CN103370164A - Method for monitoring cutting machining on a workpiece - Google Patents
Method for monitoring cutting machining on a workpiece Download PDFInfo
- Publication number
- CN103370164A CN103370164A CN2011800675548A CN201180067554A CN103370164A CN 103370164 A CN103370164 A CN 103370164A CN 2011800675548 A CN2011800675548 A CN 2011800675548A CN 201180067554 A CN201180067554 A CN 201180067554A CN 103370164 A CN103370164 A CN 103370164A
- Authority
- CN
- China
- Prior art keywords
- workpiece
- laser beam
- radiation
- cutting
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D5/007—Control means comprising cameras, vision or image processing systems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/02—Iron or ferrous alloys
- B23K2103/04—Steel or steel alloys
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/04—Processes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/849—With signal, scale, or indicator
- Y10T83/865—Indicates work characteristic
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to a method for monitoring cutting machining of a workpiece (2) for dividing a part of the workpiece (2b) from the rest of the workpiece (2a) along a desired cutting contour (20), in which, following the cutting machining, the following steps are carried out: irradiating the workpiece (2) with an in particular pulsed laser beam (5) or laser beam pulse at a point (22) within the desired cutting contour (20), detecting radiation (8) generated by interaction between the laser beam (5) and the workpiece (2), and evaluating the detected radiation (8) in order to check whether, during the cutting machining, the part of the workpiece (2b) has been divided completely from the rest of the workpiece (2a). The invention also relates to a laser processing machine for carrying out the method.
Description
Technical field
The present invention relates to a kind of method for checking the cutting processing on the workpiece, described cutting processing is used for the workpiece part is separated with the residue workpiece along desirable cutting profile.The invention still further relates to a kind of for carry out the laser machine of cutting processing so that the workpiece part is separated with the residue workpiece along desirable cutting profile at workpiece.
Background technology
Particularly the cutting processing of the workpiece of plate shape (for example sheet material) can (for example by punch process (step punching)) realizes by hot-working (for example by the laser beam cutting) or by machining.When Laser Processing, by laser Machining head realize the cutting, described laser Machining head along predetermined cutting wheel hub with respect to the workpiece motion s that is arranged in the processing plane.In order to produce relative motion, laser Machining head and/or workpiece can move in processing plane.By the punch process cut workpiece time, fixing punching press press carries out punching course in the place usually, and wherein, workpiece is mobile in processing plane.Will be understood that, on same toolroom machine, not only can carry out punch process and also can carry out hot-working.
In cutting processing, workpiece is divided into one or more workpiece part and a residue workpiece (remainder or residue grid) along (normally sealing) cutting profile.These workpiece part drops from the residue grid when cutting off fully, and if this be good parts, then these workpiece parts can be supported on the supporting member that is arranged on described residue grid below.But the workpiece part of cut-out also can be to cut off the waste material that will be eliminated afterwards.
Following problem may appear when separation cuts, namely, independent workpiece part, particularly cut clout because process mistake or the wrong procedure parameter of regulating not have fully or may even fully not cut off and therefore do not drop from remaining grid from the residue grid, thereby when cutting processing, in desirable cutting profile, in remaining grid, do not produce completely breach.This mistake is not detected and may just be operated person or other process participant identification usually in quality examination subsequently in automatically making.In this case, the cutting clout is the workpiece part that is cut to from the good part for generation of desirable profile and is eliminated mainly as waste material.
US 4,504, and 727 have described a kind of system for the Laser Processing on the control slab.Passing the multilayer of being made by different layer materials when carrying out Drilling operation, to identify cut point and avoid in such a way miscut according to photoacoustic signal, described photoacoustic signal is being produced in corresponding layer material by the laser beam of chopping.
Also disclose a kind of laser machine by JP 03077790A, be used for during cutting process, surveying miscut.The photo-detector that is arranged on below workpiece in the zone of cutting the slit is surveyed the laser emission of passing the cutting slit.If described photo-detector no longer detects radiation, then workpiece is not separated when laser cutting fully, thereby has miscut.
JP 2,002 331 383 A have described a kind of device for monitoring thermal cutting process, in this device, reality is cut gap width compare to determine miscut with theoretical cutting gap width.In order to determine actual cutting gap width, be provided with the device that rotates around flame-cutting plant, described device allows to observe the cutting slit at described flame-cutting plant rear.
By DE 691 14 399 T2 a kind of device is disclosed, the end that described device pierces through or separates when allowing to detect the cutting metal face.Described device has the sensor head for detection of light, and described light produces at (metal) surface of the work when Laser Processing.Described device descends to survey the end that separates in the penetration process according to the signal of the signal that detects.Guide subsequently cutting process and determine by the reference voltage level of the voltage of being derived by described signal whether described cutting process correctly or erroneously moves.
Summary of the invention
Task of the present invention is that following improvement starts method and the laser machine of described type, that is, can automatically check the workpiece part and cut off fully after the cutting processing workpiece.
According to the present invention, described task solves by the method for the described type of beginning, wherein, implements following steps after cutting processing: with particularly laser beam or the position of laser pulse in desirable cutting profile of chopping are incided on the workpiece; The radiation that the reciprocation of detection by laser beam and workpiece produces; And whether the radiation that analyzing and processing detects separates with the residue workpiece fully with examination workpiece part in cutting processing.
In the situation of cutting processing closed outline correctly, workpiece part, particularly cut clout and separate with the residue workpiece fully and down drop from workpiece planarization from residue workpiece or residue grid, thereby in desirable cutting profile, no longer have workpiece material.If laser beam incides on the position in the desirable cutting profile with the direction of beam propagation with respect to the surface of the work perpendicular in this case, then laser beam passes formed breach or passes formed hole, there and enters and leave a blank.In this case, reciprocation not occuring between laser beam and the workpiece, thereby surveys less than or only detect minimum radiation intensity.
In contrast, if the workpiece part is not fully separated in cutting processing, then workpiece part residual (might tilt) is in the residue grid.In this case, laser beam in the zone of hole that supposition is cut or breach with the workpiece reciprocation, and produce radiation, can infer vicious cutting process according to described radiation.At this, generally enough be, only have unique laser pulse to incide on the position in the desirable cutting profile, that is to say, not the laser beam that needs forcibly to have a plurality of pulses of mutually following.But conversely, described unique laser pulse also can represent by a plurality of pulses of mutually following.
Therefore, the radiation that detects by analyzing and processing can directly automatically check processing result.At this, the inspection after cutting processing can correspondingly realize after producing independent (sealing) cutting profile; But alternatively also possible is that described inspection is just implemented in all on workpiece (plate material piece) or one group (sealing) when profile is cut.In contrast, if the workpiece that is not completely severed part just falls after one or more continuous process steps, for example after member was by japanning and installation, the waste product that then produces here was associated with high cost.
In flexible program, the radiation that detects is process light and/or the heat radiation that produces during reciprocation between laser beam and workpiece.Produce the process illumination with the following stated wavelength in the workpiece reciprocation partly of laser beam and workpiece or incomplete cut-off, described wavelength is usually located in UV-or the VIS-scope.The process illumination and/or the heat radiation (in NIR-or VIS-scope) that produce in the time of can surveying by the laser beam heats workpiece by suitable detector.Specifically, also the device that is used for observation process light can be used for survey, these devices have been arranged in the corresponding laser machine anyway.When detection process light or heat radiation, in the workpiece reciprocation partly of laser beam and incomplete cut-off, the workpiece part is usually damaged.
In other flexible program, the radiation that detects is the laser emission that is reflected back from workpiece.In this case, described workpiece is made by the material of reflected laser radiation at least in part, and this situation occurs in the situation of metal works, especially sheet material usually.If detect the laser emission that is reflected back from workpiece, then laser emission is to throw light on respect to detection process or obviously less power incident of heat radiation, because workpiece is optional at the locational partial melting that laser beam occurs in this case.Except being used for processing the employed laser beam, alternately also can use other laser instrument (laser instrument, for example pilot tone laser instrument that particularly have other wavelength) in order to incide on the interior position of desirable cutting profile.
In other flexible program, in the situation that workpiece part is not exclusively separated, the laser beam of chopping or laser beam pulses fully pierce through the workpiece part on the position of laser beam incident to the workpiece.In this case, laser beam or laser pulse can incide on the workpiece with the power and the duration that are enough to pierce through fully the workpiece part.Substitute the fixing ground of predetermined duration of pulse laser beam or laser beam pulses, also can identify completely according to the time changing curve of the radiation that detects or the radiation that detects and pierce through.Pierce through as long as recognize, laser beam or laser beam pulses can automatically be closed in this case.
In one embodiment, determine the workpiece part of not exclusively separation and the inclination angle between the residue workpiece according to the radiation that detects.If workpiece part is fully pierced through by the laser beam of incident, the duration that then can infer penetration process according to duration (in the described duration, surveying the radiation intensity that improves).Because the thickness of the corresponding material that is pierced through by laser beam is relevant with the inclination angle, therefore can infer the inclination angle from the duration of penetration process with reference to material type.Alternately also possiblely be, thorn is then inferred the inclination angle through not having signal to descend (do not have signal descend expression fully pierce through) in the workpiece and as long as identify the radiation of surveying in the duration of determining, described inclination angle is greater than the reference tilt angle.In this case, fully pierce through workpiece not necessarily.
Other aspect of the present invention relates to the laser machine of the described type of beginning, comprising: laser Machining head, and particularly the laser beam of chopping or laser beam pulses incide position in the desirable cutting profile to be used for after cutting processing finishes general; Detector cells is used for surveying the radiation that produces by the reciprocation between laser beam and the workpiece; And APU, described APU is configured or is programmed in order to check according to the radiation that detects whether workpiece partly separates with the residue workpiece fully when cutting processing.
Will be understood that the laser emission that described detector can be configured to detection process light, heat radiation and/or reflect from workpiece.The radiation intensity of laser beam and pulse duration also can so be conditioned or by long duration of action, may also be present in the workpiece part that remains in the grid so that laser beam can pierce through fully.This can be used to determine that by APU the workpiece part is with respect to the inclination angle of residue workpiece.At this, particularly can use APU or measurement-sensor apparatus, described APU or measurement-sensor apparatus have been used for other task, for example have been used for on-line monitoring during cutting process.For application scheme of the present invention, described APU can be suitably programmed, and its mode is that suitable analyzing and processing algorithm is added in the APU.
Description of drawings
Other advantage of the present invention is drawn by specification and accompanying drawing.Similarly, previously mentioned and also further effective feature can be respectively individually or a plurality ofly to be used in combination arbitrarily.Shown and described embodiment is not understood to exhaustive, has exemplary characteristic but describe for the present invention on the contrary.
Wherein:
Fig. 1: schematically show the laser machine for the cutting processing workpiece;
Fig. 2 a, b: (Fig. 2 is a) and vicious cutting processing (Fig. 2 b) to schematically show correct cutting processing; And
Fig. 3 a-3c: the measurement curve that shows laser beam in the reciprocation between the workpiece part of laser beam and incomplete cut-off in the situation at three different inclinations angle and measured process light intensity.
The specific embodiment
Fig. 1 shows the details for the laser machine 1 of cutting processing workpiece 2, and described laser machine comprises the machining cell of laser Machining head 3 forms.Laser Machining head 3 has condenser lens 4, cutting gas-nozzle 6 and deviation mirror 7, and described condenser lens is made by zinc selenide and is used for CO
2-laser beam 5 focuses on described CO
2-laser beam is by (unshowned) CO
2-laser instrument produces.In situation of the present invention, deviation mirror 7 is configured to the part transmission and with the CO of incident
2-laser beam 5(has the wavelength of about 10 μ m) reflection and transmission for process monitoring important, from the radiation 8 of workpiece 2 beginning, described radiation 8 is in following wave-length coverage, namely is between about 550nm and the 2000nm in example of the present invention.Will be understood that illustrated laser machine 1 also can have (unshowned) solid state laser light beam source (such as disk laser or fibre laser) here, described solid state laser light beam source has radiation or the frequency conversion in 1 mu m range.
In laser machine 1, at the rear of the mirror 7 of part transmission other deviation mirror 9 is set, described other deviation mirror 9 redirect to radiation 8 on the detector of video camera 10 forms.Video camera 10 can be high-speed camera, and described video camera arranges and therefore independent of direction ground setting coaxially with respect to laser beam axis 11 or with respect to the extended line 11a that laser is penetrated axis.In order to improve imaging, in example of the present invention, arrange between the mirror 7 of part transmission and video camera 10 among Fig. 1 as optical system 12 shown in the lens, imaging, that focus on, described optical system will focus on the video camera 10 for the important radiation 8 of process monitoring.Alternatively also possible is that the described radiation of not spatially resolved detection for example replaces video camera 10 to use one or more photodiodes as detector cells.In order to survey the laser emission of reflecting on the workpiece, also can be by the form different from beam splitter, for example come the deviation mirror 7 of Substitute For Partial transmission by aperture mirror, thus the radiation with wavelength of laser beam 5 can arrive on the video camera 10 and be detected.
When other radiant section or wavelength partly were excluded outside the detection of video camera 10, the wave filter 13 of video camera 10 fronts was favourable in the example shown in Fig. 1.Wave filter 13 can for example be configured to have the narrow band filter of low half breadth.In principle, as long as additional lighting source radiation in the NIR-scope, then draw by video camera 10 with incident illumination method (in the situation of using (unshowned) fill light light source) in the VIS-wave-length coverage, the also possibility of photographic images in the NIR-wave-length coverage, and alternately shooting process self-luminous or heat picture in the wave-length coverage of UV and NIR/IR.Specifically, also can survey by additional (unshowned) detector in workpiece 2 laser emissions reflection, in the wave-length coverage of about 10 μ m, described detector for example is installed in laser Machining head 3 outsides.Will be understood that, monitoring for the important radiation of laser cutting process also can be implemented by other mode, for example as described in the applicant's DE 10 2,010 028 179.4, implement, aspect this described document is being brought in the application's the content.
In order during the laser cutting process shown in Fig. 1 (in described laser cutting process, in workpiece 2, forming cutting slit 14), to implement cutting survey, APU 18 shown in Fig. 1 is set, and described APU is to carrying out analyzing and processing by detector 10 measured intensity I.Here, APU 18 can be used for on-line monitoring during laser cutting process.In application scheme of the present invention, APU 18 also additionally is used for cutting survey after laser cutting finishes, or rather, be used for checking previous along desirable cutting profile 20(referring to Fig. 2 a, Fig. 2 b) whether workpiece part 2b to be separated fully cuts off with residue workpiece 2a during the cutting processing of carrying out.Described examination can be carried out after the single cutting profile immediately in cutting, but alternatively also possiblely is, when at workpiece 2(plate material piece) just implement described examination when cutting all or one group of (sealing) profile.
In example of the present invention, desirable cutting profile 20 is circular, but will be understood that, the geometric configuration of cutting profile 20 can be arbitrarily.Here, desirable cutting profile 20 is normally sealed, but this is not that pressure is necessary.For example for this situation, namely the seamed edge of workpiece part to be separated forms the outer seamed edge of workpiece, then the workpiece part can be separated with the residue workpiece, and not need to cut the profile of sealing.When cutting processing, this may be for example owing to the following stated situation occurs the procedure parameter of adversely selecting, that is, the profile that is cut is not consistent with desirable cutting profile, thereby leaves the attachment that for example remains the bar shaped between workpiece 2a and the workpiece part 2b.
Fig. 2 a shows the correctly situation of cutting processing, in the situation of correct cutting processing, along cutting profile 20 cutting the time, (unshowned in Fig. 2 a) workpiece part is separated with residue workpiece 2a fully and is dropped out from workpiece 2, thus in residue workpiece 2a the conglobate hole 21 of shape.In this case, in the zone of cutting profile 20, no longer there is material.
In contrast, Fig. 2 b shows the situation of vicious cutting processing, in the situation of mistake processing, workpiece part 2b does not separate with residue workpiece 2a fully and remains among the residue workpiece 2a, because workpiece part 2b also is connected with residue workpiece 2a by the attachment 23 of bar shaped.
Whether separate fully with residue workpiece 2a in order to check workpiece part 2b, in two shown situations, laser Machining head 3 and/or workpiece 2 are so positioned in the XY-plane by (unshowned) telecontrol equipment, so that the laser beam 5 substantially perpendicularly directed with respect to the surface of workpiece 2 incides on the workpiece 2 in the position 22 of cutting profile 20 inside.If form there hole 21 shown in Fig. 2 a, then laser beam 5 is radiated blank space.Therefore, not having or only have small radiation intensity I to be detected device 10 detects.In contrast, if workpiece part 2b does not cut off from residue workpiece 2a shown in Fig. 2 b fully, then laser beam 5 in the zone in the hole that supposition is cut with workpiece 2 or the workpiece part 2b reciprocation of cut-out not.The radiation 8 of the form of production process self-luminous here, because the heat radiation that causes of workpiece 2 heating and the laser emission that is reflected back, described radiation is can above civilian described mode detected by detector 10 or additional detector.
If APU 18(is referring to Fig. 1) determine according to the radiation 8 that detects: workpiece part 2b fully is not cut off, then described APU sends rub-out signal to control device 19, and described control device forms signalling technique with APU 18 and is connected.Control device 19 alternatively the described vicious member of mark or workpiece part, give a warning, interrupt described cutting process, in the situation of using other parameter, again fully or for the subregion of profile to be cut restart again described cutting process etc. in case of necessity to the user.
Analysis and processing unit 18 can just not define wrong cutting processing, but also determines the workpiece part 2b of not exclusively separation about the inclined angle alpha on (XY-) plane of workpiece 2 in the situation of mistake, as setting forth according to Fig. 3 a-c subsequently.Described inclination is owing to the deadweight of workpiece part 2b produces, and described deadweight only also keeps being connected with residue workpiece 2a by the attachment of for example bar shaped.
Fig. 3 a-c shows respectively process light-signal 30 of being received by detector 10 and the intensity-signal 31 of (chopping) laser beam 5.In the measurement shown in Fig. 3 a-c, workpiece 2 is made by the structural steel with about 1mm thickness.
In the situation shown in Fig. 3 a, the workpiece part 2b that is not completely severed in the plane of residue workpiece 2a, do not tilt (inclined angle alpha=0 °, referring to Fig. 2 b).The total duration of laser pulse 31 is 2ms.When laser pulse 31 beginning, process light-signal 30 strong risings and again strongly decline after about 0.3ms.Pierce through the material of described workpiece part 2b fully at this time point.
In the situation shown in Fig. 3 b, workpiece part 2a is about residue workpiece 2a(XY-plane) ° downward-sloping with inclined angle alpha=15.In this case, laser pulse 31 has the duration of 10ms.Low in the example shown in level ratio Fig. 3 a of the process light-signal 30 that records, and the time of piercing through increase until till the level of process light-signal 30 disappears.
In the situation shown in Fig. 3 c, there is not the workpiece part 2b that cuts off also further to tilt, or rather inclined angle alpha=45 °.In this case, the duration of laser pulse 31 is 10ms equally.The measurement level of process light-signal 30 will be low with respect to the measurement level of the situation shown in Fig. 3 b and the time of piercing through again prolong.
According to Fig. 3 a-c clearly, according to process light-signal 30, or rather, according to the change curve of the measurement level that records in the penetration process, particularly pierce through the duration and determine inclined angle alpha, residual workpiece part 2b has described inclination angle with respect to the plane of residue workpiece 2a in residue workpiece 2a.By carry out before the cutting process, can calibrate described measurement in the test of (and in situation of predetermined thickness) on the predetermined workpiece material.
Generally speaking, can carry out the automatic examination that workpiece part and residue workpiece cut off fully by above-mentioned method.Examination described here can be implemented very fast, needs only several milliseconds because be used between workpiece and the laser-processing head in relative motion and the penetration process of cutting profile positioned internal laser beam.
Will be understood that described cutting processing is not must be forcibly to realize by laser beam, on the contrary, cutting processing can be additionally provided on where necessary also that (for example by the step punching) realizes on the stamping station on the laser machine.In this case, also can after cutting processing, laser beam be positioned at above the zone of workpiece part to be cut off.
Claims (6)
1. method that be used for to check the cutting processing on the workpiece (2), described cutting processing be used for workpiece part (2b) along desirable cutting profile (20) with remain workpiece (2a) and separate, wherein, after described cutting processing, implement following steps:
-with particularly laser beam or the position (22) of laser beam pulses (5) in desirable cutting profile (20) of chopping are incided on the described workpiece (2);
The radiation (8) that-detection produces by the reciprocation between described laser beam (5) and the described workpiece (2); And
The radiation that-analyzing and processing detects (8) so as examination described workpiece part (2b) when cutting processing whether separate with described residue workpiece (2a) fully.
2. method according to claim 1, wherein, the described radiation that detects (8) is process light and/or the heat radiation that produces during reciprocation between described laser beam (5) and described workpiece (2).
3. method according to claim 1 and 2, wherein, the radiation that detects (5) is the laser emission that is reflected back from described workpiece (2).
4. according to each described method in the claims, wherein, in situation that described workpiece part (2b) is not exclusively separated, the laser beam of described chopping (5) fully pierces through described workpiece part (2b) on it incides position (22) on the described workpiece part (2b).
5. according to each described method in the claims, wherein, determine the workpiece part (2b) of not exclusively separation and the inclination angle (α) between the residue workpiece (2a) according to the described radiation that detects (8).
One kind be used for workpiece (2) carry out cutting processing with workpiece part (2b) along desirable cutting profile (20) and the laser machine (1) that remains workpiece (2a) and separate, comprising:
-laser Machining head (3), particularly the laser beam of chopping or laser beam pulses (5) incide position (22) in the desirable cutting profile (20) to be used for after cutting processing finishes general;
-detector cells (10) is used for surveying the radiation (8) that produces by the reciprocation between described laser beam (5) and the described workpiece (2); And
Whether-APU (18), described APU are configured to check when cutting processing described workpiece part (2b) according to the radiation (8) that detects separates with described residue workpiece (2a) fully.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102011004117.6 | 2011-02-15 | ||
| DE201110004117 DE102011004117A1 (en) | 2011-02-15 | 2011-02-15 | Method for controlling a cutting operation on a workpiece |
| PCT/EP2011/071708 WO2012110129A1 (en) | 2011-02-15 | 2011-12-05 | Method for monitoring cutting machining on a workpiece |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103370164A true CN103370164A (en) | 2013-10-23 |
| CN103370164B CN103370164B (en) | 2015-02-25 |
Family
ID=45065917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180067554.8A Active CN103370164B (en) | 2011-02-15 | 2011-12-05 | Method for monitoring cutting machining on a workpiece |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9452544B2 (en) |
| EP (1) | EP2675588B1 (en) |
| KR (1) | KR101515736B1 (en) |
| CN (1) | CN103370164B (en) |
| DE (1) | DE102011004117A1 (en) |
| ES (1) | ES2627407T3 (en) |
| WO (1) | WO2012110129A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106999319A (en) * | 2014-12-15 | 2017-08-01 | 花王株式会社 | The manufacture method and manufacture device of piece fusion body |
| CN109862990A (en) * | 2016-10-19 | 2019-06-07 | 通快机床两合公司 | Method and machine for cutting processing workpiece |
| CN113874156A (en) * | 2019-05-29 | 2021-12-31 | 通快机床两合公司 | Laser automated material identification |
| CN114654105A (en) * | 2022-02-16 | 2022-06-24 | 上海柏楚电子科技股份有限公司 | Method, apparatus, system, device and medium for controlling laser cutting state |
| CN117291987A (en) * | 2023-11-27 | 2023-12-26 | 武汉华工赛百数据***有限公司 | Method, device, computer equipment and storage medium for identifying cutting position of excess material |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8638387B2 (en) * | 2012-01-25 | 2014-01-28 | Optex Systems, Inc. | Multiple spectral single image sighting system using single objective lens set |
| DE102013217126B4 (en) * | 2013-08-28 | 2015-09-03 | Trumpf Laser- Und Systemtechnik Gmbh | Method for determining deviations of an actual position of a laser processing head from a desired position, laser processing machine and computer program product |
| PL2894004T3 (en) | 2014-01-08 | 2018-04-30 | Bystronic Laser Ag | Device for laser machining with a camera and a movavble mirror |
| CN103831539B (en) * | 2014-01-10 | 2016-01-20 | 合肥鑫晟光电科技有限公司 | Laser boring method and laser drilling system |
| US10646961B2 (en) | 2015-05-13 | 2020-05-12 | Bystronic Laser Ag | Laser-machining device |
| EP3159093B1 (en) | 2015-10-23 | 2018-07-18 | Bystronic Laser AG | Method of controlling a laser cuting process in a high energy zone with interruption of the cutting process ; corresponding device and computer program |
| DE102016111455B4 (en) | 2016-06-22 | 2019-07-25 | Trumpf Laser- Und Systemtechnik Gmbh | Method for determining a reference focus position and machine tool |
| DE102017205095B3 (en) | 2017-03-27 | 2018-06-28 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Apparatus and method for removing a workpiece part from a remnant workpiece |
| DE102017109186B4 (en) | 2017-04-28 | 2019-10-10 | Jenoptik Automatisierungstechnik Gmbh | Method for supervised cutting out of a cutting tool from a metallic workpiece |
| CN109940109A (en) * | 2019-03-22 | 2019-06-28 | 知亦达知识产权(深圳)有限公司 | A kind of disconnecting device of compressor wire fixed-length blanking |
| DE102019116735A1 (en) * | 2019-06-20 | 2020-12-24 | Jenoptik Automatisierungstechnik Gmbh | Process for checking and reworking a workpiece with a laser-cut, closed inner contour |
| DE102019123654B3 (en) * | 2019-09-04 | 2020-11-05 | Jenoptik Automatisierungstechnik Gmbh | Method for producing at least one pattern figure comprising a plurality of pattern elements by means of a laser |
| JP7375634B2 (en) * | 2020-03-16 | 2023-11-08 | 村田機械株式会社 | Laser processing system and laser processing method |
| CN115243826A (en) * | 2020-03-17 | 2022-10-25 | 三菱电机株式会社 | Laser processing system |
| JP7435145B2 (en) * | 2020-03-27 | 2024-02-21 | 村田機械株式会社 | Laser processing system and laser processing method |
| CN112044874B (en) * | 2020-09-27 | 2022-02-25 | 厦门理工学院 | Real-time monitoring system and monitoring method for laser cleaning |
| DE102021125781A1 (en) | 2021-10-05 | 2023-04-06 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Laser cutting process and laser cutting machine |
| KR102463081B1 (en) | 2021-10-05 | 2022-11-03 | 허덕행 | Cnc multifunction equipment predictive maintenance monitoring system and its methods |
| DE102022103745A1 (en) | 2022-02-17 | 2023-08-17 | TRUMPF Werkzeugmaschinen SE + Co. KG | Laser cutting process and laser cutting machine |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0377790A (en) * | 1989-08-15 | 1991-04-03 | Mitsubishi Electric Corp | Laser beam machine |
| US5618454A (en) * | 1995-04-28 | 1997-04-08 | International Business Machines Corporation | Multi-wavelength programmable laser processing mechanisms and apparatus utilizing design data translation system |
| JP2002331383A (en) * | 2001-05-08 | 2002-11-19 | Koike Sanso Kogyo Co Ltd | Monitoring device for cutting |
| EP1433563A2 (en) * | 2002-12-23 | 2004-06-30 | Maschinenfabrik Spaichingen GmbH | Process and device for laser cutting |
| DE10305876A1 (en) * | 2003-02-13 | 2004-08-26 | Robert Bosch Gmbh | Regulation method for a laser cutting process generates a desired cutting geometry by evaluation of at least one sensor-measured parameter of the illumination process in order to evaluate and regulate laser focus and movement |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4504727A (en) | 1982-12-30 | 1985-03-12 | International Business Machines Corporation | Laser drilling system utilizing photoacoustic feedback |
| US4873414A (en) * | 1988-06-13 | 1989-10-10 | Rolls Royce Inc. | Laser drilling of components |
| DE3835981A1 (en) * | 1988-10-21 | 1990-04-26 | Mtu Muenchen Gmbh | METHOD FOR TESTING THE TOLERANCES OF HOLES |
| JP2843415B2 (en) * | 1990-05-11 | 1999-01-06 | 株式会社アマダ | Laser processing machine image processing system |
| US5155328A (en) | 1990-08-07 | 1992-10-13 | Amada Company, Limited | Device for detecting cutting states in laser beam machining |
| JPH0645730A (en) * | 1992-07-23 | 1994-02-18 | Fujitsu Ltd | Pattern correcting device of printed substrate |
| GB9321866D0 (en) * | 1993-10-22 | 1993-12-15 | Kinsman Grant | Fuzzy logic control of laser welding |
| US5763853A (en) * | 1994-04-20 | 1998-06-09 | Hitachi Construction Machinery Co., Ltd. | Laser processing apparatus, laser processing method and dam bar processing method |
| US7062845B2 (en) * | 1996-06-05 | 2006-06-20 | Laservia Corporation | Conveyorized blind microvia laser drilling system |
| JP3297312B2 (en) * | 1996-06-28 | 2002-07-02 | 三菱重工業株式会社 | How to confirm defective cutting in laser cutting |
| JP3269440B2 (en) * | 1997-12-12 | 2002-03-25 | 松下電器産業株式会社 | Laser processing apparatus and control method thereof |
| ITMI20011506A1 (en) | 2001-07-13 | 2003-01-13 | Salvagnini Italia Spa | QUALITY CONTROL SYSTEM FOR A LASER CUT OR DRILLING, IN PARTICULAR FOR SHEET METAL SHEETS |
| JP2006315033A (en) * | 2005-05-12 | 2006-11-24 | Fuji Photo Film Co Ltd | System and method for laser beam cutting-off operation of master carrier for magnetic transfer |
| TWI352001B (en) * | 2005-11-18 | 2011-11-11 | Hon Hai Prec Ind Co Ltd | Laser machining system and process for laser machi |
| DE602006007580D1 (en) | 2006-08-07 | 2009-08-13 | Lvd Co | Arrangement and method for on-line monitoring of the laser process of a workpiece using a heat chamber detector and a tilted mirror |
| JP4885658B2 (en) * | 2006-09-01 | 2012-02-29 | 株式会社ディスコ | Drilling hole depth detection device and laser processing machine |
| US20080220590A1 (en) * | 2007-03-06 | 2008-09-11 | Texas Instruments Incorporated | Thin wafer dicing using UV laser |
| DE102008047239A1 (en) | 2008-09-11 | 2010-04-15 | Jenoptik Automatisierungstechnik Gmbh | Method for producing a series of through holes in a material layer by means of laser |
| US8440933B2 (en) * | 2009-04-17 | 2013-05-14 | University Of Connecticut | Systems and methods for enhanced control of laser drilling processes |
| US20110132883A1 (en) * | 2009-12-07 | 2011-06-09 | Panasonic Corporation | Methods for precise laser micromachining |
| DE102010028179A1 (en) | 2010-04-26 | 2011-10-27 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Laser processing machine for, e.g. cutting of workpiece, has laser radiation filter and pump radiation filter which are located between dichroic mirror and photodiode so that only laser beam reflected from workpiece reaches photodiode |
-
2011
- 2011-02-15 DE DE201110004117 patent/DE102011004117A1/en not_active Ceased
- 2011-12-05 KR KR1020137023152A patent/KR101515736B1/en active IP Right Grant
- 2011-12-05 EP EP11790635.4A patent/EP2675588B1/en active Active
- 2011-12-05 WO PCT/EP2011/071708 patent/WO2012110129A1/en active Application Filing
- 2011-12-05 CN CN201180067554.8A patent/CN103370164B/en active Active
- 2011-12-05 ES ES11790635.4T patent/ES2627407T3/en active Active
-
2013
- 2013-08-14 US US13/966,455 patent/US9452544B2/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0377790A (en) * | 1989-08-15 | 1991-04-03 | Mitsubishi Electric Corp | Laser beam machine |
| US5618454A (en) * | 1995-04-28 | 1997-04-08 | International Business Machines Corporation | Multi-wavelength programmable laser processing mechanisms and apparatus utilizing design data translation system |
| JP2002331383A (en) * | 2001-05-08 | 2002-11-19 | Koike Sanso Kogyo Co Ltd | Monitoring device for cutting |
| EP1433563A2 (en) * | 2002-12-23 | 2004-06-30 | Maschinenfabrik Spaichingen GmbH | Process and device for laser cutting |
| DE10305876A1 (en) * | 2003-02-13 | 2004-08-26 | Robert Bosch Gmbh | Regulation method for a laser cutting process generates a desired cutting geometry by evaluation of at least one sensor-measured parameter of the illumination process in order to evaluate and regulate laser focus and movement |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106999319A (en) * | 2014-12-15 | 2017-08-01 | 花王株式会社 | The manufacture method and manufacture device of piece fusion body |
| CN109862990A (en) * | 2016-10-19 | 2019-06-07 | 通快机床两合公司 | Method and machine for cutting processing workpiece |
| US11420292B2 (en) | 2016-10-19 | 2022-08-23 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Cutting a workpiece |
| CN113874156A (en) * | 2019-05-29 | 2021-12-31 | 通快机床两合公司 | Laser automated material identification |
| CN114654105A (en) * | 2022-02-16 | 2022-06-24 | 上海柏楚电子科技股份有限公司 | Method, apparatus, system, device and medium for controlling laser cutting state |
| CN117291987A (en) * | 2023-11-27 | 2023-12-26 | 武汉华工赛百数据***有限公司 | Method, device, computer equipment and storage medium for identifying cutting position of excess material |
| CN117291987B (en) * | 2023-11-27 | 2024-03-01 | 武汉华工赛百数据***有限公司 | Method, device, computer equipment and storage medium for identifying cutting position of excess material |
Also Published As
| Publication number | Publication date |
|---|---|
| ES2627407T3 (en) | 2017-07-28 |
| US9452544B2 (en) | 2016-09-27 |
| DE102011004117A1 (en) | 2012-08-16 |
| US20130327194A1 (en) | 2013-12-12 |
| KR20130133839A (en) | 2013-12-09 |
| EP2675588A1 (en) | 2013-12-25 |
| CN103370164B (en) | 2015-02-25 |
| KR101515736B1 (en) | 2015-04-28 |
| WO2012110129A1 (en) | 2012-08-23 |
| EP2675588B1 (en) | 2017-03-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103370164B (en) | Method for monitoring cutting machining on a workpiece | |
| JP6675420B2 (en) | Laser processing equipment | |
| CN101676059B (en) | Method and device for perforating printed circuit board | |
| US20130068738A1 (en) | Laser cutting head and method for cutting a workpiece by means of a laser cutting head | |
| US9457427B2 (en) | Detecting an incomplete cutting action | |
| US7676061B2 (en) | Laser safety system | |
| US20170113300A1 (en) | Laser process monitoring | |
| CN1829418B (en) | Method and apparatus for perforating printed circuit board | |
| JP5649770B2 (en) | Mechanical sheet making equipment | |
| CN109952171A (en) | Method and apparatus for determining and adjusting the focal position of processing beam | |
| CN102947045A (en) | Method for determining the laser machinability of sheet metal, method for laser machining sheet metal, as well as arrangements and a computer program product for carrying out said method | |
| US20220080523A1 (en) | Automatic material recognition with laser | |
| GB2467296A (en) | Apparatus and method for perforating material | |
| EP1716961B1 (en) | Laser beam machining system | |
| JP4621602B2 (en) | Lithium leak detector | |
| CN111141738A (en) | Ultrafast laser drilling and arranging hole and in-situ detection method for composite material plate | |
| EP1275465B1 (en) | System for the control of the quality of a laser cut or perforation, in particular for sheets of metal | |
| CN117123943A (en) | Water guide laser hole making device and method based on spectrum detection and visual detection | |
| CN111318819A (en) | Laser cutting head, laser processing equipment and detection method | |
| WO2019028452A1 (en) | Material layer detection and processing | |
| CN114029636A (en) | Cutting device and perforation process based on spectrum detection technology | |
| CN209754273U (en) | Laser welding detection equipment | |
| CN116140832B (en) | Method and system for automatically correcting precision of intelligent inductance coil laser cutting system | |
| CN211840645U (en) | Laser cutting head and laser processing equipment | |
| CN215145782U (en) | Laser processing system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |