CN103311626A - Conversion circuit for microstrip lines to substrate integration nonradiative dielectric waveguide - Google Patents
Conversion circuit for microstrip lines to substrate integration nonradiative dielectric waveguide Download PDFInfo
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- CN103311626A CN103311626A CN2013102466980A CN201310246698A CN103311626A CN 103311626 A CN103311626 A CN 103311626A CN 2013102466980 A CN2013102466980 A CN 2013102466980A CN 201310246698 A CN201310246698 A CN 201310246698A CN 103311626 A CN103311626 A CN 103311626A
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Abstract
The invention provides a conversion circuit for microstrip lines to a substrate integration nonradiative dielectric waveguide. The circuit is of a three-layer dual conversion circuit structure with the substrate integration nonradiative dielectric waveguide being sandwiched by two microstrip lines. The two microstrip lines are respectively disposed on the upper side and the lower side of a printed circuit board. The substrate integration nonradiative dielectric waveguide is achieved by directly drilling the printed circuit board. The conversion circuit has the advantages that manufacturing process of the nonradiative dielectric waveguide is simplified, leakage loss of the substrate integration nonradiative dielectric waveguide at an air hole is restrained effectively, the two microstrip lines are separated, and coupling and interference of two planar circuits are restrained; by the three-layer circuit structure, space is fully utilized, a planar system and non-planar system are integrated in a compact manner, and circuit size can be reduced effectively; the conversion circuit is simple and flexible in manufacturing process, dual-layer conversion of the microstrip lines and the substrate integration nonradiative dielectric waveguide is achieved, and basis is provided for design of millimeter wave band hybrid integration planar and non-planar circuits.
Description
Technical field
The invention belongs to microwave technical field, particularly a kind of microstrip line is to the change-over circuit of the integrated non-radiative dielectric waveguide of substrate.
Background technology
Along with the fast development of Modern wireless communication technology, frequency spectrum resource is day by day in short supply, so that the research of microwave circuit and application are towards millimeter wave and more high band expansion.But not the radiation medium waveguide has less radiation and leakage losses at structural bending and discontinuous place, and this characteristic makes it become critical elements in the millimeter wave frequency band circuit design., there are following two problems in traditional non-radiative dielectric waveguide when being applied to the millimetre-wave circuit design: 1, traditional non-radiative dielectric waveguide step on manufacture craft is numerous and diverse, and needing up and down, two metallic plates paste respectively the medium strip both sides; And the medium strip height of non-radiative dielectric waveguide is 0.2 λ-0.5 λ, cause frequency to be increased to certain level after, craft precision is difficult to satisfy the making of traditional non-radiative dielectric waveguide; 2, the planar circuit structure has important effect equally in the millimetre-wave circuit design, but not the radiation medium waveguide needs a kind of change-over circuit of design as a kind of non-planar circuits structure, realizes that it arrives the conversion of planar circuit.In order to use very easily non-radiative dielectric waveguide, design mixes integrated planar and non-planar circuits, must propose a kind of non-radiative dielectric waveguide structure that is easy to processing and fabricating, and on this architecture basics, propose a kind of change-over circuit, realize smoothly the transition of plane and non-planar circuits.
Summary of the invention
Technical problem to be solved by this invention is in order to overcome the deficiencies in the prior art, to make and integrated hard problem for the non-radiative dielectric waveguide of tradition, the change-over circuit of a kind of microstrip line to the integrated non-radiative dielectric waveguide of substrate being provided.
The present invention adopts following technical scheme for solving the problems of the technologies described above:
A kind of microstrip line comprises the first microstrip line, the second microstrip line and printed circuit board (PCB) to the change-over circuit of the integrated non-radiative dielectric waveguide of substrate;
Described the first microstrip line comprises the first metal band, first medium substrate and the first ground plate;
Described the second microstrip line comprises the second metal band, second medium substrate and the second ground plate;
The two sides of described printed circuit board (PCB) fits with the one side of the first ground plate and the one side of the second ground plate respectively; The one side of described first medium substrate is affixed with the another side of the first ground plate; The one side of described second medium substrate is affixed with the another side of the second ground plate; Described the first metal band is fitted in the another side of first medium substrate; Described the second metal band is fitted in the another side of second medium substrate;
The broadside of described the first metal band aligns with the long limit of first medium substrate; On described the first ground plate the first rectangular opening is set, described the first rectangular opening is along arranging on the broken line of the first ground plate long side direction;
The broadside of described the second metal band aligns with the long limit of second medium substrate; On described the second ground plate the second rectangular opening is set, described the second rectangular opening is along arranging on the broken line of the second ground plate long side direction;
On the described printed circuit board (PCB) air vent hole is set, along on the printed circuit board (PCB) long side direction broken line, apart from the broken line W scope air vent hole not being set, namely printed circuit board (PCB) middle part not the width of perforated area be 2W; W is that 0.025 λ is to 0.75 λ; λ is electromagnetic wavelength;
The first rectangular opening on described the first ground plate is spatially with the first metal band orthogonal vertical;
The second rectangular opening on described the second ground plate is spatially with the second metal band orthogonal vertical.
In the described printed circuit board (PCB) radius of air vent hole be 0.1mm to 5mm, the hole of air vent hole is in the heart apart from arrive 10mm for 0.25mm.
Described the first rectangular opening and the second rectangular opening measure-alike, the length of the first rectangular opening and the second rectangular opening is that 0.3 λ is to λ; The width of the first rectangular opening and the second rectangular opening is that 0.2mm is to 3mm.
The thickness of described printed circuit board (PCB) is 0.2 λ-0.5 λ.
Beneficial effect of the present invention: the present invention proposes a kind of microstrip line to the change-over circuit of the integrated non-radiative dielectric waveguide of substrate.Described circuit adopts three layers of circuit structure of two conversions of an integrated non-radiative dielectric waveguide of substrate of two microstrip line therebetween; Described two-layer microstrip line is placed on respectively up and down both sides of printed circuit board (PCB), and the integrated non-radiative dielectric waveguide of described substrate is directly to realize in the printed circuit board (PCB) punching.The present invention has simplified the manufacture craft of non-radiative dielectric waveguide, and the integrated non-radiative dielectric waveguide of establishment substrate is isolated two-layer microstrip line construction in the leakage losses at air hole place, has suppressed coupling and interference between two-layer planar circuit; Adopt three layers of circuit structure, take full advantage of the space, compact integrated planar and on-plane surface system can effectively reduce the circuit volume; Manufacture craft is simple, flexible simultaneously, also can realize the double-deck change-over circuit of the integrated non-radiative dielectric waveguide of microstrip line and substrate, and the design that mixes integrated planar and non-planar circuits for millimere-wave band provides foundation.
Description of drawings
Fig. 1 is the integrally-built end view of change-over circuit.
Fig. 2 is branch's schematic diagram of the first microstrip line layer in the change-over circuit; Wherein: Fig. 2 a is the vertical view of microstrip line layer; Fig. 2 b is the upward view of microstrip line layer.
Fig. 3 is the vertical view of printed circuit board (PCB) in the change-over circuit.
The simulation performance figure of Fig. 4 change-over circuit; Wherein: Fig. 4 a is the simulation performance figure of change-over circuit when using the integrated non-radiative dielectric waveguide of substrate; Fig. 4 b is the simulation performance figure of change-over circuit when using traditional non-radiative dielectric waveguide.
Among description of reference numerals: Fig. 1 and Fig. 2: 1 is the first metal band, and 2 is second metal bands, the 3rd, and first medium substrate, the 4th, second medium substrate, 5 is first ground plates, and 6 is second ground plates, the 7th, and printed circuit board (PCB), 8 is first rectangular openings, and 9 is second rectangular openings, the 10th, and air vent hole.
Embodiment
Below in conjunction with accompanying drawing technical scheme of the present invention is described in further detail:
As shown in Figure 1, the overall structure of change-over circuit is from top to bottom successively: the first metal band 1, first medium substrate 3, the first ground plates 5, printed circuit board (PCB) 7, the second ground plate 6, second medium substrate 4, the second metal bands 2 are wherein opened the first rectangular opening 8 on the first ground plate 5, open the second rectangular opening 9 on the second ground plate, air vent hole 10 is set on the printed circuit board (PCB).
And on circuit function, change-over circuit is three layers of circuit structure of two conversions of the integrated non-radiative dielectric waveguide of the first microstrip line, substrate and the second microstrip line.Described the first microstrip line layer is by the first metal band 1, and first medium substrate 3, the first ground plates 5 consist of.Shown in Fig. 2 a, the first metal band 1 is placed on the first medium substrate 3; Shown in Fig. 2 b, the first ground plate 5 is along opening the first rectangular opening 8 on the long side direction broken line, and be placed on first medium substrate 3 below.Described the second microstrip line layer is by the second metal band 2, and second medium substrate 4, the second ground plates 6 consist of, and its structure is identical with the first microstrip line layer with size.The integrated non-radiative dielectric waveguide of described substrate is made of printed circuit board (PCB) 7 and air vent hole 10, reserves one section wide in the middle part of the printed circuit board (PCB) as shown in Figure 3 and is the not perforated area of 2W, and 2W is 0.05 λ-1.5 λ, and λ is electromagnetic wavelength; In this left and right sides, zone, symmetry is made air hole.Conversion between the integrated non-radiative dielectric waveguide of the first microstrip line layer and substrate is realized by the first rectangular opening 8 of opening on the first ground plate 5; Conversion between the integrated non-radiative dielectric waveguide of substrate and the second microstrip line layer is realized by the second rectangular opening 9 of opening on the second ground plate 6.
As shown in Figure 4, to have provided medium substrate thick be that 0.52 mm, relative dielectric constant are 2.56 to Fig. 4 a; The printed circuit plate thickness is that 7.5 mm, relative dielectric constant are 3.27; Rectangular opening is 10.2 * 5.5 mm
2The time, utilize the bandwidth of operation (operating frequency 15GHz) of the change-over circuit of HFSS software emulation.As a comparison, Fig. 4 b has provided and has adopted same design of material, had the bandwidth of operation of three layers of change-over circuit of the non-radiative dielectric waveguide of use tradition of same working frequency range.According to contrast as seen, use the change-over circuit of the integrated non-radiative dielectric waveguide of substrate can reach the effect of using traditional non-radiative dielectric waveguide, show based on the integrated non-radiative dielectric waveguide of the substrate of printed circuit board (PCB) can be applied in the circuit design of millimere-wave band; Further, the microstrip line that the present invention proposes can realize effectively that to the change-over circuit of substrate integration wave-guide the mixing of plane and non-planar circuits is integrated.
Microstrip line takes full advantage of the space to the change-over circuit of the integrated non-radiative dielectric waveguide of substrate, and compact integrated planar and on-plane surface system effectively reduce the circuit volume.Simultaneously this structure can the integrated non-radiative dielectric waveguide of establishment substrate in the leakage losses at air hole place, isolate two-layer microstrip line construction, reduce coupling and interference between two-layer planar circuit.Therefore, the present invention provides foundation for the design of millimeter wave frequency band mixing integrated planar and non-planar circuits.
Claims (4)
1. a microstrip line is characterized in that to the change-over circuit of the integrated non-radiative dielectric waveguide of substrate, comprises the first microstrip line, the second microstrip line and printed circuit board (PCB);
Described the first microstrip line comprises the first metal band, first medium substrate and the first ground plate;
Described the second microstrip line comprises the second metal band, second medium substrate and the second ground plate;
The two sides of described printed circuit board (PCB) fits with the one side of the first ground plate and the one side of the second ground plate respectively; The one side of described first medium substrate is affixed with the another side of the first ground plate; The one side of described second medium substrate is affixed with the another side of the second ground plate; Described the first metal band is fitted in the another side of first medium substrate; Described the second metal band is fitted in the another side of second medium substrate;
The broadside of described the first metal band aligns with the long limit of first medium substrate; On described the first ground plate the first rectangular opening is set, described the first rectangular opening is along arranging on the broken line of the first ground plate long side direction;
The broadside of described the second metal band aligns with the long limit of second medium substrate; On described the second ground plate the second rectangular opening is set, described the second rectangular opening is along arranging on the broken line of the second ground plate long side direction;
On the described printed circuit board (PCB) air vent hole is set, along on the printed circuit board (PCB) long side direction broken line, apart from the broken line W scope air vent hole not being set, namely printed circuit board (PCB) middle part not the width of perforated area be 2W; W is that 0.025 λ is to 0.75 λ; λ is electromagnetic wavelength;
The first rectangular opening on described the first ground plate is spatially with the first metal band orthogonal vertical;
The second rectangular opening on described the second ground plate is spatially with the second metal band orthogonal vertical.
2. a kind of microstrip line as claimed in claim 1 is characterized in that to the change-over circuit of the integrated non-radiative dielectric waveguide of substrate, in the described printed circuit board (PCB) radius of air vent hole be 0.1mm to 5mm, the hole of air vent hole is in the heart apart from arrive 10mm for 0.25mm.
3. a kind of microstrip line as claimed in claim 1 is characterized in that to the change-over circuit of the integrated non-radiative dielectric waveguide of substrate, described the first rectangular opening and the second rectangular opening measure-alike, and the length of the first rectangular opening and the second rectangular opening is that 0.3 λ is to λ; The width of the first rectangular opening and the second rectangular opening is that 0.2mm is to 3mm.
4. a kind of microstrip line as claimed in claim 1 is characterized in that to the change-over circuit of the integrated non-radiative dielectric waveguide of substrate, and the thickness of described printed circuit board (PCB) is 0.2 λ-0.5 λ.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102466980A CN103311626A (en) | 2013-06-20 | 2013-06-20 | Conversion circuit for microstrip lines to substrate integration nonradiative dielectric waveguide |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102466980A CN103311626A (en) | 2013-06-20 | 2013-06-20 | Conversion circuit for microstrip lines to substrate integration nonradiative dielectric waveguide |
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| CN103311626A true CN103311626A (en) | 2013-09-18 |
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| CN2013102466980A Pending CN103311626A (en) | 2013-06-20 | 2013-06-20 | Conversion circuit for microstrip lines to substrate integration nonradiative dielectric waveguide |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103943927A (en) * | 2014-04-15 | 2014-07-23 | 南京邮电大学 | Circuit for switching from coplanar waveguides to substrate integrated nonradiative dielectric waveguides |
| CN104835996A (en) * | 2015-05-05 | 2015-08-12 | 南京邮电大学 | Conversion circuit from coplanar waveguides to substrate integrated non-radiative dielectric waveguide |
| CN104868213A (en) * | 2015-04-20 | 2015-08-26 | 南京邮电大学 | Novel substrate integrated non-radiation dielectric waveguide feed structure |
| CN105680136A (en) * | 2016-03-21 | 2016-06-15 | 南京邮电大学 | Transition circuit from coplanar waveguide to groove line and to substrate integrated non-radiation dielectric waveguides |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010049266A1 (en) * | 2000-04-26 | 2001-12-06 | Kazuki Hayata | Structure for connecting non -radiative dielectric waveguide and metal waveguide, millimeter wave transmitting/receiving module and millimeter wave transmitter/receiver |
| JP2008048021A (en) * | 2006-08-11 | 2008-02-28 | Omron Corp | Transmission line conversion apparatus |
-
2013
- 2013-06-20 CN CN2013102466980A patent/CN103311626A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010049266A1 (en) * | 2000-04-26 | 2001-12-06 | Kazuki Hayata | Structure for connecting non -radiative dielectric waveguide and metal waveguide, millimeter wave transmitting/receiving module and millimeter wave transmitter/receiver |
| JP2008048021A (en) * | 2006-08-11 | 2008-02-28 | Omron Corp | Transmission line conversion apparatus |
Non-Patent Citations (2)
| Title |
|---|
| FENG XU等: "Substrate Integrated Nonradioactive Dielectric Waveguide Structures Directly Fabricated on Printed Circuit Boards and Metallized Dielectric Layers", 《IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES》 * |
| YVES CASSIVI等: "Substrate Integrated Nonradiative Dielectric Waveguide", 《IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103943927A (en) * | 2014-04-15 | 2014-07-23 | 南京邮电大学 | Circuit for switching from coplanar waveguides to substrate integrated nonradiative dielectric waveguides |
| CN104868213A (en) * | 2015-04-20 | 2015-08-26 | 南京邮电大学 | Novel substrate integrated non-radiation dielectric waveguide feed structure |
| CN104835996A (en) * | 2015-05-05 | 2015-08-12 | 南京邮电大学 | Conversion circuit from coplanar waveguides to substrate integrated non-radiative dielectric waveguide |
| CN105680136A (en) * | 2016-03-21 | 2016-06-15 | 南京邮电大学 | Transition circuit from coplanar waveguide to groove line and to substrate integrated non-radiation dielectric waveguides |
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Application publication date: 20130918 |