CN103296380A - Antenna device - Google Patents
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- CN103296380A CN103296380A CN 201210051588 CN201210051588A CN103296380A CN 103296380 A CN103296380 A CN 103296380A CN 201210051588 CN201210051588 CN 201210051588 CN 201210051588 A CN201210051588 A CN 201210051588A CN 103296380 A CN103296380 A CN 103296380A
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Abstract
An antenna device comprises a medium substrate and an antenna unit. The medium substrate comprises a first surface and a second surface opposite to the first surface. The antenna unit comprises a first resonance frequency band unit and a second resonance frequency band unit both of which are arranged on the surface of the medium substrate. The first resonance frequency band unit and the second resonance frequency band unit share one feed part. The antenna unit further comprises a micro-strip feeder, choke parts and a grounding part. The micro-strip feeder comprises a feeder, first outer conductors and a second outer conductor, wherein the feeder is arranged on the first surface, the first outer conductors are distributed on the two sides of the micro-strip feeder, and the second outer conductor is arranged on the second surface. The first conductors are electrically connected with the second outer conductor through a metallization via hole. The feed part is connected with one end of the micro-strip feeder. The choke parts are symmetrically arranged on the two sides of the second outer conductor. One end of the second outer conductor is electrically connected with one end of each choke part into a whole. Meanwhile, the gain and other comprehensive properties of the antenna device are further improved through the medium substrate with the low dielectric loss, the antenna model selection, and the design of the optimization of the model selection.
Description
Technical field
The present invention relates to antenna assembly, more particularly, relate to a kind of antenna assembly of GPRS double frequency.
Background technology
GPRS (General Packet Radio Service is called for short GPRS) is a kind of classified data bearer service.Because the GPRS communication is not subjected to the operation distance limit, is particularly suitable for the signals of telecommunication such as city, mountain area and stops serious complex area operation and be widely applied.GPRS communication operating frequency section is 880～960MHz and two frequency ranges of 1710～1880MHz.
Existing GPRS antenna adopts telescopic antenna substantially, so antenna is when the state of use, and its length is relatively long, is not suitable for use in the antenna module of consumption electronic products.In the radio-frequency antenna technical field, based on the copper clad laminate designing antenna owing to be advantage such as tabular, also make its a large amount of use with various electronic equipments in, test is found after deliberation: relevant parameters such as existing copper clad laminate relevant parameter such as dielectric constant pact, dielectric loss value are very big to antenna radiation efficiency and even entire antenna effectiveness affects.
Simultaneously, for antenna design dealer, each factor restriction day line development and designs such as the size of antenna, size, length, resonance band, resonant bandwidth, suitable device environment, gain benefit, a property.It is a pair of outstanding contradiction that outstanding aerial radiation field pattern and antenna require the high-gain performance.And the antenna type selecting has material impact to the design of antenna, exploitation.Therefore consider than miniature antenna under the finite size condition, make the overall performance of antenna meet corresponding electronic equipment demand, the cost that can save a day line development, design and manufacturing again is that the antenna developer faces comprehensive problem, as GPRS dual-band antenna design etc.
Summary of the invention
The technical problem to be solved in the present invention is, improve that a kind of cost is low, the antenna assembly of GPRS double frequency that miniaturization and efficient are high.Therefore, the invention provides a kind of antenna assembly of the GPRS double frequency based on the composite material medium substrate.
A kind of antenna assembly comprises:
One medium substrate comprises a first surface and a second surface of relative with described first surface two;
One antenna element comprises one first resonance band unit and one second resonance band unit and arranges on the surface of described medium substrate; The described first resonance band unit and the second resonance band units shared, one current feed department;
Described antenna element also comprises a microstrip feed line, chokes portion and a ground unit; Microstrip feed line comprises the feeder line that is arranged on the first surface, first outer conductor of the described feeder line both sides that distribute and be arranged at second outer conductor on the second surface; First outer conductor is electrically connected with second outer conductor by some metallization via holes of offering on the described medium substrate; Current feed department links to each other with described feeder line one end;
Described chokes portion is arranged at the second outer conductor both sides symmetrically; One end of one end of described second outer conductor and described chokes portion is electrically connected and is one.
Further, described feeder line and first outer conductor are arranged at second outer conductor in first surface view field.
Further, described medium substrate is worked under the 1GHz frequency, has≤0.008 electrical loss tangent amount.
Further, the resonance band of the described first resonance band unit is 880MHz～960MHz; The resonance band of the second resonance band unit is 1710MHz～1880MHz.
Further, described chokes portion is 880MHz～960MHz frequency range chokes line or 1710MHz～1880MHz frequency range chokes line.
Further, described ground unit comprises first grounding parts that arranges on the first surface and second grounding parts that arranges on the second surface, and the other end of described second outer conductor extends into described second grounding parts and is arranged at first grounding parts in second surface inner projection zone; Described first grounding parts is electrically connected with second grounding parts by some metallization via holes of offering on the described medium substrate.
Further, the described first resonance band unit and the second resonance band unit are arranged on the same surface and are connected as a single entity.
Further, described medium substrate comprises glass cloth, epoxy resin and comprises compound with described epoxy resin generation cross-linking reaction.
Further, select styrene maleic anhydride copolymer for use with the compound of described epoxy resin generation cross-linking reaction.
Further, described styrene maleic anhydride copolymer molecular formula:
Further, the described microstrip feed line other end extends into a conductive connection part, and described conductive connection part is round shape and offers a through hole, the relative setting of insulating with first grounding parts of described conductive connection part at the center.
Further, antenna assembly also comprises a microwave high-frequency connector (SMA signal connector), and described microwave high-frequency connector passes described through hole and conductive connection part electrically contacts.
Relative prior art, utilize the medium substrate of above-mentioned composition, single-layer sheet prepreg or prepreg, the invention of multilayer layer pressing plate processing cost, reduce dielectric constant and the dielectric loss of medium base substrate by the form of introducing polarity and non-polar high polymer copolymer, thereby make that the antenna assembly loss is less, energy conversion rate improves; The combination properties such as gain of antenna assembly have further been improved simultaneously by antenna type selecting, optimization antenna Selection and Design.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples:
Fig. 1 is the perspective view of antenna assembly one embodiment material object of the present invention;
Fig. 2 is the floor map of the first surface of antenna assembly shown in Figure 1;
Fig. 3 is through hole, the back side and the via hole floor map of antenna assembly medium substrate shown in Figure 1;
Fig. 3 a is the schematic diagram of another execution mode of the antenna assembly medium substrate shown in Figure 3 back side;
Fig. 4 is antenna assembly S11 simulation parameter figure shown in Figure 1;
Fig. 5 is the Smith chart of antenna assembly shown in Figure 1;
Fig. 6 is the corresponding parameter list of each frequency on the Smith chart shown in Figure 5;
Fig. 7 is that antenna assembly shown in Figure 1 is at the emulation field pattern figure of 920MHz on the E plane;
Fig. 8 is that antenna assembly shown in Figure 1 is at the emulation field pattern figure of 1800MHz on the E plane.
Embodiment
The present middle embodiment that describes in detail with reference to the accompanying drawings.For complete understanding the present invention, numerous details have been mentioned in the following detailed description.But it should be appreciated by those skilled in the art that the present invention can need not these details and realize.In other embodiments, be not described in detail known method.Process, assembly and circuit are in order to avoid unnecessarily make embodiment fuzzy.
See also Fig. 1, be the perspective view of an embodiment material object of antenna assembly of the present invention.Antenna assembly comprises a medium substrate 1 and is arranged at 1 liang of lip-deep antenna element 3 of described medium substrate, and described medium substrate 1 comprises a first surface 5 (with reference to figure 2) and a second surface 6 relative with described first surface 5.Described antenna element 3 comprises one first resonance band unit EFGHJ and one second resonance band unit EC; The described first resonance band unit EFGHJ intercouples related with the second resonance band unit EI and shares a current feed department E.In the present embodiment, the first resonance band unit EFHGJ and one second resonance band unit EI all arrange on the first surface 5 of described medium substrate 1.In other embodiments, the first resonance band unit EFHGJ and one second resonance band unit EI are arranged at respectively on the first surface 5 and second surface 6 of described medium substrate 1.
See also Fig. 2 and Fig. 3, Fig. 3 a, be respectively the floor map of offering the metallization via hole on through hole, second surface and the medium substrate on antenna assembly first surface of the present invention, the medium substrate.Described antenna element 3 also comprise a microstrip feed line MN, an AB of chokes portion and ground unit 9 19.Described microstrip feed line MN comprises and is arranged on the first surface 5 and first outer conductor 21 of a feeder line 20 that links to each other with described current feed department E, described feeder line 20 both sides that distribute and be arranged at second outer conductor 23 on the second surface 6.Described feeder line 20 and first outer conductor 21 are arranged at second outer conductor 23 in first surface 5 view fields.The other end of described second outer conductor 23 (N end) extends into described second grounding parts 9.
In the present embodiment, the described chokes AB of portion is 1710MHz～1880MHz frequency range chokes line.In other embodiments, the described chokes AB of portion is 880MHz～960MHz frequency range chokes line.
Described ground unit 9 19 comprise and first grounding parts 19 on the first surface 5 be set and second grounding parts 9 on the second surface 6 is set, described first grounding parts 19 is arranged at second grounding parts 9 in first surface 5 inner projection zones, some metallization via holes 7 that medium substrate 1 in described projected area is offered, described first grounding parts 19 is electrically connected with second grounding parts 9 by described some metallization via holes 7.
Described microstrip feed line 20 1 ends (M end) are electrically connected with described current feed department E, and the other end (N end) extends into a conductive connection part 22.In the present embodiment, described conductive connection part 24 is round shape and offers a through hole 22 at the center.Described conductive connection part 24 arranges with the 19 relative insulation of first grounding parts.The described chokes AB of portion symmetrically and parallel second outer conductor 10 both sides arrange.The end (B end) of one end of described second outer conductor 23 (M end) and the described chokes AB of portion is electrically connected and is one.
The through hole 8 of several arbitrary shapes is set on the medium substrate 1 of antenna assembly in the present embodiment.In the present embodiment, described through hole 8 is that rectangle is to reduce the width of antenna assembly of the present invention.Offer several metallization via holes 7 on the medium substrate 1 of described first outer conductor, 21 correspondences.Described metallization via hole 7 is used for being positioned at first outer conductor 21 of first surface 5 and second outer conductor 23 of second surface 6 is electrically connected.
In the present embodiment, described antenna assembly also comprises a bronze medal axis signal line 8, and conductive connection part 24 is electrically connected by the inner wire (not shown) of described through hole 22 with described copper axis signal line 8.The outer conductor of described ground unit 12 above-mentioned copper axis signal lines 8 is electrically connected.Wherein copper axis signal line 8 adopts the microwave high-frequency connector, also claims SMA signal connector 4 (consulting Fig. 1).In the present embodiment, the resonance band of the described first resonance band unit EFHGJ is 880MHz～960MHz; The resonance band of the second resonance band unit EC is 1710MHz～1880MHz.The inner wire of described microwave high-frequency connector 4 passes described through hole 22 and electrically contacts with conductive connection part 24.
In other enforcement sides, the described first resonance band unit EFHGJ and the second resonance band unit EC are separately positioned on a first surface 5 and the second surface 6, and the some metallization via hole (not shown)s that arrange at the medium substrate 4 of described current feed department 9 correspondences, the described first resonance band unit EFHGJ is electrically connected with the second resonance band unit EC by described metallization via hole, makes coaxial signal line 8 signals of telecommunication can conduct to simultaneously on the described first resonance band unit EFHGJ and the second resonance band unit EC.
In other optional execution modes, the described first resonance band unit EFGHJ and the second resonance band unit EC are etched into two independent electric conductors, and connect by a conductor that is associated.
The design of the medium substrate of antenna assembly:
In order to reduce the energy loss of antenna element, improve the performance of entire antenna device, adopt the low dielectric constant and low loss medium substrate, require antenna medium substrates under the 1GHz frequency, to work, have≤4.0 nominal dielectric constant and≤0.008 electrical loss tangent amount.Described medium substrate comprises glass cloth, epoxy resin and comprises compound with described epoxy resin generation cross-linking reaction.Described medium substrate first kind execution mode is as follows:
Described medium substrate manufacture craft is as follows: at first, provide an infiltration solution to comprise: first component includes epoxy resin; Second component comprises the compound with described epoxy resin generation cross-linking reaction; And one or more solvents.Wherein first component and second component dispose mixing according to a certain percentage.
Described infiltration solution is through stirring the back, a described glass cloth is soaked into making first component and second component be adsorbed in the glass cloth in the described infiltration solution or on the surface; Baking is copied described glass cloth and is made described one or more solvent evaporates then, and makes first component and the mutual chemical combination of second component be cross-linked to form prepreg or cured sheets.Prepreg refers to the glass cloth of absorption first component and second component is copied in the relatively low environment of temperature in baking, and first component comprises the soft mixture that the chemical combination cross-linking reaction partly takes place for epoxy resin and the second component inclusion compound.Solidfied material refers to absorption first component is copied in the relative higher environment of temperature in baking with the glass cloth of second component, and first component comprises the relative harder mixture that the chemical combination cross-linking reaction partly takes place for epoxy resin and the second component inclusion compound.
In the present embodiment, the glass cloth of described infiltration forms semi-solid preparation thing (in the form of sheets) by low-temperature bake, described semi-solid preparation thing is cut into and cuts out sheet then, and it is superimposed and be hot pressed into this and implement described multilayer dielectricity substrate (being multilayer layer pressing plate or sheet) according to the thickness needs described multi-disc to be cut out sheet.
In specific embodiment, the compound of described second component can be selected the copolymer that comprises by polarity macromolecule and non-polar high polymer chemical combination for use, as styrene maleic anhydride copolymer.Be understandable that, can all can be used for the prescription composition of present embodiment with the copolymer of epoxy resin generation chemical combination cross-linking reaction.The styrene maleic anhydride copolymer of present embodiment wherein, its molecular formula is as follows:
In above-mentioned styrene maleic anhydride copolymer molecular formula, comprise 4 styrene.In other embodiments, can select corresponding molecular weight, as comprising 6,8 styrene or any number in the styrene maleic anhydride copolymer molecular formula.Epoxy resin is the organic high molecular compound that contains two or more epoxide groups in the general reference molecule.
In other embodiment, the mixture that the compound of described second component can also be selected the cyanate performed polymer for use or select for use styrene maleic anhydride copolymer and cyanate performed polymer to mix according to arbitrary proportion.
In specific embodiment, described epoxy resin and styrene maleic anhydride copolymer are prepared according to the ratio of sense value, add the certain amount of solvent wiring solution-forming then.Described epoxy resin and styrene maleic anhydride copolymer hybrid technique adopt conventional equipment to process, as common agitator and reactor epoxy resin is evenly mixed with styrene maleic anhydride copolymer, thereby the epoxy resin in the described solution is evenly mixed with styrene maleic anhydride copolymer.
In specific embodiment, impel gel in above-mentioned infiltration solution 200-400 time second (selecting 171 ℃ of gel ambient temperatures for use) by adding certain promoter, promote wherein about the above-mentioned 260 seconds infiltration solution gelatinizing time that (as 258-260 second or 250-270 second etc.) effect is better.Described promoter can be selected for use and be included but not limited to tertiary amines, any class in imidazoles and the boron trifluoride mono aminoethane or mixture between them.
Described one or more solvents can be selected for use and include but not limited to acetone, butanone, N, mix the mixed solvent that forms in dinethylformamide, EGME, the toluene between any one or the above-mentioned two or more solvent.
In another embodiment, described infiltration solution comprises: first component comprises epoxy resin; Second component comprises the compound with described epoxy resin generation cross-linking reaction; And one or more solvents.The mixture that the compound of described second component selects for use styrene maleic anhydride copolymer and cyanate performed polymer to mix according to arbitrary proportion.Wherein said cyanate performed polymer concentration 75%.Promoter is selected methylimidazole for use; Described solvent is selected butanone for use.This execution mode soaks into solution specifically fills a prescription as following table:
Added styrene maleic anhydride copolymer and cyanate performed polymer in above-mentioned prescription simultaneously, the chemical combination cross-linking reaction all can take place with epoxy resin in both.
The second class execution mode is as follows:
In the present invention's second class execution mode, the medium substrate manufacture process of described low dielectric constant and low loss also comprises following technology: at first, second component is comprised the compound and the described epoxy resin that crosslinked reaction take place with described epoxy resin prepare according to the ratio of sense value, add the certain amount of solvent wiring solution-forming then.In specific embodiment, described compound comprises the copolymer of polarity macromolecule and non-polar high polymer chemical combination, and wherein the copolymer of preferred embodiment can be selected styrene maleic anhydride copolymer for use.Described epoxy resin and styrene maleic anhydride copolymer hybrid technique adopt conventional equipment to process, and as common agitator and reactor epoxy resin are evenly mixed with styrene maleic anhydride copolymer.The styrene maleic anhydride copolymer of present embodiment wherein, its molecular formula is as follows:
In above-mentioned styrene maleic anhydride copolymer molecular formula, comprise 4 styrene.In other embodiments, can select corresponding molecular weight, as comprising 6 or 8 styrene in the styrene maleic anhydride copolymer molecular formula.Epoxy resin is the organic high molecular compound that contains two or more epoxide groups in the general reference molecule.
In other embodiment, the mixture that the compound of described second component can also be selected the cyanate performed polymer for use or select for use styrene maleic anhydride copolymer and cyanate performed polymer to mix according to arbitrary proportion.
In specific embodiment, make epoxy resin and styrene maleic anhydride copolymer in the described solution can carry out the chemical combination cross-linking reaction under certain condition, take place to depend on described glass cloth after the chemical combination cross-linking reaction, thereby form medium substrate of the present invention.
Described one or more solvents can be selected for use and include but not limited to acetone, butanone, N, in dinethylformamide, EGME, the toluene any one or above-mentioned between mixed solvent.
The described various component ratios of solution one specific embodiment such as following table:
Above-mentioned solution formula comprises epoxy resin, styrene maleic anhydride copolymer, cyanate performed polymer, promoter methylimidazole and a kind of solvent butanone.Added styrene maleic anhydride copolymer and cyanate performed polymer in above-mentioned prescription simultaneously, both are all crosslinked with epoxy resin energy chemical combination.
Then, from above-mentioned solution, extract described a small amount of test sample book, in a certain specified temp environmental testing described solution gelatinizing time, regulate described solution at this fixed temperature environment gel time by adding promoter.Can impel above-mentioned solution in 200-400 gel in time second by adding one or more promoter, wherein said a certain specified temp environment is a single temperature value or a selected specific range of temperatures, in present embodiment, carry out gel time by being set in 171 degrees centigrade of environment, make above-mentioned solution preferable in gel time about 260 seconds (as 258-260 second or 250-270 second etc.) effect.Described promoter can be selected for use and be included but not limited to select for use tertiary amines, any class in imidazoles and the boron trifluoride mono aminoethane or mixture between them.
The 3rd step is when above-mentioned test sample book during gel, is soaked into the back with glass cloth and taken out oven dry in 200-400 time range second, the formation composition in described solution.In these concrete steps, glass cloth immersed fully to soak in the solution guarantee described epoxy resin and styrene maleic anhydride copolymer is adsorbed in the glass cloth or on the surface, immerse the glass cloth of solution then by hanging on air dry oven 180 ℃ of bakings about 5 minutes, purpose is fully volatilized the solvent butanone exactly, and make described epoxy resin and styrene maleic anhydride copolymer chemical combination cross-linking reaction, the product of glass cloth and described chemical combination cross-linking reaction makes the semi-solid preparation composition.Be understandable that, prolong stoving time and or improve baking temperature, can form hardening composition.General a large amount of industrial production adopts in the vertical gluing machine and finishes in the impregnation subsystem and baking oven subsystem.
At last, change composition and the conductive foil with oven dry carries out pressing.In these concrete steps, with change composition (prepreg or prepreg) and conductive foil pressing in the vacuum hotpressing machine of oven dry.Described conductive foil is selected for use and is comprised the electric conducting material that copper, silver, gold, aluminium or above-mentioned material alloy material etc. make.Because the price of copper product is relatively low, the conductive foil of therefore selecting for use copper to become is suitable for industrialization.By etch process the above-mentioned copper medium substrate that covers is etched into the corresponding antenna assembly of the present invention at last.
It is as follows that antenna assembly of the present invention is carried out the emulation testing result:
See also Fig. 4, shown in antenna assembly S11 simulation parameter figure.Described antenna assembly in 880～960MHz frequency range and 1710～1880MHz frequency range fine gain performance is arranged all.As following table: respectively at the corresponding S11 parametric gain numerical value of 880MHz (m1), 920MHz (m2), 960MHz (m3), 1710MHz (m4), 1800MHz (m5), 1880MHz (m6), 1733MHz (m7) and 1854MHz (m8):
| Name | X | Y |
| m1 | 0.8800 | 3.2867 |
| m2 | 0.9200 | 1.8174 |
| m3 | 0.9600 | 2.1843 |
| m4 | 1.7100 | 3.0196 |
| m5 | 1.8000 | 1.1305 |
| m6 | 1.8800 | 3.2656 |
| m7 | 1.7330 | 2.3242 |
| m8 | 1.8540 | 2.3932 |
See also Fig. 5 and Fig. 6, antenna assembly is at 880～960MHz frequency range and 1710～1880MHz frequency range Schmidt circle diagram.Expression is respectively at the corresponding standing wave numerical value of 1810MHz (m1), 1727.5MHz (m2), 1865MHz (m3), 875MHz (m4), 902.5MHz (m5) and 957.5MHz (m6).
See also Fig. 7, shown in antenna assembly at the directional diagram of 920MHz emulation field pattern E face.As can be seen, antenna assembly is that omni-directional antenna and gain all reach 1.56dBi about the 900MHz frequency range from field pattern figure.
See also Fig. 8, shown in antenna assembly at the directional diagram of 1800MHz emulation field pattern E face.As can be seen, antenna assembly is that omni-directional antenna and gain all reach 2.28dBi about the 1800MHz frequency range from field pattern figure.
Utilize the medium substrate of above-mentioned composition, single-layer sheet prepreg or prepreg, the invention of multilayer layer pressing plate processing cost, reduce dielectric constant and the dielectric loss of medium base substrate by the form of introducing polarity and non-polar high polymer copolymer, thereby make that the antenna assembly loss is less, energy conversion rate improves; The combination properties such as gain of antenna assembly have further been improved simultaneously by antenna type selecting, optimization antenna Selection and Design.
By reference to the accompanying drawings embodiments of the invention are described above; but the present invention is not limited to above-mentioned embodiment; above-mentioned embodiment only is schematic; rather than it is restrictive; those of ordinary skill in the art is under enlightenment of the present invention; not breaking away under the scope situation that aim of the present invention and claim protect, also can make a lot of forms, these all belong within the protection of the present invention.
Claims (12)
1. an antenna assembly is characterized in that, comprising:
One medium substrate comprises a first surface and a second surface of relative with described first surface two;
One antenna element comprises one first resonance band unit and one second resonance band unit and arranges on the surface of described medium substrate; The described first resonance band unit and the second resonance band units shared, one current feed department;
Described antenna element also comprises a microstrip feed line, chokes portion and a ground unit; Microstrip feed line comprises the feeder line that is arranged on the first surface, first outer conductor of the described feeder line both sides that distribute and be arranged at second outer conductor on the second surface; First outer conductor is electrically connected with second outer conductor by some metallization via holes of offering on the described medium substrate; Current feed department links to each other with described feeder line one end;
Described chokes portion is arranged at the second outer conductor both sides symmetrically; One end of one end of described second outer conductor and described chokes portion is electrically connected and is one.
2. antenna assembly according to claim 1 is characterized in that, described feeder line and first outer conductor are arranged at second outer conductor in first surface view field.
3. antenna assembly according to claim 2 is characterized in that, described medium substrate is worked under the 1GHz frequency, has≤0.008 electrical loss tangent amount.
4. according to claim 1 or 3 described antenna assemblies, it is characterized in that the resonance band of the described first resonance band unit is 880MHz～960MHz; The resonance band of the second resonance band unit is 1710MHz～1880MHz.
5. antenna assembly according to claim 4 is characterized in that, described chokes portion is 880MHz～960MHz frequency range chokes line or 1710MHz～1880MHz frequency range chokes line.
6. antenna assembly according to claim 5, it is characterized in that, described ground unit comprises first grounding parts that arranges on the first surface and second grounding parts that arranges on the second surface, the other end of described second outer conductor extends into described second grounding parts, and described first grounding parts is arranged at second grounding parts in first surface inner projection zone; Described first grounding parts is electrically connected with second grounding parts by some metallization via holes of offering on the described medium substrate.
7. antenna assembly according to claim 6 is characterized in that, the described first resonance band unit and the second resonance band unit are arranged on the same surface and are connected as a single entity.
8. antenna assembly according to claim 7 is characterized in that, described medium substrate comprises glass cloth, epoxy resin and comprises compound with described epoxy resin generation cross-linking reaction.
9. antenna assembly according to claim 8 is characterized in that, selects styrene maleic anhydride copolymer for use with the compound of described epoxy resin generation cross-linking reaction.
10. antenna assembly according to claim 9 is characterized in that, described styrene maleic anhydride copolymer molecular formula:
11. antenna assembly according to claim 9 is characterized in that, the described microstrip feed line other end extends into a conductive connection part, and described conductive connection part is round shape and offers a through hole, the relative setting of insulating with first grounding parts of described conductive connection part at the center.
12. antenna assembly according to claim 11 is characterized in that, antenna assembly also comprises a microwave high-frequency connector (SMA signal connector), and described microwave high-frequency connector passes described through hole and conductive connection part electrically contacts.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210051588.4A CN103296380B (en) | 2012-03-01 | 2012-03-01 | Antenna assembly |
| PCT/CN2012/075701 WO2013127128A1 (en) | 2012-03-01 | 2012-05-18 | Antenna device |
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| CN201210051588.4A CN103296380B (en) | 2012-03-01 | 2012-03-01 | Antenna assembly |
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| CN103296380A true CN103296380A (en) | 2013-09-11 |
| CN103296380B CN103296380B (en) | 2017-09-15 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102723594A (en) * | 2012-06-12 | 2012-10-10 | 深圳光启创新技术有限公司 | GPRS (general packet radio service) antenna and electronic device |
| CN103367887A (en) * | 2012-03-31 | 2013-10-23 | 深圳光启创新技术有限公司 | Gprs electronic device |
| CN107359398A (en) * | 2017-03-24 | 2017-11-17 | 重庆市乐众潼源科技有限公司 | A kind of mobile communication equipment combined antenna based on high molecular polymer |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6337666B1 (en) * | 2000-09-05 | 2002-01-08 | Rangestar Wireless, Inc. | Planar sleeve dipole antenna |
| CN101394018B (en) * | 2007-09-20 | 2012-06-06 | 大同大学 | Feed-in circular polarized antenna of wide band co-plane wave-guide |
| CN101895010B (en) * | 2010-06-13 | 2012-10-24 | 南京邮电大学 | Coplanar waveguide feed wideband printed monopole antenna |
-
2012
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103367887A (en) * | 2012-03-31 | 2013-10-23 | 深圳光启创新技术有限公司 | Gprs electronic device |
| CN103367887B (en) * | 2012-03-31 | 2018-01-23 | 深圳光启智能光子技术有限公司 | Gprs electronic device |
| CN102723594A (en) * | 2012-06-12 | 2012-10-10 | 深圳光启创新技术有限公司 | GPRS (general packet radio service) antenna and electronic device |
| CN102723594B (en) * | 2012-06-12 | 2015-08-12 | 深圳光启创新技术有限公司 | A kind of GPRS antenna and electronic installation |
| CN107359398A (en) * | 2017-03-24 | 2017-11-17 | 重庆市乐众潼源科技有限公司 | A kind of mobile communication equipment combined antenna based on high molecular polymer |
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| CN103296380B (en) | 2017-09-15 |
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Effective date of registration: 20210426 Address after: 518057 2 / F, software building, No.9, Gaoxin Middle Road, Nanshan District, Shenzhen, Guangdong Province Patentee after: KUANG-CHI INSTITUTE OF ADVANCED TECHNOLOGY Address before: 518034. A, 18B, CIC international business center, 1061 Mei Xiang Road, Shenzhen, Guangdong, Futian District Patentee before: KUANG-CHI INNOVATIVE TECHNOLOGY Ltd. |