CN103369907A

CN103369907A - Heat-radiating module group and application method thereof

Info

Publication number: CN103369907A
Application number: CN2012100818957A
Authority: CN
Inventors: 柯佩君; 余骏生; 王维德; 谢志昇; 洪忠仁; 丁俊壬; 王文杰
Original assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2012-03-26
Filing date: 2012-03-26
Publication date: 2013-10-23

Abstract

The invention discloses a heat-radiating module group. The heat-radiating module group comprises a radiator, the bottom of which is provided with a plurality of grooves, a plurality of heat pipes which are embedded into the corresponding grooves in a manner of close fit, and a heat conduction pad which is pasted on the bottom of the radiator. The heat conduction pad is a solid with toughness in normal temperature. When the heat conduction pad is heated to the phase-transition temperature, the heat conduction pad is changed into paste with fluidity. The invention also discloses an application method of the heat-radiating module group, and the method comprises steps of: fixing the heat-radiating module group on a heating element, making the heat conduction pad close to the heating element, heating the heat-radiating module group to enable the heat conduction pad to reach the phase-transition temperature. The heat-radiating module group can fit the phase-transitioned heat conduction pad to the bottom of the radiator. The heat conduction pad is changed into the paste with fluidity when the heat conduction pad is heated to the phase-transition temperature, so as to make a gap between the heat-radiating module group and the heating element be filled flowingly. Consequently, the gap between the heat-radiating module group and the heating element can be dissipated without milling, thereby reducing cost and protecting the heat pipes from being damaged.

Description

Heat radiation module and using method thereof

Technical field

The present invention relates to a kind of heat radiation module and using method thereof.

Background technology

The heat radiation module that is combined by Aluminium Radiator and copper heat pipe had both had good radiating effect, had again cost advantage, thereby was widely used in the semiconductor heating element radiatings such as central processing unit of electronic product.When making such heat radiation module, normally offer groove in the bottom of Aluminium Radiator, heat pipe is closely embedded in the groove.Because the impact of the factors such as the shape of heat pipe and the assembler between heat pipe and the radiator are poor, when being mounted on the heater element, there being the gap in the bottom surface out-of-flatness of heat radiation module between the bottom surface of heat radiation module and the heater element, thereby having reduced radiating effect.Therefore, after heat pipe embeds Aluminium Radiator, the bottom of heat radiation module need to be milled flatly, this will increase the processing cost of the module that dispels the heat.Simultaneously, in milling process, damage easily heat pipe, cause the heat pipe leakage.

Summary of the invention

In view of above content, be necessary to provide a kind of heat radiation module and using method thereof that need not Milling Process.

A kind of heat radiation module, this heat radiation module comprises that a bottom is provided with the heat pipe in the radiator of some grooves, the some respective slot that embeds this radiator in friction tight mode and is covered on the heat conductive pad of the bottom of this radiator and heat pipe, this heat conductive pad is the solid for having toughness under the normal temperature state, when this heat conductive pad is heated to its phase transition temperature, change the paste with flowability into.

A kind of using method of the module that dispels the heat comprises above-mentioned heat radiation module is fixed in a heater element and makes this heat conductive pad be adjacent to this heater element and heat this heat radiation module making this heat conductive pad reach its phase transition temperature.

Compare prior art, but this heat radiation module fits in radiator and heat pipe bottom with the heat conductive pad of phase transformation, because heat conductive pad changes mobile paste into when being heated to phase transition temperature, fill gap between this heat radiation module and this heater element thereby can flow, therefore need not the Milling Process heat pipe and also can fill the gap of dispelling the heat between module and the heater element, thereby reduced cost and avoided damaging heat pipe.

Description of drawings

The present invention is further detailed explanation below in conjunction with the drawings and specific embodiments.

Fig. 1 is the dispel the heat three-dimensional exploded view of preferred embodiments of module of the present invention.

Fig. 2 is the dispel the heat use state diagram of preferred embodiments of module of the present invention.

Fig. 3 and Fig. 4 are that Fig. 2 is along the cutaway view of III-III, and respectively before the heating of expression heat radiation module and the state after the heating.

The main element symbol description

Radiator	10
		Base plate	11
Groove	112
		Radiating fin	12
Heat pipe	20
		Heat conductive pad	30
Heater element	200

Following embodiment further specifies the present invention in connection with above-mentioned accompanying drawing.

Embodiment

See also Fig. 1, the present invention's heat conductive pad 30 that the preferred embodiments of module comprises that a radiator 10, some heat pipes 20 and are made by the thermal induced phase transition material that dispels the heat.

This radiator 10 comprises a base plate 11 and some radiating fins 12 that is vertically installed in these base plate 11 end faces.The bottom surface of this base plate 11 is provided with some grooves 112.

In the present embodiment, the cross section of these heat pipes 20 is circular, and in other embodiments, the cross section of these heat pipes 20 also can be oval or other shapes.

This heat conductive pad 30 is solid under the normal temperature state, and has certain toughness.The one side coating adhesive-layer of this heat conductive pad 30, and on this adhesive-layer, cover the layer protecting film (not shown).This heat conductive pad 30 changes the paste with certain fluidity into when being heated to its phase transition temperature.

Please continue to consult Fig. 2, during assembling, towards these heat pipes 20 of groove 112 extruding of correspondence, these heat pipe 20 stress deformations to be adapting to the shape of groove 112, thereby these heat pipes 20 are embedded in the corresponding groove 112 in close-fitting mode.The diaphragm of this heat conductive pad 30 is removed, this heat conductive pad 30 is fitted in the bottom of this radiator 10 and heat pipe 20 at the adhesive-layer that utilizes this heat conductive pad 30.

Please continue to consult Fig. 3 and 4, when using this heat radiation module, the module that should dispel the heat is fixed in a heater element 200 so that this heat conductive pad 30 dorsad the one side of this radiator 10 be adjacent to the end face of this heater element 200.Heat this heat radiation module to the phase transition temperature of this heat conductive pad 30, this heat conductive pad 30 changes paste body shape into, fills this dispel the heat bottom surface of module and gap between this heater element 200 thereby flow.

Owing to produce heat during heater element work, therefore, the thermal source that heats this heat radiation module can derive from the heat that produces when this heater element is worked.When needs are tested the radiating effect of heat radiation module, can carry out this test when utilizing heater element to this heat radiation module heating.

Claims

One kind the heat radiation module, this heat radiation module comprises that a bottom is provided with the heat pipe in the radiator of some grooves, the some respective slot that embeds this radiator in friction tight mode and is covered on the heat conductive pad of the bottom of this radiator and heat pipe, this heat conductive pad is the solid for having toughness under the normal temperature state, when this heat conductive pad is heated to its phase transition temperature, change the paste with flowability into.
2. heat radiation module as claimed in claim 1, it is characterized in that: this radiator comprises a base plate and some radiating fins that is vertically installed in this plate top surface, and these grooves are arranged at the bottom surface of this base plate.
3. the using method of a heat radiation module as claimed in claim 1 comprises:

The module that should dispel the heat is fixed in a heater element and makes this heat conductive pad be adjacent to this heater element; And

Heating this heat radiation module makes this heat conductive pad reach its phase transition temperature.
4. using method as claimed in claim 3 is characterized in that: the heat that the thermal source that heats this heat radiation module produces when deriving from this heater element work.
5. using method as claimed in claim 4 is characterized in that: this using method also is included in when utilizing heater element to this heat radiation module heating the radiating effect of heat radiation module is tested.