CN103407254A - Heat-conducting interface material capable of eliminating surface static electricity and preparation method thereof - Google Patents
Heat-conducting interface material capable of eliminating surface static electricity and preparation method thereof Download PDFInfo
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- CN103407254A CN103407254A CN2013103267467A CN201310326746A CN103407254A CN 103407254 A CN103407254 A CN 103407254A CN 2013103267467 A CN2013103267467 A CN 2013103267467A CN 201310326746 A CN201310326746 A CN 201310326746A CN 103407254 A CN103407254 A CN 103407254A
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Abstract
The invention relates to heat-conducting interface material capable of eliminating surface static electricity and a preparation method of the heat-conducting interface material. The heat conducting interface material comprises a semi-finished silica gel gasket and a surface dielectric-layer material, wherein the semi-finished silica gel gasket comprises the following ingredients by weight: 100 parts of resin matrix, 250-400 parts of heat conducting filler and additive, wherein the weight of the additive is 1%-10% of that of heat conducting filler; the surface dielectric-layer material comprises conductive aluminum-foil paper, conductive silver paper and a type of film with an aluminum coating. The heat conducting interface material prepared through the preparation method not only has the inherent performance of the conventional heat conducting interface material but also has the function of eliminating static electricity of devices.
Description
Technical field
The present invention relates to a kind of heat-conducting interface material of eliminating surface electrostatic and preparation method thereof, be applicable to the electronics production field.
Background technology
Electronic devices and components can produce a large amount of heat when work, and, because heat can't be discharged, at high temperature carry out for a long time work, and material is easy to aging, and the life-span obviously shortens, and causes component failure to be scrapped.
And because electronic device often can produce static in running, static gathers and release, tend to electromagnetic interference occurs between electronic device, thereby affect the normal operation of equipment.
So developing a kind of boundary material of not only can heat conduction but also can eliminate surface electrostatic has been instant.The boundary material of this specific function is different from traditional heat-conducting interface material, has only played the effect of heat conduction, and, in current electronic application field, more and more payes attention to for diversity and the particularity of this function.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of heat-conducting interface material of eliminating surface electrostatic and preparation method thereof, heat-conducting interface material prepared by the present invention had both had the intrinsic performance of heat-conducting interface material, made again a side surface have the effect of abatement device static.
The technical scheme that the present invention solves the problems of the technologies described above is as follows: a kind of heat-conducting interface material of eliminating surface electrostatic comprises: silica gel pad semi-finished product and surface dielectric layer material, and the silica gel pad semi-finished product are the cream state, have mobility,
Wherein, described silica gel pad semi-finished product comprise that the heat-conducting filler of resin matrix, 250～400 weight portions of 100 weight portions and weight are 1%～10% auxiliary agents of heat-conducting filler weight,
Described surface dielectric layer material comprises the conductive aluminum foil paper, conduction tinfoil, a kind of in the aluminized coating film.
On the basis of technique scheme, the present invention can also do following improvement.
Further, described heat-conducting filler comprises one or more the mixture in aluminium oxide, zinc oxide, boron nitride, aluminium nitride, titanium oxide, aluminium hydroxide.
Further, described auxiliary agent comprises one or more the mixture in silane coupler, aluminate coupling agent, titanate coupling agent, silane crosslinker, dispersant, defoamer.
The present invention also provides a kind of preparation method who eliminates the heat-conducting interface material of surface electrostatic, comprising:
1) get the side surface that surface conditioning agent is coated in the surface dielectric layer material, coating thickness is 0.1～0.15mm, 100 ℃～150 ℃ bakings 5～10 minutes, until surface conditioning agent is dried fully;
2) take resin matrix and auxiliary agent, mix, stir, after having stirred, add heat-conducting filler in said mixture, stir, obtain the silica gel pad semi-finished product;
3) by 2) the silica gel pad semi-finished product that obtain are coated on 1) side surface (being that face of surface dielectric layer material coating surface inorganic agent) of the surface dielectric layer material processed, coating thickness is 0.5mm～10mm, use the format roll moulding desired thickness (heat-conducting interface material of 0.5mm～10mm), solidify, obtain
Wherein, described silica gel pad semi-finished product comprise that the heat-conducting filler of resin matrix, 250～400 weight portions of 100 weight portions and weight are 1%～10% auxiliary agents of heat-conducting filler weight.
On the basis of technique scheme, the present invention can also do following improvement.
Further, in step 1), described surface conditioning agent comprises in alcohol, acetone, toluene, natural rubber, butyl rubber, silicon rubber, ethylene propylene diene rubber the mixture of one or more.
The beneficial effect that adopts this step is to strengthen surface dielectric layer material and the half-finished adhesiveness of silica gel pad.
Further, in step 2) in, described stirring technique condition is: be vacuum defoamation under-0.1MPa 20～40 minutes in vacuum.
Further, in step 3), describedly be cured as 130 ℃ and solidified 20～40 minutes.
The beneficial effect that adopts above-mentioned further scheme is to make the material deaeration, and after hot setting, the product surface light is smooth, thereby can guarantee the heat-conducting effect of material.
The invention has the beneficial effects as follows:
The present invention is composite surface dielectric layer material in the moulding heat-conducting pad, and the heat-conducting interface material of preparing had both had the intrinsic performance of heat-conducting interface material, makes again a side surface have the effect of abatement device static.
The specific embodiment
Below principle of the present invention and feature are described, example, only be used to explaining the present invention, is not intended to limit scope of the present invention.
Embodiment 1
By alcohol and ethylene propylene diene rubber 1:1 mixing in mass ratio, obtain surface conditioning agent, surface conditioning agent is coated in to a side surface of conductive aluminum foil paper, coating thickness is 0.1～0.15mm, baking is 10 minutes under 120 ℃, until surface conditioning agent is dried fully.
Accurately take organic siliconresin 100 weight portions, and add the Pt catalyst of 25 weight portions, add in mixing and blending machine, under vacuum-0.1MPa, stirred 40 minutes, after having stirred, to the alumina powder that adds 350 weight portions in said mixture, under vacuum-0.1MPa, stir discharging after 35 minutes, obtain the silica gel pad semi-finished product, the silica gel pad semi-finished product are coated on to the surface-treated side surface of conductive aluminum foil paper, use the thick heat-conducting interface material of format roll moulding 0.5mm～10mm, 130 ℃ solidified 20 minutes, must eliminate the heat-conducting interface material of surface electrostatic.
Embodiment 2
By toluene and silicon rubber 1:1 mixing in mass ratio, obtain surface conditioning agent, be coated in a side surface of conduction tinfoil, coating thickness is 0.1～0.15mm, baking is 10 minutes at the temperature of 120 ℃, until surface conditioning agent is dried fully.
Accurately take organic siliconresin 100 weight portions, and add the inhibitor of 25 weight portions, add in mixing and blending machine, under vacuum-0.1MPa, stirred 40 minutes, after having stirred, to the aluminium hydroxide that adds 350 weight portions in said mixture, under vacuum-0.1MPa, stir discharging after 35 minutes, obtain the silica gel pad semi-finished product, the silica gel pad semi-finished product are coated on to the surface-treated side surface of conduction tinfoil, use the thick heat-conducting interface material of format roll moulding 0.5mm～10mm, 130 ℃ solidify after 20 minutes, must eliminate the heat-conducting interface material of surface electrostatic.
The present invention is to the heat-conducting interface material of embodiment 1,2 preparation with according to the method for embodiment 1,2, and the heat-conducting interface material for preparing of composite surface dielectric layer does not contrast, test surfaces resistance (ohm-cm), and experimental result is as shown in table 1.
Table 1 experimental result
From above-described embodiment, can illustrate, heat-conducting interface material is after eliminating the surface electrostatic processing, and sheet resistance obviously reduces, thereby surface electrostatic is relatively easily derived, so play the effect of eliminating surface electrostatic.
The foregoing is only preferred embodiment of the present invention, in order to limit the present invention, within the spirit and principles in the present invention not all, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (7)
1. a heat-conducting interface material of eliminating surface electrostatic, is characterized in that, comprising: silica gel pad semi-finished product and surface dielectric layer material,
Wherein, described silica gel pad semi-finished product comprise that the heat-conducting filler of resin matrix, 250～400 weight portions of 100 weight portions and weight are 1%～10% auxiliary agents of heat-conducting filler weight,
Described surface dielectric layer material comprises a kind of in conductive aluminum foil paper, conduction tinfoil, aluminized coating film.
2. heat-conducting interface material according to claim 1, is characterized in that, described heat-conducting filler comprises one or more the mixture in aluminium oxide, zinc oxide, boron nitride, aluminium nitride, titanium oxide, aluminium hydroxide.
3. heat-conducting interface material according to claim 1, is characterized in that, described auxiliary agent comprises one or more the mixture in silane coupler, aluminate coupling agent, titanate coupling agent, silane crosslinker, dispersant, defoamer.
4. a preparation method who eliminates the heat-conducting interface material of surface electrostatic, is characterized in that, comprising:
1) get the side surface that surface conditioning agent is coated in the surface dielectric layer material, coating thickness is 0.1～0.15mm, 100 ℃～150 ℃ bakings 5～10 minutes, until surface conditioning agent is dried fully;
2) take resin matrix and auxiliary agent, mix, stir, after having stirred, add heat-conducting filler in said mixture, stir, obtain the silica gel pad semi-finished product;
3) by 2) the silica gel pad semi-finished product that obtain are coated on 1) side surface of the surface dielectric layer material processed, coating thickness is 0.5mm～10mm, uses the heat-conducting interface material of format roll moulding desired thickness, solidifies, obtain,
Wherein, described silica gel pad semi-finished product comprise that the heat-conducting filler of resin matrix, 250～400 weight portions of 100 weight portions and weight are 1%～10% auxiliary agents of heat-conducting filler weight.
5. preparation method according to claim 4, is characterized in that, in step 1), described surface conditioning agent comprises one or more mixing in alcohol, acetone, toluene, natural rubber, butyl rubber, silicon rubber, ethylene propylene diene rubber.
6. preparation method according to claim 4, is characterized in that, in step 2) in, described stirring technique condition is: be vacuum defoamation under-0.1MPa 20～40 minutes in vacuum.
7. preparation method according to claim 4, is characterized in that, in step 3), describedly is cured as 130 ℃ and solidified 20～40 minutes.
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| CN201310326746.7A CN103407254B (en) | 2013-07-30 | 2013-07-30 | A kind of heat-conducting interface material eliminating surface electrostatic and preparation method thereof |
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| CN201310326746.7A CN103407254B (en) | 2013-07-30 | 2013-07-30 | A kind of heat-conducting interface material eliminating surface electrostatic and preparation method thereof |
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| CN103407254B CN103407254B (en) | 2015-09-23 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105196647A (en) * | 2015-10-14 | 2015-12-30 | 文雪烽 | Interface material used for eliminating surface static electricity |
| CN105315970A (en) * | 2015-11-16 | 2016-02-10 | 华中科技大学 | Thermal interface material for chip testing and preparation method of thermal interface material |
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| CN1495245A (en) * | 2002-09-02 | 2004-05-12 | 信越化学工业株式会社 | Heat-conducting composite sheet and preparing method thereof |
| JP2006348238A (en) * | 2005-06-20 | 2006-12-28 | Furukawa Sky Kk | Undercoating resin composition for hydrophilic coating and aluminum alloy coated plate |
| CN101225234A (en) * | 2008-02-01 | 2008-07-23 | 南京凯汇工业科技有限公司 | Heat conductive insulating material and preparation method thereof |
| CN101343402A (en) * | 2008-08-27 | 2009-01-14 | 南亚塑胶工业股份有限公司 | Resin composition with high-heat, high-glass transition temperature for printed circuit board, prepreg and coating substance |
| CN201690669U (en) * | 2010-05-06 | 2010-12-29 | 冠捷显示科技（厦门）有限公司 | Anti-static component for display |
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- 2013-07-30 CN CN201310326746.7A patent/CN103407254B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1495245A (en) * | 2002-09-02 | 2004-05-12 | 信越化学工业株式会社 | Heat-conducting composite sheet and preparing method thereof |
| JP2006348238A (en) * | 2005-06-20 | 2006-12-28 | Furukawa Sky Kk | Undercoating resin composition for hydrophilic coating and aluminum alloy coated plate |
| CN101225234A (en) * | 2008-02-01 | 2008-07-23 | 南京凯汇工业科技有限公司 | Heat conductive insulating material and preparation method thereof |
| CN101343402A (en) * | 2008-08-27 | 2009-01-14 | 南亚塑胶工业股份有限公司 | Resin composition with high-heat, high-glass transition temperature for printed circuit board, prepreg and coating substance |
| CN201690669U (en) * | 2010-05-06 | 2010-12-29 | 冠捷显示科技（厦门）有限公司 | Anti-static component for display |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105196647A (en) * | 2015-10-14 | 2015-12-30 | 文雪烽 | Interface material used for eliminating surface static electricity |
| CN105315970A (en) * | 2015-11-16 | 2016-02-10 | 华中科技大学 | Thermal interface material for chip testing and preparation method of thermal interface material |
| CN105315970B (en) * | 2015-11-16 | 2019-01-22 | 华中科技大学 | A kind of thermal interfacial material and preparation method thereof for chip detection |
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| CN103407254B (en) | 2015-09-23 |
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