CN103394608A - High-speed blanking piece grading device - Google Patents
High-speed blanking piece grading device Download PDFInfo
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- CN103394608A CN103394608A CN201310360790XA CN201310360790A CN103394608A CN 103394608 A CN103394608 A CN 103394608A CN 201310360790X A CN201310360790X A CN 201310360790XA CN 201310360790 A CN201310360790 A CN 201310360790A CN 103394608 A CN103394608 A CN 103394608A
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Abstract
The invention discloses a high-speed blanking piece grading device, which is matched with feeding and blanking and is connected with a dedicated full automatic feeding mechanism. A sensor is arranged on a pressed stripper plate; when die assembling is carried out, and the sensor sends out a signal; after receiving the signal, the full automatic feeding device pushes workpieces forward for one stroke, so that next machining can be carried out. The high-speed blanking piece grading device has a reasonably designed structure, can machine two workpieces at one time, and has greatly improved machining speed and slightly improved working efficiency; meanwhile, due to matching of the sensor and the full automatic feeding mechanism, the feeding stroke is scientific and reasonable; the high-speed blanking piece grading device also solves the technical problems of material waste and high defective rate caused by manual feeding.
Description
Technical field
The present invention relates to field of machining, particularly relate to a kind of high-speed punching off-chip level motion device.
Background technology
Traditional handicraft adopts common punching die, and manually-operated is adopted in loading and unloading, and can only process a workpiece at every turn, and workman's security risk when operation is large, inefficiency; During manually-operated to the stroke of charging by means of naked eyes and micro-judgment, when charging is more, can cause waste of material, when charging is less, can cause substandard products quantity to increase.
Summary of the invention
The objective of the invention is for the technological deficiency that exists in prior art, and a kind of accurate assurance charging process is provided, can process simultaneously the high-speed punching off-chip level motion device of two workpiece.
For realizing that the technical scheme that purpose of the present invention adopts is: high-speed punching off-chip level motion device, it is characterized in that comprising mould bases, described mould bases comprises top mold frame and lower mold holder, and top mold frame is connected by four ball guide pillars with lower mold holder is middle, and the ball guide pillar can effectively reduce friction; The below of described top mold frame is fixed with upper die plate and upper mould fixed plate successively; Described upper mould fixed plate is connected with the pressure discharge plate by several punch; On described pressure discharge plate, be provided with sensor, the location optimization of sensor is arranged on the stage casing of pressure discharge plate, and sensor can send signal to Full-automatic feeding device when matched moulds, and workpiece makes stroke of workpiece feeding by Full-automatic feeding device; The top of described counterdie backing plate is fixed with die block, on described die block, is equipped with respectively and the cooperatively interact die of work of described punch; The both sides of described die block are respectively arranged with two positioning guiding plates for charging processing, and the centre of described positioning guiding plate has two circular grooves for processing work, so just can guarantee that the workpiece quantity of each charging processing is two.
Preferably, the angle of the center of circle connecting line of described circular groove and vertical direction formation is 30 °.
Between described upper die plate and described pressure discharge plate, cylindroid helical-coil compression spring is installed.
On described upper die plate, lead is installed, described pressure discharge plate is extended in the end of described lead, on described counterdie backing plate, has the groove that matches with the end of described lead.
Further, described pressure discharge plate is equipped with the lead sliding sleeve that passes for lead.
Operation principle of the present invention and beneficial effect are: high-speed punching off-chip level motion device is connected with the dedicated full-automatic feed mechanism, on the pressure discharge plate, sensor is set, when matched moulds, sensor just sends signal, Full-automatic feeding device advances a stroke by workpiece after receiving signal, thereby processes next time; As can be seen here, than hand feed of the prior art with only can process a workpiece at every turn, reasonable in design of the present invention, once can process two workpiece, and process velocity promotes greatly, and operating efficiency also increases; Simultaneously, by sensor, coordinate Full-automatic feeding mechanism to make the charging stroke scientific and reasonable, the present invention has also solved waste of material and the high technical problem of defect rate that hand feed causes.
The accompanying drawing explanation
Figure 1 shows that the structural representation of high-speed punching off-chip level motion device of the present invention;
Figure 2 shows that in Fig. 1 that A is to view;
Figure 3 shows that the structural representation of Raw material processing spare.
The specific embodiment
Below in conjunction with specific embodiment, the present invention is described in further detail.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Embodiment:
Be illustrated in figure 1 high-speed punching off-chip level motion device, comprise mould bases 1, described mould bases 1 comprises top mold frame and lower mold holder, and top mold frame is connected by four ball guide pillars 21 with lower mold holder is middle, and ball guide pillar 21 can effectively reduce friction; The below of described top mold frame is fixed with upper die plate 2 and upper mould fixed plate 3 successively; Described upper mould fixed plate 3 is connected with pressure discharge plate 11 by several punch 4,7,8.
Shown in Figure 1, on described pressure discharge plate 11, be provided with sensor 19, the location optimization of sensor 19 is arranged on the stage casing of pressure discharge plate 11, and sensor 19 can send signal to Full-automatic feeding device when matched moulds, and workpiece makes stroke of workpiece feeding by Full-automatic feeding device.
The top of described counterdie backing plate 18 is fixed with die block 17, on described die block 17, is equipped with respectively and the cooperatively interact die 16,15,14 of work of described punch 4,7,8.
As shown in Figure 2, the both sides of described die block are respectively arranged with two positioning guiding plates for charging processing 12,13, the centre of described positioning guiding plate 12,13 has two circular grooves for processing work 20, so just can guarantee that the workpiece quantity of each charging processing is two.
Preferably, the angle that the center of circle connecting line of described circular groove 20 and vertical direction form is 30 °, and 20 the center of circle connecting line of comparing circular groove is the design of vertical direction, so more can conservation, be illustrated in figure 3 the workpiece after processing.
For stability and the security that improves device work, between described upper die plate 2 and described pressure discharge plate 11, cylindroid helical-coil compression spring 5 is installed, and is bolted.
In order to promote the accuracy of blanking, on described upper die plate 2, lead 9 is installed, described pressure discharge plate 11 is extended in the end of described lead 9, on described counterdie backing plate 18, has the groove that matches with the end of described lead 9; During blanking, lead 9 just directly falls into groove like this, to promote stability and the accuracy of integral device blanking.
Further, described pressure discharge plate 11 is equipped with the lead sliding sleeve 10 that passes for lead 9, and the position that lead sliding sleeve 10 can righting lead 9, be distorted and damage equipment to avoid lead 9.
During work, high-speed punching off-chip level motion device is connected with the dedicated full-automatic feed mechanism, and sensor 19 is set on pressure discharge plate 11, when matched moulds, sensor just sends signal, and Full-automatic feeding device advances a stroke by workpiece after receiving signal, thereby processes next time; As can be seen here, than hand feed of the prior art with only can process a workpiece at every turn, reasonable in design of the present invention, once can process two workpiece, and process velocity promotes greatly, and operating efficiency also increases; Simultaneously, by sensor, coordinate Full-automatic feeding mechanism to make the charging stroke scientific and reasonable, the present invention has also solved waste of material and the high technical problem of defect rate that hand feed causes.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (5)
1. high-speed punching off-chip level motion device, is characterized in that comprising mould bases, and described mould bases comprises top mold frame and lower mold holder, and top mold frame is connected by four ball guide pillars with lower mold holder is middle, and the ball guide pillar can effectively reduce friction; The below of described top mold frame is fixed with upper die plate and upper mould fixed plate successively; Described upper mould fixed plate is connected with the pressure discharge plate by several punch; On described pressure discharge plate, be provided with sensor, the location optimization of sensor is arranged on the stage casing of pressure discharge plate, and sensor can send signal to Full-automatic feeding device when matched moulds, and workpiece makes stroke of workpiece feeding by Full-automatic feeding device; The top of described counterdie backing plate is fixed with die block, on described die block, is equipped with respectively and the cooperatively interact die of work of described punch; The both sides of described die block are respectively arranged with two positioning guiding plates for charging processing, and the centre of described positioning guiding plate has two circular grooves for processing work, so just can guarantee that the workpiece quantity of each charging processing is two.
2. high-speed punching off-chip level motion device according to claim 1, is characterized in that the center of circle connecting line of described circular groove and the angle that vertical direction forms are 30 °.
3. high-speed punching off-chip level motion device according to claim 1, is characterized in that, between described upper die plate and described pressure discharge plate, cylindroid helical-coil compression spring is installed.
4. high-speed punching off-chip level motion device according to claim 1, it is characterized in that, on described upper die plate, lead is installed, described pressure discharge plate is extended in the end of described lead, on described counterdie backing plate, has the groove that matches with the end of described lead.
5. high-speed punching off-chip level motion device according to claim 4, is characterized in that described pressure discharge plate is equipped with the lead sliding sleeve that passes for lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310360790XA CN103394608A (en) | 2013-08-19 | 2013-08-19 | High-speed blanking piece grading device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310360790XA CN103394608A (en) | 2013-08-19 | 2013-08-19 | High-speed blanking piece grading device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103394608A true CN103394608A (en) | 2013-11-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310360790XA Pending CN103394608A (en) | 2013-08-19 | 2013-08-19 | High-speed blanking piece grading device |
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| CN (1) | CN103394608A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104384307A (en) * | 2014-12-06 | 2015-03-04 | 漳州永裕隆精密五金有限公司 | Punch forming die for heat-dissipating holes of cabinet side plates |
| CN108704999A (en) * | 2018-05-23 | 2018-10-26 | 芜湖华铸汽车部件有限公司 | A kind of auto parts and components fast ram former |
| CN111673836A (en) * | 2020-07-15 | 2020-09-18 | 赣州明高科技股份有限公司 | Anti-adhesion flexible circuit board stamping die |
-
2013
- 2013-08-19 CN CN201310360790XA patent/CN103394608A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104384307A (en) * | 2014-12-06 | 2015-03-04 | 漳州永裕隆精密五金有限公司 | Punch forming die for heat-dissipating holes of cabinet side plates |
| CN108704999A (en) * | 2018-05-23 | 2018-10-26 | 芜湖华铸汽车部件有限公司 | A kind of auto parts and components fast ram former |
| CN111673836A (en) * | 2020-07-15 | 2020-09-18 | 赣州明高科技股份有限公司 | Anti-adhesion flexible circuit board stamping die |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131120 |
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| WD01 | Invention patent application deemed withdrawn after publication |