negative electropotential, is-0.96v, and therefore, the aluminium alloy making coating material all contains a certain amount of zinc; The present invention is controlled below 0.15%.
Gd has good ductility, when Gd and Ce exists simultaneously, shows good mechanical property, but when it exceeds certain value, mechanical property will decline gradually, shows as best state when being controlled in 0.05 ~ 0.10%.
In aluminium, add Zn and Mg simultaneously, form strengthening phase MgZn
2, alloy produces obvious strengthening effect, and Cu and other elements can produce strengthening phase S(CuMgAl
2), thus improving alloy strength, Cu can reduce crystal boundary and intracrystalline potential difference, can suppress intergranular crack trend, improves Alloy Anti stress corrosion performance.In Al, Zn, Mg, Cu of trace exists, also can put forward heavy alloyed yield strength, the alloy after viscous deformation is made to have good elasticity, thin plate advantageously in 0.1mm thickness keeps planeness and warping resistance ability, in serial section buttress plate production process, folding line can be avoided, damage, the defect such as gravure occurs.
Ti is conventional Addition ofelements in aluminium alloy, adds molten aluminium, form Al with the continuous rod-like form of Al-5Ti-1B alloy
3ti and TiB
2phase, and heterogeneous necleus when becoming crystallization, play the effect of refinement Microstructure of roll casting, is conducive to alloy plasticity and improves.
2, the present invention has selected more aluminium scrap material, not only comprise 1XXX system fine aluminium group alloyed scrap, the magnesium and silicon contained alloyed scrap of 6XXX system, the alloyed scrap of 8XXX system iron content and silicon, further comprises the aluminium base foil waste material of special PCB that 3XXX system produces containing manganese alloy waste material and the present invention, add aluminium ingot and the rare earth element of aluminum content more than 99.50% again, leave standstill through smelting furnace melting and initial refining → standing furnace remove the gred with secondary refining → degasification tank degasification → filter cleaner → casting of strumbox two channels twin-stage ceramic filter plate becomes new exclusive PCB aluminium base foil alloy Casting Rolled Sheet, and then through cold rolling, process annealing, paper tinsel rolls and makes the aluminium base foil of the special PCB of alloy.It is wider that visible the present invention annexes waste extent, further saves cost, improve benefit.
In sum, the aluminium base foil of special PCB that the present invention's aluminium scrap material is produced, its plate shape is good, and tensile strength is high, clean surface, uniform color, scratch without wiping, folding line and damage, the defect such as gravure, steady quality; Mechanical property is high, have high thermal conductivity, is adapted to the machinings such as boring, punching and cutting, is more suitable for (PCC) power surface mount SMT technique; The utilization ratio of waste material is higher, and the waste extent be suitable for is wider, solves production scene waste material and farthest recycles problem, improve production environment.
Embodiment
Below in conjunction with embodiment, the specific embodiment of the present invention is further described.Following examples only for technical scheme of the present invention is clearly described, and can not limit the scope of the invention with this.
embodiment 1
The aluminium base foil of special PCB that aluminium mixing waste is produced, the chemical composition mass percent of the aluminium base special foil of described PCB is: Fe:0.49 ~ 0.65%, Si:0.36 ~ 0.49%, Ce:0.10 ~ 0.15%, Gd:0.05 ~ 0.10%, Mn:< 0.25%, Zn:< 0.15%, Ti:< 0.05%, Cu:< 0.045%, Mg:< 0.045%, surplus are Al.
The mass ratio of described Fe and Si is between 1.12 ~ 1.35.
The preparation technology of the aluminium base foil of special PCB produced with aluminium mixing waste, described technique comprises the steps:
S1: smelting furnace preparation → furnace charge preparation → shove charge → melt → stir with skim → adjusting component → stove in first time refining → converter and leaving standstill → second time refining → degasification tank degasification skim → filter cleaner → casting of strumbox two channels twin-stage ceramic filter plate becomes the casting of 8mm thickness to roll up;
S2: described casting volume is rolled, first casting volume is cold rolled to 3.0mm thickness, carries out process annealing, then continue to be rolled to 0.38mm thickness, turn paper tinsel and roll, then be rolling to desired thickness;
Described intermediate annealing process adopts the annealing of furnace gas temperature control method, that is: furnace temperature≤100 DEG C shove charge, is warmed up to 480 DEG C through 2 hours furnace temperature, is incubated 16 hours; Again furnace temperature was cooled to 420 DEG C through 1 hour, air cooling of coming out of the stove.
The charge composition of described casting volume is:
Waste material uses the alloyed scrap of 1XXX system fine aluminium group, 8XXX system iron content and silicon, total input amount≤25% of waste material, wherein secondary waste≤20%;
Waste material uses 3XXX system containing manganese waste material, total input amount≤10% of waste material, wherein secondary waste≤10%;
Waste material uses the magnesium and silicon contained alloyed scrap of 6XXX system, total input amount≤5% of waste material, wherein secondary waste≤5%;
Total input amount >=60% of virgin aluminium ingot.
In described S2 step, the idiographic flow of rolling is: 8.0mm Casting Rolled Sheet → 5.0mm → 3.0mm → process annealing → 1.3mm → 0.7mm → rewind reel trimming → 0.38mm → turning paper tinsel rolls → and 0.25mm → be rolled down to finished product thickness → 0.10mm.
General working rate after described intermediate annealing process is 96.67%.
The tensile strength of the aluminium base foil of described special PCB that described preparation technology produces is 200-220MPa.
embodiment 2
The aluminium base foil of special PCB that centre aluminium mixing waste is produced, the chemical composition mass percent of the aluminium base special foil of described PCB is: Fe:0.49 ~ 0.65%, Si:0.36 ~ 0.49%, Ce:0.10 ~ 0.15%, Gd:0.05 ~ 0.10%, Mn:< 0.25%, Zn:< 0.15%, Ti:< 0.05%, Cu:< 0.045%, Mg:< 0.045%, surplus are Al.
The mass ratio of described Fe and Si is between 1.12 ~ 1.35.
The preparation technology of the aluminium base foil of special PCB produced with aluminium mixing waste, described technique comprises the steps:
S1: smelting furnace preparation → furnace charge preparation → shove charge → melt → stir with skim → adjusting component → stove in first time refining → converter and leaving standstill → second time refining → degasification tank degasification skim → filter cleaner → casting of strumbox two channels twin-stage ceramic filter plate becomes the casting of 8mm thickness to roll up;
S2: described casting volume is rolled, first casting volume is cold rolled to 3.0mm thickness, carries out process annealing, continue to be rolled to 0.38mm thickness, then turn paper tinsel and roll, then be rolling to desired thickness;
Described intermediate annealing process adopts the annealing of furnace gas temperature control method, that is: furnace temperature≤100 DEG C shove charge, is warmed up to 480 DEG C through 2 hours furnace temperature, is incubated 16 hours; Again furnace temperature was cooled to 420 DEG C through 1 hour, air cooling of coming out of the stove.
The charge composition of described casting volume is:
Waste material uses the alloyed scrap of 1XXX system fine aluminium group, 8XXX system iron content and silicon, total input amount≤30% of waste material, wherein secondary waste≤25%;
Waste material uses 3XXX system containing manganese waste material, total input amount≤10% of waste material, wherein secondary waste≤10%;
Total input amount >=60% of virgin aluminium ingot.
In described S2 step, the idiographic flow of rolling is: 8.0mm Casting Rolled Sheet → 5.0mm → 3.0mm → process annealing → 1.3mm → 0.7mm → rewind reel trimming → 0.38mm → turning paper tinsel rolls → and 0.25mm → be rolled down to finished product thickness → 0.15mm.
General working rate after described annealing process is 95%.
The tensile strength of the aluminium base foil of described special PCB that described preparation technology produces is 190-210MPa.
embodiment 3
The aluminium base foil of special PCB that aluminium mixing waste is produced, the chemical composition mass percent of the aluminium base special foil of described PCB is: Fe:0.49 ~ 0.65%, Si:0.36 ~ 0.49%, Ce:0.10 ~ 0.15%, Gd:0.05 ~ 0.10%, Mn:< 0.25%, Zn:< 0.15%, Ti:< 0.05%, Cu:< 0.045%, Mg:< 0.045%, surplus are Al.
The mass ratio of described Fe and Si is between 1.12 ~ 1.35.
The preparation technology of the aluminium base foil of special PCB produced with aluminium mixing waste, described technique comprises the steps:
S1: smelting furnace preparation → furnace charge preparation → shove charge → melt → stir with skim → adjusting component → stove in first time refining → converter and leaving standstill → second time refining → degasification tank degasification skim → filter cleaner → casting of strumbox two channels twin-stage ceramic filter plate becomes the casting of 8mm thickness to roll up;
S2: described casting volume is rolled, first casting volume is cold rolled to 3.0mm thickness, carries out process annealing, when continuing to be rolled to 0.38mm thickness, then turn paper tinsel and roll, then be rolling to desired thickness;
Described intermediate annealing process adopts the annealing of furnace gas temperature control method, that is: furnace temperature≤100 DEG C shove charge, is warmed up to 480 DEG C through 2 hours furnace temperature, is incubated 16 hours; Again furnace temperature was cooled to 420 DEG C through 1 hour, air cooling of coming out of the stove.
Preferred technical scheme is, the charge composition of described casting volume is:
Waste material use 1XXX system fine aluminium group, the alloyed scrap of 8XXX system iron content and silicon, total input amount≤35% of waste material, wherein secondary waste≤30%;
Waste material uses the magnesium and silicon contained alloyed scrap of 6XXX system, total input amount≤5% of waste material, wherein secondary waste≤5%;
Total input amount >=60% of virgin aluminium ingot.
In described S2 step, the idiographic flow of rolling is: 8.0mm Casting Rolled Sheet → 5.0mm → 3.0mm → process annealing → 1.3mm → 0.7mm → rewind reel trimming → 0.38mm → turning paper tinsel rolls → and 0.25mm → be rolled down to finished product thickness → 0.2mm.
General working rate after described intermediate annealing process is 93.33%.
The tensile strength of the aluminium base foil of described special PCB that described preparation technology produces is 180-200MPa.
The aluminium base foil of PCB requires that aluminium alloy plate shape is good, tensile strength between 155 ~ 220MPa, clean surface, uniform color, scratch without wiping, folding line and damage, the defect such as gravure, environment for use is normal temperature, and the severe required chemical composition is not very high.Therefore use aluminium mixing waste to produce the optimum management of special PCB aluminium base foil Shi Lv processing enterprise, beautify production on-site environment, pursue performance of enterprises maximization, the most effectively selection and approach.
The aluminium base foil the key technical indexes of special PCB that the present invention produces is:
(a) alloy state: H18;
(b) dimensions and permissible variation:
Thickness × width × length: 0.1 ~ 0.2 ± 0.01 × 1245 ± 1 × 1092/1041/940 ± 1 mm, diagonal lines tolerance≤1mm;
(c) mechanical property: tensile strength 180 ~ 220 MPa, unit elongation >=1%;
(d) clean surface, uniform color, scratch without wiping, folding line and damage, the defect such as gravure;
E () surface flatness should be not more than 15I.
The special aluminium base foil novel alloy of PCB of the present invention is the new alloy in 8XXX line aluminium alloy, uses 0.1 ~ 0.2mm thickness PCB aluminium base foil mechanical property of this alloy production high, and has high thermal conductivity, is suitable for boring, punching and cutting; And the aluminium base foil of the special PCB of alloy of the present invention's research and development is based on 8XXX system alloy, add Mn, Zn, after the elements such as rare earth, the special advantage such as make the excellent features such as it has more easy welding, intensity is high, resistance to elevated temperatures good, erosion resistance is strong and thermal diffusivity is good, the process-cycle is short, cost is low, compared with other PCB material, be more suitable for (PCC) power SMT technique.
Simultaneously, the aluminium base foil of special PCB is produced with aluminium mixing waste, solve the timely recovery of the on-the-spot waste material of process for processing further and melt down, add the kind of waste recovery, shorten the waste material shelf-time, improve production management environment, accelerate turnover of funds, reduce production cost, improve economic benefit.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the technology of the present invention principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (3)
1., by a preparation technology for the aluminium base foil of special PCB of aluminium waste production, described technique comprises the steps:
S1: smelting furnace preparation → furnace charge preparation → shove charge → melt → stir with skim → adjusting component → stove in first time refining → converter and leaving standstill → second time refining → degasification tank degasification skim → filter cleaner → casting of strumbox two channels twin-stage ceramic filter plate becomes the casting of 8mm thickness to roll up;
S2: described casting volume is rolled, when first casting volume being cold rolled to 3.0mm thickness, carrying out intermediate annealing process, when continuing to be cold-rolled to 0.38mm thickness, then turn paper tinsel and roll, then be rolling to desired thickness;
Described intermediate annealing process adopts the annealing of furnace gas temperature control method, that is: furnace temperature≤100 DEG C shove charge, is warmed up to 480 DEG C through 2 hours furnace temperature, is incubated 16 hours; Again furnace temperature is cooled to 420 DEG C through 1 hour, be incubated 4 hours, air cooling of coming out of the stove;
The charge composition of described casting volume is: below any one,
A, waste material use the alloyed scrap of 1XXX system fine aluminium group, 8XXX system iron content and silicon, total input amount≤25% of waste material, wherein secondary waste≤20%;
Waste material uses 3XXX system containing manganese waste material, total input amount≤10% of waste material, wherein secondary waste≤10%;
Waste material uses the magnesium and silicon contained alloyed scrap of 6XXX system, total input amount≤5% of waste material, wherein secondary waste≤5%;
Total input amount >=60% of virgin aluminium ingot;
B, waste material use 1XXX system fine aluminium group, the alloyed scrap of 8XXX system iron content and silicon, total input amount≤30% of waste material, wherein secondary waste≤25%;
Waste material uses 3XXX system containing manganese waste material, total input amount≤10% of waste material, wherein secondary waste≤10%;
Total input amount >=60% of virgin aluminium ingot;
C, waste material use 1XXX system fine aluminium group, the alloyed scrap of 8XXX system iron content and silicon, total input amount≤35% of waste material, wherein secondary waste≤30%;
Waste material uses the magnesium and silicon contained alloyed scrap of 6XXX system, total input amount≤5% of waste material, wherein secondary waste≤5%;
Total input amount >=60% of virgin aluminium ingot;
D, waste material use the aluminium base foil alloyed scrap of described special PCB, total input amount≤30% of waste material, wherein secondary waste≤30%, virgin aluminium ingot >=70%.
2. as claimed in claim 1 by the preparation technology of the aluminium base foil of special PCB of aluminium waste production, it is characterized in that: in described S2 step, the idiographic flow of rolling is: 8.0mm Casting Rolled Sheet → 5.0mm → 3.0mm → process annealing → 1.3mm → 0.7mm → rewind reel trimming → 0.38mm → turning paper tinsel rolls → 0.25mm → be rolled down to finished product thickness → 0.2-0.1mm.
3. the preparation technology of the aluminium base foil of special PCB of aluminium waste production according to claim 2, is characterized in that: the general working rate after described intermediate annealing process is 93.33-96.67%.
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|---|---|---|---|
| CN201310322526.7A CN103409667B (en) | 2013-07-30 | 2013-07-30 | Novel dedicated PCB aluminum-based foil produced by aluminum scraps and preparation process of novel dedicated PCB aluminum-based foil |
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|---|---|---|---|
| CN201310322526.7A CN103409667B (en) | 2013-07-30 | 2013-07-30 | Novel dedicated PCB aluminum-based foil produced by aluminum scraps and preparation process of novel dedicated PCB aluminum-based foil |
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| CN109266912A (en) * | 2018-11-22 | 2019-01-25 | 贵阳市白云区科创生产力促进中心 | A method of the casting-rolling aluminum alloy and its manufacture double-zero aluminum foil of addition rare earth element |
| CN110093535A (en) * | 2019-06-12 | 2019-08-06 | 海安润嘉有色金属制品有限公司 | A kind of high intensity low thickness rare earth aluminium alloy band and its manufacturing method |
| CN113235023B (en) * | 2021-05-10 | 2022-05-31 | 广西正润新材料科技有限公司 | Low-voltage electronic aluminum foil for capacitor and preparation process thereof |
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| CN102021446A (en) * | 2010-12-21 | 2011-04-20 | 湖南晟通科技集团有限公司 | Method for manufacturing aluminum-alloy double-zero aluminum foil |
| CN102181642A (en) * | 2011-03-30 | 2011-09-14 | 江阴新仁科技有限公司 | PCB (Printed Circuit Board) base material produced by mixed waste and preparation method thereof |
| CN102796922A (en) * | 2012-08-17 | 2012-11-28 | 江阴新仁科技有限公司 | Alloy cathode foil which is special for capacitor and produced by continuous roll casting method and preparation method |
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2013
- 2013-07-30 CN CN201310322526.7A patent/CN103409667B/en active Active
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| CN102021446A (en) * | 2010-12-21 | 2011-04-20 | 湖南晟通科技集团有限公司 | Method for manufacturing aluminum-alloy double-zero aluminum foil |
| CN102181642A (en) * | 2011-03-30 | 2011-09-14 | 江阴新仁科技有限公司 | PCB (Printed Circuit Board) base material produced by mixed waste and preparation method thereof |
| CN102796922A (en) * | 2012-08-17 | 2012-11-28 | 江阴新仁科技有限公司 | Alloy cathode foil which is special for capacitor and produced by continuous roll casting method and preparation method |
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