CN103366858B - A kind of LED aluminium oxide pedestal silver slurry and application thereof - Google Patents
A kind of LED aluminium oxide pedestal silver slurry and application thereof Download PDFInfo
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- CN103366858B CN103366858B CN201310285671.2A CN201310285671A CN103366858B CN 103366858 B CN103366858 B CN 103366858B CN 201310285671 A CN201310285671 A CN 201310285671A CN 103366858 B CN103366858 B CN 103366858B
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- silver
- aluminium oxide
- oxide pedestal
- silver slurry
- powder
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 title claims abstract description 95
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 58
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 45
- 239000004332 silver Substances 0.000 title claims abstract description 45
- 239000002002 slurry Substances 0.000 title claims abstract description 44
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 title claims abstract description 31
- 239000011521 glass Substances 0.000 claims abstract description 25
- 238000005245 sintering Methods 0.000 claims abstract description 19
- 239000000428 dust Substances 0.000 claims abstract description 16
- 239000010946 fine silver Substances 0.000 claims abstract description 11
- 239000000203 mixture Substances 0.000 claims abstract description 10
- 229910001312 Amalgam (dentistry) Inorganic materials 0.000 claims abstract description 8
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 8
- 239000000956 alloy Substances 0.000 claims abstract description 8
- 239000000448 dental amalgam Substances 0.000 claims abstract description 8
- 229920002521 macromolecule Polymers 0.000 claims abstract description 8
- 239000006259 organic additive Substances 0.000 claims abstract description 8
- 239000011347 resin Substances 0.000 claims abstract description 8
- 229920005989 resin Polymers 0.000 claims abstract description 8
- 239000002904 solvent Substances 0.000 claims abstract description 8
- 239000000654 additive Substances 0.000 claims abstract description 7
- 230000000996 additive effect Effects 0.000 claims abstract description 7
- 239000000843 powder Substances 0.000 claims description 13
- 239000001856 Ethyl cellulose Substances 0.000 claims description 6
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 6
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 6
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 229910052797 bismuth Inorganic materials 0.000 claims description 6
- 229920001249 ethyl cellulose Polymers 0.000 claims description 6
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 6
- 150000002430 hydrocarbons Chemical class 0.000 claims description 6
- 229910052748 manganese Inorganic materials 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- 150000001298 alcohols Chemical class 0.000 claims description 5
- 150000002170 ethers Chemical class 0.000 claims description 5
- 229920000058 polyacrylate Polymers 0.000 claims description 5
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- HBGPNLPABVUVKZ-POTXQNELSA-N (1r,3as,4s,5ar,5br,7r,7ar,11ar,11br,13as,13br)-4,7-dihydroxy-3a,5a,5b,8,8,11a-hexamethyl-1-prop-1-en-2-yl-2,3,4,5,6,7,7a,10,11,11b,12,13,13a,13b-tetradecahydro-1h-cyclopenta[a]chrysen-9-one Chemical compound C([C@@]12C)CC(=O)C(C)(C)[C@@H]1[C@H](O)C[C@]([C@]1(C)C[C@@H]3O)(C)[C@@H]2CC[C@H]1[C@@H]1[C@]3(C)CC[C@H]1C(=C)C HBGPNLPABVUVKZ-POTXQNELSA-N 0.000 claims description 3
- PFRGGOIBYLYVKM-UHFFFAOYSA-N 15alpha-hydroxylup-20(29)-en-3-one Natural products CC(=C)C1CCC2(C)CC(O)C3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 PFRGGOIBYLYVKM-UHFFFAOYSA-N 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 3
- SOKRNBGSNZXYIO-UHFFFAOYSA-N Resinone Natural products CC(=C)C1CCC2(C)C(O)CC3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 SOKRNBGSNZXYIO-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 230000009477 glass transition Effects 0.000 claims description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 238000007639 printing Methods 0.000 abstract description 8
- 238000005476 soldering Methods 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 14
- 238000002360 preparation method Methods 0.000 description 7
- 239000006185 dispersion Substances 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 229940072049 amyl acetate Drugs 0.000 description 4
- PGMYKACGEOXYJE-UHFFFAOYSA-N anhydrous amyl acetate Natural products CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- -1 high-tap density Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000010791 quenching Methods 0.000 description 4
- 230000000171 quenching effect Effects 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 239000003085 diluting agent Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- RBNWAMSGVWEHFP-UHFFFAOYSA-N trans-p-Menthane-1,8-diol Chemical compound CC(C)(O)C1CCC(C)(O)CC1 RBNWAMSGVWEHFP-UHFFFAOYSA-N 0.000 description 3
- LVGKNOAMLMIIKO-UHFFFAOYSA-N Elaidinsaeure-aethylester Natural products CCCCCCCCC=CCCCCCCCC(=O)OCC LVGKNOAMLMIIKO-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- LVGKNOAMLMIIKO-QXMHVHEDSA-N ethyl oleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCC LVGKNOAMLMIIKO-QXMHVHEDSA-N 0.000 description 2
- 229940093471 ethyl oleate Drugs 0.000 description 2
- MNWFXJYAOYHMED-UHFFFAOYSA-M heptanoate Chemical compound CCCCCCC([O-])=O MNWFXJYAOYHMED-UHFFFAOYSA-M 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- PAAZPARNPHGIKF-UHFFFAOYSA-N 1,2-dibromoethane Chemical compound BrCCBr PAAZPARNPHGIKF-UHFFFAOYSA-N 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002632 lipids Chemical class 0.000 description 1
- OJURWUUOVGOHJZ-UHFFFAOYSA-N methyl 2-[(2-acetyloxyphenyl)methyl-[2-[(2-acetyloxyphenyl)methyl-(2-methoxy-2-oxoethyl)amino]ethyl]amino]acetate Chemical compound C=1C=CC=C(OC(C)=O)C=1CN(CC(=O)OC)CCN(CC(=O)OC)CC1=CC=CC=C1OC(C)=O OJURWUUOVGOHJZ-UHFFFAOYSA-N 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000009967 tasteless effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000010930 yellow gold Substances 0.000 description 1
- 229910001097 yellow gold Inorganic materials 0.000 description 1
Abstract
The invention discloses a kind of LED aluminium oxide pedestal silver slurry and application thereof, count by weight percentage, silver-colored slurry formula composition comprises following component: super fine silver powder 50 ~ 80%, alloy for dental amalgam 2 ~ 10%, glass dust 2 ~ 10%, inorganic additive 1 ~ 10%, macromolecule resin 2 ~ 15%, solvent 10 ~ 40%, organic additive 1 ~ 10%.LED aluminium oxide pedestal silver slurry of the present invention is applied in prepares aluminium oxide pedestal wiring board, has good printing performance, after sintering, silver-colored face is continuous, light, adhesive force are high, has excellent electrical property and high temperature soldering resistance.
Description
Technical field
The present invention relates to field of electronic materials, particularly a kind of LED aluminium oxide pedestal silver slurry and application thereof.
Background technology
Electronic silver slurry is a kind of electric conducting material for dip-coating and silk screen process use in electronics industry, and being set electron, chemical industry, metallurgical Trinitarian high-tech product, is one of primary base material in electronics industry.The present invention is the basic material of LED aluminium oxide pedestal wiring board, and silver slurry is through techniques such as silk screen printing, levelling, oven dry, sintering, and on alumina substrate, sintering forms conducting film, makes the wiring board of LED.The wiring board that current LED adopts mostly is PCB, the radiating effect of this wiring board is poor, greatly reduce the useful life of LED, and adopt the wiring board of aluminium oxide ceramics pedestal printing can solve heat dissipation problem well, electric conductivity is also very excellent, and then improves the useful life of LED.
Along with the wiring board of LED is gradually to the development of aluminium oxide pedestal wiring board, the demand of market to LED aluminium oxide pedestal silver slurry can be increasing, therefore LED aluminium oxide pedestal silver slurry has good market prospects.And LED aluminium oxide pedestal silver slurry requires that silver slurry has good electrical property, high temperature soldering resistance, high adhesion force after sintering, this is several technological difficulties of LED silver slurry exploitation, and domestic at present also do not have enterprise can produce LED aluminium oxide pedestal silver slurry.
Summary of the invention
For overcoming shortcoming of the prior art, the invention provides a kind of LED aluminium oxide pedestal silver slurry, it has excellent electrical property, high temperature soldering resistance and high adhesion force.
Another object of the present invention is to provide the application of above-mentioned LED aluminium oxide pedestal silver slurry.
In order to solve the problems of the technologies described above, the present invention is achieved by the following technical solutions: a kind of LED aluminium oxide pedestal silver slurry, count by weight percentage, formula composition comprises following component: super fine silver powder 50 ~ 80%, alloy for dental amalgam 2 ~ 10%, glass dust 2 ~ 10%, inorganic additive 1 ~ 10%, macromolecule resin 2 ~ 15%, solvent 10 ~ 40%, organic additive 1 ~ 10%.
Described super fine silver powder is that purity is greater than 99.95%, and granularity is less than the powder of the spherical or nearly ball-type of 10 μm.
Described alloy for dental amalgam be selected from silver-bearing copper powder, silver-colored palladium powder, silver-colored nickel powder, silver-colored titanium valve one or more.
Described glass dust is B
2o
3-SiO
2-Bi
2o
3-Al
2o
3-Mn
2o
3glass system; Preferably, described B
2o
3-SiO
2-Bi
2o
3-Al
2o
3-Mn
2o
3in glass system: B
2o
35 ~ 30Wt%, SiO
25 ~ 25Wt%, Bi
2o
340 ~ 85Wt%, Al
2o
32 ~ 20Wt%, Mn
2o
35 ~ 15Wt%, glass transition temperature is 650 ~ 700 DEG C.
Described inorganic additive is selected from Fe
2o
3, ZrO, TiO
2, Nb
2o
5, V
2o
5in one or more.
Described macromolecule resin be selected from ethyl cellulose, acrylic resin, polyvinyl alcohol resin one or more.
Described solvent is ester class, and ethers, alcohols, in hydrocarbon compound at least a kind.
Described organic additive is selected from one or both mixing in organosilicon-modified acrylate or polyacrylate.
The application on aluminium oxide pedestal wiring board prepared by above-mentioned LED aluminium oxide pedestal silver slurry.
Above-mentioned application, is characterized in that: after LED aluminium oxide pedestal silver slurry is printed on aluminium oxide pedestal, dry 1-6 minute at 200-250 DEG C, then sinter, most high sintering temperature 800 DEG C ~ 830 DEG C.
Silver slurry of the present invention, in high solids content situation, has good printing performance, and after sintering, silver-colored face is continuous, light, adhesive force are high, have excellent electrical property and high temperature soldering resistance.
Embodiment
The present invention is a kind of LED aluminium oxide pedestal silver slurry, count by weight percentage, formula composition comprises following component: super fine silver powder 50 ~ 80%, alloy for dental amalgam 2 ~ 10%, glass dust 2 ~ 10%, inorganic additive 1 ~ 10%, macromolecule resin 2 ~ 15%, solvent 10 ~ 40%, organic additive 1 ~ 10%.
Described super fine silver powder is that commercially available purity is greater than 99.95%, granularity is less than the powder of the spherical or nearly ball-type of 10 μm, there is good dispersion, high-tap density, slurry can be made to have good rheological property, effective control electrode thickness, raising electrode surface evenness, there are excellent compactness and glossiness in dry rear electrode surface, and sintering shrinkage is little, there is good conductivity, ensure that silver-colored face is continuous, light, adhesive force are high, excellent electrical property.In formula, super fine silver powder 50 ~ 80%, preferably 60 ~ 80%, more preferably 65 ~ 75%.
Described alloy for dental amalgam be selected from commercially available silver-bearing copper powder, silver-colored palladium powder, silver-colored nickel powder, silver-colored titanium valve one or more.The powder that alloyed powder requires good dispersion, granularity is less than the spherical or nearly ball-type of less than 10 μm.The present invention is on the basis of conventional silver slurry formula composition (silver powder, glass dust, organic carrier), add alloy for dental amalgam innovatively, regulate silver slurry high temperature soldering resistance and electrical property by it, after making silver slurry sintering, 480 DEG C of welding, and extremely low resistance can be had.Described glass dust is inorganic bond phase, preferred B
2o
3-SiO
2-Bi
2o
3-Al
2o
3-Mn
2o
3glass system, preferred, B
2o
3-SiO
2-Bi
2o
3-Al
2o
3-Mn
2o
3in glass system: B
2o
35 ~ 30Wt%, SiO
25 ~ 25Wt%, Bi
2o
340 ~ 85Wt%, Al
2o
32 ~ 20Wt%, Mn
2o
35 ~ 15Wt%, glass transition temperature is 650 ~ 700 DEG C.During preparation, each component mixed with jar mill in proportion, 430-470 DEG C of preheating 20-40min, 1150-1250 DEG C of melting 50-70min, quenching, is milled to granularity and is less than 5 μm, filtering drying.The present invention's glass powder used is not leaded, cadmium and compound thereof, meets the environmental requirement of European Union RoHS.In formula, glass dust 2 ~ 10%, preferably 3 ~ 8%, more preferably 3 ~ 6%.
Described inorganic additive is selected from Fe
2o
3, ZrO, TiO
2, Nb
2o
5, V
2o
5in one or more, improve mechanical strength and the chemical stability of glass, also assures that electrical property and the chemical property of glass, be convenient to rete after sintering silver layer be attached to securely on substrate.Have high adhesion force after the present invention's silver slurry sintering, adhesive force is greater than 50N.
The organic carrier of the composition such as macromolecule resin, organic solvent and organic additive, can meet the silk-screen printing technique requirement of slurry in LED aluminium oxide pedestal.After organic carrier drying sintering, can be completely decomposed of volatile, can not residue be there is, bring negative effect to product.Wherein:
Described macromolecule resin be selected from ethyl cellulose, acrylic resin, polyvinyl alcohol resin one or more, select according to the powder body material that reality uses.
Described solvent is the ester class that toxicity is lower, and ethers, alcohols, in hydrocarbon compound at least a kind, difficult volatilization under making it have low temperature, volatile characteristic under high temperature, conveniently can keep good printing performance in printing process like this, after ensureing silver slurry sintering, the smooth gloss of silver layer surface, pore-free.Wherein lipid is for must add class, and it can give silver slurry good lubrification, ensures the printing performance of silver slurry; In ethers, alcohols, hydrocarbon compound more than at least a kind, for adjusting silver slurry sintering character, after ensureing silver slurry sintering, the smooth gloss of silver layer surface, pore-free.The ester class be suitable for, ethers, alcohols, hydrocarbon compound can be selected from fat hydrocarbon solvent, tasteless gasoline, mixed type dibasic acid dimethyl ester as DBE, terpinol, ethyl oleate, butyl, repefral, diethylene glycol ether amyl acetate, butyl amyl acetate etc.
Described organic additive is selected from one or both mixing in organosilicon-modified acrylate or polyacrylate.The present invention adds organosilicon-modified acrylate, polyacrylate surfactant in organic carrier, organic carrier is allowed to roll fully wetting parcel inoganic solids in slurry process, silver powder and glass dust is made to reach sufficient dispersion, improve the dispersiveness of solid powder, the mobility of slurry, the overall fineness that silver is starched is controlled below 10 μm simultaneously, ensure that silver slurry is in high solids content situation, has good printing performance, so that slurry is transferred on substrate form required figure.
Below by way of concrete example, the present invention is further elaborated, but the present invention is not limited to this specific examples.
Embodiment 1
1, the preparation of glass dust
B by mass percentage
2o
315Wt%, SiO
215Wt%, Bi
2o
360Wt%, Al
2o
33.5Wt%, Mn
2o
35Wt%, ZrO1.5%.Mix with jar mill, 450 ° of C preheating 30min, 1200 ° of C melting 60min, quenching, is milled to granularity and is less than 5 μm, filtering drying.
2, the preparation of organic carrier
Ethyl cellulose 20%, terpinol 30%, butyl 30%, ethyl oleate 10%, organosilicon-modified acrylate 10%, after above each thing mixing, 80 ~ 100 ° of C heating for dissolving, obtains transparent glue.
3, mix 73% super fine silver powder, 2% palladium-silver alloy powder, 4% glass dust, 1%TiO
2, be made into powder, after stirring, add 20% organic carrier, after high speed dispersion, be rolled to fineness through three-high mill and be less than less than 10 μm, add diluent, adjustment viscosity.
Embodiment 2
1, the preparation of glass dust
B by mass percentage
2o
310Wt%, SiO
220Wt%, Bi
2o
355Wt%, Al
2o
35Wt%, Mn
2o
38Wt%, ZrO2%.Mix with jar mill, 450 ° of C preheating 30min, 1200 ° of C melting 60min, quenching, is milled to granularity and is less than 5 μm, filtering drying.
2, the preparation of organic carrier
Ethyl cellulose 25%, terpinol 45%, butyl amyl acetate 20%, polyacrylate 10%, after above each thing mixing, 80 ~ 100 ° of C heating for dissolving, obtains transparent glue.
3,69% super fine silver powder, 9% yellow gold powder, 4% glass dust, 1%Nb is mixed
2o
5, be made into powder, after stirring, add 17% organic carrier, after high speed dispersion, be rolled to fineness through three-high mill and be less than less than 10 μm, add diluent, adjustment viscosity.
Embodiment 3
1, the preparation of glass dust
B by mass percentage
2o
310Wt%, SiO
215Wt%, Bi
2o
365Wt%, Al
2o
32Wt%, Mn
2o
36Wt%, ZrO2%.Mix with jar mill, 450 ° of C preheating 30min, 1200 ° of C melting 60min, quenching, is milled to granularity and is less than 5 μm, filtering drying.
3, the preparation of organic carrier
Ethyl cellulose 15%, diethylene glycol ether amyl acetate 22%, butyl 43%, repefral 10%, organosilicon-modified acrylate 10%, after above each thing mixing, 80 ~ 100 ° of C heating for dissolving, obtains transparent glue.
4,75% super fine silver powder, 5% silver-nickel powder, 5% glass dust, 1%Nb is mixed
2o
5, be made into powder, after stirring, add 14% organic carrier, after high speed dispersion, be rolled to fineness through three-high mill and be less than less than 10 μm, add diluent, adjustment viscosity.
Experimental example
The silver slurry using method of embodiment 1-3:
1. silk screen printing (note: standard printing condition: mesh: 250 orders) on alumina substrate
2.. drying condition: 230 DEG C 3 minutes
3.. sintering condition: sintering temperature: 800 DEG C ~ 830 DEG C
Sintering condition in this experimental example: the highest 810 DEG C, high-temperature region maintains 10 minutes, 60 minutes altogether.
4.. carry out performance test after sintering, corresponding product randomly draws 10, and soldering resistance method of testing is pressed GB/T17473.7-2008 and implemented, and adhesive force test is pressed GB/T17473.4-2008 and implemented, and sheet resistance test is pressed GB/T17473.3-2008 and implemented.Data are as table 1.
Table 1.
Claims (7)
1. a LED aluminium oxide pedestal silver slurry, count by weight percentage, formula composition comprises following component: super fine silver powder 50 ~ 80%, alloy for dental amalgam 2 ~ 10%, glass dust 2 ~ 10%, inorganic additive 1 ~ 10%, macromolecule resin 2 ~ 15%, solvent 10 ~ 40%, organic additive 1 ~ 10%; Wherein, glass dust is B
2o
3-SiO
2-Bi
2o
3-Al
2o
3-Mn
2o
3glass system; Inorganic additive is selected from Fe
2o
3, ZrO, TiO
2, Nb
2o
5, V
2o
5in one or more; Macromolecule resin be selected from ethyl cellulose, acrylic resin, polyvinyl alcohol resin one or more; Described organic additive is selected from one or both mixing in organosilicon-modified acrylate or polyacrylate.
2. LED aluminium oxide pedestal silver slurry according to claim 1, it is characterized in that: described super fine silver powder is that purity is greater than 99.95%, granularity is less than the powder of the spherical or nearly ball-type of 10 μm.
3. LED aluminium oxide pedestal according to claim 1 silver slurry, is characterized in that: described alloy for dental amalgam be selected from silver-bearing copper powder, silver-colored palladium powder, silver-colored nickel powder, silver-colored titanium valve one or more.
4. LED aluminium oxide pedestal silver slurry according to claim 1, is characterized in that: described B
2o
3-SiO
2-Bi
2o
3-Al
2o
3-Mn
2o
3in glass system: B
2o
35 ~ 30Wt%, SiO
25 ~ 25Wt%, Bi
2o
340 ~ 85Wt%, Al
2o
32 ~ 20Wt%, Mn
2o
35 ~ 15Wt%, glass transition temperature is 650 ~ 700 DEG C.
5. LED aluminium oxide pedestal according to claim 1 silver slurry, is characterized in that: described solvent is ester class, and ethers, alcohols, in hydrocarbon compound at least a kind.
6. the application on aluminium oxide pedestal wiring board prepared by the LED aluminium oxide pedestal silver slurry in claim 1-5 described in arbitrary claim.
7. application according to claim 6, is characterized in that: after LED aluminium oxide pedestal silver slurry is printed on aluminium oxide pedestal, dry 1-6 minute at 200-250 DEG C, then sinter, most high sintering temperature 800 DEG C ~ 830 DEG C.
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|---|---|---|---|
| CN201310285671.2A CN103366858B (en) | 2013-07-08 | 2013-07-08 | A kind of LED aluminium oxide pedestal silver slurry and application thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310285671.2A CN103366858B (en) | 2013-07-08 | 2013-07-08 | A kind of LED aluminium oxide pedestal silver slurry and application thereof |
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|---|---|
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| CN103366858B true CN103366858B (en) | 2015-10-14 |
Family
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|---|---|---|---|---|
| CN1049675A (en) * | 1990-03-06 | 1991-03-06 | 北京市印刷技术研究所 | Conductive printing ink of copper series |
| CN101720311A (en) * | 2007-06-29 | 2010-06-02 | E.I.内穆尔杜邦公司 | Conductor paste for ceramic substrate and electric circuit |
| CN101986390A (en) * | 2010-11-23 | 2011-03-16 | 肇庆市羚光电子化学品材料科技有限公司 | Silver paste for disk capacitor electrode |
| CN102222536A (en) * | 2011-03-28 | 2011-10-19 | 彩虹集团公司 | Environment-friendly silver conductive paste for surface mounting of semiconductor chips and preparation method of environment-friendly silver conductive paste |
| CN102543260A (en) * | 2012-02-27 | 2012-07-04 | 江苏科技大学 | Silver paste for electrode of solar cell and method for preparing silver paste |
| CN102569603A (en) * | 2012-01-13 | 2012-07-11 | 张家港市金港镇东南电子厂 | Light emitting diode (LED) ceramic substrate and production method thereof |
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| JP5887086B2 (en) * | 2011-08-11 | 2016-03-16 | 株式会社タムラ製作所 | Conductive material |
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| CN1049675A (en) * | 1990-03-06 | 1991-03-06 | 北京市印刷技术研究所 | Conductive printing ink of copper series |
| CN101720311A (en) * | 2007-06-29 | 2010-06-02 | E.I.内穆尔杜邦公司 | Conductor paste for ceramic substrate and electric circuit |
| CN101986390A (en) * | 2010-11-23 | 2011-03-16 | 肇庆市羚光电子化学品材料科技有限公司 | Silver paste for disk capacitor electrode |
| CN102222536A (en) * | 2011-03-28 | 2011-10-19 | 彩虹集团公司 | Environment-friendly silver conductive paste for surface mounting of semiconductor chips and preparation method of environment-friendly silver conductive paste |
| CN102569603A (en) * | 2012-01-13 | 2012-07-11 | 张家港市金港镇东南电子厂 | Light emitting diode (LED) ceramic substrate and production method thereof |
| CN102543260A (en) * | 2012-02-27 | 2012-07-04 | 江苏科技大学 | Silver paste for electrode of solar cell and method for preparing silver paste |
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Denomination of invention: Silver paste for LED (Light-Emitting Diode) lamp aluminum oxide base and application thereof Effective date of registration: 20200426 Granted publication date: 20151014 Pledgee: China Co. truction Bank Corp Zhaoqing branch Pledgor: GUANGDONG LINGGUANG NEW MATERIAL Co.,Ltd. Registration number: Y2020440000098 |
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