CN103307475A - LED (Light Emitting Diode) tubular lamp with self-clamped heat transfer substrate - Google Patents
LED (Light Emitting Diode) tubular lamp with self-clamped heat transfer substrate Download PDFInfo
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- CN103307475A CN103307475A CN2012105451874A CN201210545187A CN103307475A CN 103307475 A CN103307475 A CN 103307475A CN 2012105451874 A CN2012105451874 A CN 2012105451874A CN 201210545187 A CN201210545187 A CN 201210545187A CN 103307475 A CN103307475 A CN 103307475A
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- heat transfer
- transfer substrate
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Abstract
The invention discloses an LED (Light Emitting Diode) tubular lamp with a self-clamped heat transfer substrate and a heat radiator for the LED tubular lamp and belongs to the technical fields of support, suspension and connection devices of illuminating devices. The heat radiator for the LED tubular lamp comprises a heat radiating body (1) and a heat transfer substrate mounting part (2), wherein the cross section of the heat radiating body (1) is of a hollow semicylindrical shape. The heat radiator is characterized in that the heat transfer substrate mounting part (2) is connected with a heat transfer bottom surface (11) and is provided with strip-shaped clamping grooves (21) for mounting a heat transfer substrate (3). According to the LED tubular lamp with the self-clamped heat transfer substrate, which is provided by the invention, the strip-shaped clamping grooves are formed in the heat transfer substrate mounting part, so that the heat transfer substrate can be clamped in the strip-shaped clamping grooves; the heat transfer substrate does not need to be fixedly arranged on the heat radiator through screws, and thus the assembly efficiency is high, and the requirement on automatic quick production can be met; the heat transfer substrate is clamped in the strip-shaped clamping grooves and is contacted with a plurality of surfaces of the strip-shaped clamping grooves, so that the heat radiating efficiency can be increased, and the thermal deformation of the heat transfer substrate is avoided.
Description
Technical field
The invention belongs to support, suspension or the jockey technical field of lighting device, more particularly belong to a kind of the LED spot is carried out the efficient fast device of assembly connection.
Background technology
Be widely used at present LED (light emitting diode) both at home and abroad as the novel energy-conserving light source, in domestic lighting, company's office room and outdoor decoration illumination, used in a large number the LED electricity-saving lamp, LED spot particularly, the LED spot of bar shaped replace the existing common incandescent spot trend that is inevitable.
The LED spot of bar shaped in the prior art comprises fluorescent tube and two end caps that link to each other with fluorescent tube, and end cap also is called lamp holder, and the fluorescent tube of the LED spot of bar shaped is generally fitted together by heat transfer substrate (also can be called light source board), radiator and semi-tubular lampshade.The same length of lampshade, heat transfer substrate and radiator, the cross section of radiator is semi-circular shape, the cross section of heat radiation main body is hollow semi-cylindrical, the outer surface of the semicircle main body of radiator has the fin of zigzag or rectangle, the outer surface of radiator also can be arc, and the fin of these zigzag or rectangle is for increasing area of dissipation and improve radiating efficiency.
The LED luminescence chip is fitted on the heat transfer substrate, and the heat that the LED luminescence chip produces directly passes to heat transfer substrate; Heat transfer substrate has been realized the conversion of heat with heat heat loss through conduction device in the contact process of radiator and air.The heat transfer substrate normal operation aluminum alloy materials of the LED spot of bar shaped in the prior art is made, the heat transfer substrate that uses aluminum alloy materials to make has the advantages such as good heat conduction effect, and the heat transfer substrate of aluminum alloy materials has been widely used in the LED spot of bar shaped now.
Fig. 1 is the fluorescent tube assembling schematic diagram of the LED spot of bar shaped of the present invention, as seen from the figure because the length of the LED spot of bar shaped is generally all long, in order to guarantee that heat transfer substrate (or light source board) effectively contacts with radiator, need to be fastened on heat transfer substrate on the bottom surface of radiator by several screws.
The LED spot of the bar shaped of prior art need to be fixed on heat transfer substrate on the radiator by screw in assembling process, and these work are all by manually finishing, so can not satisfy fast production in enormous quantities because operating efficiency is lower; Owing to using when manually finishing this work, need manually at first heat transfer substrate to be contained on the radiator, then tighten screw at corresponding screw hole, the course of work is consuming time very long.
Need to use heat-conducting glue in the assembling process of the LED spot of prior art bar shaped, heat-conducting glue is coated between the bottom surface of heat transfer substrate and radiator, and such assembly work can be used a lot of heat-conducting glue materials usually,
How to simplify the LED spot of bar shaped the technological process of production, reduce its production cost be the restriction the art a difficult problem.
Summary of the invention
The present invention has provided a kind of heat transfer substrate from the LED spot that clamps for above technical problem.
A kind of radiator for the LED spot of the present invention comprises heat radiation main body, heat transfer substrate installation portion, and described heat transfer substrate installation portion links to each other with described heat radiation main body, and the cross section of described heat radiation main body is hollow half arc body; It is characterized in that: described heat transfer substrate installation portion has the strip-shaped clamp groove that is used for holding heat transfer substrate that a heat transfer bottom surface by two T shape snap fits of described heat transfer substrate installation portion, described heat radiation main body forms.
According to above-described radiator for the LED spot, preferred: the position of the elastic deformability of the support cylinder of described two T shape snap fits bottom surface so that the pinching end of described two T shape snap fits conducts heat relatively can be adjusted.
According to above-described radiator for the LED spot, preferred: that a boss bottom surface is arranged on the described heat transfer bottom surface.
According to above-described radiator for the LED spot, preferred: two T shape snap fits of described heat transfer substrate installation portion are symmetricly set on the heat radiation main body bottom surface.
According to above-described radiator for the LED spot, preferred: the boss bottom surface of described heat transfer substrate installation portion is parallel with the pinching end of two T shape snap fits of heat transfer substrate installation portion.
According to above-described radiator for the LED spot, preferred: the length of force side is greater than the length of pinching end on the described T shape snap fit.
According to above-described radiator for the LED spot, preferred: the vertical range on the boss bottom surface of described heat transfer substrate installation portion and the heat transfer substrate installation portion between the pinching end of two T shape snap fits is less than the thickness that is installed in heat transfer substrate in the strip-shaped clamp groove.
According to above-described radiator for the LED spot, preferred: the pinching end of described two T shape snap fits has angle with the boss bottom surface of described heat transfer substrate installation portion respectively.
A kind of heat transfer substrate that uses above-described radiator of the present invention is from the LED spot that clamps, and described LED spot comprises heat radiation main body, heat transfer substrate installation portion, heat transfer substrate, lampshade and end cap; Described end cap is installed in the described lamp tube ends that is comprised of heat radiation main body, heat transfer substrate installation portion, heat transfer substrate and lampshade; It is characterized in that: described heat transfer substrate relies on the elasticity predeformation power of two T shapes of heat transfer substrate installation portion snap fit to be fixed in the strip-shaped clamp groove.
From the LED spot that clamps, preferred according to above-described heat transfer substrate: the pinching end of two T shapes of the led chip mounting plane of heat transfer substrate and heat transfer substrate installation portion snap fit clamps and contacts.
From the LED spot that clamps, preferred according to above-described heat transfer substrate: the heat transfer plane of heat transfer substrate contacts with boss bottom surface face on the main body bottom surface of dispelling the heat.
From the LED spot that clamps, preferred: the width of described strip-shaped clamp groove is greater than the heat transfer substrate width according to above-described heat transfer substrate.
The heat of heat transfer substrate of the present invention luminous generation in the LED luminescence chip course of work on the LED spot that clamps is passed to the heat radiation main body by heat transfer substrate, heat by heat radiation close-connected three faces of main body (boss bottom surface, two pinching ends) pass to the heat radiation main body, the heat adopted from heat transfer substrate can be dispersed in the air by fin or the smooth heat radiation main body extrados that the main body extrados that dispels the heat arranges.Because heat radiation main body and heat transfer substrate installation portion have consisted of whole radiator jointly, the boss bottom surface is maximum from the heat that heat transfer substrate absorbs, two pinching ends are few from the heat that heat transfer substrate absorbs from the relative boss of the heat bottom surface that heat transfer substrate absorbs.
When heat transfer substrate self-clamp type LED spot of the present invention is in confined state, two T shape snap fits of heat transfer substrate installation portion can rely on the elastic deformation force of himself heat transfer substrate to be clamped in tightly in the strip-shaped clamp groove of heat transfer substrate installation portion, realized the boss bottom surface of heat transfer substrate and heat transfer substrate installation portion, two pinching end close contacts, can guarantee that heat passes to radiator by heat transfer substrate and heat radiation main body close-connected boss bottom surface or two pinching ends.The heat transfer substrate of heat transfer substrate self-clamp type LED spot of the present invention is fastened in the strip-shaped clamp groove of heat transfer substrate installation portion and realizes clamping with the boss bottom surface of heat transfer substrate installation portion and three faces of two pinching ends and contacts, heat transfer substrate self-clamp type LED spot of the present invention can improve heat transfer efficiency, avoids heat transfer substrate generation thermal deformation.
Heat transfer substrate self-clamp type LED spot of the present invention is owing to being limited by the restriction of fluorescent tube length, the real area of the boss bottom surface of heat transfer substrate installation portion is less than the base area of heat transfer substrate installation portion strip-shaped clamp groove, can guarantee that like this boss bottom surface of heat transfer substrate installation portion has higher flatness and linearity.The boss bottom surface of heat transfer substrate installation portion has higher flatness and linearity, and heat transfer substrate also has higher flatness and linearity, can guarantee that the boss bottom surface of heat transfer substrate installation portion and heat transfer substrate are in close contact all the time.
Radiator of the present invention relies on self-tightening power that heat transfer substrate is fixedly clamped in thereon the strip-shaped clamp groove, and heat transfer substrate utilizes being fixedly clamped of radiator in clamping action is realized strip-shaped clamp groove at radiator, and radiating effect is better.The heat of heat transfer substrate can directly conduct to radiator by the heat that sheds with the contacted face of radiator, produce on the heat transfer substrate, and radiator diffuses to heat in the air again.The thermal conductive surface of heat transfer substrate of the present invention is fitted on the radiator all the time, and the heat dispersion of fluorescent tube is better, and heat transfer substrate can be realized three-dimensional heat radiation, and radiating efficiency is higher.
In the assembling process of heat transfer substrate of the present invention and radiator, can realize the automation assembling of heat transfer substrate and radiator, operating efficiency is very high.The present invention can use automation equipment to carry out the automation assembling, and is high doubly more a lot of than the efficient of Traditional Man mounting means.The present invention also can adopt the manual type assembling, and efficiency of assembling still exceeds doubly a lot than traditional approach.
The structure of fluorescent tube of the present invention is simpler, does not need to use screw that heat transfer substrate is fastened on the radiator in the fluorescent tube assembling process, has so greatly simplified assembly technology, and the suitable dress of fluorescent tube is very good, is conducive to the automation assembling.Efficiently solve heat transfer substrate and radiator in the prior art cause heat transfer substrate in Long contact time thermal deformation problem, can guarantee that heat transfer substrate and radiator are in all the time to contact fully, avoid the generation of heat transfer substrate thermal deformation, more be conducive to heat radiation.Heat transfer substrate of the present invention contacts with the boss bottom surface of radiator all the time, and radiator plays clamping action to heat transfer substrate.
Do not need to use heat-conducting glue in the fluorescent tube assembling process of the present invention, so greatly saved the heat-conducting glue material, simplified technological process, reduced production cost.Owing to having certain pollution in the process of heat-conducting glue production and use, the present invention has omitted the effect that the operation of using heat conductive silica gel can obtain protection of the environment.
Description of drawings
Accompanying drawing 1 is the structural representation of prior art LED spot;
Accompanying drawing 2 is the first radiator views one of heat transfer substrate self-clamp type LED spot of the present invention;
Accompanying drawing 3 is the first radiator views two of heat transfer substrate self-clamp type LED spot of the present invention;
Accompanying drawing 4 is the first radiator stereograms of heat transfer substrate self-clamp type LED spot of the present invention;
Accompanying drawing 5 is structural representations of installing on the first radiator of heat transfer substrate self-clamp type LED spot of the present invention behind the heat transfer substrate;
Accompanying drawing 6 is the first light fixture schematic diagrames of heat transfer substrate self-clamp type LED spot of the present invention;
Accompanying drawing 7 is structural representations of installing on the first radiator of heat transfer substrate self-clamp type LED spot of the present invention behind heat transfer substrate and the lampshade;
The second radiator view one of accompanying drawing 8 heat transfer substrate self-clamp type LED spots of the present invention;
Accompanying drawing 9 is structural representations of installing on the second radiator of heat transfer substrate self-clamp type LED spot of the present invention behind the heat transfer substrate;
Accompanying drawing 10 is structural representations of installing on the second radiator of heat transfer substrate self-clamp type LED spot of the present invention behind heat transfer substrate and the lampshade;
The second radiator view two of accompanying drawing 11 heat transfer substrate self-clamp type LED spots of the present invention;
Accompanying drawing 12 is the second radiator stereograms of heat transfer substrate self-clamp type LED spot of the present invention.
Description of reference numerals:
The 1-main body of dispelling the heat; 2-heat transfer substrate installation portion; The 21-strip-shaped clamp groove;
22-boss bottom surface; The 241-pinching end; 24-T shape snap fit;
The 242-support cylinder; The 242-force side; The 3-heat transfer substrate;
31-LED chip mounting plane; 32-heat transfer end face; The 4-lampshade;
The 5-end cap; 11-heat transfer bottom surface.
The specific embodiment
A kind of preferred embodiment 1
Fig. 2 is the first radiator view of heat transfer substrate self-clamp type LED spot of the present invention; Fig. 3 is the first radiator stereogram one of heat transfer substrate self-clamp type LED spot of the present invention; Fig. 4 is the first radiator view two of heat transfer substrate self-clamp type LED spot of the present invention; Fig. 5 is the schematic diagram of installing on the first radiator of heat transfer substrate self-clamp type LED spot of the present invention behind the heat transfer substrate; Fig. 7 is the structural representation of installing on the first radiator of heat transfer substrate self-clamp type LED spot of the present invention behind heat transfer substrate and the lampshade.
The radiator that the present embodiment provides comprises heat radiation main body 1 and the heat transfer substrate installation portion 2 of bar shaped, the cross section of heat radiation main body 1 is the arc radiating surface, heat transfer substrate installation portion 2 is positioned on the bottom surface of heat radiation main body 1, and heat transfer substrate installation portion 2 has for the strip-shaped clamp groove 21 that heat transfer substrate 3 is installed.Radiator for the LED spot of the present invention, comprise heat radiation main body 1, heat transfer substrate installation portion 2, the cross section of heat radiation main body 1 is similar hollow semi-cylindrical, the fin of zigzag or rectangle can be set on the extrados of heat radiation main body 1, heat transfer substrate installation portion 2 links to each other with the bottom surface of heat radiation main body 1, and heat transfer substrate installation portion 2 has for the strip-shaped clamp groove 21 that heat transfer substrate 3 is installed.Heat radiation main body 1 is hollow structure, can alleviate the weight of radiator and can reduce material cost; The fin of the zigzag that arranges or rectangle can increasing heat radiation area and improved radiating efficiency on the extrados of heat radiation main body 1.
The radiator that is comprised of heat radiation main body 1 and heat transfer substrate installation portion 2 can adopt aluminum alloy materials to be made, the radiator that adopts aluminum alloy materials to make can alleviate the weight of himself, and can improve radiating efficiency in the radiator course of work simultaneously because aluminium alloy has good heat conductivility.
The strip-shaped clamp groove 21 of radiator heat transfer substrate installation portion 2 be by the support cylinder 243 of the pinching end 241 of two T shape snap fits 24, two T shape snap fits 24, the heat radiation main body 1 the bottom surface form; The strip-shaped clamp groove 21 of radiator heat transfer substrate installation portion 2 is used for installing heat transfer substrate 2.The cross section of strip-shaped clamp groove 21 can be the opening elongated rectangular shape, be to have two T shape snap fits 24, heat transfer substrates 3 on the bottom surface of the bottom surface (or bottom surface of heat radiation main body 1) that is equivalent to strip-shaped clamp groove 21, the top of strip-shaped clamp groove 21, strip-shaped clamp groove 21 to be installed between the pinching end 241 of the bottom surface (bottom surface of the main body of namely dispelling the heat 1) of strip-shaped clamp groove 21 and two T shape snap fits 24, the led chip mounting plane 31 of heat transfer substrate 3 contacts with the pinching end 241 of T shape snap fit 24, the bottom surface of the heat transfer plane of heat transfer substrate 3 32 close strip-shaped clamp groove 21; The width of strip-shaped clamp groove 21 is greater than the width that is installed in heat transfer substrate 3 in the strip-shaped clamp groove 21, satisfies the morpheme dimensional requirement of heat transfer substrate 3 assembling in the strip-shaped clamp groove 21.
On the bottom surface (being the bottom surface of strip-shaped clamp groove 21) of heat radiation main body 1 a boss bottom surface 22 can be arranged, boss bottom surface 22 is along the bar shaped boss on strip-shaped clamp groove 21 length directions.The pinching end 241 of two T shape snap fits 24 of heat transfer substrate installation portion 2 is symmetrical arranged, and the boss bottom surface 22 of heat transfer substrate installation portion 2 is parallel with the pinching end 241 of two T shape snap fits 24 of heat transfer substrate installation portion 2.
The led chip of installing on the led chip mounting plane 31 of heat transfer substrate 3 is positioned at the place, axis of led chip mounting plane 31, and the heat that led chip produces concentrates on along the midline of led chip mounting plane 31 length, herein heat flow density maximum mostly.When radiator was in running order, the zone of heat flow density maximum contacted directly, can guarantee like this that the heat of led chip generation effectively passes to radiator by heat transfer substrate 3 in bar shaped boss bottom surface 22 and the heat transfer substrate 3.
Vertical range on the boss bottom surface 22 of heat transfer substrate installation portion 2 and the heat transfer substrate installation portion 2 between the pinching end 241 of two T shape snap fits 24 is less than the thickness that is installed in heat transfer substrate 3 in the strip-shaped clamp groove 21.When in the strip-shaped clamp groove 21 of heat transfer substrate installation portion 2 heat transfer substrate 3 being installed, under the acting in conjunction of two T shape snap fit 24 elastic restoring forces and boss bottom surface 22 holding powers, heat transfer substrate 3 will small strain occur producing towards boss bottom surface 22 directions with two T shape snap fits, 24 contacted end positions places; Heat transfer substrate 3 is after the small strain that produces under two T shape snap fit 24 elastic restoring force effects, the heat transfer plane 32 of heat transfer substrate 3 can realize that with boss bottom surface 22 complete face contacts, and the led chip mounting plane 31 of heat transfer substrate 3 can realize that with the pinching end 241 of two T shape snap fits 24 complete face contacts; Strip-shaped clamp groove 21 installs heat transfer substrate 3, and heat transfer plane 32 is realized simultaneously clamping with the pinching end 241 of two T shape snap fits 24 with strip-shaped clamp groove 21 boss bottom surfaces 22, led chip mounting plane 31 and contacted.
The length of force side 242 can be greater than the length of pinching end 241 on the T shape snap fit 24, the support cylinder 243 of T shape snap fit 24, force side 242 and pinching end 241 are equivalent to a lever, and the length of force side 242 and pinching end 241 is equivalent to two arm of forces of lever, the fulcrum that support cylinder 243 is equivalent to lever.The process that heat transfer substrate 3 is installed in the strip-shaped clamp groove 21 applies respectively two smaller upwards active forces, can cause two T shape snap fits 24 that small elastic deformation occurs causing the real space of strip-shaped clamp groove 21 to increase to hold heat transfer substrate 3 on the force side 242 of the T of both sides shape snap fit 24.
The process that heat transfer substrate 3 is installed in the strip-shaped clamp groove 21 is as follows:
Small elastic deformation occurs and causes the actual volume of strip-shaped clamp groove 21 to increase for the T shape snap fit 24 (namely apply the active force towards heat radiation main body 1 bottom surface direction in the force side 242 of two T shape snap fits 24, make two T shape snap fits 24 produce micro-strain) of outwards pulling two strip-shaped clamp groove 21, two T shape snap fits 24 in the first step;
Second step is for penetrating into the side mouth of heat transfer substrate 3 from the strip-shaped clamp groove 21 of heat transfer substrate installation portion 2 strip-shaped clamp groove 21 by robot apparatus or manual type;
The 3rd step, T shape snap fit 24 was fastened on heat transfer substrate 3 in the strip-shaped clamp groove 21 of heat transfer substrate installation portion 2 under the effect of elastic restoring force in order to install in the strip-shaped clamp groove 21 after the heat transfer substrate 3, to remove and be applied to two external force on the T shape snap fit 24;
The 4th step was that two T shape snap fits 24 are under the elastic restoring force effect, the heat transfer plane 32 of heat transfer substrate 3 is contacted with boss bottom surface 22 realization faces, the two ends of the led chip mounting plane 31 of heat transfer substrate 3 contact with the pinching end 241 realization faces of two T shape snap fits 24 respectively contact so that the upper and lower surface of heat transfer substrate 3 all realizes clamping with strip-shaped clamp groove 21.
Fig. 6 is the light fixture schematic diagram of heat transfer substrate self-clamp type LED spot of the present invention, and the LED light fixture that the present embodiment provides comprises radiator, heat transfer substrate 3, end cap 5 and lampshade 4.Heat transfer substrate 3 is fastened in the strip-shaped clamp groove 21 of radiator, and lampshade 4 is located on the heat transfer substrate 3, and end cap 5 is coated on the two ends of the fluorescent tube that is comprised of radiator 2, heat transfer substrate 3 and lampshade 4, and lampshade 4 can be fastened on the radiator 2 two ends draw-in grooves.
Heat transfer substrate of the present invention comprises heat radiation main body 1, heat transfer substrate installation portion 2, heat transfer substrate 3, lampshade 4 and end cap 5 from the LED spot that clamps; End cap 5 is installed in the lamp tube ends that is comprised of heat radiation main body 1, heat transfer substrate installation portion 2, heat transfer substrate 3 and lampshade 4; Heat transfer substrate 3 relies on the elasticity predeformation power of 2 two T shapes of heat transfer substrate installation portion snap fit 24 to be fixed in the strip-shaped clamp groove 21.
241 of the pinching ends of 2 two T shapes of the led chip mounting plane 31 of heat transfer substrate 3 and heat transfer substrate installation portion snap fit 24 contact.The heat transfer plane 32 of heat transfer substrate 3 contacts with 22 of boss bottom surfaces on heat radiation main body 1 bottom surface.
In actual applications, after the energising of the led chip on the heat transfer substrate 3, the pinching end 241 of the heat that led chip produces by boss bottom surface 22 and two T shape snap fits 24 passes to the fin on the heat radiation main body 1, the fin on the heat radiation main body 1 again with dissipation of heat in air.
The radiator that the present embodiment provides, owing to being provided with strip-shaped clamp groove 21 at heat transfer substrate installation portion 2, heat transfer substrate 3 can be fastened in the strip-shaped clamp groove 21, no longer need by screw heat transfer substrate 3 to be fixed on the radiator, thereby efficiency of assembling is high, can satisfy the requirement that automation is produced fast, and heat transfer substrate card 3 is located in the strip-shaped clamp groove 21 and contact with a plurality of of strip-shaped clamp groove 21, thereby can improve radiating efficiency, avoid heat transfer substrate 3 that thermal deformation occurs.
The LED light fixture that the present embodiment provides, owing to being provided with strip-shaped clamp groove 21 at heat transfer substrate installation portion 2, heat transfer substrate 3 can be fastened in the strip-shaped clamp groove 21, no longer need by screw heat transfer substrate 3 to be fixed on the radiator, thereby efficiency of assembling high energy satisfies the requirement that automation is produced fast, heat transfer substrate 3 is fastened in the strip-shaped clamp groove 21 and contact with a plurality of of strip-shaped clamp groove 21, thereby can improve radiating efficiency, avoids heat transfer substrate 3 that thermal deformations occur.
The lamp body heat transfer flow process of heat transfer substrate self-clamp type LED spot of the present invention: the heat that comes from heat transfer substrate 3 can be dispersed into the air by the fin that main body 1 extrados that dispels the heat arranges zigzag or rectangle by the heat passing to heat radiation main body 1 with heat radiation main body 1 close-connected three faces (boss bottom surface 22, two pinching ends 241), come from heat transfer substrate 3.Because heat radiation main body 1 and heat transfer substrate installation portion 2 have consisted of whole radiator jointly, boss bottom surface 22 is maximum from the heat that heat transfer substrate 3 absorbs, two pinching ends 241 are few from the heat that heat transfer substrate 3 absorbs from the relative boss of the heat bottom surface 22 that heat transfer substrate 3 absorbs.
When heat transfer substrate self-clamp type LED spot of the present invention is in confined state, two T shape snap fits 24 of heat transfer substrate installation portion 2 can rely on the elastic deformation force of himself that heat transfer substrate 3 is only stepped up in the strip-shaped clamp groove 21 of heat transfer substrate installation portion 2, have realized that heat transfer substrate 3 contacts with the boss bottom surface 22 of heat transfer substrate installation portion 2, two pinching end 241 complete faces.
Because the heat transfer substrate 3 of heat transfer substrate self-clamp type LED spot of the present invention is fastened on the strip-shaped clamp groove interior 21 of heat transfer substrate installation portion 2 and realizes that with 241 3 faces in boss bottom surface 22 and two pinching ends of heat transfer substrate installation portion 2 face contacts completely, thereby heat transfer substrate self-clamp type LED spot of the present invention can improve heat transfer efficiency, avoids heat transfer substrate 3 that thermal deformations occur.
Owing to being limited by the length restriction of heat transfer substrate self-clamp type LED spot of the present invention, the real area of the boss bottom surface 22 of heat transfer substrate installation portion 2 is less than the bottom surface of the strip-shaped clamp groove 21 of heat transfer substrate installation portion 2, can guarantee that like this boss bottom surface 22 of heat transfer substrate installation portion 2 has higher flatness and linearity.The boss bottom surface 22 of heat transfer substrate installation portion 2 has higher flatness and linearity, and heat transfer substrate 3 also has higher flatness and linearity, can guarantee that the boss bottom surface 22 of heat transfer substrate installation portion 2 is in close contact all the time with heat transfer substrate 3.
A kind of preferred embodiment 2
The second radiator view one of Fig. 8 heat transfer substrate self-clamp type of the present invention LED spot; Fig. 9 is the structural representation of installing on the second radiator of heat transfer substrate self-clamp type LED spot of the present invention behind the heat transfer substrate; Figure 10 is the structural representation of installing on the second radiator of heat transfer substrate self-clamp type LED spot of the present invention behind heat transfer substrate and the lampshade; The second radiator view two of Figure 11 heat transfer substrate self-clamp type of the present invention LED spot; Figure 12 is the second radiator stereogram of heat transfer substrate self-clamp type LED spot of the present invention.
The radiator that the present embodiment provides comprises heat radiation main body 1 and the heat transfer substrate installation portion 2 of bar shaped, the cross section of heat radiation main body 1 is the arc radiating surface, heat transfer substrate installation portion 2 is positioned on the bottom surface of heat radiation main body 1, and heat transfer substrate installation portion 2 has for the strip-shaped clamp groove 21 that heat transfer substrate 3 is installed.Radiator for the LED spot of the present invention, comprise heat radiation main body 1, heat transfer substrate installation portion 2, the cross section of heat radiation main body 1 is similar hollow semi-cylindrical, on the extrados of heat radiation main body 1 zigzag in the preferred embodiment 1 or the fin of rectangle are not set, heat transfer substrate installation portion 2 links to each other with the bottom surface of heat radiation main body 1, and heat transfer substrate installation portion 2 has for the strip-shaped clamp groove 21 that heat transfer substrate 3 is installed.Heat radiation main body 1 is hollow structure, can alleviate the weight of radiator and can reduce material cost; The extrados of heat radiation main body 1 directly contacts equally the effect of can increasing heat radiation area and having improved radiating efficiency with air.
The radiator that is comprised of heat radiation main body 1 heat transfer substrate installation portion 2 can adopt aluminum alloy materials to be made, the radiator that adopts aluminum alloy materials to make can alleviate the weight of himself, and can guarantee to have higher radiating efficiency in the radiator course of work simultaneously because aluminium alloy has good heat conductivility.
The strip-shaped clamp groove 21 of radiator heat transfer substrate installation portion 2 be by the support cylinder 243 of the pinching end 241 of two T shape snap fits 24, two T shape snap fits 24, the heat radiation main body 1 the bottom surface form; The strip-shaped clamp groove 21 of radiator heat transfer substrate installation portion 2 is for the heat transfer substrate 2 that is installed led chip is installed.The cross section of strip-shaped clamp groove 21 is the opening elongated rectangular shape, and namely the top of strip-shaped clamp groove 21 is equivalent to have two T shape snap fits 24 on the bottom surface of bottom surface (or heat radiation main body 1 bottom surface), strip-shaped clamp groove 21 of strip-shaped clamp groove 21.Heat transfer substrate 3 is installed between the pinching end 241 of the bottom surface (bottom surface of the main body of namely dispelling the heat 1) of strip-shaped clamp groove 21 and two T shape snap fits 24, and the led chip mounting plane 31 of heat transfer substrate 3 contacts with the pinching end 241 of T shape snap fit 24, the heat transfer plane of heat transfer substrate 3 32 is near the bottom surface of strip-shaped clamp groove 21.The length of strip-shaped clamp groove 21 is consistent with the length that is installed in heat transfer substrate 3 in the strip-shaped clamp groove 21, the width of strip-shaped clamp groove 21 is greater than the width that is installed in heat transfer substrate 3 in the strip-shaped clamp groove 21, satisfies the morpheme dimensional requirement of heat transfer substrate 3 assembling in the strip-shaped clamp groove 21.
On the bottom surface (being the bottom surface of strip-shaped clamp groove 21) of heat radiation main body 1 a boss bottom surface 22 can be arranged, boss bottom surface 22 is along the bar shaped boss on strip-shaped clamp groove 21 length directions.The pinching end 241 of two T shape snap fits 24 of heat transfer substrate installation portion 2 is symmetrical arranged, and the boss bottom surface 22 of heat transfer substrate installation portion 2 can be parallel with the pinching end 241 of two T shape snap fits 24 of heat transfer substrate installation portion 2.Boss bottom surface 22 is along the Central Symmetry setting of radiator cross section, and two T shape snap fits 24 also are all along the Central Symmetry setting of radiator cross section.
After radiator installs heat transfer substrate 3, boss bottom surface 22 in the strip-shaped clamp groove 21 is used for the heat transfer plane 32 of butt heat transfer substrate 3, behind the interior installation heat transfer substrates 3 of the strip-shaped clamp groove 21 of heat transfer substrate installation portion 2, two T shape snap fits 24 hold out against two-end part at the led chip mounting plane 31 of heat transfer substrate 3, the heat transfer plane 32 of heat transfer substrate 3 tightly is fitted on the boss bottom surface 22 under the elastic acting force of two T shape snap fits 24, heat transfer substrate 3 is installed in the strip-shaped clamp groove 21 tightly.By applying elasticity denaturation power for two T shape snap fits 24, the led chip mounting plane 31 of heat transfer substrate 3 is realized contacting closely with the pinching end 241 of two T shape snap fits 24, the heat transfer plane 32 of heat transfer substrate 3 realizes that with boss bottom surface 22 face contacts closely, so that the heat transfer plane 32 of heat transfer substrate 3 all realizes contacting completely with the strip-shaped clamp groove 21 of heat transfer substrate 3 installation portions with led chip mounting plane 31.
The led chip of installing on the led chip mounting plane 31 of heat transfer substrate 3 is positioned at the medium line place of led chip mounting plane 31, and the heat that led chip produces concentrates on along the midline of led chip mounting plane 31 length, herein heat flow density maximum mostly.The LED spot of radiator is installed when in running order, the zone of heat flow density maximum contacts directly, can guarantee like this that the heat of led chip generation effectively passes to radiator by heat transfer substrate 3 in the boss bottom surface 22 of elongate in shape and the heat transfer substrate 3.
Vertical range on the boss bottom surface 22 of heat transfer substrate installation portion 2 and the heat transfer substrate installation portion 2 between the pinching end 241 of two T shape snap fits 24 can be slightly less than the thickness that is installed in heat transfer substrate 3 in the strip-shaped clamp groove 21; Apply respectively latter two T shape snap fit 24 of active force that is in reverse to strip-shaped clamp groove 21 to two T shape snap fits 24 strain occurs, the actual volume space of strip-shaped clamp groove 21 can increase, and heat transfer substrate 3 can be inserted into from the side mouth of strip-shaped clamp groove 21 strip-shaped clamp groove 21; After heat transfer substrate 3 is installed in the strip-shaped clamp groove 21, removes and put on two active forces on the T shape snap fit 24, two T shape snap fits 24 can with heat transfer substrate 3 led chip mounting plane 31 clamp and contact.
The pinching end 241 of two T shape snap fits 24 also can have angle with the boss bottom surface 22 of heat transfer substrate installation portion 2 respectively, and these two angles are no more than 1 degree.Apply respectively latter two T shape snap fit 24 of active force that is in reverse to strip-shaped clamp groove 21 to two T shape snap fits 24 strain occurs, the actual volume space of strip-shaped clamp groove 21 can increase is enough to hold heat transfer substrate 3, and heat transfer substrate 3 can be inserted into from the side mouth of strip-shaped clamp groove 21 strip-shaped clamp groove 21; After heat transfer substrate 3 is installed in the strip-shaped clamp groove 21, removes and put on two active forces on the T shape snap fit 24, two T shape snap fits 24 can with heat transfer substrate 3 led chip mounting plane 31 clamp and contact.
When in the strip-shaped clamp groove 21 of heat transfer substrate installation portion 2 heat transfer substrate 3 being installed, under the acting in conjunction of two T shape snap fit 24 elastic restoring forces and boss bottom surface 22 holding powers, heat transfer substrate 3 will small strain occur producing towards boss bottom surface 22 directions with two T shape snap fits, 24 contacted end positions places; Heat transfer substrate 3 is after the small strain that produces under two T shape snap fit 24 elastic restoring force effects, the heat transfer plane 32 of heat transfer substrate 3 can realize that with boss bottom surface 22 complete face contacts, and the led chip mounting plane 31 of heat transfer substrate 3 can realize that with the pinching end 241 of two T shape snap fits 24 complete face contacts; Strip-shaped clamp groove 21 installs heat transfer substrate 3, and heat transfer plane 32 is realized simultaneously clamping with the pinching end 241 of two T shape snap fits 24 with strip-shaped clamp groove 21 boss bottom surfaces 22, led chip mounting plane 31 and contacted.
The length of force side 242 can be greater than the length of pinching end 241 on the T shape snap fit 24, the support cylinder 243 of T shape snap fit 24, force side 242 and lever of pinching end 241 common compositions, the length of force side 242 and pinching end 241 is equivalent to two arm of forces of lever, the fulcrum that support cylinder 243 is equivalent to lever.In the process that heat transfer substrate 3 is installed in the strip-shaped clamp groove 21, on the force side 242 of two T shape snap fits 24, apply respectively two smaller upwards active forces, can make two T shape snap fits 24 that small elastic deformation occurs to cause the real space of strip-shaped clamp groove 21 to increase to hold heat transfer substrate 3.
The process that heat transfer substrate 3 is installed in the strip-shaped clamp groove 21 is as follows:
Small elastic deformation occurs and causes the actual volume of strip-shaped clamp groove 21 to increase for the T shape snap fit 24 (can be the active force that applies in the force side 242 of two T shape snap fits 24 towards heat radiation main body 1 bottom surface direction, make two T shape snap fits 24 produce small strain) of outwards pulling two strip-shaped clamp groove 21, two T shape snap fits 24 in the first step;
Second step is for penetrating into the side mouth of heat transfer substrate 3 from strip-shaped clamp groove 21 any ends of heat transfer substrate installation portion 2 strip-shaped clamp groove 21 by robot apparatus or manual type;
The 3rd step, two T shape snap fits 24 were fastened on heat transfer substrate 3 in the strip-shaped clamp groove 21 of heat transfer substrate installation portion 2 under the effect of elastic restoring force in order to install in the strip-shaped clamp groove 21 after the heat transfer substrate 3, to remove and be applied to two external force on the T shape snap fit 24;
The 4th step be two T shape snap fits 24 under the elastic restoring force effect, make that the heat transfer plane 32 of heat transfer substrate 3 contact with boss bottom surface 22 realization faces, the two ends of the led chip mounting plane 31 of heat transfer substrate 3 contact with the pinching end 241 realization clampings of two T shape snap fits 24 respectively; The heat transfer plane 32 of heat transfer substrate 3 has also been realized clamping with boss bottom surface 22 and has been contacted under the clamping force effect of two T shape snap fits 24, so just so that the upper and lower surface of heat transfer substrate 3 all realizes that with strip-shaped clamp groove 21 clamping contacts.
A kind of LED light fixture that present embodiment provides comprises radiator, heat transfer substrate 3, end cap 5 and lampshade 4, and is similar to the light fixture of LED spot among Fig. 6 of preferred embodiment 1.Heat transfer substrate 3 is fastened in the strip-shaped clamp groove 21 of radiator, and lampshade 4 is located on the heat transfer substrate 3, and end cap 5 is coated on the two ends of the fluorescent tube that is comprised of radiator 2, heat transfer substrate 3 and lampshade 4, and lampshade 4 can be fastened on the radiator 2 two ends draw-in grooves.
Heat transfer substrate of the present invention comprises heat radiation main body 1, heat transfer substrate installation portion 2, heat transfer substrate 3, lampshade 4 and end cap 5 from the LED spot that clamps; End cap 5 is installed in the lamp tube ends that is comprised of heat radiation main body 1, heat transfer substrate installation portion 2, heat transfer substrate 3 and lampshade 4; Heat transfer substrate 3 relies on the elasticity predeformation power of 2 two T shapes of heat transfer substrate installation portion snap fit 24 to be fixed in the strip-shaped clamp groove 21.
241 of the pinching ends of 2 two T shapes of the led chip mounting plane 31 of heat transfer substrate 3 and heat transfer substrate installation portion snap fit 24 contact.The heat transfer plane 32 of heat transfer substrate 3 contacts with 22 of boss bottom surfaces on heat radiation main body 1 bottom surface.
In actual applications, after the energising of the led chip on the heat transfer substrate 3, the heat that led chip produces passes on the heat radiation main body 1 by the pinching end 241 of boss bottom surface 22 and two T shape snap fits 24, the heatsink outer surface on the heat radiation main body 1 again with dissipation of heat in air.
The radiator that present embodiment provides is owing to being provided with strip-shaped clamp groove 21 at heat transfer substrate installation portion 2, heat transfer substrate 3 can be fastened in the strip-shaped clamp groove 21, no longer need by screw heat transfer substrate 3 to be fixed on the radiator, thereby efficiency of assembling is high, can satisfy the requirement that automation is produced fast, heat transfer substrate 3 is fastened in the strip-shaped clamp groove 21 and realize close contacts with a plurality of of strip-shaped clamp groove 21, thereby can improve radiating efficiency, avoids heat transfer substrate 3 that thermal deformations occur.
The LED light fixture that present embodiment provides is owing to being provided with strip-shaped clamp groove 21, heat transfer substrate 3 can being fastened in the strip-shaped clamp groove 21 at heat transfer substrate installation portion 2, no longer need by screw heat transfer substrate 3 to be fixed on the radiator, the requirement that LED light fixture efficiency of assembling is produced to satisfy automation fast than your pupil, heat transfer substrate 3 be fastened in the strip-shaped clamp groove 21 and with a plurality of close contacts of strip-shaped clamp groove 21, can improve the radiating efficiency of LED light fixture, avoid the heat transfer substrate 3 of LED light fixture that thermal deformation occurs.
The lamp body heat transfer flow process of heat transfer substrate self-clamp type LED spot of the present invention: the heat that comes from heat transfer substrate 3 can be dispersed into the air by main body 1 extrados that dispels the heat by the heat of passing to heat radiation main body 1 with heat radiation main body 1 close-connected three faces (boss bottom surface 22, two pinching ends 241), come from heat transfer substrate 3.Because heat radiation main body 1 and heat transfer substrate installation portion 2 have consisted of whole radiator jointly, boss bottom surface 22 is maximum from the heat that heat transfer substrate 3 absorbs, two pinching ends 241 are few from the heat that heat transfer substrate 3 absorbs from the relative boss of the heat bottom surface 22 that heat transfer substrate 3 absorbs.Between the heat transfer plane 32 of boss bottom surface 22 and heat transfer substrate 3 for face contact the heat that can guarantee to come from led chip directly by 22 conduction of boss bottom surface to heat radiation main body 1; Two pinching end 241 distance L ED chips are relatively far away, and pinching end 241 is few from the heat that the relative boss of the heat bottom surface 22 that heat transfer substrate 3 absorbs absorbs.
When heat transfer substrate self-clamp type LED spot of the present invention is in confined state, two T shape snap fits 24 of heat transfer substrate installation portion 2 can rely on the elasticity of himself to give birth to deformation force heat transfer substrate 3 is clamped in the strip-shaped clamp groove 21 of heat transfer substrate installation portion 2 tightly, have realized that heat transfer substrate 3 clamps contact fully with the boss bottom surface 22 of heat transfer substrate installation portion 2, two pinching ends 241.
Because the heat transfer substrate 3 of heat transfer substrate self-clamp type LED spot of the present invention is fastened on the strip-shaped clamp groove interior 21 of heat transfer substrate installation portion 2 and can realizes also that with 241 3 faces in boss bottom surface 22 and two pinching ends of heat transfer substrate installation portion 2 clamping area contacts completely, heat transfer substrate self-clamp type LED spot of the present invention can improve heat transfer efficiency, keeps away exhausted heat transfer substrate 3 thermal deformation occurs.
Owing to being limited by the length restriction of heat transfer substrate self-clamp type LED spot of the present invention, the real area of the boss bottom surface 22 of heat transfer substrate installation portion 2 can guarantee like this that less than the bottom surface of the strip-shaped clamp groove 21 of heat transfer substrate installation portion 2 the boss bottom surface 22 of heat transfer substrate installation portion 2 has higher fineness, flatness and linearity.The boss bottom surface 22 of heat transfer substrate installation portion 2 has higher fineness, flatness and linearity, the heat transfer plane 32 of heat transfer substrate 3 also has higher fineness, flatness and linearity, and the boss bottom surface 22 that can guarantee heat transfer substrate installation portion 2 in the LED spot course of normal operation is in all the time tight face with the heat transfer plane 32 of heat transfer substrate 3 and contacts.In LED spot installation process, can scribble heat conductive silica gel between the boss bottom surface 22 of heat transfer substrate installation portion 2 and the heat transfer plane 32 of heat transfer substrate 3 and obtain better heat-transfer effect.
Claims (12)
1. radiator that is used for the LED spot, comprise heat radiation main body (1), heat transfer substrate installation portion (2), described heat transfer substrate installation portion (2) links to each other with described heat radiation main body (1), and the cross section of described heat radiation main body (1) is hollow half arc body; It is characterized in that: described heat transfer substrate installation portion (2) has that the heat transfer bottom surface (11) of two the T shape snap fits (24) by described heat transfer substrate installation portion (2), described heat radiation main body (1) forms is used for holding the strip-shaped clamp groove (21) of heat transfer substrate (3).
2. the radiator for the LED spot according to claim 1, it is characterized in that: the position of the elastic deformability of the support cylinder (243) of described two T shape snap fits (24) bottom surface (11) so that the pinching end (241) of described two T shape snap fits (24) conducts heat relatively can be adjusted.
3. the radiator for the LED spot according to claim 1 is characterized in that: a boss bottom surface (22) is arranged on the described heat transfer bottom surface (11).
4. the radiator for the LED spot according to claim 1 is characterized in that: two T shape snap fits (24) of described heat transfer substrate installation portion (2) are symmetricly set on heat radiation main body (1) bottom surface.
5. described radiator for the LED spot according to claim 1-4, it is characterized in that: the boss bottom surface (22) of described heat transfer substrate installation portion (2) is parallel with the pinching end (241) of two T shape snap fits (24) of heat transfer substrate installation portion (2).
6. described radiator for the LED spot according to claim 1-4 is characterized in that: the length of the upper force side (26) of described T shape snap fit (24) is greater than the length of pinching end (241).
7. described radiator for the LED spot according to claim 1-4 is characterized in that: the vertical range between the boss bottom surface (22) of described heat transfer substrate installation portion (2) and the pinching end (241) of upper two the T shape snap fits of heat transfer substrate installation portion (2) (24) is less than the thickness that is installed in heat transfer substrate (3) in the strip-shaped clamp groove (21).
8. described radiator for the LED spot according to claim 1-4 is characterized in that: the pinching end (241) of described two T shape snap fits (24) has angle with the boss bottom surface (22) of described heat transfer substrate installation portion (2) respectively.
9. a right to use requires the heat transfer substrate of the described radiator of 1-8 from the LED spot of clamping, and described LED spot comprises heat radiation main body (1), heat transfer substrate installation portion (2), heat transfer substrate (3), lampshade (4) and end cap (5); Described end cap (5) is installed in the described lamp tube ends that is comprised of heat radiation main body (1), heat transfer substrate installation portion (2), heat transfer substrate (3) and lampshade (4); It is characterized in that: described heat transfer substrate (3) relies on the elasticity predeformation power of heat transfer substrate (2) two T shape snap fits of installation portion (24) to be fixed in the strip-shaped clamp groove (21).
10. heat transfer substrate according to claim 9 is characterized in that from the LED spot that clamps: the led chip mounting plane (31) of heat transfer substrate (3) clamps with the pinching end (241) of (2) two T shape snap fits of heat transfer substrate installation portion (24) and contacts.
11. heat transfer substrate according to claim 9 is characterized in that from the LED spot that clamps: the heat transfer plane (32) of heat transfer substrate (3) contacts with boss bottom surface (22) face on main body (1) bottom surface of dispelling the heat.
12. heat transfer substrate according to claim 9 is from the LED spot that clamps, it is characterized in that: the width of described strip-shaped clamp groove (21) is greater than the width of heat transfer substrate (3).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210545187.4A CN103307475B (en) | 2012-11-29 | 2012-11-29 | Heat transfer substrate is from the LED tubular lamp clamped and radiator thereof |
| PCT/CN2013/000576 WO2014040364A1 (en) | 2012-09-14 | 2013-05-14 | Led lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210545187.4A CN103307475B (en) | 2012-11-29 | 2012-11-29 | Heat transfer substrate is from the LED tubular lamp clamped and radiator thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103307475A true CN103307475A (en) | 2013-09-18 |
| CN103307475B CN103307475B (en) | 2015-10-14 |
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| CN201210545187.4A Expired - Fee Related CN103307475B (en) | 2012-09-14 | 2012-11-29 | Heat transfer substrate is from the LED tubular lamp clamped and radiator thereof |
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| CN (1) | CN103307475B (en) |
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| CN102734685A (en) * | 2012-06-11 | 2012-10-17 | 蔡干强 | LED (Light Emitting Diode) strip-shaped lamp and manufacturing method thereof |
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Patent Citations (7)
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| KR20100006046A (en) * | 2008-07-08 | 2010-01-18 | 문대승 | Lighting device using led superseding fluorescent lamp |
| CN201964160U (en) * | 2010-10-22 | 2011-09-07 | 苏州盟泰励宝光电有限公司 | LED (light-emitting diode) illuminating lamp |
| DE202010013037U1 (en) * | 2010-12-01 | 2011-02-24 | Harvatek Corp. | Dismountable luminous tube for lighting purposes |
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| CN103307475B (en) | 2015-10-14 |
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Owner name: DALIAN TERMALWAY TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: DALIAN TERMALWAY HEAT TRANSFER TECHNOLOGY CO., LTD. Effective date: 20150831 Owner name: DALIAN TERMALWAY HEAT TRANSFER TECHNOLOGY CO., LTD Effective date: 20150831 |
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Effective date of registration: 20150831 Address after: 116600 2-1- East, 11 Optics Valley Road, Dalian Development Zone, Liaoning, China Applicant after: Dalian Termalway Technology Co., Ltd. Applicant after: Dalian Sanwei Heat Transfer Technology Co., Ltd. Address before: 11 2-1 East, Optics Valley Road, Dalian Development Zone, Liaoning 116600, China Applicant before: Dalian Sanwei Heat Transfer Technology Co., Ltd. |
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