CN103408799B - Modified nano silicon dioxide used for LED organosilicon packaging material, and preparation method thereof - Google Patents
Modified nano silicon dioxide used for LED organosilicon packaging material, and preparation method thereof Download PDFInfo
- Publication number
- CN103408799B CN103408799B CN201310321330.6A CN201310321330A CN103408799B CN 103408799 B CN103408799 B CN 103408799B CN 201310321330 A CN201310321330 A CN 201310321330A CN 103408799 B CN103408799 B CN 103408799B
- Authority
- CN
- China
- Prior art keywords
- silicon dioxide
- modified manometer
- encapsulating material
- led
- manometer silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Silicon Polymers (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention belongs to the field of organosilicon packaging material and discloses modified nano silicon dioxide used for LED organosilicon packaging material, and a preparation method and the application of the modified nano silicon dioxide. The modified nano silicon dioxide comprises the following components in parts by weight: 50 parts of nano silicon dioxide, 2 to 20 parts of hydrogenous chlorosilane monomer, 0.5 to 20 parts of phenyl silicone monomer and 500 to 2000 parts of organic solvent. When the modified nano silicon dioxide is applied to LED organosilicon packaging basis material, the comprehensive effect of improving the strength, the refractive index, the light transmittance and other optical properties of the material can be achieved, so that the LED organosilicon packaging material has the excellent properties such as high refracting index, high transparency, ultraviolet aging resistance and thermal aging resistance.
Description
Technical field
The invention belongs to organosilicon encapsulating material field, particularly a kind of LED used for packing material modified manometer silicon dioxide and preparation method thereof and application.
Background technology
LED encapsulation refers to the encapsulation of luminescence chip, and comparing integrated antenna package has relatively big difference.The encapsulation of LED not only requirement can be protected wick, but also can printing opacity, so the encapsulation of LED has special requirement to packaged material.Along with LED manufacturing technology is constantly perfect, its luminous efficiency, brightness and power all have increased significantly, and require packaged material to have the performances such as high optics, mechanics, electricity and resistance toheat.At present, LED packaged material is mainly epoxy resin and organosilicon material both at home and abroad.Organosilicon material has the good transparency, weathering resistance, insulativity and strong hydrophobicity etc., be widely used as LED packaged material, but its lower specific refractory power (1.40) and mechanical strength, limited again it conversely in the particularly application in high-end LED packaged material field of LED packaged material.
Nano silicon or titanium dioxide etc. carry out modification to organosilicon LED packaged material can effectively improve the performances such as its specific refractory power (1.40) and mechanical strength, but, nano silicon adopts the mode of physical blending more to the modification of LED packaged material at present, although this modification mode can make LED packaged material specific refractory power and mechanical property etc. be improved, but the increase along with nano-silicon dioxide particle addition, because the homogeneity of Nano particles of silicon dioxide and organosilicon body material is poor, cause the optical properties such as the transparency of organosilicon encapsulating material obviously to decline.
Summary of the invention
For overcoming shortcoming and defect of the prior art, primary and foremost purpose of the present invention is to provide a kind of modified manometer silicon dioxide that can simultaneously improve LED organosilicon encapsulating material specific refractory power, transmissivity, mechanical strength.
Another object of the present invention is to provide the preparation method of above-mentioned LED organosilicon encapsulating material with modified manometer silicon dioxide.
A further object of the present invention is to provide the application of above-mentioned modified manometer silicon dioxide in LED organosilicon encapsulating material.
Object of the present invention is achieved through the following technical solutions: a kind of LED organosilicon encapsulating material modified manometer silicon dioxide, and described LED organosilicon encapsulating material is comprised of the following component of meter by weight with modified manometer silicon dioxide:
The particle diameter of described nano silicon is 50～500nm.
Described has following structure containing silicon hydride chlorid monomer:
or
in a kind of or mixture of two kinds;
Wherein, R is CH
3, CH
2cH
3or Ph.
Described is a kind of in phenyl three (dimethyl siloxane) silane, phenyl three (trimethylsiloxane group) silane, dimethoxydiphenylsilane, phenylbenzene diethoxy silane, phenyltrimethoxysila,e and phenyl triethoxysilane or at least two kinds containing phenyl siloxane monomer.
Described organic solvent is a kind of in tetrahydrofuran (THF), benzene, toluene and butanone or at least two kinds.
The preparation method of modified manometer silicon dioxide for above-mentioned LED organosilicon encapsulating material, comprises following operation steps:
By the packing in reactor containing phenyl siloxane monomer, 500～2000 weight part organic solvents containing silicon hydride chlorid monomer, 0.5～20 weight part of the nano silicon of 50 weight parts, 2～20 weight parts, mix and stir, again mixture is reacted 3～10 hours at 30～100 ℃, at 40～100 ℃, rotary evaporation is removed organic solvent, then adding triethylamine to regulate PH is 6～8, distilled water wash, finally at 50～80 ℃, vacuum-drying obtains modified manometer silicon dioxide.
Described reactor is the reactor with stirrer, condensing reflux pipe and thermometer; The number of times of described distilled water wash is 5～10 times.
The application of above-mentioned modified manometer silicon dioxide in preparation LED organosilicon encapsulating material, described application is according to following operation steps: meter by weight, 0.5～60 part of modified manometer silicon dioxide, the containing hydrogen silicone oil of 5～100 parts, the vinyl silicone oil of 5～100 parts, the catalyzer of 0.0001～0.01 part are placed in to open container, under normal temperature, stir, under 60～150 ℃ of vacuum conditions, react 0.3～2 hour, obtain the LED organosilicon encapsulating material that contains modified manometer silicon dioxide.
Described catalyzer is Platinic chloride, H
2ptCl
6tetrahydrofuran solution, H
2ptCl
6aqueous isopropanol, Pt (PPh
3)
4, Cp
2the mixture of one or both in the platinum complex of the platinum complex of PtCl, the coordination of ethylene methacrylic radical siloxane, the platinum complex of diethyl phthalate coordination, dicyclopentadiene platinum dichloride and dichloro two (triphenylphosphine);
Described containing hydrogen silicone oil is more than one in Methyl Hydrogen Polysiloxane Fluid, methyl and phenyl hydrogen-containing silicon oil, and the molar content of hydrogen is 0.2%～1.45%;
Described vinyl silicone oil is more than one in methyl vinyl silicon oil, methyl phenyl vinyl silicone oil, and the molar content of vinyl is 0.1%～2.3%.
The present invention compared with prior art tool has the following advantages and beneficial effect:
(1) adopt and have containing silicon hydride chlorid, the condensation that is hydrolyzed of phenyl siloxane and nano silicon obtains the modified manometer silicon dioxide containing the high refractive index of silicon-hydrogen bond, utilize the Si-H group on modified manometer silicon dioxide to participate in the addition reaction of silicon with hydrogen of LED organosilicon encapsulation matrix material, the agglomeration traits of having avoided nano silicon and the blend of LED organosilicon encapsulation matrix Material Physics to cause is more obvious to organosilicon material reinforcement.
(2) adopt and have containing silicon hydride chlorid, phenyl siloxane and nano silicon are hydrolyzed condensation must be containing the modified manometer silicon dioxide of the high refractive index of silicon-hydrogen bond, owing to having introduced the phenyl siloxane of high refractive index in modified manometer silicon dioxide, therefore, with this modified manometer silicon dioxide, add in LED organosilicon encapsulating compound, overcome the problem of the optical property reduction that makes organosilicon encapsulating material adding of nano silicon.
(3) prepared modified manometer silicon dioxide is applied to the performance that LED organosilicon encapsulating material has the excellences such as high refractive index, high-clarity, excellent ultraviolet aging resistance and heat-proof aging.
Embodiment
Below in conjunction with embodiment, the present invention is done to further detailed description, but embodiments of the present invention are not limited to this.
Embodiment 1
1, the preparation method of modified manometer silicon dioxide for a kind of LED organosilicon encapsulating material
The nano silicon of 50g (particle diameter is 50nm), the diphenyl dichlorosilane of 2g, the dimethoxydiphenylsilane of 10g, 1500g butanone are packed into possess stirrer, in the reactor of condensing reflux pipe and thermometer, mix and stir, then mixture is reacted 8 hours at 30 ℃, at 50 ℃, rotary evaporation is removed organic solvent, then adding triethylamine to regulate PH is 6 rear distilled water wash 5 times, and then at 60 ℃, vacuum-drying obtains modified manometer silicon dioxide.
2, the application of modified manometer silicon dioxide in LED organosilicon encapsulating material
0.2%), (contents of ethylene is: for the methyl vinyl silicon oil of 80g 1.2%), the H of 0.0001g (hydrogen content is the methyl and phenyl hydrogen-containing silicon oil of modified manometer silicon dioxide 0.5g, the 100g of step 1 preparation:
2ptCl
6tetrahydrofuran solution be placed in open container, under normal temperature, stir, at 100 ℃, under vacuum condition, react 0.3 hour the cured article of the LED organosilicon encapsulating material that obtains containing modified manometer silicon dioxide.The cured article of the LED organosilicon encapsulating material that gained is contained to modified manometer silicon dioxide carries out Performance Detection, and result is as follows:
Performance: refraction coefficient 1.50, transmittance 95%, hardness Shao Shi A35.
Transmissivity: press GB/T2410-2008 and measure; Specific refractory power: press GB/T6488-2008 and measure; Hardness: press GB/T2411-2008 and measure.
Embodiment 2
1, the preparation method of modified manometer silicon dioxide for a kind of LED organosilicon encapsulating material
The nano silicon of 50g (particle diameter is 500nm), the diphenyl chlorosilane of 10g, 10g dimethylchlorosilane, the dimethoxydiphenylsilane of 5g, 800g tetrahydrofuran (THF) are packed into possess stirrer, in the reactor of condensing reflux pipe and thermometer, mix and stir, then mixture is reacted 10 hours at 50 ℃, at 40 ℃, rotary evaporation is removed organic solvent, then adding triethylamine to regulate PH is 8 rear distilled water wash 8 times, and then at 75 ℃, vacuum-drying obtains modified manometer silicon dioxide.
2, the application of modified manometer silicon dioxide in LED organosilicon encapsulating material
1.45%), (contents of ethylene is: for the phenyl-vinyl silicon oil of 8g 2.01%), the Pt (PPh of 0.0005g (hydrogen content is the methyl and phenyl hydrogen-containing silicon oil of modified manometer silicon dioxide 5g, the 5g of step 1 preparation:
3)
4be placed in open container, under normal temperature, stir, at 70 ℃, under vacuum condition, react 0.5 hour, the cured article of the LED organosilicon encapsulating material that obtains containing modified manometer silicon dioxide.The cured article of the LED organosilicon encapsulating material that gained is contained to modified manometer silicon dioxide carries out Performance Detection, and result is as follows:
Performance: refraction coefficient 1.55, transmittance 96%, hardness Shao Shi A42.
Transmissivity: press GB/T2410-2008 and measure; Specific refractory power: press GB/T6488-2008 and measure; Hardness: press GB/T2411-2008 and measure.
Embodiment 3
1, the preparation method of modified manometer silicon dioxide for a kind of LED organosilicon encapsulating material
The nano silicon of 50g (particle diameter is 200nm), the dimethylchlorosilane of 5g, the phenyl of 15g three (dimethyl siloxane) silane, 1000g toluene are packed into possess stirrer, in the reactor of condensing reflux pipe and thermometer, mix and stir, then mixture is reacted 3 hours at 100 ℃, at 80 ℃, rotary evaporation is removed organic solvent, then adding triethylamine to regulate PH is 7 rear distilled water wash 5 times, and then at 80 ℃, vacuum-drying obtains modified manometer silicon dioxide.
2, the application of modified manometer silicon dioxide in LED organosilicon encapsulating material
1.23%), (contents of ethylene is: for the methyl vinyl silicon oil of 5g 1.52%), the Pt (PPh of 0.002g (hydrogen content is the Methyl Hydrogen Polysiloxane Fluid of modified manometer silicon dioxide 10g, the 20g of step 1 preparation:
3)
4, 0.003g Cp
2ptCl is placed in open container, under normal temperature, stirs, and at 60 ℃, reacts 1 hour under vacuum condition, the cured article of the LED organosilicon encapsulating material that obtains containing modified manometer silicon dioxide.The cured article of the LED organosilicon encapsulating material that gained is contained to modified manometer silicon dioxide carries out Performance Detection, and result is as follows:
Performance: refraction coefficient 1.53, transmittance 93%, hardness Shao Shi A40.
Transmissivity: press GB/T2410-2008 and measure; Specific refractory power: press GB/T6488-2008 and measure; Hardness: press GB/T2411-2008 and measure.
Embodiment 4
1, the preparation method of modified manometer silicon dioxide for a kind of LED organosilicon encapsulating material
The nano silicon of 50g (particle diameter is 100nm), the ethyl dichlorosilane of 15g, the dimethoxydiphenylsilane list of 0.5g, 500g toluene are packed into possess stirrer, in the reactor of condensing reflux pipe and thermometer, mix and stir, then mixture is reacted 6 hours at 80 ℃, at 100 ℃, rotary evaporation is removed organic solvent, then adding triethylamine to regulate PH is 7 rear distilled water wash 10 times, and then at 60 ℃, vacuum-drying obtains modified manometer silicon dioxide.
2, the application of modified manometer silicon dioxide in LED organosilicon encapsulating material
0.51%), (contents of ethylene is: for the methyl phenyl vinyl silicone oil of 30g 2.3%), the platinum complex of the diethyl phthalate coordination of 0.01g is placed in open container (hydrogen content is the methyl and phenyl hydrogen-containing silicon oil of modified manometer silicon dioxide 60g, the 40g of step 1 preparation:, under normal temperature, stir, under 120 ℃ of vacuum conditions, react 1.5 hours the cured article of the LED organosilicon encapsulating material that obtains containing modified manometer silicon dioxide.The cured article of the LED organosilicon encapsulating material that gained is contained to modified manometer silicon dioxide carries out Performance Detection, and result is as follows:
Performance: refraction coefficient 1.51, transmittance 90%, hardness Shao Shi A50.
Transmissivity: press GB/T2410-2008 and measure; Specific refractory power: press GB/T6488-2008 and measure; Hardness: press GB/T2411-2008 and measure.
Embodiment 5
1, the preparation method of modified manometer silicon dioxide for a kind of LED organosilicon encapsulating material
By the nano silicon of 50g (particle diameter is 150nm), the diphenyl dichlorosilane of 5g, the diphenyl chlorosilane of 5g, the phenyltrimethoxysila,e of 5g, 10g dimethoxydiphenylsilane, 5g phenylbenzene diethoxy silane, 2000g tetrahydrofuran (THF) packs into and possesses stirrer, in the reactor of condensing reflux pipe and thermometer, mix and stir, then mixture is reacted 5 hours at 60 ℃, at 60 ℃, rotary evaporation is removed organic solvent, then adding triethylamine to regulate PH is 6 rear distilled water wash 6 times, then at 50 ℃, vacuum-drying obtains modified manometer silicon dioxide.
2, the application of modified manometer silicon dioxide in LED organosilicon encapsulating material
1.05%), (contents of ethylene is: for the methyl phenyl vinyl silicone oil of 100g 0.1%), the platinum complex of the ethylene methacrylic radical siloxane coordination of 0.008g is placed in open container (hydrogen content is the Methyl Hydrogen Polysiloxane Fluid of modified manometer silicon dioxide 20g, the 80g of step 1 preparation:, under normal temperature, stir, at 150 ℃, under vacuum condition, react 2 hours the cured article of the LED organosilicon encapsulating material that obtains containing modified manometer silicon dioxide.The cured article of the LED organosilicon encapsulating material that gained is contained to modified manometer silicon dioxide carries out Performance Detection, and result is as follows:
Performance: refraction coefficient 1.50, transmittance 93%, hardness Shao Shi A34.
Transmissivity: press GB/T2410-2008 and measure; Specific refractory power: press GB/T6488-2008 and measure; Hardness: press GB/T2411-2008 and measure.
Comparative example
1, nano-silicon dioxide modified LED organosilicon encapsulating material
Common nano silicon 20g(particle diameter is 200nm), 0.51%), (contents of ethylene is: for the methyl phenyl vinyl silicone oil of 50g 0.1%), the H of 0.006g (hydrogen content is: for the Methyl Hydrogen Polysiloxane Fluid of 30g
2ptCl
6aqueous isopropanol be placed in open container, under normal temperature, stir, under 120 ℃ of vacuum conditions, react 0.8 hour the cured article of the LED organosilicon encapsulating material that obtains containing modified manometer silicon dioxide.The cured article of the LED organosilicon encapsulating material that gained is contained to modified manometer silicon dioxide carries out Performance Detection, and result is as follows:
Performance: ultraviolet aging resistance is good, refraction coefficient 1.42, transmittance 86%, hardness Shao Shi A30.
Transmissivity: press GB/T2410-2008 and measure; Specific refractory power: press GB/T6488-2008 and measure; Hardness: press GB/T2411-2008 and measure.
Above-described embodiment is preferably embodiment of the present invention; but embodiments of the present invention are not restricted to the described embodiments; other any do not deviate from change, the modification done under spirit of the present invention and principle, substitutes, combination, simplify; all should be equivalent substitute mode, within being included in protection scope of the present invention.
Claims (7)
1. a LED organosilicon encapsulating material modified manometer silicon dioxide, is characterized in that: described LED organosilicon encapsulating material is comprised of the following component of meter by weight with modified manometer silicon dioxide:
Described has following structure containing silicon hydride chlorid monomer:
or
in a kind of or mixture of two kinds;
Wherein, R is CH
3, CH
2cH
3or Ph;
Described is a kind of in phenyl three (dimethyl siloxane) silane, phenyl three (trimethylsiloxane group) silane, dimethoxydiphenylsilane, phenylbenzene diethoxy silane, phenyltrimethoxysila,e and phenyl triethoxysilane or at least two kinds containing phenyl siloxane monomer.
2. LED organosilicon encapsulating material modified manometer silicon dioxide according to claim 1, is characterized in that: the particle diameter of described nano silicon is 50～500nm.
3. LED organosilicon encapsulating material modified manometer silicon dioxide according to claim 1, is characterized in that: described organic solvent is a kind of in tetrahydrofuran (THF), benzene, toluene and butanone or at least two kinds.
4. the preparation method of modified manometer silicon dioxide for LED organosilicon encapsulating material according to claim 1, is characterized in that comprising following operation steps:
By the packing in reactor containing phenyl siloxane monomer, 500～2000 weight part organic solvents containing silicon hydride chlorid monomer, 0.5～20 weight part of the nano silicon of 50 weight parts, 2～20 weight parts, mix and stir, again mixture is reacted 3～10 hours at 30～100 ℃, at 40～100 ℃, rotary evaporation is removed organic solvent, then adding triethylamine to regulate pH is 6～8, distilled water wash, finally at 50～80 ℃, vacuum-drying obtains modified manometer silicon dioxide.
5. preparation method according to claim 4, is characterized in that: described reactor is the reactor with stirrer, condensing reflux pipe and thermometer; The number of times of described distilled water wash is 5～10 times.
6. the application of modified manometer silicon dioxide according to claim 1 in preparation LED organosilicon encapsulating material, it is characterized in that: described application is according to following operation steps: meter by weight, 0.5～60 part of modified manometer silicon dioxide, the containing hydrogen silicone oil of 5～100 parts, the vinyl silicone oil of 5～100 parts, the catalyzer of 0.0001～0.01 part are placed in to open container, under normal temperature, stir, under 60～150 ℃ of vacuum conditions, react 0.3～2 hour, obtain the LED organosilicon encapsulating material that contains modified manometer silicon dioxide.
7. application according to claim 6, is characterized in that: described catalyzer is Platinic chloride, H
2ptCl
6tetrahydrofuran solution, H
2ptCl
6aqueous isopropanol, Pt (PPh
3)
4, Cp
2the mixture of one or both in the platinum complex of the platinum complex of PtCl, the coordination of ethylene methacrylic radical siloxane, the platinum complex of diethyl phthalate coordination, dicyclopentadiene platinum dichloride and dichloro two (triphenylphosphine);
Described containing hydrogen silicone oil is more than one in Methyl Hydrogen Polysiloxane Fluid, methyl and phenyl hydrogen-containing silicon oil, and the molar content of hydrogen is 0.2%～1.45%;
Described vinyl silicone oil is more than one in methyl vinyl silicon oil, methyl phenyl vinyl silicone oil, and the molar content of vinyl is 0.1%～2.3%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310321330.6A CN103408799B (en) | 2013-07-26 | 2013-07-26 | Modified nano silicon dioxide used for LED organosilicon packaging material, and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310321330.6A CN103408799B (en) | 2013-07-26 | 2013-07-26 | Modified nano silicon dioxide used for LED organosilicon packaging material, and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103408799A CN103408799A (en) | 2013-11-27 |
| CN103408799B true CN103408799B (en) | 2014-09-10 |
Family
ID=49601847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310321330.6A Active CN103408799B (en) | 2013-07-26 | 2013-07-26 | Modified nano silicon dioxide used for LED organosilicon packaging material, and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103408799B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117819919B (en) * | 2024-03-04 | 2024-04-30 | 德州润德混凝土有限公司 | Light anti-cracking high-performance concrete and preparation method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7791093B2 (en) * | 2007-09-04 | 2010-09-07 | Koninklijke Philips Electronics N.V. | LED with particles in encapsulant for increased light extraction and non-yellow off-state color |
| CN101457022A (en) * | 2007-12-12 | 2009-06-17 | 深圳大学 | Production method of high refractive index nano modified organosilicon encapsulating material |
| CN102993753B (en) * | 2012-11-23 | 2015-08-05 | 中科院广州化学有限公司 | A kind of composite hybridization organosilicon LED encapsulation material and its preparation method and application |
-
2013
- 2013-07-26 CN CN201310321330.6A patent/CN103408799B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN103408799A (en) | 2013-11-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102391529B (en) | Preparation method of silicone resin type organic/inorganic hybrid material for packaging | |
| CN102181159B (en) | Polysilsesquioxane reinforced light emitting diode (LED) encapsulation organic silicon rubber and preparation method thereof | |
| CN102993753B (en) | A kind of composite hybridization organosilicon LED encapsulation material and its preparation method and application | |
| CN101891893B (en) | Preparation method of phenyl-based hydrogen-based silicone resin for encapsulating LED | |
| CN101343365A (en) | Preparation method for methyl phenyl vinyl polysiloxane for packaging LED | |
| CN101215381B (en) | Method for preparing methylphenyl hydrogen-containing silicone oil | |
| CN103131189B (en) | Inorganic or organic hybridization nanocomposite for packaging light emitting diode (LED) and preparation method thereof | |
| CN103408947B (en) | A kind of can the high-performance LED encapsulation material and preparation method thereof of dual cure | |
| CN104710621B (en) | Substrate bonding phenyl vinyl polysiloxane and its preparation method and application | |
| CN102850804B (en) | Transparent two-component organic silicon pouring sealant for LED and preparation method thereof | |
| CN102268186A (en) | Composition for thermosetting silicone resin | |
| CN103360603B (en) | A kind of LED phenyl vinyl polysiloxane and preparation method thereof | |
| TW200835722A (en) | Aryl (thio) ether aryl polysiloxane composition and methods for making and using same | |
| CN101323667A (en) | Preparation of methyl vinyl MQ resin for LED encapsulated strengthening | |
| CN106433551A (en) | Thermal shock resistant high-refraction LED packaging glue composition and preparation method thereof | |
| Fan et al. | Preparation and origin of thermally resistant biobased epoxy resin with low internal stress and good UV resistance based on SiO2 hybridized cellulose for light emitting diode encapsulation | |
| CN106459587A (en) | Polycarbosiloxane containing curable compositions for LED encapsulants | |
| CN102532900B (en) | Organosilicon lens material for power type light-emitting diode (LED) packaging | |
| CN103848990A (en) | High-refractive index vinyl phenyl silicon resin for light-emitting diode (LED) package | |
| CN103289096A (en) | Preparation method and application of polyhedral oligomeric silsesquioxane skeleton containing vinyl silicone oil | |
| CN106381121A (en) | Transparent organic pouring sealant | |
| CN103408799B (en) | Modified nano silicon dioxide used for LED organosilicon packaging material, and preparation method thereof | |
| CN105778100B (en) | A kind of organic silicon rigidity-increasing stick and preparation method thereof and a kind of addition-type silicon rubber composition | |
| CN103074030B (en) | Organosilicon bismaleimide conductive adhesive for LED | |
| CN103305183B (en) | The wind energy assembly embedding two component RTV joint sealant of add-on type |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |