CN103310990A

CN103310990A - Solid electrolytic capacitor substrate module and circuit board comprising same

Info

Publication number: CN103310990A
Application number: CN2012101393865A
Authority: CN
Inventors: 徐健明; 李明林; 蔡丽端
Original assignee: Industrial Technology Research Institute ITRI
Current assignee: Industrial Technology Research Institute ITRI
Priority date: 2012-03-12
Filing date: 2012-05-07
Publication date: 2013-09-18
Anticipated expiration: 2032-05-07
Also published as: US9030808B2; TWI483352B; TW201338105A; CN103310990B; US20130233605A1

Abstract

The invention discloses a solid electrolytic capacitor substrate module and a circuit board comprising the same. The solid electrolytic capacitor substrate module comprises a substrate, an oxide layer, a second electrode, an insulating layer, a conducting sheet and a conducting hole. The substrate includes a first electrode and a porous structure, the first electrode including a first surface. The porous structure includes a surface and a plurality of distribution regions, each having a depth. The oxide layer is disposed on the surface of the porous structure. The second electrode is disposed on the oxide layer and includes a conductive polymer material. The insulating layer is arranged on the second electrode and comprises a third surface and a fourth surface, and the fourth surface is connected with the second electrode. The conducting sheet is arranged on the first surface of the first electrode and the third surface of the insulating layer and is correspondingly and electrically connected with the conducting hole according to different polarities.

Description

Solid electrolyte capacitor substrate module and comprise its circuit board

Technical field

The present invention relates to a kind of capacity substrate module, and particularly relate to a kind of circuit board that has the solid electrolyte capacitor substrate module of low symbiosis inductance and comprise this solid electrolyte capacitor substrate module.

Background technology

That portable electronic product development is stressed is light, thin, short, little, at a high speed, low power consumption rate and multifunctionality.In recent years, along with the IC Manufacturing Techniques constantly promotes and the signaling rate increase, printed circuit board (PCB) (Printed Circuit Board) or IC support plate (substrate) must transmit the more signal of high frequency, and the methd of power supply random signal phase mutual interference that synchronously switching produces is also day by day serious.The method that is widely used at present reducing methd of power supply random signal is to place SMD electric capacity near power pin (power/ground pin), is referred to as decoupling capacitance (decoupling capacitor) or shunt capacitance (bypass capacitor).Major function be with electrical power storage in capacitor, in good time supply electric energy when electric energy is not enough is to reach the effect that absorbs surging (glitch), reduction methd of power supply random signal and stabilized power supply.

Yet, following Circuits System is emphasized multi-functional (Multi-function), and the frequency band that its noise produces is also more and more wide, under the limited area of IC support plate, the SMD pattern electric capacity number of putting certainly will be limited, therefore suppresses methd of power supply random signal with preceding method and also will run into bottleneck.And develop in recent years the built in capacitor substrate, and the electric capacity of some metal-insulator-metal type (MIM) structure for example, the capacitance that its unit are can provide still can not satisfy the capacitance demand on the CPU support plate.

Summary of the invention

The object of the present invention is to provide a kind of solid electrolyte capacitor substrate module, to address the above problem.

For reaching above-mentioned purpose, the invention provides a kind of solid electrolyte capacitor substrate module, it comprises substrate, the second electrode, insulating barrier, conducting thin slice and via.Described substrate comprises the first electrode and multi-pore structure, and the first electrode comprises first surface, is multi-pore structure with respect to first surface.Multi-pore structure comprises surface and a plurality of distributed areas, and distributed areas have a plurality of degree of depth, and oxide layer is arranged on the surface of multi-pore structure.The second electrode is arranged on the oxide layer, and the second electrode comprises the macromolecular material with conductivity.Insulating barrier is arranged at the second electrode with respect on the relative another side of substrate, and insulating barrier comprises the 3rd surface and the 4th surface, and the 4th surface connects the second electrode.Described conducting thin slice is arranged on the first surface of the first electrode and on the 3rd surface of insulating barrier.Described via is electrically connected with the conducting thin slice accordingly according to different polarity.

A plurality of embodiment one of them, a kind of solid electrolyte capacitor substrate module is provided, comprise a plurality of solid electrolyte capacitor structures, insulating barrier, conducting thin slice and via, with sequentially adjacent arrangement of array way, wherein each solid electrolyte capacitor structure comprises substrate and the second electrode.Described substrate comprises the first electrode and multi-pore structure, and the first electrode comprises first surface, is multi-pore structure with respect to first surface.Oxide layer is arranged on the surface of multi-pore structure.The second electrode is arranged on the oxide layer, and the second electrode comprises conductive polymer material.Wherein, the multi-pore structure of per two solid electrolyte capacitor structures comprises at least one the first distributed areas and at least one the second distributed areas, and the first distributed areas are to have the different degree of depth from the second distributed areas.Insulating barrier is arranged at the top of solid electrolyte capacitor structure, and insulating barrier comprises the 3rd surface and the 4th surface, and the 4th surface connects the second electrode of solid electrolyte capacitor structure.Described conducting thin slice is arranged at respectively on the first surface of the first electrode of solid electrolyte capacitor structure and on the 3rd surface of insulating barrier.Described via is electrically connected with the conducting thin slice accordingly according to different polarity.

For above-mentioned feature of the present invention can be become apparent, embodiment cited below particularly, and cooperate appended accompanying drawing to be described in detail below.

Description of drawings

Figure 1A and Figure 1B are solid electrolyte capacitor substrate module side cutaway view and the vertical view of content of the present invention;

Fig. 2 A and Fig. 2 B are the solid electrolyte capacitor substrate module profile and the vertical view that comprise the solid electrolyte capacitor array of content of the present invention;

Fig. 3 A, Fig. 3 B and Fig. 3 C are solid electrolyte capacitor substrate module side cutaway view, vertical view and the equivalent circuit diagram of content of the present invention;

Fig. 4 A, Fig. 4 B and Fig. 4 C are the solid electrolyte capacitor substrate module side cutaway view, vertical view and the equivalent circuit diagram that comprise the solid electrolyte capacitor array of content of the present invention;

Fig. 5 is the side cutaway view of the printed circuit board arrangement of the solid electrolyte capacitor substrate module of a plurality of embodiment of application content of the present invention.

The main element symbol description

100,300: the solid electrolyte capacitor substrate module

110,310: substrate

112,312,412: the first electrodes

112a, 412a: first surface

112b, 412b, 512b: oxide layer

116,316,416: the first distributed areas

116H, 416H: first degree of depth

118,318,418: the second distributed areas

118H, 418H: second degree of depth

121,321: multi-pore structure

130,330: the second electrodes

132,332,332a: conductive polymer material

134,334,334a: carbon-containing bed

136,336,336a: conductive silver glue

150: insulating barrier

152: the three surfaces

154: the four surfaces

160,660: the conducting thin slice

162: the first conducting thin slices

164: the second conducting thin slices

166: positive electrode conducting thin slice

168: negative electrode conducting thin slice

170: via

172,672: blind hole

173: the insulation through hole

174,674: through hole

174a: insulating material

C1: the first electric capacity

C2: the second electric capacity

A1: first area

A2: second area

200,400: the solid electrolyte capacitor substrate module with solid electrolyte capacitor structure of array arrangement

330a: the 4th electrode

340,440: groove

L1, L2: stray inductance

R1, R2: dead resistance

410: first substrate

421: the first multi-pore structures

510: second substrate

512: third electrode

512a: the 3rd surface

521: the second multi-pore structures

600: board structure of circuit

60: the solid electrolyte capacitor substrate module

62: the surface

70: integrated circuit

Embodiment

Figure 1A is the solid electrolyte capacitor substrate module structural profile schematic diagram of a kind of embodiment of content of the present invention.Solid electrolyte capacitor substrate module 100 is built-in inner in printed circuit board (PCB) or IC support plate, and it comprises a substrate 110, oxide layer 112b, the second electrode 130, insulating barrier 150, a plurality of conducting thin slice 160 and a plurality of via 170.The solid electrolyte capacitor structure comprises above-mentioned substrate 110, oxide layer 112b and the second electrode 130.In an embodiment of the present invention, one substrate 110 is provided, wherein this substrate 110 comprises multi-pore structure 121 and the first electrode 112, wherein, substrate 110 via etching process in zones of different (116,118) form the multi-pore structure 121 of different depth (118H, 116H), this multi-pore structure 121 is one to have the rough interfaces (High Surface Area Interface) of high surfaces area compared to traditional MIM capacity plate antenna.And substrate 110 passes through the control in etching process zone, and this multi-pore structure 121 can have the different degree of depth.

Beneath with the illustrated embodiment explanation.Please refer to Figure 1A, this substrate 110 is an aluminium base, and behind the process etching process, this aluminium base forms and comprises the first electrode 112 and multi-pore structure 121.At this, the multi-pore structure that is produced by the electrochemistry manufacture craft is irregular, therefore in the profile of Figure 1A, the section of multi-pore structure for example is an irregular jaggies.Aluminium base forms oxide layer 112b via the electrochemistry manufacture craft on the surface of multi-pore structure 121, for example is aluminium oxide (Al ₂O ₃), and oxide layer 112b covers on the surface of multi-pore structure 121, and this oxide layer 112b is megohmite insulant, and namely can be used as is dielectric layer (Dielectric layer) in the capacitance structure.Therefore in the part-structure profile of Figure 1A, oxide layer 112b is the upper limb that covers jaggies.And the distributed areas of multi-pore structure 121 comprise the first distributed areas 116 and the second distributed areas 118.The multi-pore structure degree of depth in the first distributed areas 116 is the first degree of depth 116H, and the multi-pore structure degree of depth in the second distributed areas 118 is the second degree of depth 118H, and wherein, the first degree of depth 116H is less than the second degree of depth 118H.

The second electrode 130 is arranged on the oxide layer 112b, and in one embodiment, the electric conducting material that covers on the oxide layer 112b can be conductive polymer material 132.Described the second electrode 130 can be separately conductive polymer material 132, in another embodiment, also can comprise one carbon-containing bed 134 and one conductive silver glue 136, so that better conductance to be provided.Do not illustrate among the embodiment at other, conductive silver glue can also conduct electricity tin cream and replace.Above-mentioned carbon-containing bed 134 are arranged on the conductive polymer material 132, and conductive silver glue 136 also is arranged on carbon-containing bed 134.

Insulating barrier 150 is arranged at the second electrode 130 tops of solid electrolyte capacitor substrate module 100, comprises 152 and 1 the 4th surface 154, one the 3rd surface, and wherein the 4th surface 154 is connected with the second electrode 130.At the first surface 112a of the first electrode 112, and the 3rd surface 152 of insulating barrier 150 is provided with a plurality of conducting thin slices 160.In the present embodiment, conducting thin slice 160 comprises one first conducting thin slice 162 and a plurality of the second conducting thin slice 164, the first conducting thin slice 162 is electrically connected with the first surface 112a of the first electrode 112, and the second conducting thin slice 164 is arranged on the 3rd surface 152 of insulating barrier 150.

Via 170 comprises a plurality of blind holes 172 and a plurality of through hole 174, blind hole 172 runs through insulating barrier 150, in the present embodiment, blind hole 172 has a conductting layer, and blind hole 172 is electrically connected with negative electrode conducting thin slice 168 and second electrode 130 of the second conducting thin slice 164 by this conductting layer.Through hole 174 is by at solid electrolyte capacitor substrate module 100 a plurality of insulation through holes 173 being set first, insulation through hole 173 passes insulating barrier 150, the second electrode 130 and substrate 110, and in insulation through hole 173 one deck insulating material 174a is set again, so that insulation through hole 173 can be electrically insulated with the first electrode 112 and the second electrode 130 respectively by insulating material 174a.Then, and at insulating material 174a internal layer one conductting layer is set again and becomes a through hole 174.Wherein, the hole wall diameter of insulation through hole 173 is large than through hole 174.Through hole 174 runs through insulating material 174a, and the positive electrode conducting thin slice 166 with the first conducting thin slice 162 and the second conducting thin slice 164 is electrically connected respectively.

In the present embodiment, the first electrode 112 is a positive electrode, and after being electrically connected to the first conducting thin slice 162, is electrically connected on the positive electrode conducting thin slice 166 of the second conducting thin slice 164 via through hole 174 again.The second electrode 130 is a negative electrode, is electrically connected to by blind hole 172 on the negative electrode conducting thin slice 168 of the second conducting thin slice 164.

In Figure 1A, the first distributed areas 116 on the multi-pore structure 121, has one first capacitor C 1, the second distributed areas 118 on the multi-pore structure 121 have one second capacitor C 2, because the aluminium base etch depth of the first distributed areas 116 is little than the aluminium base etch depth of the second distributed areas 118, in other words, the first degree of depth 116H is little than the second degree of depth 118H.In the darker zone of etch depth, more its relative surface area of pore structure is also larger, so effective capacitance area is also larger, therefore the second capacitor C 2 is greater than the first capacitor C 1.

In addition, because of the first more shallow distributed areas 116 of 172 etch depths in multi-pore structure of blind hole, so the second electrode 130 is shorter by the distance that blind hole 172 is electrically connected to negative electrode conducting thin slice 168, so the solid electrolyte capacitor substrate module 100 of content of the present invention also has the characteristics of low stray inductance value.

Figure 1B is the embodiment schematic top plan view of the solid electrolyte capacitor substrate module of Figure 1A.Please refer to Figure 1B, in the exemplary embodiment of content of the present invention, first area A1 is the first distributed areas 116 among Figure 1A, and second area A2 is the second distributed areas 118 among Figure 1A.Centered on by the second distributed areas 118 around the first distributed areas 116, in solid electrolyte capacitor substrate module 100, the first capacitor C 1 of middle section A1 is less than the second capacitor C 2 of peripheral region A2.Therefore middle section A1 can suppress the noise of higher-frequency, and peripheral region A2 draws the first electrode by through hole 174, can suppress the noise district than low frequency.Therefore, this solid electrolyte capacitor substrate module 100 can be for having the solid electrolyte capacitor substrate module of wideband effect.In addition, the first capacitor C 1 of middle section A1 can be greater than or less than the second capacitor C 2 of peripheral region A2.

Fig. 2 A is the array solid electrochemical capacitor substrate module generalized section of one of them embodiment of content of the present invention, and Fig. 2 B is the schematic top plan view of Fig. 2 A.Please also refer to Fig. 2 A and Fig. 2 B, in the present embodiment, solid electrolyte capacitor substrate module 200 has the solid electrolyte capacitor structure that a plurality of arrays are arranged, and it comprises at least one distributed areas, and these distributed areas have a degree of depth with respect to the second electrode 130.And the solid electrolyte capacitor substrate module 200 of the present embodiment, per two adjacent solid electrolyte capacitor structures comprise at least one the first distributed areas 116 and at least one the second distributed areas 118.In this embodiment, adopt the solid electrolyte capacitor structure such as Figure 1A to be illustrated, but be not as restriction.For convenience of description, the solid electrolyte capacitor substrate module similar elements of Fig. 2 A and Figure 1A part represents with same numeral, no longer superfluous stating.

In the present embodiment, because per two adjacent solid electrolyte capacitor structures comprise different multi-pore structure distributed areas, so the first distributed areas 116 and the second distributed areas 118 are adjacent and periodically alternatively arrange.Because the first capacitor C 1 of the first distributed areas 116 is less than the second capacitor C 2 of the second distributed areas 118, therefore less interlaced being arranged in the solid electrolyte capacitor array of first area A1 of the second area A2 that electric capacity is larger among Fig. 2 B and electric capacity.Yet first area A1 can have different capacitances from second area A2, and its area and the multi-pore structure degree of depth can be made different arrangement design according to circuit requirements, and for example this embodiment arranges in the mode of matrix, but is not as restriction.

Fig. 3 A is the solid electrolyte capacitor substrate module generalized section of wherein a kind of embodiment of content of the present invention, and Fig. 3 B is the schematic top plan view of Fig. 3 A, and Fig. 3 C is the schematic equivalent circuit of Fig. 3 A.For convenience of description, the solid electrolyte capacitor substrate module similar elements of Fig. 3 A and Figure 1A part represents with same numeral, no longer superfluous stating.

Please refer to Fig. 3 A and Fig. 3 B, in the present embodiment, solid electrolyte capacitor substrate module 300 comprises substrate 310, the second electrode 330, insulating barrier 150, a plurality of conducting thin slice 160 and a plurality of via 170.In addition, solid electrolyte capacitor substrate module 300 also can comprise a groove 340, so that the second electrode 330 on substrate 310,

multi-pore structure

321 and 310 at the first electrode are separated out the first distributed areas 316 and the second distributed areas 318, wherein the first distributed areas 316 in the second electrode 330 and the second distributed areas 318 are electrically insulated mutually by groove 340.The conductive polymer material 332 of the second electrode 330, carbon-containing bed 334, conductive silver glue 336 and multi-pore structure 321 also mutually are electrically insulated by groove 340 and separate into zones of different.

In the present embodiment, the first electrode 312 of substrate 310 still is electrically connected with the first conducting thin slice 162, and be connected to by through hole 174 on the positive electrode conducting thin slice 166 of the second conducting thin slice 164, the second electrode 330 of zones of different leads on the negative electrode conducting thin slice 168 of the second conducting thin slice 164 by blind hole 172, and many group capacitances are provided.Therefore, in Fig. 3 B, the first area A1 of solid electrolyte capacitor substrate module 300 is depicted as the upper viewed area of the first distributed areas 316 of Fig. 3 A, second area A2 is depicted as the upper viewed area of the second distributed areas 318 of Fig. 3 A, between first area A1 and second area A2, namely have 340 of grooves this two region insulation ground is spaced apart.

In addition, in the schematic equivalent circuit shown in Fig. 3 C, the first distributed areas 316 have one first capacitor C 1, and a stray inductance L1 and dead resistance R1 are arranged, and the second distributed areas 318 have one second capacitor C 2, and a stray inductance L2 and dead resistance R2 are arranged.When the negative electrode conducting thin slice 168 of zones of different was electrically connected mutually, the electric capacity that the solid electrolyte capacitor structure of zones of different can be produced was parallel with one another, therefore more can reduce the stray inductance value of solid electrolyte capacitor.

Fig. 4 A is one of them array solid electrochemical capacitor substrate module generalized sections of a plurality of embodiment of content of the present invention, and Fig. 4 B is the schematic top plan view of Fig. 4 A, and Fig. 4 C is the schematic equivalent circuit of Fig. 4 A.Please also refer to Fig. 4 A and Fig. 4 B, in the present embodiment, solid electrolyte capacitor substrate module 400 comprises a plurality of the first solid electrolyte capacitor structures and a plurality of the second solid electrolyte capacitor structure.The first solid electrolyte capacitor structure comprises a first substrate 410 and the second electrode 330.First substrate 410 comprises the first electrode 412 and the first multi-pore structure 421, the first electrode 412 comprises a first surface 412a, be the first multi-pore structure 421 with respect to first surface 412a, the first multi-pore structure 421 comprises at least one the first distributed areas 416, and the multi-pore structure degree of depth in the first distributed areas 416 is the first degree of depth 416H.Via the electrochemistry manufacture craft, form an oxide layer 412b on the surface of the first multi-pore structure 421 with high surface area.The second electrode 330 is arranged on the oxide layer 412b, and the second electrode 330 comprises conductive polymer material 332, carbon-containing bed 334 and conductive silver glue 336.

The second solid electrolyte capacitor structure comprises second substrate 510 and the 4th electrode 330a, second substrate 510 comprises third electrode 512 and the second multi-pore structure 521, third electrode 512 comprises one the 3rd surperficial 512a, be the second multi-pore structure 521 with respect to the 3rd surperficial 512a, the second multi-pore structure 521 comprises at least one the second distributed areas 418, and the multi-pore structure degree of depth in the second distributed areas 418 is the second degree of depth 418H.Via the electrochemistry manufacture craft, form an oxide layer 512b on the surface of the second multi-pore structure 521 with high surface area.The 4th electrode 330a is arranged on the oxide layer 512b, and the 4th electrode 330a comprises conductive polymer material 332a, carbon-containing bed 334a and conductive silver glue 336a.

Shown in Fig. 4 A and Fig. 4 B, in the multi-pore structure 421,521 of first substrate 410 and second substrate 510 distributes, the first distributed areas 416 and the 418 adjacent alternatively arrangements of the second distributed areas, and the first degree of depth 416H is less than the second degree of depth 418H.In addition, by groove 440 so that the first distributed areas 416 and the second distributed areas 418 mutually be electrically insulated.Therefore, by the schematic top plan view shown in Fig. 4 B as can be known, the solid electrolyte capacitor substrate module 400 that has a solid electrolyte capacitor structure that array arranges is arranged with array way in the horizontal direction by the first distributed areas 416 of a plurality of different etch depths and the second distributed areas 418 and is formed.And because the first capacitor C 1 of the first distributed areas 416 is less than the second capacitor C 2 of the second distributed areas 418, therefore less interlaced being arranged in the solid electrolyte capacitor array of structures of first area A1 of the second area A2 that electric capacity is larger among Fig. 4 B and electric capacity.Yet first area A1 can have different capacitances from second area A2, and its area and the multi-pore structure degree of depth can be made different arrangement design according to circuit requirements, and for example this embodiment arranges in the mode of matrix, but is not as restriction.

Therefore in the equivalent circuit diagram of Fig. 4 C, arrange by the first distributed

areas

416 and 418 matrix ground, the second distributed areas, and the negative electrode conducting thin slice 168 of zones of different is electrically connected, then the electric capacity that produces of the solid electrolyte capacitor structure of zones of different also can be in parallel such as matrix form ground, therefore more can reduce the stray inductance value of solid electrolyte capacitor.

Fig. 5 is the printed circuit board (PCB) generalized section of the solid electrolyte capacitor substrate module of a plurality of embodiment of application the present invention.Please refer to Fig. 5, in the present embodiment, the solid electrolyte capacitor substrate module 60 in the board structure of circuit 600 can be the arbitrary solid electrolyte capacitor substrate module of Figure 1A to Fig. 4 C.By at conducting thin slice 660 cabling shunt capacitances, through hole 674 and blind hole 672 can lead to electric capacity the surface 62 of board structure of circuit 600, provide integrated circuit 70 required capacitance.Therefore the solid electrolyte capacitor structure of content of the present invention and substrate module is built-in is applied in soft or rigid printed circuit board (PCB) or the IC support plate, and can provide a capacitance to offer integrated circuit to use.

In sum, the solid electrolyte capacitor substrate module of content of the present invention, the multi-pore structure of its substrate has the different degree of depth in different zones, so that the solid electrolyte capacitor substrate module can have multiple different capacitance simultaneously.And it is long-pending that the darker zone of the multi-pore structure degree of depth has larger conductive surface, therefore also can have larger capacitance.In addition, a plurality of embodiment of content of the present invention one of them, with the arrangement of solid electrolyte capacitor structural cycle, formation comprises the solid electrolyte capacitor substrate module of solid electrolyte capacitor array, connect by the negative electricity of cabling with the different distributions zone again, more can reduce the stray inductance value of substrate module.

Although disclosed the present invention in conjunction with above embodiment; yet it is not to limit content of the present invention; be familiar with this operator in the technical field under any; in the spirit and scope that do not break away from content of the present invention; can do a little change and retouching, thus the protection range of content of the present invention should with enclose claim was defined is as the criterion.

Claims

1. solid electrolyte capacitor substrate module comprises:

Substrate comprises the first electrode and multi-pore structure, and this first electrode comprises first surface, is this multi-pore structure with respect to this first surface, and this multi-pore structure comprises surface and a plurality of distributed areas, and each distributed areas has respectively a degree of depth;

Oxide layer is arranged on this surface of this multi-pore structure;

The second electrode is arranged on this oxide layer, and this second electrode comprises conductive polymer material;

Insulating barrier is arranged at this second electrode surface on the relative another side of this substrate, and this insulating barrier comprises the 3rd surface and the 4th surface, and the 4th surface connects this second electrode;

A plurality of conducting thin slices are arranged at respectively on this first surface of this first electrode and on the 3rd surface of this insulating barrier; And

A plurality of vias are electrically connected with those conducting thin slices accordingly according to different polarity.

2. solid electrolyte capacitor substrate module as claimed in claim 1, wherein this material is an aluminium base.

3. solid electrolyte capacitor substrate module as claimed in claim 1, wherein this second electrode also comprises:

Carbon-containing bed, be arranged on this conductive polymer material; And

Conductive silver glue, be arranged at this carbon-containing bed on.

4. solid electrolyte capacitor substrate module as claimed in claim 1, wherein those distributed areas comprise the first distributed areas and the second distributed areas, these first distributed areas have first degree of depth and the first electric capacity with respect to this second electrode, these second distributed areas have second degree of depth and the second electric capacity with respect to this second electrode, this first degree of depth is less than this second degree of depth, and this first electric capacity is not equal to this second electric capacity.

5. solid electrolyte capacitor substrate module as claimed in claim 1, wherein these first distributed areas mutual arrangement adjacent with this second distributed areas.

6. solid electrolyte capacitor substrate module as claimed in claim 1, also comprise groove, be arranged between these first distributed areas and this second distributed areas, and be electrically insulated this first electrode and this second electrode between these first distributed areas and this second distributed areas.

7. solid electrolyte capacitor substrate module as claimed in claim 1, wherein those vias comprise:

A plurality of blind holes, each blind hole has a conductting layer, and those blind holes run through this insulating barrier and are electrically connected with those second electrodes by this conductting layer; And

A plurality of through holes, each through hole has a conductting layer, and those through holes connect this solid electrolyte capacitor structure, and are electrically connected with those conductive foils accordingly by this conductting layer.

8. solid electrolyte capacitor substrate module as claimed in claim 1, wherein those conducting thin slices also comprise:

A plurality of the first conducting thin slices are arranged on the first surface of this first electrode, and are electrically connected with this first electrode; And

A plurality of the second conducting thin slices are arranged at respectively on the 3rd surface of this insulating barrier.

9. a solid electrolyte capacitor substrate module comprises

A plurality of solid electrolyte capacitor structures, with sequentially adjacent arrangement of array way, wherein each this solid electrolyte capacitor structure comprises:

Substrate comprises the first electrode and multi-pore structure, and this first electrode comprises first surface, is this multi-pore structure with respect to this first surface, and this multi-pore structure comprises a surface;

Oxide layer is arranged on this surface of this multi-pore structure; And

Wherein, those multi-pore structures of per two solid electrolyte capacitor structures comprise at least one the first distributed areas and at least one the second distributed areas, and these first distributed areas have the different degree of depth from these second distributed areas;

Insulating barrier is arranged at the top of those solid electrolyte capacitor structures, and this insulating barrier comprises the 3rd surface and the 4th surface, and the 4th surface connects those second electrodes of those solid electrolyte capacitor structures;

A plurality of conducting thin slices are arranged at respectively on the first surface of those the first electrodes of those solid electrolyte capacitor structures and on the 3rd surface of this insulating barrier; And

10. solid electrolyte capacitor substrate module as claimed in claim 9, wherein this substrate material is an aluminium base.

11. solid electrolyte capacitor substrate module as claimed in claim 9, wherein this second electrode also comprises:

Carbon-containing bed, be arranged on this conductive polymer material; And

Conductive silver glue, be arranged at this carbon-containing bed on.

12. solid electrolyte capacitor substrate module as claimed in claim 9, wherein these first distributed areas have first degree of depth and the first electric capacity with respect to this second electrode, these second distributed areas have second degree of depth and the second electric capacity with respect to this second electrode, this first degree of depth is less than this second degree of depth, and this first electric capacity is not equal to this second electric capacity.

13. solid electrolyte capacitor substrate module as claimed in claim 9, wherein these first distributed areas mutual arrangement adjacent with this second distributed areas.

14. solid electrolyte capacitor substrate module as claimed in claim 9, also comprise groove, be arranged between these first distributed areas and this second distributed areas, and be electrically insulated this first electrode and this second electrode between these first distributed areas and this second distributed areas.

15. solid electrolyte capacitor substrate module as claimed in claim 9, wherein those vias comprise:

A plurality of blind holes, each blind hole has conductting layer, and those blind holes run through this insulating barrier and are electrically connected with those second electrodes by this conductting layer; And

A plurality of through holes, each through hole has conductting layer, and those through holes connect this solid electrolyte capacitor structure, and are electrically connected with those conductive foils accordingly by this conductting layer.

16. solid electrolyte capacitor substrate module as claimed in claim 9, wherein those conducting thin slices also comprise:

A plurality of the first conducting thin slices are arranged on this first surface of this first electrode, and are electrically connected with this first electrode; And

17. a solid electrolyte capacitor substrate module comprises:

A plurality of the first solid electrolyte capacitor structures and a plurality of the second solid electrolyte capacitor structure with the sequentially adjacent arrangement of array way copline wherein, have an insulated trench at each between this first solid electrolyte capacitor structure and each this second solid electrolyte capacitor structure,

Each this first solid electrolyte capacitor structure comprises:

First substrate, comprise the first electrode and the first multi-pore structure, this first electrode comprises first surface, is this first multi-pore structure with respect to this first surface, this first multi-pore structure comprises at least one the first distributed areas and a surface, and these first distributed areas have first degree of depth;

Oxide layer, be arranged on this surface of this multi-pore structure and

Each this second solid electrolyte capacitor structure comprises:

Second substrate, comprise third electrode and the second multi-pore structure, this third electrode comprises the 3rd surface, is this second multi-pore structure with respect to the 3rd surface, this second multi-pore structure comprises at least one the second distributed areas and a surface, and these second distributed areas have second degree of depth;

Oxide layer is arranged on this surface of this multi-pore structure; And

The 4th electrode is arranged on this oxide layer, and the 4th electrode comprises conductive polymer material,

Wherein, this first degree of depth is greater than this second degree of depth;

Insulating barrier, comprise first surface and second surface, wherein this second surface of this insulating barrier connects in those the first solid electrolyte capacitor structures this second electrode surface to the relative another side of this first substrate, and is arranged in those the second solid electrolyte capacitor structures the 4th electrode surface to the relative another side of this second substrate;

A plurality of conducting thin slices are arranged at respectively on the 3rd surface of this third electrode on this first surface of this first electrode in those the first solid electrolyte capacitor structures, in those the second solid electrolyte capacitor structures, and on this first surface of this insulating barrier; And

18. a circuit board is embedded at least one such as claim 1 to 17 each described solid electrolyte capacitor substrate module wherein.