CN103264555B - Composite resin material capable of resisting high and low temperatures and high-energy radiation environment, and preparation method thereof - Google Patents
Composite resin material capable of resisting high and low temperatures and high-energy radiation environment, and preparation method thereof Download PDFInfo
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- CN103264555B CN103264555B CN201310185707.XA CN201310185707A CN103264555B CN 103264555 B CN103264555 B CN 103264555B CN 201310185707 A CN201310185707 A CN 201310185707A CN 103264555 B CN103264555 B CN 103264555B
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Abstract
The invention discloses a composite resin material capable of resisting high and low temperatures and a high-energy radiation environment, and a preparation method of the composite resin material, belonging to the field of an organic resin and chemical fiber composite material and preparation thereof. The composite resin material comprises a base layer and a composite layer closely combined with the base layer, wherein the base layer is a fabric taking heterocyclic aromatic polyamide fibers as a main material; and the composite layer is made of m-xylylenediamine tetra-glycidyl-amine epoxy resin and/or reinforced resin taking m-xylylenediamine tetra-glycidyl-amine epoxy resin as a matrix material. The preparation method sequentially comprises the following steps of: gluing in a two-step method, cold press molding, hot press curing, carrying out heat preservation at a constant temperature, and cooling to obtain the finished product. The resin-based fiber composite material disclosed by the invention is capable of resisting high and low temperatures and high-energy radiation.
Description
Technical field
The invention belongs to organic resin, chemical fibre composite and preparation field thereof, particularly the resin composite materials of extreme application (high-low temperature resistant and high-energy particle radiation environment) and preparation thereof.
Background technology
Polyfunctional epoxy resin due to insulation, heat insulation, without characteristics such as magnetic disturbances, become ultralow temperature equip in indispensable important materials.And bisphenol A type epoxy resin conventional at present and novolac glycidyl ethers resin do not possess above-mentioned combination property; Along with the use field of composite under ultra-low temperature surroundings is constantly expanded, the demand and deficiency are outstanding all the more; Therefore, people improve to adapt to this demand to existing ordinary epoxy resin.But the low temperature resistant serviceability of ordinary epoxy resin depends on adding of low viscosity flexibilizer; As the most frequently used bisphenol A type epoxy resin material, its condensation poor-performing that is low temperature resistant and resistant to high energy radiation, though the composite that current employing glass fibre, carbon fiber are reinforcing material to be made to a certain degree alleviates its above-mentioned defect, its result causes combination property poor (as electrical property).In sum: Material Field lacks the resin-based fibrous composite of a kind of high-low temperature resistant, resistant to high energy radiation at present.
Summary of the invention
The object of the invention is to: the resin-based fibrous composite and preparation method thereof proposing a kind of high-low temperature resistant, resistant to high energy radiation.
The object of the invention is realized by following technical proposals:
The resin composite materials of a kind of high-low temperature resistant and high-energy particle radiation environment, the composite bed comprising basal layer and combine closely with basal layer, the fabric that described basal layer is is main material with heteroaromatic Fypro, described composite bed is m-xylene diamine four glycidyl amine epoxy resin and/or the enhancing resin that is matrix material with m-xylene diamine four glycidyl amine epoxy resin.
Described heteroaromatic Fypro and aramid IIII fiber heteroaromatic Fypro.
The structure of described m-xylene diamine four glycidyl amine epoxy resin can be expressed as follows:
As preferred embodiment, described basal layer is that heteroaromatic Fypro plain, heteroaromatic Fypro twill or heteroaromatic Fypro are without latitude cloth.
As preferred embodiment, described composite bed is made up of m-xylene diamine four glycidyl amine epoxy resin of nexine and the outer field enhancing resin being matrix material with m-xylene diamine four glycidyl amine epoxy resin.
As above-mentioned preferred preferred further, described enhancing resin strengthens m-xylene diamine four glycidyl amine epoxy resin with aromatic polyamide fibre.
As further preferred embodiment, each component of described enhancing resin and percentage by weight thereof are:
M-xylene diamine four glycidyl amine epoxy resin is 90%, silica flour 3%, Nomex resin 7%.
A preparation method for above-mentioned resin composite materials, comprises the following steps successively:
1) on basal layer, adopt rolling method to apply m-xylene diamine four glycidyl amine epoxy resin;
2) solvent, in vacuum removal composite bed;
3), continue to adopt the enhancing resin that spraying process coating is matrix material with m-xylene diamine four glycidyl amine epoxy resin;
4) solvent, in vacuum removal composite bed;
5), cold moudling;
6), hot-press solidifying;
7), permanent heat insulation;
8), to lower the temperature to obtain finished product.
As preferred embodiment, described cold moudling condition is: temperature 18 ~ 25 DEG C, pressure 2 ~ 3MPa.
As preferred embodiment, described hot-press solidifying condition is: more than pressure 6MPa, temperature 100 DEG C, time 2.5h.
As preferred embodiment, the hot heat-retaining condition of described perseverance is: temperature 125 DEG C, time 1.5h.
Beneficial effect of the present invention:
1, its high and low temperature resistance of the composite obtained by the present invention is excellent, and at immersing in liquid nitrogen lower surface flawless, tensile strength is unchanged; Under 330 DEG C of high temperature, property indices is still excellent.
2, its radiation resistance of gained composite of the present invention is excellent.After the fast neutron fluence being greater than 0.1Mev through energy and heavy dose of gamma ray radiation, outward appearance is without foaming, seminess, and intensity is without significant change.
3, the composite quality obtained by the present invention is light, and density is 1.3 kgs/m
3left and right.
Detailed description of the invention
Following non-limiting examples is for illustration of the present invention.
1, the resin composite materials of a kind of high-low temperature resistant and high-energy particle radiation environment, the composite bed comprising basal layer and combine closely with basal layer, basal layer is heteroaromatic Fypro plain, and composite bed is made up of m-xylene diamine four glycidyl amine epoxy resin of nexine and the outer field enhancing resin being matrix material with m-xylene diamine four glycidyl amine epoxy resin.As preferably above-mentioned, strengthening resin is strengthen m-xylene diamine four glycidyl amine epoxy resin with aromatic polyamide fibre, and its concrete each component and percentage by weight thereof are:
M-xylene diamine four glycidyl amine epoxy resin is 90%, silica flour 3%, Nomex resin 7%.
2, the preparation method of above-mentioned resin composite materials, comprises the following steps successively:
1) on aforementioned base layer, adopt rolling method to apply m-xylene diamine four glycidyl amine epoxy resin;
2) solvent, in vacuum removal composite bed;
3), continue to adopt spraying process to apply aforementioned enhancing resin;
4) solvent, in vacuum removal composite bed;
5), cold moudling, condition is: temperature 18 ~ 25 DEG C (preferably 25 DEG C), the preferred 2MPa of pressure 2 ~ 3MPa().
6), hot-press solidifying, condition is: more than pressure 6MPa, temperature 100 DEG C, time 2.5h.
7), permanent heat insulation, condition is: temperature 125 DEG C, time 1.5h.
8), to lower the temperature to obtain finished product.
3, the test of above-mentioned material:
3.1, testing standard:
Q ∕ 78912 m-xylene diamine four glycidyl amine epoxy resin;
Q ∕ 78912 heteroaromatic Fypro (aramid fiber III).
3.2, test result:
Resistance to low temperature: at-196 DEG C of lower surface flawlesses, tensile strength is unchanged;
Resistance to elevated temperatures: at 300 DEG C, property indices is still excellent.
Radiation resistance; After the fast neutron fluence and heavy dose of gamma ray radiation of energy 70.1Mev, outward appearance is without foaming, seminess, and intensity is without significant change.
Density of material: 1.3 kgs/m
3left and right.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (5)
1. the preparation method of the resin composite materials of a high-low temperature resistant and high-energy particle radiation environment, the composite bed that this resin composite materials comprises basal layer and combines closely with basal layer, the fabric that described basal layer is is main material with heteroaromatic Fypro, described composite bed is m-xylene diamine four glycidyl amine epoxy resin and/or the enhancing resin that is matrix material with m-xylene diamine four glycidyl amine epoxy resin, it is characterized in that comprising the following steps successively:
1) on basal layer, adopt rolling method to apply m-xylene diamine four glycidyl amine epoxy resin;
2) solvent, in vacuum removal composite bed;
3), continue to adopt the enhancing resin that spraying process coating is matrix material with m-xylene diamine four glycidyl amine epoxy resin;
4) solvent, in vacuum removal composite bed;
5), cold moudling;
6), hot-press solidifying;
7), permanent heat insulation;
8), to lower the temperature to obtain finished product;
Described cold moudling condition is: temperature 18 ~ 25 DEG C, pressure 2 ~ 3MPa; Described hot-press solidifying condition is: more than pressure 6MPa, temperature 100 DEG C, time 2.5h; The hot heat-retaining condition of described perseverance is: temperature 125 DEG C, time 1.5h.
2. the preparation method of the resin composite materials of high-low temperature resistant as claimed in claim 1 and high-energy particle radiation environment, is characterized in that: described basal layer is that heteroaromatic Fypro plain, heteroaromatic Fypro twill or heteroaromatic Fypro are without latitude cloth.
3. the preparation method of the resin composite materials of high-low temperature resistant as claimed in claim 1 and high-energy particle radiation environment, is characterized in that: described composite bed is made up of m-xylene diamine four glycidyl amine epoxy resin of nexine and the outer field enhancing resin being matrix material with m-xylene diamine four glycidyl amine epoxy resin.
4. the preparation method of the high-low temperature resistant as described in claim 1,2 or 3 and the resin composite materials of high-energy particle radiation environment, is characterized in that: described enhancing resin strengthens m-xylene diamine four glycidyl amine epoxy resin with aromatic polyamide fibre.
5. the preparation method of the resin composite materials of high-low temperature resistant as claimed in claim 4 and high-energy particle radiation environment, is characterized in that: each component of described enhancing resin and percentage by weight thereof are:
M-xylene diamine four glycidyl amine epoxy resin is 90%, silica flour 3%, Nomex resin 7%.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310185707.XA CN103264555B (en) | 2013-05-20 | 2013-05-20 | Composite resin material capable of resisting high and low temperatures and high-energy radiation environment, and preparation method thereof |
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| CN201310185707.XA CN103264555B (en) | 2013-05-20 | 2013-05-20 | Composite resin material capable of resisting high and low temperatures and high-energy radiation environment, and preparation method thereof |
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| CN103264555B true CN103264555B (en) | 2015-06-03 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101704313A (en) * | 2009-09-22 | 2010-05-12 | 中国船舶重工集团公司第七二五研究所 | Structural high-damping fiber-reinforced composite |
| CN102030985A (en) * | 2010-09-30 | 2011-04-27 | 长安大学 | Method for preparing carbon fiber reinforced cyanate resin-based composite material |
| CN102470650A (en) * | 2009-09-23 | 2012-05-23 | 乐金华奥斯有限公司 | Flooring material and fabrication method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH0745226B2 (en) * | 1987-06-23 | 1995-05-17 | 日本カ−ボン株式会社 | Laminate |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101704313A (en) * | 2009-09-22 | 2010-05-12 | 中国船舶重工集团公司第七二五研究所 | Structural high-damping fiber-reinforced composite |
| CN102470650A (en) * | 2009-09-23 | 2012-05-23 | 乐金华奥斯有限公司 | Flooring material and fabrication method thereof |
| CN102030985A (en) * | 2010-09-30 | 2011-04-27 | 长安大学 | Method for preparing carbon fiber reinforced cyanate resin-based composite material |
Non-Patent Citations (1)
| Title |
|---|
| 芳香族聚酰胺纤维的性能与应用;季萍 等;《中国纤检》;20101215(第23期);第76-77页 * |
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Address after: 643200 Fu County town, Fushun County, Sichuan, Zigong province (Chenguang Science Park) Patentee after: SICHUAN HUITENG TECHNOLOGY Co.,Ltd. Address before: 643200 Zigong City, Sichuan province Chenguang Science Park Road West, No. 411 Fu Jiang Patentee before: SICHUAN PHAETON Corp. |
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Denomination of invention: Resin composite material resistant to high and low temperature and high-energy radiation environment and preparation method thereof Effective date of registration: 20220901 Granted publication date: 20150603 Pledgee: Sichuan Fushun Rural Commercial Bank Co.,Ltd. Pledgor: SICHUAN HUITENG TECHNOLOGY Co.,Ltd. Registration number: Y2022980014202 |