CN103347365B - Remove the method for pcb board surface layer baric flow glue - Google Patents
Remove the method for pcb board surface layer baric flow glue Download PDFInfo
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- CN103347365B CN103347365B CN201310224863.2A CN201310224863A CN103347365B CN 103347365 B CN103347365 B CN 103347365B CN 201310224863 A CN201310224863 A CN 201310224863A CN 103347365 B CN103347365 B CN 103347365B
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Abstract
The invention provides a kind of method removing pcb board surface layer baric flow glue, comprise the steps: 1) provide Plate grinder that the plate needed except glue process is done nog plate preliminary treatment, the cull making pcb board face thinner is removed, and thinning original thicker cull; 2) provide laser drill by electing property of the pcb board laser calcination process after nog plate, make the cull in pcb board face go through the process of expansion, fusing, evaporation, contraction, the adhesion in cull and pcb board face declines; 3) by the pcb board through laser selective calcination, again do nog plate process, make the cull in plate face pulverize, get loose, final disengaging plate face.So, realize effective removal of pcb board face cull, and cleaning of plate face.
Description
Technical field
The present invention relates to the manufacture method of circuit board, particularly a kind of method removing pcb board surface layer baric flow glue.
Background technology
Along with the raising of the rate of information throughput and the increase of transinformation content, electronic product volume is more and more less, and power density is increasing, promotes the future development of PCB to high density, high integrated, miniaturization and multiple stratification.How seeking heat radiation and the construction design method of best PCB and package assembly thereof, is the huge challenge of current electronics industry design.
In this context, bury copper billet plate (as Fig. 1) to develop rapidly, in Fig. 1, by high-power component 13 position pre-slotting 12 need be assembled to frequency PCB 11 before PCB pressing, imbed small copper billet 14, make copper billet and PCB combine by the mode of pressing gummosis, as the passage of heat in key function region, solve the problem of PCB local heat radiation.
Being difficult to control and inevitably having resin dust to exist in PCB bonding processes due to pressing gummosis amount, bury the resin glue especially burying copper billet position and often have area, thickness not etc. in copper billet plate plate face to remain, if do not removed, then can affect the adhesion of copper at the bottom of follow-up pcb board face copper plate and PCB, cause reliability hidden danger.And existing method exists efficiency low, easy damage plate face layers of copper and make the shortcoming of plate generation irregular deformation, be unfavorable for the manufacture of high-quality PCB.
Summary of the invention
In view of the above, the present invention is necessary to provide that a kind of efficiency is high, the method for the removal pcb board surface layer baric flow glue of the manufacture that is beneficial to high-quality PCB.
Remove a method for pcb board surface layer baric flow glue, comprise the steps:
1) provide Plate grinder that the plate needed except glue process is done nog plate preliminary treatment, the cull making pcb board face thinner is removed, and thinning original thicker cull;
2) provide laser drill by electing property of the pcb board laser calcination process after nog plate, make the cull in pcb board face go through the process of expansion, fusing, evaporation, contraction, the adhesion in cull and pcb board face declines;
3) by the pcb board through laser selective calcination, again do nog plate process, make the cull in plate face pulverize, get loose, final disengaging plate face.
Further, the cull that described nog plate preliminary treatment makes pcb board face thinner is removed, and thinning thicker cull.
Further, described thinner cull thickness is at 0.001mm to 0.010mm, and described thicker cull thickness, at 0.010mm to 0.100mm, makes the thinning about 0.010mm of thicker cull by nog plate preliminary treatment.
Further, the template way that described Plate grinder uses comprises adhesive-bonded fabric polish-brush, ceramic polish-brush or abrasive band polish-brush mode.
Further, described Plate grinder setting grinding electric current is that between 0.8A to 1.5A, transfer rate is set between 1.0m/min to 2.5m/min.
Further, described laser drill is chosen as CO
2laser drill, the drilling parameter of laser drill program is set as 152 μm to 254 μm, aperture, and position, hole overlap proportion is 0.125.
Further, described laser burns program hole position Overlap design is, the periphery of centre-drilling hole distributes the identical boring of six diameters, each boring of outside is crossing with centre-drilling hole, and divide equally the circumference of centre-drilling hole, the aperture of centre-drilling hole is 152 μm to 254 μm, intersection the widest crossing with centre-drilling hole of holing outside each is of a size of 19.00 μm to 31.75 μm, and the intersection size that adjacent outer boring is between two intersected is measure-alike with the intersection crossing with centre-drilling hole of holing outside each.
Compared to prior art, the method that the present invention removes pcb board surface layer baric flow glue does nog plate preliminary treatment by selecting Plate grinder, and coordinate the nog plate parameter that setting is certain, nog plate parameter is gentleer can not cause plate irregular deformation; Pass through CO
2laser burns can not damage PCB copper face, and CO
2the ultrahigh in efficiency of laser drill, thus the method remove pcb board face cull effective, efficiency is high.
Accompanying drawing explanation
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to be illustrated more clearly in technical scheme of the present invention, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, accompanying drawing in description is only correspond to specific embodiments of the invention, to those skilled in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings when needing.
Fig. 1 is the existing schematic cross-section burying copper circuit board;
Fig. 2 is the method flow diagram that the present invention removes pcb board surface layer baric flow glue;
Fig. 3 is laser burns program hole position Overlap design schematic diagram.
Embodiment
In order to elaborate the technical scheme that the present invention takes for reaching predetermined technique object, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only section Example of the present invention, instead of whole embodiments, and, under the prerequisite not paying creative work, technological means in embodiments of the invention or technical characteristic can be replaced, below with reference to the accompanying drawings and describe the present invention in detail in conjunction with the embodiments.
Refer to Fig. 2, present pre-ferred embodiments removes the method for pcb board surface layer baric flow glue, comprises the steps:
Step 1: provide Plate grinder, does nog plate preliminary treatment by the plate needed except glue process; The cull making pcb board face thinner is removed, and thinning original thicker cull.The polish-brush mode that Plate grinder uses can use the polish-brush modes such as adhesive-bonded fabric polish-brush, ceramic polish-brush or abrasive band, sets certain grinding electric current and transfer rate, is preferably set to 1.2A, 1.5m/min.Put plate along cross direction during nog plate, nog plate once.
Step 2: provide laser drill by electing property of the pcb board laser calcination process after nog plate; The adhesion in cull and pcb board face is declined; Laser drill can be CO
2laser drill, design laser drill program, by the CO of high temperature
2laser beam, makes the cull in pcb board face go through the process of expansion, fusing, evaporation, contraction, thus the adhesion in cull and pcb board face is declined.
Before selectivity calcination, establishment CO
2the drilling program of laser drill, comprises boring aperture, position, hole overlap proportion, bore position.CO
2during laser burns, the parameters such as setting pulsed light wave type, pulse period, pulse duration, pulse number.Preferably being set to pulsed light wave type is Gaussian waveform (Gaussian beam shape) or TOPHAT waveform, aperture scale is 254 μm, position, hole overlap proportion is 0.125, and bore position is that copper block surface edge starts to 0.25mm in copper billet, extend to the inner 5mm of copper billet by closed area.CO
2the parameter of laser burns is: the pulse period is 0.5ms, and pulse duration is 30 μ s, and pulse number is 2 times.Incorporated by reference to consulting Fig. 3, be depicted as laser burns program hole position Overlap design, the shown aperture of centre-drilling hole is 254 μm, the periphery of centre-drilling hole is distributed with the identical boring of six diameters, each boring of outside is crossing with centre-drilling hole, and divide equally the circumference of centre-drilling hole, intersection 21 the widest crossing with centre-drilling hole of holing outside each is of a size of 31.75 μm, the intersection size that adjacent outer boring is between two intersected is identical with the intersection 21 of holing outside each with centre-drilling hole is intersected, and the widest size of intersection is also 31.75 μm.Adopt this laser burns program hole position Overlap design, the aperture scale (254 μm) of conventional laser rig can be maximally utilised, ensure all should be all capped by the copper block surface of laser burns, thus ensure that the cull of copper block surface is all subject to laser burns, and the ratio of laser burns overlap is minimum.Compare conventional design, the laser burns drilling hole amount of 200% can be saved, thus save the laser drill energy ezpenditure of 200%, save the production time of 200%.
Step 3: the pcb board through laser selective calcination is done nog plate process again, makes the cull in plate face pulverize, get loose, final disengaging plate face.When nog plate, certain grinding electric current and transfer rate are set, are preferably set to 1.2A, 1.5m/min.Put plate along length direction during nog plate, nog plate once.Thus realize effective removal of pcb board face cull, and cleaning of plate face.
Between step 2 and step 1, comprise the step of inspection further, checked whether cull, if any then entering step 2.
In step 1 and step 3, needing a point different directions nog plate, and do not limit successively, can be step 1 for length direction puts plate, and corresponding step 3 puts plate for cross direction.
The method that the present invention removes pcb board surface layer baric flow glue is applied to the method for the cull in pcb board face (comprise copper face and copper billet, electric capacity, inductance etc. and imbed device), nog plate preliminary treatment is done by selecting Plate grinder, the nog plate parameter (as grinding electric current and transfer rate) coordinating setting certain, nog plate parameter is gentleer can not cause plate irregular deformation.Pass through CO
2laser burns can not damage PCB copper face, and CO
2the ultrahigh in efficiency of laser drill, thus the method remove pcb board face cull effective, efficiency is high.
The above, it is only preferred embodiment of the present invention, not any pro forma restriction is done to the present invention, although the present invention discloses as above with preferred embodiment, but and be not used to limit the present invention, any those skilled in the art, do not departing within the scope of technical solution of the present invention, make a little change when the technology contents of above-mentioned announcement can be utilized or be modified to the Equivalent embodiments of equivalent variations, in every case be do not depart from technical solution of the present invention content, according to technical spirit of the present invention, within the spirit and principles in the present invention, to any simple amendment that above embodiment is done, equivalent replacement and improvement etc., within the protection range all still belonging to technical solution of the present invention.
Claims (8)
1. remove a method for pcb board surface layer baric flow glue, comprise the steps:
Step 1: provide Plate grinder, does nog plate preliminary treatment by the plate needed except glue process;
Step 2: provide laser drill by electing property of the pcb board laser calcination process after nog plate; The adhesion in cull and pcb board face is declined;
Step 3: the pcb board through laser selective calcination is done nog plate process again, makes the cull in plate face pulverize, get loose, final disengaging plate face;
Wherein, laser burns process mesopore position Overlap design is, the periphery of centre-drilling hole distributes the identical boring of six diameters, each boring of outside is crossing with centre-drilling hole, and divide equally the circumference of centre-drilling hole, the aperture of centre-drilling hole is 152 μm to 254 μm, intersection the widest crossing with centre-drilling hole of holing outside each is of a size of 19.00 μm to 31.75 μm, and the intersection size that adjacent outer boring is between two intersected is measure-alike with the intersection crossing with centre-drilling hole of holing outside each.
2. the method for removal pcb board surface layer baric flow glue according to claim 1, is characterized in that: the cull that described nog plate preliminary treatment makes pcb board face thinner is removed, and thinning thicker cull.
3. the method for removal pcb board surface layer baric flow glue according to claim 2, it is characterized in that: described thinner cull thickness is at 0.001mm to 0.010mm, described thicker cull thickness, at 0.010mm to 0.100mm, makes the thinning 0.010mm of thicker cull by nog plate preliminary treatment.
4. the method for removal pcb board surface layer baric flow glue according to claim 1, is characterized in that: the polish-brush mode that described Plate grinder uses comprises adhesive-bonded fabric polish-brush, ceramic polish-brush or abrasive band polish-brush mode.
5. the method for removal pcb board surface layer baric flow glue according to claim 1, is characterized in that: in step 1 with step 3, and described Plate grinder setting grinding electric current is that between 0.8A to 1.5A, transfer rate is set between 1.0m/min to 2.5m/min.
6. the method for removal pcb board surface layer baric flow glue according to claim 1, is characterized in that: described laser drill is chosen as CO
2laser drill, the drilling parameter of laser drill program is set as that aperture is 152 μm to 254 μm, and position, hole overlap proportion is 0.125, and the laser pulse cycle is 0.25ms to 1ms, and pulse duration is 5 μ s to 40 μ s, and impulse waveform is Gaussian or TOPHAT waveform.
7. the method for removal pcb board surface layer baric flow glue according to claim 1, it is characterized in that: described laser burns program bore position is at copper block surface, from copper billet edge to 0mm to 0.25mm in copper billet, extend to the closed area of inner 3.0mm to the 5.0mm cut-off of copper billet.
8. the method for removal pcb board surface layer baric flow glue according to claim 1, is characterized in that: between step 2 and step 1, comprises the step of inspection further, checked whether cull, if any then entering step 2.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310224863.2A CN103347365B (en) | 2013-06-07 | 2013-06-07 | Remove the method for pcb board surface layer baric flow glue |
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| CN201310224863.2A CN103347365B (en) | 2013-06-07 | 2013-06-07 | Remove the method for pcb board surface layer baric flow glue |
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| CN103347365A CN103347365A (en) | 2013-10-09 |
| CN103347365B true CN103347365B (en) | 2015-09-30 |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104853523A (en) * | 2015-05-18 | 2015-08-19 | 惠州市金百泽电路科技有限公司 | Buried and embedded copper block PCB manufacturing method |
| CN104960123B (en) * | 2015-07-03 | 2018-01-12 | 日月光半导体（昆山）有限公司 | Integrated circuit packaging glue overflow removing equipment and method |
| CN105491806B (en) * | 2016-01-13 | 2018-04-03 | 深圳崇达多层线路板有限公司 | A kind of minimizing technology of embedding copper billet edge excessive glue |
| CN106028653B (en) * | 2016-06-17 | 2018-10-30 | 景旺电子科技(龙川)有限公司 | A kind of copper base surface crater fills and leads up method |
| CN108055786A (en) * | 2017-11-29 | 2018-05-18 | 江西合力泰科技有限公司 | The treatment process of residue glue on a kind of flexible PCB |
| CN108014618A (en) * | 2017-12-12 | 2018-05-11 | 江西鑫力华数码科技有限公司 | A kind of printed wiring board removes gluing method |
| CN108377612A (en) * | 2018-01-29 | 2018-08-07 | 奥士康精密电路（惠州）有限公司 | A kind of PCB blind slots bottom circuit processing technology |
| CN112449495B (en) * | 2019-08-27 | 2021-11-30 | 南通深南电路有限公司 | Drilling detection method and drilling detection equipment |
| CN114101224A (en) * | 2020-08-28 | 2022-03-01 | 碁鼎科技秦皇岛有限公司 | Excessive glue removing method and device for circuit board |
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| CN101699939A (en) * | 2009-11-05 | 2010-04-28 | 深南电路有限公司 | Method for rolling PCB |
| CN101790290A (en) * | 2010-01-22 | 2010-07-28 | 东莞生益电子有限公司 | Method for manufacturing embedded high-conductivity printed circuit board (PCB) |
| CN102489882A (en) * | 2011-11-30 | 2012-06-13 | 深圳市木森科技有限公司 | Method, device and equipment for colloid removal with laser |
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Patent Citations (3)
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|---|---|---|---|---|
| CN101699939A (en) * | 2009-11-05 | 2010-04-28 | 深南电路有限公司 | Method for rolling PCB |
| CN101790290A (en) * | 2010-01-22 | 2010-07-28 | 东莞生益电子有限公司 | Method for manufacturing embedded high-conductivity printed circuit board (PCB) |
| CN102489882A (en) * | 2011-11-30 | 2012-06-13 | 深圳市木森科技有限公司 | Method, device and equipment for colloid removal with laser |
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Address after: 523127 Dongcheng District City, Guangdong province (with sand) science and Technology Industrial Park Road, No. 33 vibration with the number of Patentee after: Shengyi electronic Limited by Share Ltd Address before: 523039 science and Technology Industrial Zone, Dongcheng District, Dongguan, Guangdong Patentee before: Dongguan Shengyi Electronics Ltd. |