CN103391685A - PCB pattern forming method and automatic optic inspection device - Google Patents
PCB pattern forming method and automatic optic inspection device Download PDFInfo
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- CN103391685A CN103391685A CN2012101441905A CN201210144190A CN103391685A CN 103391685 A CN103391685 A CN 103391685A CN 2012101441905 A CN2012101441905 A CN 2012101441905A CN 201210144190 A CN201210144190 A CN 201210144190A CN 103391685 A CN103391685 A CN 103391685A
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Abstract
The invention discloses a PCB pattern forming method. The method includes the following steps: (1) pattern transfer: displaying an exposed pattern to be detected on a PCB through a pattern transfer technology, (2) automatic optic inspection: delivering the PCB with the pattern to be detected to an automatic optic inspection device, carrying out photographic type scanning on the surface of the PCB through a photographic device under irradiation of a light source device to acquire an identifiable pattern, carrying out automatic identification on the identifiable pattern through the automatic optic inspection device, comparing the pattern to be detected with a standard pattern which is stored in a system of the automatic optic inspection device and meets imaging requirements to detect defects or errors of the pattern to be detected, determining the PCB as disqualified if the defects or errors exist, and determining the PCB as qualified if the defects or errors do not exist, (3) etching forming: carrying out line etching on the PCB which is determined as qualified through detection to obtain a PCB according with the standard pattern. The PCB pattern forming method reduces the rejection rate of PCBs and can save production rate.
Description
Technical field
The present invention relates to PCB product detection technique field, relate in particular to a kind of method of pcb board figure shaping and the automated optical detection equipment of use thereof.
Background technology
The generative process of pcb board includes the figure forming step, in this step, detect to judge whether its figure exists defect or mistake to the pcb board semi-finished product, present figure shaping flow process:
For the erect image figure: figure transfer → graphic plating → etching → automatic visual inspection
For the negative-appearing image figure: figure transfer → etching → automatic visual inspection.
In prior art,, for the inspection of pcb board half-finished copper face figure mistake and defect, be all generally that (AOI) detects by automatic optical checking equipment after circuit is shaped.namely after etching step, just carrying out automated optical with automatic optical checking equipment detects to judge defect or the mistake of pcb board figure, AOI identifies the board under test face to judge defect or mistake by the light of collecting the reflection of pcb board copper face, because the exposure figure 1 that generates after the dry film exposure can form aberration, present this aberration of AOI None-identified, the defect of the pcb board face copper face figure after the None-identified exposure, and increasing PCB demand commercial city does not allow have the pcb board of line defct to repair after on the pcb board copper face, figure being shaped, because this can cause some copper face circuits of pcb board face the open circuit breach to occur, cause product to do to scrap processing, cause the loss of production cost.At present, not yet have and can check the technology and equipment of pattern integrity before figure is shaped.
Summary of the invention
Embodiment of the present invention technical problem to be solved is: a kind of method that provides pcb board figure to be shaped, to reduce the scrappage of pcb board, saves production cost.
The embodiment of the present invention the technical problem that will further solve be: a kind of automated optical detection equipment for pcb board figure forming process is provided, can be before Etching to be checked be shaped defect or the mistake of detection figure to be checked.
In order to solve the problems of the technologies described above, the embodiment of the present invention has proposed a kind of method of checking the pcb board figure to be shaped, it is characterized in that, comprises the steps:
Figure shifts: the figure to be checked by figure transfer process after manifesting exposure on pcb board;
automated optical detects: will send into automated optical detection equipment with the pcb board of figure to be checked, under the irradiation of automatic optical detection device light source device, by its camera head, photographic-type scanning being carried out on the pcb board surface obtains identifying figure, automated optical detection equipment automatically identification described identify figure and with its be pre-stored within the intrasystem test pattern that meets imaging requirements of automated optical detection equipment and compare to judge defect or the mistake of figure to be checked, if the defect of existence or mistake, be defined as defective item, if zero defect or mistake, be defined as qualified product,
Etching forming: the pcb board that will be defined as after testing qualified product carries out circuit etching, is shaped and obtains meeting the pcb board of test pattern.
Further, in described automated optical detecting step, judge figure to be checked whether exist defect or wrong method as:, if can identify figure and test pattern is identical, judge figure zero defect to be checked or the mistake of pcb board face; There is difference outside the error allowed band if can identify figure and test pattern, judge and have defect or mistake.
Further, in described automated optical detecting step, the optical wavelength of described light supply apparatus emission is outside 320-420nm.
Further, in described automated optical detecting step, the light source of described light supply apparatus is yellow light sources.
Further, in described automated optical detecting step, described camera head adopts the black and white camera.
Further,, for the shaping of pcb board erect image figure, also need carry out the graphic plating step before the etching forming step; , for the shaping of pcb board negative-appearing image figure, directly carry out the etching forming step after described automated optical detecting step.
In order further to solve the problems of the technologies described above, the embodiment of the present invention has proposed a kind of automated optical detection equipment of the method for aforesaid pcb board figure shaping, comprise light supply apparatus and camera head, described light supply apparatus adopts the light source of optical wavelength outside 320-420nm, and described camera head adopts the black and white camera.
The beneficial effect of the embodiment of the present invention is: the method that pcb board figure of the present invention is shaped, the figure to be checked that displays after utilizing automatic optical checking equipment to the exposure of pcb board face carries out photo taking type scanning, this automated optical detection equipment adopts the yellow light sources of optical wavelength outside 320-420nm to shine, and utilize the camera head of black and white camera to scan, the scanning figure identified that obtains and the test pattern that meets imaging requirements that is pre-stored within automated optical detection equipment are compared to judge defect or the mistake of pcb board figure; This method is before figure is shaped, and the figure that displays on dry film is checked, before guaranteeing circuit etching, product surface figure complete, reduced unnecessary product rejection rate, saved production cost.
Automated optical detection equipment of the present invention, its light supply apparatus adopts the light source of optical wavelength outside 320-420nm, and its camera head adopts the black and white camera, and the light source when AOI scanning not only can be provided, can guarantee also can not exposed again in pcb board to be measured surface.This automated optical detection equipment just can check defect or the mistake of figure before figure is shaped.
The present invention is described in further detail below in conjunction with accompanying drawing.
Description of drawings
Fig. 1 is the method flow diagram of the embodiment of the present invention.
Fig. 2 is the schematic diagram of the figure to be checked of the pcb board that can not be identified by automated optical detection equipment.
Fig. 3 is the schematic diagram of the figure identified of the pcb board that can be identified by automated optical detection equipment.
Fig. 4 is the schematic diagram of test pattern that meets the pcb board of imaging requirements.
The explanation of part drawing reference numeral:
1, figure to be checked,
2, can identify figure,
3, test pattern.
Embodiment
As shown in Figures 1 to 4, a kind of method that the embodiment of the present invention provides pcb board figure to be shaped, comprise the steps:
Figure shifts: the figure to be checked 1 by figure transfer process after manifesting exposure on pcb board;
automated optical detects: will send into automated optical detection equipment with the pcb board of figure 1 to be checked, under the irradiation of automatic optical detection device light source device, by its camera head, photographic-type scanning being carried out on the pcb board surface obtains identifying figure 2, automated optical detection equipment automatically identification described identify figure 2 and with its be pre-stored within the intrasystem test pattern 3 that meets imaging requirements of automated optical detection equipment and compare to judge defect or the mistake of figure to be checked, if the defect of existence or mistake, be defined as defective item, if zero defect or mistake, be defined as qualified product,
Etching forming: the pcb board that will be defined as after testing qualified product carries out circuit etching, is shaped and obtains meeting the pcb board of test pattern 3.
Described automated optical detecting step comprises graph scanning step, figure identification step and figure determination step.Described graph scanning step is to utilize described light supply apparatus irradiation pcb board face, and with camera head, photographic-type scanning, the figure identified 2 after being scanned is carried out in the pcb board surface.Described figure identification step is to identify in the figure the identified 2 input automated optical detection equipments after the scanning of taking pictures.In the present embodiment, the light supply apparatus of described automatic light source checkout equipment adopts yellow light sources to shine, its camera head adopts the black and white camera to take pictures, adopt yellow light sources and black and white camera, light source when AOI scanning not only can be provided, generate the discernible figure 2 of identifying of AOI, can guarantee also can not exposed again in pcb board to be measured surface.Described figure determination step is to identify figure 2 and be pre-stored within the intrasystem test pattern 3 that meets imaging requirements of automated optical detection equipment and compare to judge defect or the mistake of pcb board figure 1 to be checked described; , if the defect of existence or mistake, determine the position defective item, can take the measures such as figure repairing; , if zero defect or mistake, be defined as qualified product, carry out next step.
In described figure determination step, judge pcb board face figure exist defect or wrong method as:, if it is identical with test pattern 3 to identify figure 2, judge figure to be checked 1 zero defect or the mistake of pcb board face; There is difference outside the error allowed band if can identify figure 2 and test pattern 3, judge that figure 1 to be checked exists defect or mistake; Described error allowed band can be set in advance in AOI equipment.
In described automated optical detecting step, the optical wavelength of described light supply apparatus emission is outside 320-420nm, if adopt the light wave of wavelength in 320-420nm, can be exposed again in the pcb board surface, therefore need to adopt the light wave of wavelength outside 320-420nm to avoid the pcb board surface again to be exposed.
, for the shaping of pcb board erect image figure, also need carry out the graphic plating step before described etching forming step; , for the shaping of pcb board negative-appearing image figure, directly carry out the etching forming step after described automated optical detecting step.
The method that PCB figure of the present invention is shaped has following advantage:
1, consider from the angle of saving cost, due to before circuit etching, whether the figure that can detect in advance pcb board exists defect or mistake, and the figure of having avoided just finding pcb board after Etching has problems and causes this underproof pcb board to do to scrap processing, and is cost-saved.
2, consider from standpoint of efficiency, just adjusted the front and back order of automatic visual inspection, do not affect working (machining) efficiency;
3, consider from the quality assurance angle, for the demanding product of some circuit integralities, technique and equipment can be identified bad in advance, therefore check out mistake or defect due to dry film figure after exposure before etching, thereby can avoid opening circuit or short circuit of line layer that the subsequent etch process causes, stop waste product and occur.
To sum up, the method that pcb board figure of the present invention is shaped, be before the circuit etching forming, the figure that displays on dry film is checked, before guaranteeing circuit etching, product surface figure complete, so can guarantee after the circuit etching forming, pcb board face figure does not have defect substantially.Adopt this method, reduced unnecessary product rejection rate, saved production cost.
In addition, the present invention also provide a kind of in pcb board figure forming process for detection of pcb board figure 1 defect to be checked or wrong automated optical detection equipment, comprise light supply apparatus and camera head, its light supply apparatus adopts the light source of optical wavelength outside 320-420nm, for example light supply apparatus adopts yellow light sources, and camera head adopts the black and white camera.The light source that described automated optical detection equipment adopts, the light source when AOI scanning not only can be provided, generate the discernible black and white pattern of AOI, can guarantee also can not exposed again in pcb board to be measured surface.This automated optical detection equipment just can detect defect or the mistake of figure 1 to be checked before figure 1 to be checked is shaped.
The above is the specific embodiment of the present invention; should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications also are considered as protection scope of the present invention.
Claims (7)
1. the method that the pcb board figure is shaped, is characterized in that, comprises the steps:
Figure shifts: the figure to be checked by figure transfer process after manifesting exposure on pcb board;
automated optical detects: will send into automated optical detection equipment with the pcb board of figure to be checked, under the irradiation of automatic optical detection device light source device, by its camera head, photographic-type scanning being carried out on the pcb board surface obtains identifying figure, automated optical detection equipment automatically identification described identify figure and with its be pre-stored within the intrasystem test pattern that meets imaging requirements of automated optical detection equipment and compare to judge defect or the mistake of figure to be checked, if the defect of existence or mistake, be defined as defective item, if zero defect or mistake, be defined as qualified product,
Etching forming: the pcb board that will be defined as after testing qualified product carries out circuit etching, is shaped and obtains meeting the pcb board of test pattern.
2. the method that is shaped of pcb board figure as claimed in claim 1, it is characterized in that, in described automated optical detecting step, judge figure to be checked whether exist defect or wrong method as:, if can identify figure and test pattern is identical, judge figure zero defect to be checked or the mistake of pcb board face; There is difference outside the error allowed band if can identify figure and test pattern, judge and have defect or mistake.
3. the method for pcb board figure shaping as claimed in claim 1, is characterized in that, in described automated optical detecting step, the optical wavelength of described light supply apparatus emission is outside 320-420nm.
4. the method for pcb board figure shaping as claimed in claim 1, is characterized in that, in described automated optical detecting step, the light source of described light supply apparatus is yellow light sources.
5. the method for pcb board figure shaping as claimed in claim 1, is characterized in that, in described automated optical detecting step, described camera head adopts the black and white camera.
6. the method for pcb board figure shaping as claimed in claim 1, is characterized in that,, for the shaping of pcb board erect image figure, also need carry out the graphic plating step before the etching forming step; , for the shaping of pcb board negative-appearing image figure, directly carry out the etching forming step after described automated optical detecting step.
7. automated optical detection equipment that is used in method that the described pcb board figure of claim 1 ~ 6 any one is shaped, comprise light supply apparatus and camera head, it is characterized in that, described light supply apparatus adopts the light source of optical wavelength outside 320-420nm, and described camera head adopts the black and white camera.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210144190.5A CN103391685B (en) | 2012-05-10 | 2012-05-10 | The method of a kind of PCB pattern shaping and automated optical detection equipment thereof |
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| CN201210144190.5A CN103391685B (en) | 2012-05-10 | 2012-05-10 | The method of a kind of PCB pattern shaping and automated optical detection equipment thereof |
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| CN103391685B CN103391685B (en) | 2016-08-31 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105842253A (en) * | 2016-03-18 | 2016-08-10 | 奥士康科技股份有限公司 | Automatic PCB optical detection method |
| CN107302829A (en) * | 2017-05-27 | 2017-10-27 | 广东正业科技股份有限公司 | A kind of manufacture method of precision circuit circuit and its application |
| CN108174523A (en) * | 2018-02-08 | 2018-06-15 | 江西景旺精密电路有限公司 | A kind of PCB appearances on-bne repair equipment and repair method |
| CN112730462A (en) * | 2021-03-30 | 2021-04-30 | 四川英创力电子科技股份有限公司 | Printed circuit board etching device, etching residue detection device and method |
| CN113129368A (en) * | 2020-01-15 | 2021-07-16 | 惠州市成泰自动化科技有限公司 | PCB direction identification method |
| CN114076771A (en) * | 2020-08-19 | 2022-02-22 | 南通深南电路有限公司 | Method for inspecting negative film and negative film inspection assembly |
| CN114505251A (en) * | 2022-01-04 | 2022-05-17 | 深圳市埃尔法光电科技有限公司 | Automatic optical detection method and AOI equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105842253A (en) * | 2016-03-18 | 2016-08-10 | 奥士康科技股份有限公司 | Automatic PCB optical detection method |
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| CN107302829A (en) * | 2017-05-27 | 2017-10-27 | 广东正业科技股份有限公司 | A kind of manufacture method of precision circuit circuit and its application |
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| CN113129368A (en) * | 2020-01-15 | 2021-07-16 | 惠州市成泰自动化科技有限公司 | PCB direction identification method |
| CN114076771A (en) * | 2020-08-19 | 2022-02-22 | 南通深南电路有限公司 | Method for inspecting negative film and negative film inspection assembly |
| CN112730462A (en) * | 2021-03-30 | 2021-04-30 | 四川英创力电子科技股份有限公司 | Printed circuit board etching device, etching residue detection device and method |
| CN112730462B (en) * | 2021-03-30 | 2021-10-26 | 四川英创力电子科技股份有限公司 | Printed circuit board etching device, etching residue detection device and method |
| CN114505251A (en) * | 2022-01-04 | 2022-05-17 | 深圳市埃尔法光电科技有限公司 | Automatic optical detection method and AOI equipment |
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|---|---|
| CN103391685B (en) | 2016-08-31 |
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Address after: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
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