CN103311206B - Be packaged with the electronic device of welding end ring and there is the electronic equipment of this electronic device - Google Patents
Be packaged with the electronic device of welding end ring and there is the electronic equipment of this electronic device Download PDFInfo
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- CN103311206B CN103311206B CN201310196796.8A CN201310196796A CN103311206B CN 103311206 B CN103311206 B CN 103311206B CN 201310196796 A CN201310196796 A CN 201310196796A CN 103311206 B CN103311206 B CN 103311206B
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Abstract
The present invention is applicable to technical field of electronic devices, discloses a kind ofly be packaged with the electronic device of welding end ring and have the electronic equipment of this electronic device.Above-mentioned electronic device comprises body and welding end ring, and described welding end is located on the periphery wall of described body, and described welding end ring has plane welding end, and described face bonding is held level with both hands together or protruded from the periphery wall of described body.Above-mentioned electronic equipment comprises circuit board, and described circuit board is provided with pad, also comprises the above-mentioned electronic device being packaged with welding end ring, and the plane welding end of described electronic device is welded on described pad.Provided by the present inventionly be packaged with the electronic device of welding end ring and there is the electronic equipment of this electronic device, it is by arranging the plane welding end flushing in body or protrude from body, when plane welding end is welded in circuit board, solder joint place is not easy to crack and reduces in application sets, the easily extensible path of crackle is also larger, product is also not easy to lose efficacy, and product reliability is high.
Description
Technical field
The invention belongs to technical field of electronic devices, particularly relate to and be a kind ofly packaged with the electronic device of welding end ring and there is the electronic equipment of this electronic device.
Background technology
Current electronic device, such as MELF packaging, its welding end is generally in cylindric, and welding end is concordant with body, welding end and PCB(PrintedCircuitBoard, printed circuit board (PCB)) pad be linear contact lay, contact area is little.When this kind of device of the prior art is welded on PCB, the height that tin cream climbs along welding end is less, causes the tin amount of welding end little.Because body is pottery, the CTE(CoefficientofThermalExpansion of itself and PCB, thermal coefficient of expansion) do not mate, and the little tin amount of welding end well can not play the unmatched effect reducing CTE, therefore when long-time running, solder joint easily cracks, thus can not reach the requirement of product long-term reliability.And there is crackle in welding end place solder joint upper stress great Yi, and crackle easily extensible path is little, easily occurs early failure, and product reliability is poor.
Summary of the invention
The object of the invention is to overcome above-mentioned the deficiencies in the prior art, provide and be a kind ofly packaged with the electronic device of welding end ring and have the electronic equipment of this electronic device, its reliability is high.
On the one hand, as the first performance, the invention provides a kind of electronic device being packaged with welding end ring, comprise body and welding end ring, it is characterized in that, described welding end is located on the periphery wall of described body, and described welding end ring has plane welding end, and described face bonding is held level with both hands together or protruded from the periphery wall of described body.
In conjunction with the first performance, as the second performance, described body is tubular, and described welding end ring comprises the end welding end ring at the two ends being packaged in described body.
In conjunction with the second performance, as the third performance, described welding end ring also comprises the middle part welding end ring being packaged in described body stage casing.
In conjunction with the third performance, as the 4th kind of performance, the plane welding end of described middle part welding end ring and the plane welding end of described end welding end ring coplanar.
In conjunction with any one performance in the second to four, as the 5th kind of performance, cylindrically, described welding end ring is rectangular for described body, and described body is inscribed within described welding end ring.
In conjunction with any one performance in the second to four, as the 6th kind of performance, cylindrically, described welding end ring is annular to described body, and the lower end of described welding end ring forms plane welding end by removing material or forms plane welding end by increasing material.
In conjunction with any one performance in the second to four, as the 7th kind of performance, described plane welding end offers groove.
In conjunction with any one performance in first to fourth, as the 8th kind of performance, described electronic device is gas discharge tube.
In conjunction with any one performance in first to fourth, as the 9th kind of performance, described electronic device adopts welding end ring end face bonding encapsulating structure.
Second aspect, present invention also offers a kind of electronic equipment, comprises circuit board, and described circuit board is provided with pad, also comprises the above-mentioned electronic device being packaged with welding end ring, and the plane welding end of described electronic device is welded on described pad.
Provided by the present inventionly be packaged with the electronic device of welding end ring and there is the electronic equipment of this electronic device, it is by arranging the plane welding end flushing in body or protrude from body, when plane welding end is welded in circuit board, solder joint place is not easy to crack and reduces in application sets, even if there is crackle, because open ended tin cream amount is more, the easily extensible path of crackle is also larger, product is also not easy to lose efficacy, and product reliability is high.
Accompanying drawing explanation
Fig. 1 is the front view that the rectangular and face bonding end of welding end ring that the embodiment of the present invention one provides flushes in the electronic device of body;
Fig. 2 is the left view of the electronic device in Fig. 1;
Fig. 3 is the front view that the rounded and face bonding end of welding end ring that the embodiment of the present invention one provides flushes in the electronic device of body;
Fig. 4 is the left view of the electronic device in Fig. 3;
Fig. 5 is the front view that the rectangular and plane welding end of welding end ring that the embodiment of the present invention one provides protrudes from the electronic device of body;
Fig. 6 is the left view of the electronic device in Fig. 5;
Fig. 7 is the front view that the rectangular and face bonding end of welding end ring that the embodiment of the present invention two provides flushes in the electronic device of body;
Fig. 8 is the left view of the electronic device in Fig. 7;
Fig. 9 is the front view that the rounded and plane welding end of welding end ring that the embodiment of the present invention two provides protrudes from the electronic device of body;
Figure 10 is the left view of the electronic device in Fig. 9;
Figure 11 is the front view that the rounded and plane welding end of welding end ring that the embodiment of the present invention two provides protrudes from the electronic device of body;
Figure 12 is the left view of the electronic device in Figure 11.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
A kind of electronic device being packaged with welding end ring that the embodiment of the present invention provides, comprise body and welding end ring, described welding end is located on the periphery wall of described body, and described welding end ring has plane welding end, and described face bonding is held level with both hands together or protruded from the periphery wall of described body.Like this, the pad of welding end ring and PCB can be made to there is larger contact area, more tin cream can be held.Solder joint place is not easy to crack and reduces in application sets, even if there is crackle, because tin cream amount is more, the easily extensible path of crackle is also just large, and product is also not easy to lose efficacy, and product reliability is high.
Embodiment one:
As depicted in figs. 1 and 2, a kind of electronic device 1 being packaged with welding end ring that the embodiment of the present invention provides, comprise body 11 and welding end ring 12, body 11 can be made up of insulating material such as pottery, plastic cement.Welding end ring 12 is placed on the periphery wall of body 11, and welding end ring 12 can be in the form of a ring.And welding end ring 12 has plane welding end 101, plane welding end 101 flushes in the periphery wall of body 11, and namely the end face of plane welding end 101 is concordant with the minimum point of body 11 periphery wall.The periphery wall of body 11 can be cylindrical, its horizontally set, and end face and the columniform body 11 of plane welding end 101 are tangent.Solder joint place is not easy to crack and reduces in application sets, even if there is crackle, the easily extensible path of crackle is large, and product is also not easy to lose efficacy, and product reliability is high.
Particularly, as depicted in figs. 1 and 2, body 11 can be tubular, such as cylindric or polygon tubular, welding end ring 12 comprises the end welding end ring 12 at the two ends being packaged in body 11, and end welding end ring 12 can in the form of a ring, during embody rule, two end welding end rings 12 can be placed on respectively or be stuck in the two ends of body 11, then by two Electrode connection in body 11 or/and end welding end ring 12.In addition, also formation welding end ring 12 can directly be electroplated on body 11.
In embody rule, as depicted in figs. 1 and 2, cylindrically, welding end ring 12 is rectangular for body 11, and body 11 is inscribed within welding end ring 12.Be that face contacts with pad bottom welding end ring 12, welding end ring 12 can be square, then welding end ring 12 can be made as square ring and to be enclosed within body 11 or Direct Electroplating forms welding end ring 12 on body 11; As shown in Figure 3 and Figure 4, if welding end ring 12 exceeds body 11, then welding end ring 12 can be made as annular element and be enclosed within body 11, because welding end ring 12 is larger than body 11, welding end ring 12 welding portion can be polished flat and form plane welding end 101; Certainly, also welding end ring 12 can be enclosed within after on body 11, be produced the plane welding end 101 exceeding body 11 at welding end position by plating mode.
Or, as shown in Figure 3 and Figure 4, the periphery wall of body 11 can cylindrical and horizontally set, plane welding end 101 protrudes from the periphery wall of body 11, namely when plane welding end 101 is welded in the pad of PCB, gap is there is between the periphery wall of body 11 and PCB, the height that tin cream climbs along welding end is larger, can hold more tin cream, solder joint place is not easy to crack and reduces in application sets, even if there is crackle, because tin cream amount is more, the easily extensible path of crackle is also larger, and product is also not easy to lose efficacy, and product reliability is high.
In embody rule, as shown in Figure 3 and Figure 4, welding end ring 12 also can be annular, and the lower end of welding end ring 12 forms plane welding end 101 by removing material or forms plane welding end 101 by increasing material.So-called removal material, namely refers on circular welding end ring 12, polish a plane by polishing, cutting etc. mode.So-called increase material, namely refers on circular welding end ring 12, form a plane by plating etc. mode.
In embody rule, as shown in Figure 5 and Figure 6, the shape of body 11 can set according to actual conditions, and the shape of welding end ring 12 can be identical with the shape of body 11 or close.
Particularly, plane welding end 101 offers groove (not shown), to hold more tin cream, be beneficial to the reliability improving product.Alternatively, the cross section of groove can be " V " font, " U " font or semicircle etc.Groove can be provided with one or more, and when being provided with many grooves, each groove can be arranged in parallel, also can crisscrossly arrange.
In embody rule, electronic device 1 can be gas discharge tube or anti-thunder tube etc.Electronic device 1 can be SMD(SurfaceMountedDevice, surface mounting component).
In embody rule, electronic device 1 can adopt welding end ring 12 end face bonding encapsulating structure, i.e. MELF(MetalElectrodeFaceBonding, metal electrode end face bonding) encapsulation.
The present embodiment additionally provides the preparation method of above-mentioned electronic device 1, comprises the following steps, and prepares the welding end ring 12 of body 11, welding end ring 12 is placed on body 11.On welding end ring 12, arrange plane plane welding end 101 in welding ring being placed between body 11 or afterwards, plane welding end 101 is concordant or protrude from the periphery wall of body 11, and end welding end ring 12 is packaged in body 11 by MELF.
The embodiment of the present invention additionally provides a kind of electronic equipment, comprises circuit board, and circuit board is provided with pad, and also comprise the above-mentioned electronic device 1 being packaged with welding end ring 12, the plane welding end 101 of electronic device 1 is welded on pad.
Embodiment two:
As shown in Figure 7 and Figure 8, on the basis of the electronic device 1 being packaged with welding end ring 12 provided in embodiment one, the electronic device 1 in the present embodiment, its welding end ring 12 also comprises the middle part welding end ring 12 being packaged in body 11 stage casing.Middle part welding end ring 12 can be provided with two or other suitable quantity, all at a distance of arranging between itself and two end welding end rings 12.Welding end ring 12 end, middle part welding end ring 12 is packaged in body 11 by MELF.By setting up middle part welding end ring 12, relative to the electronic device 1 only having two end welding end rings 12, the stress effectively can alleviating end, two ends welding end ring 12 is concentrated, and by stress dispersion on each welding end ring 12, is beneficial to lifting reliability; Welding end ring 12 is set to face with the way of contact of pad contact, or the bottom of welding end ring 12 is exceeded body 11, tin cream can be made to increase at the volume of plane welding end 101 and increase the contact area of plane welding end 101 and circuit board, extend the path of Crack Extension, the stress of effective absorption two end pad is concentrated, thus promotes reliability.
Particularly, as shown in Figure 9 and Figure 10, welding end ring 12 also can be annular, and the lower end of welding end ring 12 forms plane welding end 101 by removing material or forms plane welding end 101 by increasing material.So-called removal material, namely refers on circular welding end ring 12, polish a plane by polishing, cutting etc. mode.So-called increase material, namely refers on circular welding end ring 12, form a plane by plating etc. mode.
Particularly, the plane welding end 101 of middle part welding end ring 12 is coplanar with the plane welding end 101 of end welding end ring 12, so that the plane welding end 101 of middle part welding end ring 12 be all welded on the pad of PCB with the plane welding end 101 of end welding end ring 12, promote the welding spot reliability of MELF encapsulation.
As shown in Figure 9 and Figure 10, the lower end of welding end ring 12 can form plane welding end 101 by removing material or form plane welding end 101 by increasing material.So-called removal material, namely refers on circular welding end ring 12, polished a plane by modes such as polishing, cuttings and ensured that plane welding end 101 protrudes from body 11.So-called increase material, namely refers on circular welding end ring 12, form a plane by plating etc. mode.
In embody rule, as is illustrated by figs. 11 and 12, cylindrically, welding end ring 12 is rectangular for body 11, and body 11 is inscribed within welding end ring 12.Be that face contacts with pad bottom welding end ring 12, welding end ring 12 can be square, then welding end ring 12 can be made as square ring and to be enclosed within body 11 or Direct Electroplating forms welding end ring 12 on body 11; If welding end ring 12 exceeds body 11, then welding end ring 12 can be made as annular element and be enclosed within body 11, because welding end ring 12 is larger than body 11, welding end ring 12 welding portion can be polished flat and form plane welding end 101 and ensure that plane welding end 101 protrudes from body 11; Certainly, also welding end ring 12 can be enclosed within after on body 11, be produced the plane welding end 101 protruding body 11 at welding end position by plating mode.
The embodiment of the present invention additionally provides a kind of electronic equipment, comprises circuit board, and circuit board is provided with pad, and also comprise the above-mentioned electronic device 1 being packaged with welding end ring 12, the plane welding end 101 of electronic device 1 is welded on pad.
These are only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement or improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. one kind is packaged with the electronic device of welding end ring, comprise body and welding end ring, it is characterized in that, described welding end is located on the periphery wall of described body, and described welding end ring has plane welding end, described plane welding end is welded in the pad of printing board PCB, and described face bonding is held level with both hands together or protruded from the periphery wall of described body.
2. be packaged with the electronic device of welding end ring as claimed in claim 1, it is characterized in that, described body is tubular, and described welding end ring comprises the end welding end ring at the two ends being packaged in described body.
3. be packaged with the electronic device of welding end ring as claimed in claim 2, it is characterized in that, described welding end ring also comprises the middle part welding end ring being packaged in described body stage casing.
4. be packaged with the electronic device of welding end ring as claimed in claim 3, it is characterized in that, the plane welding end of described middle part welding end ring and the plane welding end of described end welding end ring coplanar.
5. the electronic device being packaged with welding end ring as described in Claims 2 or 3 or 4, is characterized in that, cylindrically, described welding end ring is rectangular for described body, and described body is inscribed within described welding end ring.
6. the electronic device being packaged with welding end ring as described in Claims 2 or 3 or 4, it is characterized in that, cylindrically, described welding end ring is annular to described body, and the lower end of described welding end ring forms plane welding end by removing material or forms plane welding end by increasing material.
7. the electronic device being packaged with welding end ring as described in Claims 2 or 3 or 4, is characterized in that, described plane welding end offers groove.
8. the electronic device being packaged with welding end ring according to any one of Claims 1-4, is characterized in that, described electronic device is gas discharge tube.
9. the electronic device being packaged with welding end ring according to any one of Claims 1-4, is characterized in that, described electronic device adopts welding end ring end face bonding encapsulating structure.
10. an electronic equipment, comprises circuit board, described circuit board is provided with pad, it is characterized in that, also comprises the electronic device being packaged with welding end ring as claimed in any one of claims 1-9 wherein, and the plane welding end of described electronic device is welded on described pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310196796.8A CN103311206B (en) | 2013-05-23 | 2013-05-23 | Be packaged with the electronic device of welding end ring and there is the electronic equipment of this electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310196796.8A CN103311206B (en) | 2013-05-23 | 2013-05-23 | Be packaged with the electronic device of welding end ring and there is the electronic equipment of this electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103311206A CN103311206A (en) | 2013-09-18 |
| CN103311206B true CN103311206B (en) | 2016-04-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310196796.8A Active CN103311206B (en) | 2013-05-23 | 2013-05-23 | Be packaged with the electronic device of welding end ring and there is the electronic equipment of this electronic device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108604581B (en) * | 2016-12-26 | 2020-04-28 | 华为技术有限公司 | Welding end structure and component |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101616544A (en) * | 2009-08-12 | 2009-12-30 | 杭州华三通信技术有限公司 | A kind of PCB assembly and implementation method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE9103353U1 (en) * | 1991-03-19 | 1991-06-20 | Sillner, Georg, 8411 Zeitlarn, De | |
| US7088573B2 (en) * | 2004-03-02 | 2006-08-08 | Vishay Sprague, Inc. | Surface mount MELF capacitor |
| CN202042476U (en) * | 2011-05-16 | 2011-11-16 | 济南晶恒电子有限责任公司 | Device packaging structure |
| CN202474046U (en) * | 2011-12-16 | 2012-10-03 | 周均 | Lithium-ion power battery for leading out cylindrical guide pins in same direction and sealed in girdling way |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101616544A (en) * | 2009-08-12 | 2009-12-30 | 杭州华三通信技术有限公司 | A kind of PCB assembly and implementation method |
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| CN103311206A (en) | 2013-09-18 |
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