CN103338619A - Server - Google Patents
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- CN103338619A CN103338619A CN2013103008195A CN201310300819A CN103338619A CN 103338619 A CN103338619 A CN 103338619A CN 2013103008195 A CN2013103008195 A CN 2013103008195A CN 201310300819 A CN201310300819 A CN 201310300819A CN 103338619 A CN103338619 A CN 103338619A
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Abstract
A server is provided with a cooling device and a heat exchanger (2), wherein the cooling device comprises an evaporation cavity (1) filled with a cooling medium; a main board of the server is soaked in the cooling medium; an evaporation outlet and an evaporation inlet are formed in the evaporation cavity (1); a heat exchanger inlet and a heat exchanger outlet are formed in the heat exchanger (2); the heat exchanger inlet is communicated with the evaporation outlet; and the heat exchanger outlet is communicated with the evaporation inlet. The liquid cooling medium is used for cooling the main board in a soaking manner, so that the cooling efficiency and the cooling effect are improved.
Description
Technical field
The present invention relates to a kind of server.
Background technology
Traditional liquid cooling cooling is only cooling off a part of element to be cooled in the machine box for server, and can't the whole mainboard in the server be cooled off comprehensively, and for the server that adopts such as fan wall, its heat radiation cooling effectiveness is lower.Therefore in the server unit heat dissipation capacity can be very big and temperature usually can be higher, higher temperature can produce a lot of adverse influences to server.Along with developing rapidly of high density server machine room, traditional air-cooled pattern can't satisfy the radiating requirements of data center.The technology that adopts liquid cooling directly to soak cooling at present in the data center machine room still is blank out.
Summary of the invention
At the one or more problems that exist in the correlation technique, the object of the present invention is to provide a kind of server real is the server cooling with the immersion way, has higher cooling efficient and effect compared to existing technology.
For achieving the above object, provide a kind of server, have cooling device, described cooling device comprises: evaporation cavity, in be filled with refrigerant, the mainboard of server is immersed in the refrigerant, and evaporation cavity also has evaporation outlet and evaporation entrance; Heat exchanger has heat exchanger entrance and heat exchanger exit, and heat exchanger entrance is communicated with the evaporation outlet, and heat exchanger exit is communicated with the evaporation entrance.
Preferably, evaporation cavity is annular seal space.
Preferably, the pressure in the evaporation cavity is lower than outside atmospheric pressure.
Preferably, be provided with circulating pump between outlet and the evaporation entrance.
Preferably, heat exchanger is air cooling heat exchanger or water cooling heat exchanger.
Preferably, refrigerant is: by change the insulation fluoride that absorbs heat with heat release between gas phase and liquid phase.
Preferably, the fluoride boiling point is 30-60 ℃.
Preferably, heat exchanger is arranged at the outside of server shell.
Than prior art, beneficial effect of the present invention is:
1. realize that be the mainboard cooling with liquid coolant in the mode of soaking, improved cooling efficient and effect.
2. the noise of having avoided traditional air-cooled technology to use fan to bring.
3. the evaporation cavity internal gas pressure is lower than outside atmospheric pressure, thereby the boiling point of refrigerant also reduces in the evaporation cavity, the high evaporation effect of refrigerant, thus further improved the ability of cooling device cooling.
Description of drawings
Fig. 1 is the schematic diagram of cooling device in the server of the present invention.
Embodiment
Below in conjunction with accompanying drawing the specific embodiment of the invention is described.
A kind of server, has cooling device, wherein cooling device comprises evaporation cavity 1 and heat exchanger 2, evaporation cavity 1 has evaporation outlet and evaporation entrance, heat exchanger has heat exchanger exit and heat exchanger entrance, and be filled with refrigerant in the evaporation cavity 1, and heat exchanger entrance is communicated with the evaporation outlet, heat exchanger exit is communicated with the evaporation entrance.When cooling device was worked, the refrigerant in the evaporation cavity 1 absorbed heat, thereby evaporation from evaporation outlet heat exchanger entrance, in heat exchanger heat-transmission condensation, is flowed back to evaporation cavity 1 from the heat exchanger exit evaporation entrance of flowing through afterwards.Further, the refrigerant in the evaporation cavity 1 soaks the mainboard of server, thereby server master board is cooled off, and obviously, the heat that above-mentioned refrigerant absorbs is exactly the heat that mainboard produces.
By the cooling device of the above-mentioned server of the present invention, realize that be the mainboard cooling with liquid coolant in the mode of soaking, improved cooling efficient and effect.Preferably by change the insulation fluoride that absorbs heat with heat release between gas phase and liquid phase, its boiling point is 30-60 ℃ to the refrigerant that uses in the cooling device of server of the present invention.
Preferably, above-mentioned fluoride can be: CF
3CHFCHFCF
2CF
3, CClF
2CCl
2Among F, the HCFC-141b any one or a few.
Preferably, evaporation cavity 1 is annular seal space, and the pressure in the evaporation cavity 1 is lower than outside atmospheric pressure, be in like this refrigerant in the evaporation cavity 1 boiling point can along with pressure reduction and reduce, easier evaporation improves the effect of evaporation, thereby has further improved the ability of cooling device cooling; And when the pressure in the evaporation cavity 1 was lower than external pressure, the refrigerant in the evaporation cavity 1 was not allowed to leak.Certainly, it is preferred embodiment a kind of that the pressure in the evaporation cavity 1 is lower than external pressure, and is not used in restriction the present invention, and evaporation cavity 1 internal pressure is equal to, or greater than the atmosphere outside pressure equally also can be suitable for the present invention.By the pressure in the control evaporation cavity 1, can control the boiling point of refrigerant in the evaporation cavity 1.
In addition, between above-mentioned heat exchanger exit and evaporation entrance, also be provided with circulating pump 3, think that refrigerant provides the power that flows back to evaporation cavity 1.Heat exchanger 2 preferably is arranged at the outside of server shell, to save the server inner space.
Above-mentioned heat exchanger 2 can or be air cooling heat exchanger for water cooling heat exchanger, if adopt water cooling heat exchanger, can further reduce the noise that fan brings.For example, be provided with coil pipe in the heat exchanger 2, be full of water in the coil pipe, to realize the refrigerant cooling to flowing into.Certainly, these just preferred embodiment can be full of the refrigerant as freon in the coil pipe equally, and heat exchanger 2 can also be other forms of heat exchangers, as long as can be the refrigerant cooling that flows into from evaporation cavity 1, and can be with in the present invention.
The above-mentioned refrigerant of mentioning can be nontoxic, non-conductive, high-flash and to entering the free from corrosion any any liquid that can realize refrigerant purpose among the present invention of parts (as mainboard parts etc.) wherein.
The above is the preferred embodiments of the present invention only, is not limited to the present invention, and for a person skilled in the art, the present invention can have various changes and variation.Within the spirit and principles in the present invention all, any modification of doing, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (8)
1. a server has cooling device, it is characterized in that, described cooling device comprises:
Evaporation cavity (1), in be filled with refrigerant, the mainboard of described server is immersed in the described refrigerant, and described evaporation cavity (1) also has evaporation outlet and evaporation entrance;
Heat exchanger (2) has heat exchanger entrance and heat exchanger exit, and described heat exchanger entrance is communicated with described evaporation outlet, and described heat exchanger exit is communicated with described evaporation entrance.
2. server according to claim 1 is characterized in that,
Described evaporation cavity (1) is annular seal space.
3. server according to claim 2 is characterized in that,
Pressure in the described evaporation cavity (1) is lower than outside atmospheric pressure.
4. server according to claim 1 is characterized in that,
Be provided with circulating pump (3) between described heat exchanger exit and the described evaporation entrance.
5. server according to claim 1 is characterized in that,
Described heat exchanger (2) is air cooling heat exchanger or water cooling heat exchanger.
6. server according to claim 1 is characterized in that,
Described refrigerant is: by change the insulation fluoride that absorbs heat with heat release between gas phase and liquid phase.
7. server according to claim 6 is characterized in that,
Described fluoride boiling point is 30-60 ℃.
8. server according to claim 6 is characterized in that,
Described heat exchanger (2) is arranged at the outside of described server shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103008195A CN103338619A (en) | 2013-07-17 | 2013-07-17 | Server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103008195A CN103338619A (en) | 2013-07-17 | 2013-07-17 | Server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103338619A true CN103338619A (en) | 2013-10-02 |
Family
ID=49246695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013103008195A Pending CN103338619A (en) | 2013-07-17 | 2013-07-17 | Server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103338619A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103616941A (en) * | 2013-11-12 | 2014-03-05 | 曙光信息产业(北京)有限公司 | Blade server |
| CN103616940A (en) * | 2013-11-12 | 2014-03-05 | 曙光信息产业(北京)有限公司 | Blade server |
| CN104166448A (en) * | 2014-08-20 | 2014-11-26 | 浪潮电子信息产业股份有限公司 | Immersion-type server cooling device |
| CN104317374A (en) * | 2014-10-28 | 2015-01-28 | 曙光信息产业(北京)有限公司 | Radiating device and method |
| CN104571418A (en) * | 2014-12-24 | 2015-04-29 | 曙光信息产业(北京)有限公司 | Server cooling device and server system |
| CN104571420A (en) * | 2014-12-31 | 2015-04-29 | 曙光信息产业(北京)有限公司 | Submersible liquid-cooling server and submersible liquid cooling method for server |
| CN104597994A (en) * | 2014-12-31 | 2015-05-06 | 曙光信息产业(北京)有限公司 | Immersed liquid cooling server and immersed liquid cooling method for server |
| CN106873738A (en) * | 2016-12-23 | 2017-06-20 | 曙光节能技术（北京）股份有限公司 | For the liquid cooling system and liquid cooling method of server |
| CN107645884A (en) * | 2016-07-21 | 2018-01-30 | 阿里巴巴集团控股有限公司 | The cooling system of data handling system and data handling system |
| RU221273U1 (en) * | 2023-06-08 | 2023-10-30 | Акционерное общество "СИТРОНИКС" | Server case |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101610662A (en) * | 2008-06-20 | 2009-12-23 | 沈国忠 | Heat pipe cooling type fully sealed high-efficiency radiating electronic cabinet |
| US20110132579A1 (en) * | 2008-08-11 | 2011-06-09 | Green Revolution Cooling, Inc. | Liquid Submerged, Horizontal Computer Server Rack and Systems and Method of Cooling such a Server Rack |
-
2013
- 2013-07-17 CN CN2013103008195A patent/CN103338619A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101610662A (en) * | 2008-06-20 | 2009-12-23 | 沈国忠 | Heat pipe cooling type fully sealed high-efficiency radiating electronic cabinet |
| US20110132579A1 (en) * | 2008-08-11 | 2011-06-09 | Green Revolution Cooling, Inc. | Liquid Submerged, Horizontal Computer Server Rack and Systems and Method of Cooling such a Server Rack |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103616941A (en) * | 2013-11-12 | 2014-03-05 | 曙光信息产业(北京)有限公司 | Blade server |
| CN103616940A (en) * | 2013-11-12 | 2014-03-05 | 曙光信息产业(北京)有限公司 | Blade server |
| CN104166448A (en) * | 2014-08-20 | 2014-11-26 | 浪潮电子信息产业股份有限公司 | Immersion-type server cooling device |
| CN104317374A (en) * | 2014-10-28 | 2015-01-28 | 曙光信息产业(北京)有限公司 | Radiating device and method |
| CN104571418B (en) * | 2014-12-24 | 2018-04-17 | 曙光节能技术（北京）股份有限公司 | Server cooling device and server system |
| CN104571418A (en) * | 2014-12-24 | 2015-04-29 | 曙光信息产业(北京)有限公司 | Server cooling device and server system |
| CN104571420A (en) * | 2014-12-31 | 2015-04-29 | 曙光信息产业(北京)有限公司 | Submersible liquid-cooling server and submersible liquid cooling method for server |
| CN104597994A (en) * | 2014-12-31 | 2015-05-06 | 曙光信息产业(北京)有限公司 | Immersed liquid cooling server and immersed liquid cooling method for server |
| CN104571420B (en) * | 2014-12-31 | 2018-04-20 | 曙光节能技术（北京）股份有限公司 | Immersion liquid-cooled suit business device, the immersion liquid cooling method for server |
| CN104597994B (en) * | 2014-12-31 | 2018-08-31 | 曙光节能技术（北京）股份有限公司 | Immersion liquid cooling server, the immersion liquid cooling method for server |
| CN107645884A (en) * | 2016-07-21 | 2018-01-30 | 阿里巴巴集团控股有限公司 | The cooling system of data handling system and data handling system |
| CN106873738A (en) * | 2016-12-23 | 2017-06-20 | 曙光节能技术（北京）股份有限公司 | For the liquid cooling system and liquid cooling method of server |
| RU221273U1 (en) * | 2023-06-08 | 2023-10-30 | Акционерное общество "СИТРОНИКС" | Server case |
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Application publication date: 20131002 |
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| RJ01 | Rejection of invention patent application after publication |