CN103359944B - Soft glass micro powder and preparation method thereof - Google Patents
Soft glass micro powder and preparation method thereof Download PDFInfo
- Publication number
- CN103359944B CN103359944B CN201210081369.0A CN201210081369A CN103359944B CN 103359944 B CN103359944 B CN 103359944B CN 201210081369 A CN201210081369 A CN 201210081369A CN 103359944 B CN103359944 B CN 103359944B
- Authority
- CN
- China
- Prior art keywords
- oxide
- soft glass
- glass micro
- micro mist
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011521 glass Substances 0.000 title claims abstract description 72
- 238000002360 preparation method Methods 0.000 title claims description 6
- 239000000843 powder Substances 0.000 title abstract description 24
- 229910052810 boron oxide Inorganic materials 0.000 claims abstract description 19
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims abstract description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 18
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000000292 calcium oxide Substances 0.000 claims abstract description 16
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract description 16
- 239000003595 mist Substances 0.000 claims description 37
- 239000000463 material Substances 0.000 claims description 26
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 11
- 239000002994 raw material Substances 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 7
- 238000010298 pulverizing process Methods 0.000 claims description 7
- 238000010791 quenching Methods 0.000 claims description 7
- 150000002500 ions Chemical class 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 17
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 239000000945 filler Substances 0.000 description 9
- 230000006872 improvement Effects 0.000 description 8
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 238000002474 experimental method Methods 0.000 description 5
- 238000007499 fusion processing Methods 0.000 description 5
- 239000003292 glue Substances 0.000 description 5
- 230000008676 import Effects 0.000 description 5
- 239000011863 silicon-based powder Substances 0.000 description 5
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 description 3
- 229910001950 potassium oxide Inorganic materials 0.000 description 3
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 3
- 229910001948 sodium oxide Inorganic materials 0.000 description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 229910021502 aluminium hydroxide Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000007405 data analysis Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
- 238000009156 water cure Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210081369.0A CN103359944B (en) | 2012-03-26 | 2012-03-26 | Soft glass micro powder and preparation method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210081369.0A CN103359944B (en) | 2012-03-26 | 2012-03-26 | Soft glass micro powder and preparation method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103359944A CN103359944A (en) | 2013-10-23 |
CN103359944B true CN103359944B (en) | 2015-07-22 |
Family
ID=49362317
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210081369.0A Active CN103359944B (en) | 2012-03-26 | 2012-03-26 | Soft glass micro powder and preparation method thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103359944B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105968713B (en) * | 2015-11-23 | 2018-01-23 | 苏州海旭新材料科技有限公司 | A kind of preparation method of copper-clad plate filler, copper-clad plate resin combination and copper-clad plate |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1962760A (en) * | 2005-11-11 | 2007-05-16 | 旭玻璃纤维股份有限公司 | Glass filler for polycarbonate resin, and polycarbonate resin composition |
CN101094818A (en) * | 2004-05-29 | 2007-12-26 | 肖特股份公司 | Nano glass powder and use thereof, particularly multicomponent glass powder with a mean particle size of less than 1 [mu]m |
CN101547558A (en) * | 2009-04-21 | 2009-09-30 | 无锡宏仁电子材料科技有限公司 | Copper clad base plate and preparation method thereof |
CN102088820A (en) * | 2009-12-03 | 2011-06-08 | 新加坡商矽比科亚洲有限公司 | Copper clad laminate and impregnation liquid for making same |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0791086B2 (en) * | 1989-04-26 | 1995-10-04 | 日東紡績株式会社 | Glass powder for thermosetting resin moldings |
JPH05155638A (en) * | 1991-12-06 | 1993-06-22 | Nippon Electric Glass Co Ltd | Glass composition |
-
2012
- 2012-03-26 CN CN201210081369.0A patent/CN103359944B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101094818A (en) * | 2004-05-29 | 2007-12-26 | 肖特股份公司 | Nano glass powder and use thereof, particularly multicomponent glass powder with a mean particle size of less than 1 [mu]m |
CN1962760A (en) * | 2005-11-11 | 2007-05-16 | 旭玻璃纤维股份有限公司 | Glass filler for polycarbonate resin, and polycarbonate resin composition |
CN101547558A (en) * | 2009-04-21 | 2009-09-30 | 无锡宏仁电子材料科技有限公司 | Copper clad base plate and preparation method thereof |
CN102088820A (en) * | 2009-12-03 | 2011-06-08 | 新加坡商矽比科亚洲有限公司 | Copper clad laminate and impregnation liquid for making same |
Also Published As
Publication number | Publication date |
---|---|
CN103359944A (en) | 2013-10-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9718941B2 (en) | Thermosetting resin composition, prepreg, laminate, metal foil-clad laminate, and circuit board | |
CN106589897A (en) | Polyphenyl ether resin mixture | |
JP5012100B2 (en) | Entry sheet for drilling | |
CN102532840A (en) | Thermoplastic resin composite material for laptop shells and manufacturing method thereof | |
CN104387685B (en) | One kind regeneration HIPS anti-flaming modified materials and preparation method thereof | |
CN104693664A (en) | Halogen-free flame-retardant thermoplastic elastomer material and preparation method thereof | |
CN104559105B (en) | A kind of low-shrinkage and high-strength degree PBT/PC alloy material for 3D printing and its preparation method and application | |
CN103788580A (en) | Halogen-free benzoxazine resin composition and prepreg and laminated board prepared from same | |
KR20150061472A (en) | Composition for non-oriented electrical steel, method of manufacturing non-oriented electrical product and non-oriented electrical product | |
CN102485804A (en) | Manufacturing method of magnesium oxide powder, manufacturing method of thermoset resin composition, manufacturing method of prepreg and overlapped plate | |
CN109608731A (en) | A kind of graphene enhances mining polyethylene composition, particle, tubing and preparation method thereof | |
CN102838807A (en) | polypropylene composite material with good impact-resistance and low-temperature toughness and preparation method thereof | |
CN103359944B (en) | Soft glass micro powder and preparation method thereof | |
Zheng et al. | Interaction of cemented carbide micro-drills and printed circuit boards during micro-drilling | |
CN103342845B (en) | Fire proofing material and preparation method thereof, light fire-proof aluminium-plastic panel | |
CN101654543B (en) | Epoxy resin composition | |
CN102796371B (en) | Laser formed polyphthalamide composition and preparation method thereof | |
CN102942304A (en) | Soft glass micro-powder and preparation method thereof | |
CN106751336A (en) | A kind of bromine system flame-retarding HIPS material of high CTI value and preparation method thereof | |
Wang et al. | Experimental study on micro-drills wear during high speed of drilling IC substrate | |
CN102938978B (en) | Thick-ceramic-base printed circuit board processing method | |
CN112759821B (en) | Ultraviolet crosslinking type low-smoke halogen-free polyolefin and preparation method and application thereof | |
CN103011606A (en) | Preparation method of electronic-grade superfine E-glass powder for large-scale integrated circuit substrate | |
CN102936097A (en) | Glass micropowder and preparation method thereof | |
TWI388623B (en) | A thermosetting epoxy resin composition for improving the drilling processability of printed circuit boards |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: CHONGQING JINYI SILICON MATERIAL DEVELPMENT CO., L Free format text: FORMER OWNER: SUZHOU BRANCH, CHONGQING JINYI SILICON MATERIAL DEVELOPMENT CO., LTD. Effective date: 20150424 Owner name: SUZHOU BRANCH, CHONGQING JINYI SILICON MATERIAL DE Effective date: 20150424 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 215216 SUZHOU, JIANGSU PROVINCE TO: 404508 YUNYANG, CHONGQING |
|
TA01 | Transfer of patent application right |
Effective date of registration: 20150424 Address after: 404508 No. 188, Man Road, Yunyang Industrial Park, Chongqing, Chongqing Applicant after: Jin Yi silicon materials development corporation, Ltd. of Chongqing City Applicant after: Suzhou Branch, Chongqing Jinyi Silicon Material Development Co., Ltd. Address before: 215216, Jiangpu Road, Suzhou Town, Suzhou Industrial Park, Jiangsu, 50 Applicant before: Suzhou Branch, Chongqing Jinyi Silicon Material Development Co., Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20181218 Address after: 215500 Eleventh Floor of Binjiang International Building, 88 Tonggang Road, Changshu Economic Development Zone, Suzhou City, Jiangsu Province Patentee after: Suzhou Jinyi New Material Science & Technology Co., Ltd. Address before: 404508 Ren Dao 188, Yunyang Industrial Park, Chongqing Co-patentee before: Suzhou Branch, Chongqing Jinyi Silicon Material Development Co., Ltd. Patentee before: Jin Yi silicon materials development corporation, Ltd. of Chongqing City |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 215536 No. 25-1 Xinggang Road, Bixi street, Changshu, Suzhou, Jiangsu Patentee after: Suzhou Jinyi New Material Technology Co.,Ltd. Address before: 215500 Eleventh Floor of Binjiang International Building, 88 Tonggang Road, Changshu Economic Development Zone, Suzhou City, Jiangsu Province Patentee before: SUZHOU JINYI NEW MATERIAL SCIENCE & TECHNOLOGY Co.,Ltd. |