CN103384449A - Line pattern manufacturing method - Google Patents
Line pattern manufacturing method Download PDFInfo
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- CN103384449A CN103384449A CN2012101354682A CN201210135468A CN103384449A CN 103384449 A CN103384449 A CN 103384449A CN 2012101354682 A CN2012101354682 A CN 2012101354682A CN 201210135468 A CN201210135468 A CN 201210135468A CN 103384449 A CN103384449 A CN 103384449A
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- line pattern
- base material
- basic unit
- coating
- manufacture method
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Abstract
The invention provides a line pattern manufacturing method. The method includes the following steps of firstly, forming a base material, secondly, attaching a metal material to the base material so as to form a line base layer on the base material, wherein the line base layer forms a curved surface structure along a curved line of the surface of the base material, thirdly, forming an anti-plating layer on the line base layer, fourthly, etching the line base layer, removing the metal material which is not covered by a line pattern of the anti-plating layer from the base material in an etching mode and enabling the line base layer to form a line pattern, and finally, removing the anti-plating layer so as to enable the line base layer with the line pattern to be exposed out of the surface of the base material. Therefore, manufacturing cost of the line patterns can be reduced, and manufacturing quality of the line patterns are improved.
Description
Technical field
The present invention relates to line pattern, the manufacture method of the line pattern that particularly relates to.
Background technology
Fig. 1 and Fig. 2 are traditional antenna structure 100,100 ' schematic diagram.Showing as Fig. 1 utilizes laser direct forming technique (Laser Direct Structuring, LDS) at a formed laser activation layer 12 of base material 11.Described base material 11 can be mobile device (for example: shell intelligent mobile phone).Because zone partly is not subject to the laser activation reaction fully, and produce inhomogeneous phenomenon (dotted portion is desirable line width), for example produce the phenomenon of jumping plating, so may have influence on the whole structure of antenna structure.And for example shown in Figure 2, when activating with laser beam L on some offers the base material 11 of perforation, the factors such as angle impact due to the size of perforation, shape, laser, may can't be subject to laser activation fully in the subregion in hole wall, and then top and following laser activation layer 12 is not connected, or the small part contact is only arranged, so also may have influence on the whole structure of circuit.Therefore, when using laser direct forming technique, usually can coordinate and offer the larger perforation in aperture.The problem that above-mentioned laser direct forming antenna structure may cause is that antenna is made in this field or other relevant conducting wire is worth further improvements.
Summary of the invention
The embodiment of the present invention provides a kind of manufacture method of line pattern, can form the line pattern of 3-D graphic or curved surface on base material, can reduce manufacturing cost and lifting workmanship as line patterns such as antenna structures.
The embodiment of the present invention provides a kind of manufacture method of line pattern, comprises the following steps.At first, form base material.Then, make metal material be attached on base material to form circuit basic unit on base material, described circuit basic unit forms curved-surface structure along the curve of substrate surface.Then, form anti-coating in circuit basic unit.Come again, will prevent that coating carries out patterned process, make anti-coating form line pattern in circuit basic unit.Then, basic unit carries out etching to circuit, and the metal material that is covered by the line pattern of anti-coating is removed from base material by etching, and makes circuit basic unit form line pattern.Then, remove anti-coating, make the circuit basic unit that forms line pattern be exposed to the surface of base material.
In sum, the manufacture method of the line pattern that the embodiment of the present invention provides, can form the line pattern of 3-D graphic or curved surface on base material, not only can make to have enough adhesions between line pattern and base material, also can reduce the manufacturing cost and lifting workmanship of line pattern.The plastics of base material of carrying line pattern are not defined as specific materials, and can avoid base material colour cast that known laser engraving 3-D graphic may cause and the manufacturing cost that reduces use laser engraving step and produce.
For enabling further to understand feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, but these explanations with appended graphic be only that the present invention is described, but not claim scope of the present invention is done any restriction.
Description of drawings
Fig. 1 is the schematic diagram of traditional antenna structure.
Fig. 2 is the schematic diagram of traditional antenna structure.
Fig. 3 is the flow chart of manufacture method of the antenna structure of the embodiment of the present invention.
Fig. 4 A is the antenna structure profile corresponding to step S300 of the embodiment of the present invention.
Fig. 4 B is the antenna structure profile corresponding to step S310 of the embodiment of the present invention.
Fig. 4 C is the antenna structure profile corresponding to step S330 of the embodiment of the present invention.
Fig. 4 D is the antenna structure vertical view corresponding to step S350 of the embodiment of the present invention.
Fig. 4 E is the antenna structure profile corresponding to step S370 of the embodiment of the present invention.
Fig. 4 F is the antenna structure profile corresponding to step S390 of the embodiment of the present invention.
Fig. 5 is the sub-process figure corresponding to step S310 of the embodiment of the present invention.
[main element symbol description]
100,100 ': traditional antenna structure
11,40: base material
12: the laser activation layer
L: laser beam
41: circuit basic unit
42: anti-coating
41a: etched part
S300, S310, S330, S350, S370, S390, S311, S313, S315: steps flow chart
Embodiment
(embodiment of the manufacture method of line pattern)
The manufacture method of the line pattern of the embodiment of the present invention can form the antenna structure of 3-D graphic or curved surface or the line pattern of other purposes on base material commonly used.The manufacture method of the line pattern of the embodiment of the present invention, illustrating as example for the manufacture of antenna structure, but the present invention only limits for the manufacture of antenna structure.In the present embodiment, described base material is for example the casing of intelligent mobile phone, and the casing of intelligent mobile phone typically uses the base material of plastics or glass.But therefore the present invention does not limit the kind of base material.For the enough adhesion of antenna structure on base material is provided, the present embodiment is fabricated to example explanation on casing with antenna structure.
Please refer to Fig. 3, Fig. 4 A to Fig. 4 F, Fig. 3 is the flow chart of manufacture method of the antenna structure (or being called line pattern) of the embodiment of the present invention, and Fig. 4 A to Fig. 4 F is the schematic diagram corresponding to the antenna structure of steps flow chart.The manufacture method of antenna structure comprises the following steps.At first, in step S300, form base material, as shown in Fig. 4 A.Base material 40 can be plastic basis material, and makes in modes such as ejection formations, but therefore the present invention does not limit.For example: base material 40 is Merlon (polycarbonate, PC), Merlon and acrylonitrile-butadiene-styrene copolymer (Acrylonitrile Butadiene Styrene, ABS) or the material that contains glass fibre.Base material 40 can be also glass baseplate.Base material 40 can be predetermined arbitrarily shape, is also three-dimensional structure, therefore the antenna structure that is manufactured on base material 40 is also three-dimensional structure.
Please in step S310, metal material be adhered on base material 40 simultaneously with reference to Fig. 3 and Fig. 4 B, forming circuit basic unit 41 on base material 40, described circuit basic unit 41 be along the curve formation curved-surface structure on base material 40 surfaces.The step that metal material is adhered on base material 40 can be to complete by modes such as sputter, chemical platings, and make between circuit basic unit 41 and base material 40 and have enough adhesions, yet the present invention does not limit metal material is attached to mode on base material 40, for example: when metal material is that when conducting electricity good copper, known copper-plated mode comprises sputter, chemical copper and electro-coppering at least).Antenna structure commonly used is in order to reach compact wireless receiving and dispatching ability with improving radiofrequency signal, and antenna structure can be designed to the curved surface of patterning.
In other words, circuit basic unit 41 can form curved-surface structure along the curve on base material 40 surfaces.Described metal material can be for example to comprise copper, titanium, aluminium, molybdenum, indium tin oxide (Indium Tin Oxide, ITO) (90wt%In
2O
3With 10wt%SnO
2) or the metal such as nichrome, but therefore the present invention does not limit the kind of metal material.No matter in which way metal material is plated on the surface of base material 40, as long as the antenna structure that completes is combined with base material 40 well by circuit basic unit 41.By this, not only can reach the stability of antenna structure, also can make the further test after antenna structure is completed by the product manufacturing, to promote the yield of making.
It is worth mentioning that, in step S310, when base material 40 has perforation (via hole) when (or being called via), the process of the embodiment of the present invention can be contracted to perforation between about 0.1 millimeter to 0.3 millimeter.With respect to make traditionally the technique of line pattern on base material, the technique of the embodiment of the present invention can significantly be dwindled the size (or diameter) of perforation.In other words, when base material 40 has perforation, and the size of perforation is between 0.1 millimeter to 0.3 millimeter the time, and step S310 still can make metal material adhere on base material 40, comprises the inboard that metal material is attached to perforation.By this, in the line pattern conducting mutually of the not coplanar of base material 40, for example: the line pattern in base material 40 fronts can link by perforation the line pattern of substrate backside.Moreover, if utilize the copper-plated mode of full plate that circuit basic unit 41 is thickened in follow-up step, described perforation can further be dwindled even can be filled (for example: the copper that is thickened use fills up), make the surface of substrate 40 not see the existence of perforation, promote by this evenness and the visual appearance on substrate 40 surfaces, especially when substrate 40 be when being exposed to the shell of product surface, substrate 40 attractive in appearance more easily is subject to liking of consumer, by this competitiveness of improving product.In addition, when substrate 40 is when being exposed to the shell of product surface, less perforation (or the perforation that is filled) can avoid the outer aqueous vapor of casing (substrate) and other exotics to infiltrate product content, protects the effect of product to promote casing.
Please be simultaneously with reference to Fig. 3 and Fig. 5, Fig. 5 is the sub-process figure corresponding to step S310 of the embodiment of the present invention.Formation circuit basic unit 41 except completing by sputter or plating mode, also can utilize the chemical plating flow process of Fig. 5 to complete in the step on base material 40 (S310).At first, in step S311, make base material 40 surface roughenings, described roughening can use mechanical type or chemical formula.Then, in step S313, chemical copper technique is carried out on base material 40 surfaces of roughening, copper is attached on base material.Then, in step S315, the thickness that will be attached to the copper on base material by plating mode thickens.For example: form the metal thickening layer on circuit basic unit 41, and make circuit basic unit 41 and the gross thickness of metal thickening layer reach predetermined thickness.For example: predetermined thickness can be to form the copper of predetermined thickness by plating mode, for example: the copper of 3 to 16 microns (um).Yet described predetermined thickness can need and adjust according to design, and therefore the present invention does not limit.
Please be simultaneously with reference to Fig. 3 and Fig. 4 C, in step S330, form and prevent that coating is in circuit basic unit.Anti-coating 42 can be the polymolecular condensate (polymer) of photo-polymerization type or hot baking-type.In the present embodiment, anti-coating 42 can for example utilize spraying process, carries out the resistance agent thickness handling procedure of hot baking-type.Then, then come polymerization wet film resistance agent by the infrared ray bake process, and strengthen the bond strength of wet film resistance agent.Perhaps, utilize the photoresist dry film, and form dry film against corrosion via press mold exposure and development.
Please be simultaneously with reference to Fig. 3 and Fig. 4 D, in step S350, will prevent that coating 42 carries out patterned process, make anti-coating 42 form line patterns in circuit basic unit 41, antenna structure vertical view as shown in Fig. 4 D, the anti-formed pattern of coating 42 is the pattern of the body of antenna structure.Anti-coating 42 is carried out in the step of patterned process, and the periphery of the line pattern of the anti-coating of available laser ablation is to remove the anti-coating 42 beyond required line pattern.Comprise the periphery with the line pattern of the anti-coating of laser ablation, to modify line pattern.Described laser can be that wavelength is the Yttrium Orthovanadate (YVO of 1064 nanometers (nm)
4) laser.It is worth mentioning that, traditionally, carry out the laser direct structuring technique of laser direct forming possibly to adjusting the sweep time of laser energy and laser for conducting wire or metallic circuit, avoiding laser excessive and destroy the surface of base material 40, or avoid laser energy to be not enough to remove conducting wire or metallic circuit.Therefore laser direct forming cost traditionally also increases.
Further say the present embodiment Yttrium Orthovanadate (YVO as used herein
4) energy of laser do not need the section of running business into particular one to adjust, as long as be enough to anti-coating 42 is removed, and is used for laser energy that removal prevents coating 42 lower than traditionally to the laser energy of conducting wire or metallic circuit.Therefore, the laser energy that the present embodiment uses is lower, and is not easy base material 40 is damaged.In other words, actual when carrying out patterned process, laser easily will anti-coating 42 remove, the impact that may cause base material 40 can significantly reduce.Yet the present invention does not limit the type of laser, and it is other laser such as green laser of 532 nanometers (nm) that the present invention also can use such as wavelength.
Please be simultaneously with reference to Fig. 3 and Fig. 4 E, in step S370, circuit basic unit 41 is carried out etching, the metal material that is covered by the line pattern of anti-coating 42 is removed from base material 40 by etching, and make circuit basic unit 41 formation line patterns.As shown in Fig. 4 E, etched part 41a is not covered by anti-coating 42.The execution mode of step S370 can be to utilize acidic etching liquid to remove etched part 41a.The main component of acidic etching liquid generally includes (chelating agent) nitric acid, sulfuric acid, hydrochloric acid, hydrogen peroxide, hydrogen fluoride, sodium chlorate (NaClO
3), iron chloride, (sodium polydithio-dipropyl sulfonate, SPS) etc., but the present invention does not limit the kind of acidic etching liquid to sodium peroxydisulfate.
Please in step S390, remove and prevent coating 42 simultaneously with reference to Fig. 3 and Fig. 4 F, make the circuit basic unit 41 that forms line pattern be exposed to the surface of base material 40.The described line pattern of circuit basic unit 41 is the patterns as the anti-coating 42 in Fig. 4 D.The removal of anti-coating 42 can be used striping liquid.For example use striping liquid dry film to be hindered agent is complete to be divested.The main component of striping liquid can be for example pH-value (PH) greater than 13 sodium carbonate (Na
2CO
3) or potash (K
2CO
3) composition.Yet the present invention does not limit the composition of striping liquid, and striping liquid can be also NaOH (NaOH)/potassium hydroxide (KOH), amidogen ether class, polyethylene glycol (monoethanolamine) equal solvent.
After step S390, also can form the metal thickening layer on circuit basic unit 41, to increase the gross thickness of circuit basic unit 41 and described metal thickening layer.In addition, in order to protect antenna structure, after step S390, also can form the step of coat of metal on circuit basic unit 41.The mode that forms coat of metal is normally completed with plating or chemical plating, and coat of metal can be that palladium, nickel palladium, nickel gold or nickel add the nickel corrosion resistance agent that is attached on nickel dam.The thickness of coat of metal can be that more than 5 microns (um), described thickness also can optionally be adjusted.
Above-described embodiment is only to illustrate as example as the line pattern of antenna structure.The manufacture method of the line pattern of the embodiment of the present invention also can for the manufacture of the line pattern as electronic circuits such as charge coupled cells (Charge Coupled Device, CCD), perhaps be made the conducting wire of 3-D graphic on plastic basis material commonly used.In other words, the present invention does not limit the purposes of the conducting wire pattern that the manufacture method of line pattern produces.
(the possible effect of embodiment)
According to the embodiment of the present invention, the manufacture method of above-mentioned line pattern can form the line pattern of 3-D graphic or curved surface on the base materials such as plastics commonly used, glass, not only can make to have enough adhesions between line pattern and base material, also reduce the manufacturing cost and lifting workmanship of line pattern.Plastics or glass that the base material of carrying line pattern uses need not be defined as specific materials, so can reduce the material cost of base material.In processing step, use the step procedure of anti-coating can avoid base material colour cast that known laser engraving 3-D graphic may cause and the manufacturing cost that reduces use laser engraving step and produce.Moreover when having perforation on base material, the perforation that uses can be reduced or be filled up, and promoting the evenness of substrate surface, and reaches the effect of attractive in appearanceization, and perforation less or that be filled can avoid the foreign object such as aqueous vapor to enter interiors of products.
The above is only embodiments of the invention, and it is not to limit to the scope of the claims of the present invention.
Claims (10)
1. the manufacture method of a line pattern, is characterized in that, comprising:
Form a base material;
Make a metal material be attached on described base material to form a circuit basic unit on described base material, wherein said circuit basic unit forms a curved-surface structure along the curve of described substrate surface;
Form an anti-coating in described circuit basic unit;
Described anti-coating is carried out patterned process, make described anti-coating form a line pattern in described circuit basic unit;
Basic unit carries out etching to described circuit, and the part that is covered by the described line pattern of described anti-coating of described metal material is not removed from described base material by etching, and makes described circuit basic unit form described line pattern; And
Remove described anti-coating, make the described circuit basic unit that forms described line pattern be exposed to the surface of described base material.
2. the manufacture method of line pattern according to claim 1, is characterized in that, after making described metal material be attached to step on described base material, and form the step of described anti-coating in described circuit basic unit before, also comprises:
Form a metal thickening layer in described circuit basic unit, and make the gross thickness of described circuit basic unit and described metal thickening layer reach a predetermined thickness.
3. the manufacture method of line pattern according to claim 2, is characterized in that, the step that described metal material is attached on described base material can be to complete by the mode of sputter, chemical copper or electro-coppering.
4. the manufacture method of line pattern according to claim 2, is characterized in that, described metal material comprises copper, titanium, aluminium, molybdenum, nichrome or indium tin oxide.
5. the manufacture method of line pattern according to claim 1, is characterized in that, the polymolecular condensate that described anti-coating is photo-polymerization type or hot baking-type.
6. the manufacture method of line pattern according to claim 1, is characterized in that, also comprises after removing the step of described anti-coating:
Form a metal thickening layer in described circuit basic unit.
7. the manufacture method of line pattern according to claim 1, is characterized in that, in described anti-coating is carried out the step of patterned process, comprises the periphery with the described line pattern of the described anti-coating of laser ablation, to modify described line pattern.
8. the manufacture method of line pattern according to claim 1, is characterized in that, also comprises after removing the step of described anti-coating, forms a coat of metal forming in the described circuit basic unit of described line pattern.
9. the manufacture method of line pattern according to claim 1, it is characterized in that, when described metal material being attached on described base material implement by copper plating process with the step that forms described circuit basic unit on described base material, the size of at least one perforation that has on described base material is between 0.1 millimeter to 0.3 millimeter.
10. the manufacture method of line pattern according to claim 1, is characterized in that, the step that described metal material is attached on described base material comprises:
Make described substrate surface roughening;
Described substrate surface to roughening carries out chemical copper technique, and copper is attached on described base material; And
The thickness that will be attached to the copper on described base material by plating mode thickens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101354682A CN103384449A (en) | 2012-05-02 | 2012-05-02 | Line pattern manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101354682A CN103384449A (en) | 2012-05-02 | 2012-05-02 | Line pattern manufacturing method |
Publications (1)
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|---|---|
| CN103384449A true CN103384449A (en) | 2013-11-06 |
Family
ID=49492113
Family Applications (1)
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|---|---|---|---|
| CN2012101354682A Pending CN103384449A (en) | 2012-05-02 | 2012-05-02 | Line pattern manufacturing method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109874226A (en) * | 2019-03-15 | 2019-06-11 | 番禺得意精密电子工业有限公司 | Curved surface metal route manufacturing method |
| CN113061275A (en) * | 2021-03-23 | 2021-07-02 | 惠州市纵胜电子材料有限公司 | Production process of spraying plate for main battery cover of mobile phone |
| CN114375102A (en) * | 2022-02-10 | 2022-04-19 | 业成科技（成都）有限公司 | Method for manufacturing patterned circuit |
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| JPH07221430A (en) * | 1994-02-07 | 1995-08-18 | Hitachi Chem Co Ltd | Manufacture of wiring board |
| CN1891018A (en) * | 2003-12-05 | 2007-01-03 | 三井金属矿业株式会社 | Printed-circuit board, its manufacturing method and semiconductor device |
| CN101322447A (en) * | 2005-10-14 | 2008-12-10 | 宇部兴产株式会社 | Process for producing polyimide film with copper wiring |
| TW200911057A (en) * | 2007-08-31 | 2009-03-01 | Foxconn Advanced Tech Inc | Method for manufacturing electrical traces of printed circuit board |
| TW200945977A (en) * | 2008-04-28 | 2009-11-01 | Ind Tech Res Inst | Method for fabricating conductive pattern on flexible substrate and protective ink used therein |
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2012
- 2012-05-02 CN CN2012101354682A patent/CN103384449A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07221430A (en) * | 1994-02-07 | 1995-08-18 | Hitachi Chem Co Ltd | Manufacture of wiring board |
| CN1891018A (en) * | 2003-12-05 | 2007-01-03 | 三井金属矿业株式会社 | Printed-circuit board, its manufacturing method and semiconductor device |
| CN101322447A (en) * | 2005-10-14 | 2008-12-10 | 宇部兴产株式会社 | Process for producing polyimide film with copper wiring |
| TW200911057A (en) * | 2007-08-31 | 2009-03-01 | Foxconn Advanced Tech Inc | Method for manufacturing electrical traces of printed circuit board |
| TW200945977A (en) * | 2008-04-28 | 2009-11-01 | Ind Tech Res Inst | Method for fabricating conductive pattern on flexible substrate and protective ink used therein |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109874226A (en) * | 2019-03-15 | 2019-06-11 | 番禺得意精密电子工业有限公司 | Curved surface metal route manufacturing method |
| CN113061275A (en) * | 2021-03-23 | 2021-07-02 | 惠州市纵胜电子材料有限公司 | Production process of spraying plate for main battery cover of mobile phone |
| CN114375102A (en) * | 2022-02-10 | 2022-04-19 | 业成科技（成都）有限公司 | Method for manufacturing patterned circuit |
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Application publication date: 20131106 |