CN103307973A - Chip mounter detection device - Google Patents
Chip mounter detection device Download PDFInfo
- Publication number
- CN103307973A CN103307973A CN2012100700279A CN201210070027A CN103307973A CN 103307973 A CN103307973 A CN 103307973A CN 2012100700279 A CN2012100700279 A CN 2012100700279A CN 201210070027 A CN201210070027 A CN 201210070027A CN 103307973 A CN103307973 A CN 103307973A
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- light source
- chip mounter
- unit
- cover body
- testing component
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Abstract
The invention provides a chip mounter detection device, which comprises an assembly to be detected, a light source, a cover body and a shooting module, wherein the light source is arranged on the side edge of the assembly to be detected; the light source is covered by the cover body; the inner surface of the cover body is provided with an atomization reflecting layer; an opening is formed in the upper end of the cover body; the shooting module is arranged above the opening; and the shooting module is used for detecting against the assembly to be detected through the opening. According to the chip mounter detection device, the light source is covered by the atomization reflecting layer of the cover body, so that high-brightness uniform illumination can be provided for the assembly to be detected; and meanwhile, the assembly to be detected is not influenced by external light rays, and the accuracy of the shooting module on the aspect of image alignment detection can be increased.
Description
Technical field
The present invention relates to a kind of chip mounter pick-up unit, refer to a kind of chip mounter pick-up unit that even illumination is provided especially.
Background technology
Along with the trend moulding of LED as the panel backlight, and LED not only be used in, undersized panel, simultaneously towards the large size panel development, so the relevant encapsulation mount technology of LED lamp bar (Light Bar) is important relatively.The manufacturing of LED lamp bar at present, be by surface mount technology (Surface Mount Technology with plural graininess led chip, SMT) pasting on the circuit board of strip, is key equipment with the chip mounter then in the surface mount technology, and the paster precision is had the high standard requirement.In general, chip mounter generally adopts visual system to aim at paster at present, described visual system is after drawing surface mount elements with placement head, in moving to the process of patch location, obtain image by the camera that is fixed on placement head or fuselage fixed position, and by the optical density distribution of described image on image sensor (as Charged Coupled Device CCD), coordinate system position through the digitized processing generation, coordinate system numerical value compared to patch location, finish the paster operation with the adjustment of carrying out position deviation, therefore influence the vision factors of accuracy and mainly determined by the resolution of camera.But, at present in the image acquisition process of surface mount elements, because the mode (no matter top or side direct irradiation) of illumination is considered the surface mount elements surface characteristic issues of the difficult focusing of radian and optical identification may not arranged, so that described illumination has the shortcoming that inhomogeneous or generation ring light inverted image etc. influence the vision precision.The external environment light at described chip mounter place might influence the vision precision equally in addition, makes the patch location skew, therefore is necessary to be studied and improve.
Summary of the invention
In view of this, be necessary to provide a kind of chip mounter pick-up unit that can improve accuracy of detection.
The invention provides a kind of chip mounter pick-up unit, it comprises a testing component, a light source, a cover body and the module of taking pictures, the side of described testing component arranges described light source, described light source is covered by described cover body, the inside surface of described cover body has an atomizing reflection horizon, described cover body upper end is provided with an opening, and described opening top arranges the described module of taking pictures, and the described module of taking pictures detects facing to described testing component by described opening.
Compare prior art, chip mounter pick-up unit of the present invention, cover the interference that described light source can be avoided extraneous light by described cover body, the described atomizing reflection horizon of the inside surface of described cover body simultaneously, the illumination that can make described light source is gentleer close and brightness can promote.Thereby need the light source of surface focusing more suitable for described testing component, can improve the precision that described testing component is inspected very effectively.
Description of drawings
Fig. 1 is the testing component of chip mounter pick-up unit of the present invention and the vertical view that light source arranges.
Fig. 2 is the side view of chip mounter pick-up unit of the present invention.
The main element symbol description
| Pick- |
10 |
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12 |
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122 |
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124 |
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14 |
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16 |
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162 |
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164 |
| The atomizing |
166 |
| The module of taking |
18 |
Following embodiment will further specify the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
Below in conjunction with accompanying drawing the present invention being done one specifically introduces.
See also Figure 1 and Figure 2, provide the testing component of chip mounter pick-up unit of the present invention and light source that vertical view is set respectively, and the side view of chip mounter pick-up unit of the present invention.Chip mounter pick-up unit 10 of the present invention, it comprises a testing component 12, a light source 14, a cover body 16 and the module 18 of taking pictures.Wherein said testing component 12 comprises a circuit board 122 and a plurality of surface mount elements 124, the predetermined position of pasting with described surface mount elements 124 on the described circuit board 122, described surface mount elements 124 is pasted described predetermined pasting on the position by described chip mounter (not indicating among the figure).In the present embodiment, described testing component 12 is to be LED lamp bar, and described circuit board 122 is elongate in shape, and described surface mount elements 124 is led chip.For confirming that described surface mount elements 124 is positioned at the described predetermined position of pasting on the described circuit board 122 accurately, need there be 10 pairs of described surface mount elements 124 of described pick-up unit to detect, detecting described surface mount elements 124 when position deviation is arranged, namely carry out the compensation correction of off normal, paste on the position thereby described surface mount elements 124 is pasted exactly described being scheduled to of described circuit board 122.
Described light source 14 is to be the side direction light source, is arranged at the both sides of described testing component 12 respectively, is the position to be detected of described testing component 12 between the described two side direction light sources 14.When described testing component 12 detects, be that described testing component 12 is arranged on the described position to be detected, after described testing component 12 is arranged on described position to be detected, make the stable of described testing component 12 holding positions by described two side direction light sources 14, as shown in Figure 1.Described light source 14 provides needed illuminating ray when detecting, and the illuminating ray of described light source 14 is launched to the upper end, and the described surface mount elements 124 of described testing component 12 is subjected to inspection surface and described light source 14 illuminating raies in the same way.Described light source 14 can be LED lamp, incandescent lamp, Halogen lamp LED, daylight lamp or mercury vapor lamp.Described light source 14 is covered by described cover body 16, and described cover body 16 has an opening 162 and an arc shell 164, and described opening 162 is positioned at the upper end of described cover body 16, and described arc shell 164 is positioned at the both sides of described opening 162.Described arc shell 164 is facing to described light source 14, and described opening 162 is facing to described testing component 12 (as shown in Figure 2).The inside surface of described cover body 16 has an atomizing reflection horizon 166, and described atomizing reflection horizon 166 is formed on the inner edge surface of described arc shell 164, and described atomizing reflection horizon 166 includes uneven surface and high reflection layer (not indicating among the figure).The uneven surface in described atomizing reflection horizon 166 makes described arc shell 164 inner edge surface roughenings, when described arc shell 164 inner edge surface roughenings shine at described light source 14, produces the uniform light effect of scattering and diffusion.The high reflection layer in described atomizing reflection horizon 166 has the brightness that the high reflectance material can strengthen described light source 14 light illuminations.Therefore, described light source 14 illuminating raies to upper end emission are subjected to described arc shell 164 to hide and be incident upon on the described atomizing reflection horizon 166 of described arc shell 164 inner edge surfaces, thereby the effect of described light source 14 by described atomizing reflection horizon 166 becomes evenly gentle closing and illuminating ray that brightness is high.Described cover body 16 covers described light source 14 makes the illuminating ray of described light source 14 can not be subjected to the interfere with or compromise of external environment light, and described light source 14 illuminating raies are the described testing component 12 of direct irradiation not, the reflection that therefore can not produce described light source 14 is reflected, and detects thereby the illuminating ray that described light source 14 is provided is more suitable for the image of the described module 18 of taking pictures.The described module 18 of taking pictures is arranged at described opening 162 tops of described cover body 16, makes the described module 18 of taking pictures carry out image by 162 pairs of described testing components 12 of described opening and detects.When the described module 18 of taking pictures is carried out the image detection, because the covering of described cover body 16 above described light source 14, therefore can not be subjected to the interfere with or compromise of extraneous light, and provide the illuminating ray of even and high brightness, make the described module 18 convenient focusings of taking pictures to obtain described testing component 12 clear high-resolution image datas, thereby by the described module 18 high resolution image data of taking pictures, can accurately detect the correctness of described surface mount elements 124 patch location of described testing component 12, reach the usefulness that improves accuracy of detection.The material of described cover body 16 is lighttight material or has high reflection layer at outside surface.The high reflection layer material in described atomizing reflection horizon 166 is titania (TiO
2).
Chip mounter pick-up unit of the present invention, inside surface by the described cover body 16 of described light source 14 irradiations, form the even illuminating ray of high brightness with the described atomizing reflection horizon 166 of described cover body 16 inside surfaces, thereby provide the good illumination of described testing component 12 in the described cover body 16, in order to the described surface mount elements 124 surface profile intensity that promote described testing component 12, make the described module 18 of taking pictures of detection determine its patch location with described surface mount elements 124 images accurately, help to improve the accuracy that described pick-up unit 10 detects.
In addition, those skilled in the art also can do other variation in spirit of the present invention, and certainly, the variation that these are done according to spirit of the present invention all should be included within the present invention's scope required for protection.
Claims (10)
1. chip mounter pick-up unit, it comprises a testing component, a light source, a cover body and the module of taking pictures, the side of described testing component arranges described light source, described light source is covered by described cover body, the inside surface of described cover body has an atomizing reflection horizon, described cover body upper end is provided with an opening, and described opening top arranges the described module of taking pictures, and the described module of taking pictures detects facing to described testing component by described opening.
2. chip mounter pick-up unit as claimed in claim 1, it is characterized in that: described testing component comprises a circuit board and a plurality of surface mount elements, and described surface mount elements is pasted in the predetermined of described circuit board and pasted on the position.
3. chip mounter pick-up unit as claimed in claim 2, it is characterized in that: described testing component is to be LED lamp bar, and described circuit board is elongate in shape, and described surface mount elements is led chip.
4. chip mounter pick-up unit as claimed in claim 1, it is characterized in that: described light source is to be the side direction light source, is arranged at the both sides of described testing component respectively, is the position to be detected of described testing component between the described two side direction light sources.
5. chip mounter pick-up unit as claimed in claim 1, it is characterized in that: the illuminating ray of described light source is launched to the upper end, and the described surface mount elements of described testing component is subjected to inspection surface and described light illumination light in the same way.
6. chip mounter pick-up unit as claimed in claim 1, it is characterized in that: described cover body has an arc shell, and described arc shell is positioned at the both sides of described opening, and described arc shell is facing to described light source.
7. chip mounter pick-up unit as claimed in claim 6 is characterized in that: described light source is hidden by described arc shell and is incident upon on the inner edge surface of described arc shell to the illuminating ray of upper end emission.
8. chip mounter pick-up unit as claimed in claim 1, it is characterized in that: described atomizing reflection horizon includes uneven surface and high reflection layer, and described atomizing reflection horizon is formed on the inner edge surface of described arc shell.
9. chip mounter pick-up unit as claimed in claim 1 is characterized in that: the material of described cover body is lighttight material or has high reflection layer at outside surface.
10. chip mounter pick-up unit as claimed in claim 8, wherein, described high reflection layer material is titania (TiO
2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100700279A CN103307973A (en) | 2012-03-16 | 2012-03-16 | Chip mounter detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100700279A CN103307973A (en) | 2012-03-16 | 2012-03-16 | Chip mounter detection device |
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| Publication Number | Publication Date |
|---|---|
| CN103307973A true CN103307973A (en) | 2013-09-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100700279A Pending CN103307973A (en) | 2012-03-16 | 2012-03-16 | Chip mounter detection device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103983185A (en) * | 2014-04-16 | 2014-08-13 | 杭州欧谱洛博自动化技术有限公司 | Detection device for detecting chamfers and end faces of rollers simultaneously |
| CN104006730A (en) * | 2014-05-16 | 2014-08-27 | 苏州创丰精密五金有限公司 | Device for detecting height of SMD LED lamp on LED lamp bar |
| CN107187212A (en) * | 2017-06-28 | 2017-09-22 | 浙江华丽达包装有限公司 | Point horizontal and vertical parity check code security printing |
| CN107456212A (en) * | 2017-09-06 | 2017-12-12 | 北京宏强富瑞技术有限公司 | Device capable of taking pictures for skin detection |
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| JP2003142375A (en) * | 2001-11-02 | 2003-05-16 | Canon Inc | Position detection device and aligner using the same |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103983185A (en) * | 2014-04-16 | 2014-08-13 | 杭州欧谱洛博自动化技术有限公司 | Detection device for detecting chamfers and end faces of rollers simultaneously |
| CN104006730A (en) * | 2014-05-16 | 2014-08-27 | 苏州创丰精密五金有限公司 | Device for detecting height of SMD LED lamp on LED lamp bar |
| CN104006730B (en) * | 2014-05-16 | 2017-01-25 | 苏州创丰精密五金有限公司 | Device for detecting height of SMD LED lamp on LED lamp bar |
| CN107187212A (en) * | 2017-06-28 | 2017-09-22 | 浙江华丽达包装有限公司 | Point horizontal and vertical parity check code security printing |
| CN107456212A (en) * | 2017-09-06 | 2017-12-12 | 北京宏强富瑞技术有限公司 | Device capable of taking pictures for skin detection |
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Application publication date: 20130918 |