CN103286446B

CN103286446B - A kind of Laser Processing synchronizes chip and removes device

Info

Publication number: CN103286446B
Application number: CN201310193932.8A
Authority: CN
Inventors: 徐玉麟
Original assignee: KUNSHAN CHENG LIN LASER TECHNOLOGY Co Ltd
Current assignee: KUNSHAN CHENG LIN LASER TECHNOLOGY Co Ltd
Priority date: 2013-05-23
Filing date: 2013-05-23
Publication date: 2016-08-24
Anticipated expiration: 2033-05-23
Also published as: CN103286446A

Abstract

The invention discloses a kind of Laser Processing to synchronize chip and remove device, it includes, machine table (1), for platform structure, for processed sample；Vibrations unit, including upper vibrations unit (2) and lower vibrations unit (3), described upper vibrations unit (2) and described lower vibrations unit (3) lay respectively at described machine table (1) both sides up and down；Cleaner unit (4), described cleaner unit (4) is positioned at described machine table (1) side；Wherein, described acoustic wave vibrations unit is electrically connected by control system (5) with described cleaner unit (4).This case also discloses a kind of Laser Processing and synchronizes chip sweep-out method, by described control system (5) accept instruction send the first signal start on shake unit (2) and described lower vibrations unit (3) and chip moved to processing object surface, described control system (5) accepts instruction and sends the second signal and start cleaner unit (4) and chip is sucked away from object realizes the removing of chip.

Description

A kind of Laser Processing synchronizes chip and removes device

Technical field

The present invention relates to a kind of chip and remove device, synchronize chip particularly to one Laser Processing and remove dress Put and method.

Background technology

Gradually tend to miniaturization along with various electronic product, its internal part is also towards the most accurate rule Lattice develop, and based on this, when various materials processings are become required part, just need to meet certain processing precise Degree.With the holding, cut of tradition machinery, compared with the contact processing such as milling, laser is this contactless Process because having the advantage that high directivity, high brightness and energy are concentrated, be the most gradually widely used in various In manufacture field, such as, the materials such as metal, plastic cement, glass and pottery are accurately cut and surface The processing such as process.

When utilizing high-octane laser beam processing object, laser beam arrives processing object surface can be by Processing object surface mass is gasificated into steam or plasma-based cloud and evaporate in air, and the gas of volatilization exists then Ambient energy lower forms molten condition liquid, is just solidified as solid residue and remains after temperature reduces It is deposited in processing object surface, causes the surface irregularity processing object, affect procedure and processed goods Matter, even causes processing to interrupt.

In order to avoid chip produced in process affects processing quality, patent No. CN1147270C is just Propose to utilize vacuum cleaner brush to get rid of chip.But, this kind of chip removal mode will be to converted products surface Produce impact.

It addition, the 4th, 284, No. 403 patent announcement case of the U.S. then proposes to utilize sound wave to remove chip, but by In moving reflecting surface or oscillator can move eliminating chip so that procedure is the most complicated, and makes Become operational inconvenience.

To sum up, it is possible to effectively remove chip and do not affect the new chip of processing and remove the exploitation of device and have very much Necessity.

Summary of the invention

The problem existed for above-mentioned technology, the invention provides a kind of Laser Processing and synchronizes chip removing dress Putting, it includes, machine table 1, for platform structure, for processed sample；Vibrations unit, including upper shake Moving cell 2 and lower vibrations unit 3, described upper vibrations unit 2 lays respectively at described lower vibrations unit 3 Described machine table about 1 both sides；Cleaner unit 4, it is other that described cleaner unit 4 is positioned at described machine table 1 Side；Wherein, described vibrations unit is electrically connected by control system 5 with described cleaner unit 4.

Preferably, described a kind of Laser Processing synchronizes chip and removes device, wherein said vibrations unit For pinger or a kind of blowning installation or a kind of getter device.

Preferably, described a kind of Laser Processing synchronizes chip and removes device, and wherein said lower vibrations are single Unit 3 is pinger, and described upper vibrations unit 2 is acoustic wave reflector.

Preferably, described a kind of Laser Processing synchronizes chip and removes device, and wherein said upper vibrations are single Unit 2 is blowning installation or getter device, and described lower vibrations unit 3 is pinger.

Preferably, described a kind of Laser Processing synchronizes chip and removes device, and wherein said upper vibrations are single Unit 2 is blowning installation, and described lower vibrations unit 3 is blowning installation.

Preferably, described a kind of Laser Processing synchronizes chip and removes device, wherein said cleaner unit 4 include that suction nozzle and suction pipe, described suction nozzle are two symmetrical globoidal structures and lay respectively at described machine table 1 Both sides, described cleaner unit 4 connects air compressor.

Also providing for a kind of Laser Processing and synchronize chip sweep-out method, it accepts to refer to by described control system 5 Order sends the first signal startup upper vibrations unit 2 and chip is moved to machining object by described lower vibrations unit 3 Part surface, described control system 5 accept instruction send second signal start cleaner unit 4 chip is sucked away from Object.

A kind of Laser Processing disclosed by the invention synchronizes chip removing device and method and need not contact machining object The chip of processing object surface depths just can be removed by part or chip, makes procedure unaffected, removes This, described vibrations unit and dust exhaust apparatus can arbitrarily load and unload, easy cleaning and operation.

Accompanying drawing explanation

Fig. 1 is that a kind of Laser Processing disclosed by the invention synchronizes chip removing device.

Detailed description of the invention

The present invention is described in further detail below in conjunction with the accompanying drawings, to make those skilled in the art's reference Specification word can be implemented according to this.

As it is shown in figure 1, the invention provides a kind of Laser Processing to synchronize chip removing device, it includes, Machine table 1, for platform structure, for processed sample；Vibrations unit, including upper vibrations unit 2 and under Vibrations unit 3, described upper vibrations unit 2 lays respectively at described machine table 1 with described lower vibrations unit 3 Both sides up and down；Cleaner unit 4, described cleaner unit 4 is positioned at described machine table 1 side；Wherein, institute State vibrations unit to be electrically connected by control system 5 with described cleaner unit 4.Wherein said machine table 1 is put On described lower vibrations unit 3, described control system 5 produce the first signal start upper vibrations unit 2 and Described lower vibrations unit 3.Described lower vibrations unit 3 is pinger, and described upper vibrations unit 2 is Acoustic wave reflector.Described cleaner unit 4 includes that suction nozzle and suction pipe, described suction nozzle are two symmetrical cambered surfaces Structure and lay respectively at described machine table 1 both sides, described cleaner unit 4 connects air compressor.Its Accept instruction by described control system 5 and send the first signal startup upper vibrations unit 2 and described lower vibrations Chip is moved to processing object surface by unit 3, and described control system 5 accepts instruction and sends the second signal Start cleaner unit 4 and chip is sucked away from object.

Although embodiment of the present invention are disclosed as above, but it is not restricted to specification and embodiment party Listed utilization in formula, it can be applied to various applicable the field of the invention completely, for being familiar with ability For the personnel in territory, be easily achieved other amendment, therefore without departing substantially from claim and etc. homotype Enclosing under limited universal, the present invention is not limited to specific details and shown here as the figure with description Example.

Claims

1. a Laser Processing synchronizes chip and removes device, it is characterised in that include,

Machine table (1), for platform structure, for processed sample；

Vibrations unit, including upper vibrations unit (2) and lower vibrations unit (3), described upper vibrations unit (2) Laying respectively at described machine table (1) both sides up and down with described lower vibrations unit (3), described lower vibrations are single Unit (3) is pinger, and described upper vibrations unit (2) is acoustic wave reflector；

Cleaner unit (4), described cleaner unit (4) is positioned at described machine table (1) side, described suction Dirt unit (4) includes that suction nozzle and suction pipe, described suction nozzle are two symmetrical globoidal structures and lay respectively at institute Stating machine table (1) both sides, described cleaner unit (4) connects air compressor；

Wherein, described vibrations unit is electrically connected by control system (5) with described cleaner unit (4), Described control system (5) accept instruction send first signal start on shake unit (2) and described lower shake Moving cell (3) is to move chip to processing object surface, and described control system (5) accepts instruction and sends out Go out the second signal startup cleaner unit (4) and chip is sucked away from object.