CN103259070B - The low-loss transmission line of a kind of fall - Google Patents
The low-loss transmission line of a kind of fall Download PDFInfo
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- CN103259070B CN103259070B CN201310125750.7A CN201310125750A CN103259070B CN 103259070 B CN103259070 B CN 103259070B CN 201310125750 A CN201310125750 A CN 201310125750A CN 103259070 B CN103259070 B CN 103259070B
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Abstract
The invention provides and a kind of drop low-loss transmission line, including hop be arranged at hop two ends and the blank area being connected with mobile terminal.Hop includes: for transmitting the signal core of signal；It is arranged at the signal stratum of the one or both sides of signal core；It is arranged at the one or both sides of signal core and the dielectric layer between signal stratum and signal core；It is arranged at the protective layer on hop outer surface；For the bonded structure of the two layer medium layer of the upper and lower both sides of bonding signal core, it includes separate two parts and is positioned at the both sides of signal core horizontal direction.The present invention uses two separate and be positioned at the bonded structure of signal core horizontal direction both sides, it is ensured that is spaced from each other between signal core and bonded structure, reduces the adhesives impact on signal core, thus efficiently reduce the insertion loss of transmission line.
Description
Technical field
The present invention relates to the design field of antenna for mobile phone, particularly relates to the low-loss transmission line of a kind of fall.
Background technology
Antenna is a kind of device utilizing frequency characteristic reception and launching signal.In recent years, for the design and performance of the mobile terminal antenna of radio communication, the developing direction of mobile communication is increasingly affected.Particularly portable mobile termianl such as mobile phone, PDA(PersonalDigitalAssistance), MP3/MP4.Several leading indicators of Antenna Design are: have suitable multifrequency resonance, and antenna realizes signal propagation and energy radiates the resonance being based on certain frequency.If antenna can resonance in multiple frequencies, then antenna can work in multiple frequencies.
In recent years, more and more wireless terminals use the structure design of low section.Namely the thickness of terminal is more and more less, and " thin " is the target that a lot of mobile phone is pursued.In order to reach this target, a lot of mobile phones have employed the pcb board design of discrete, two pieces of pcb boards are i.e. used to lay respectively at the two ends of mobile phone, we can refer to one piece therein with mainboard, there is radio-frequency module in general above, platelet refers to other one piece, has some simply to connect and match circuit above, is typically antenna above platelet.The coaxial line that piece diameter is the thinnest connects platelet and mainboard, is used for radiofrequency signal to be directed to platelet from mainboard.The diameter of coaxial line is the least, and the loss in unit length is the biggest.But, because the spatially integrate degree of mobile phone is more and more higher, it is desirable to use the coaxial line of minor diameter as far as possible, this and reduction loss are exactly contradiction.How in the case of not increasing loss, reduce the space shared by this section of coaxial line as far as possible, be our facing challenges.In recent years, realizing transmission line with microstrip line is a possible selection.But microstrip line is a structure semi-open for signal, and the shielding of signal is problematic, easily produce the interference of signal.The transmission line realized with strip lines configuration is a good selection.Holding wire is positioned at the centre on two-layer ground, and signal has obtained good shielding, it is not easy to produce interference.On the other hand, for radio-frequency performance and the stability of manufacture, the width of holding wire is not the most less than 0.1 millimeter.This just thickness to strip line have certain requirement.Meanwhile, the transmission line such as strip line, microstrip line all relies on the pressing of least one layer of medium and at least one of which holding wire, and medium and holding wire can not directly pressing, the adhesive linkage of at least one of which adhesive properties will necessarily occur.Owing to relative dielectric constant and the loss angle of adhesives are higher, this phenomenon is at high band, and it is particularly evident that such as more than 3Ghz shows, thus causes the insertion loss of transmission line to become to deteriorate at high band.
Accompanying drawing 1-2 is the schematic diagram of prior art, and in Fig. 1,10 is transmission line, and 11 and 12 is the blank area of transmission line 50 ohm, is connected with impedance devices such as mobile terminal 50 ohm such as mobile phones.13 remove the local transmission part of joint 11,12 for transmission line, and 13-1 is front view, and 13-2 is side view.From 13-2, can be seen that the adhesive-layer of prior art intactly covered holding wire and overlapped with holding wire 21 existence, owing to viscose glue has the characteristic of flowing, make holding wire be fully embedded among viscose glue by the extruding of viscose glue and holding wire.Fig. 2 is the transmission line without via, and adhesive structure is identical with Fig. 1.Directly cover holding wire due to viscose glue, the loss angle of viscose glue directly affects the insertion loss of holding wire, thus causes the insertion loss of transmission line to increase.
Summary of the invention
It is desirable to provide a kind of, low-loss transmission line drops, to solve insertion loss deterioration technical matters in transmission line prior art.
The present invention is the low-loss transmission line of a kind of fall, it is characterised in that the low-loss transmission line of this fall includes hop and is arranged at the blank area at described hop two ends, and described blank area is connected with the impedance device of mobile terminal；Wherein, described hop includes:
Signal core, is used for transmitting signal, and described signal core is made up of one or more metallic conductors；
At least one of which signal stratum, is a metallic plate, and described signal stratum is arranged at the one or both sides of described signal core；
At least one of which dielectric layer, is arranged at the one or both sides of described signal core, and between described signal stratum and described signal core, mutually bonding between described dielectric layer with described signal core and described signal stratum；
Bonded structure, for the two layer medium layer of the bonding upper and lower both sides of described signal core, described bonded structure includes separate two parts and is positioned at the both sides of horizontal direction of described signal core, and is provided with gap between described bonded structure and described signal core.
In some embodiments, the outer surface of described hop being provided with protective layer, described protective layer is mutually bonding with described signal ground or described dielectric layer.
In some embodiments, described protective layer uses antioxidation insulant.
In some embodiments, described dielectric layer uses non-conductive dielectric material.
In some embodiments, the upper and lower both sides of described signal core are equipped with between signal stratum, and described signal core and described signal stratum and are equipped with dielectric layer.
In some embodiments, described hop being provided with several vias, described via is for connecting the signal stratum of the upper and lower both sides of described signal core.
Due to the fact that the above technical scheme of employing, be allowed to compared with prior art, have the advantage that with good effect and be: the present invention uses two separate and be positioned at the bonded structure of described signal core both sides, efficiently reduces the insertion loss of transmission line.
Accompanying drawing explanation
In conjunction with accompanying drawing, by hereafter state detailed description, the above-mentioned and other feature and advantage of the present invention can be more clearly understood that, wherein:
Fig. 1 is prior art one；
Fig. 2 is prior art two；
Fig. 3 is the embodiment of the present invention one；
Fig. 4 is the embodiment of the present invention two.
Symbol description:
10-transmission line
11,12-blank area
13-hop
21-signal core
22-bonded structure
23-via
24,25-protective layer
26,27-dielectric layer
28,29-signal stratum
30-gap
Detailed description of the invention
See the accompanying drawing illustrating the embodiment of the present invention, the present invention is described in more detail.But, the present invention can realize in many different forms, and should not be construed as the embodiment by herein proposing and limited.On the contrary, proposing these embodiments is to reach fully and complete disclosure, and makes those skilled in the art understand the scope of the present invention completely.In these accompanying drawings, for clarity sake, may be exaggerated layer and the size in region and relative size.
With reference to shown in Fig. 3-4, the invention provides the low-loss transmission line of a kind of fall, this transmission line 10 includes hop 13 and blank area 11,12, and blank area 11,12 is arranged at the two ends of hop 13, and blank area 11,12 is connected with the impedance device of the mobile terminals such as mobile phone.Wherein, hop 13 includes signal core 21, at least one of which signal stratum, at least one of which dielectric layer and bonded structure 22, as it is shown on figure 3,13-1 is the front view of transmission line, 13-2 is the sectional view of transmission line.
In the present embodiment, signal core 21 is used for transmitting signal, and signal core 21 can be collectively formed by one or more conductors, the shape of signal core 21 can be straight line or folding line etc., and each conductor of signal core 21 is metallic conductor, such as copper, silver, nickel etc., depending on as the case may be, it is not restricted.
In the present embodiment, as it is shown on figure 3, be provided with two-layer signal stratum 28,29 on hop 13, and signal stratum 28,29 is respectively arranged at the both sides up and down of signal core 21.Concrete, signal stratum 28,29 is metallic plate, and signal stratum 28,29 binding signal core 21 carries out the transmission of signal jointly.Being bonded with two layer medium layer 26,27, the i.e. upper surface of signal core 21 between signal stratum 28,29 and signal core 21 the most respectively mutually bonding with dielectric layer 26 and signal stratum 28 successively, the lower surface of signal core 21 is mutually bonding with dielectric layer 27 and signal stratum 29 successively.Dielectric layer 26,27 is for by spaced apart with signal core 21 for signal stratum 28,29 and play the effect of impedance, support signal stratum 28,29 simultaneously.Dielectric layer 26,27 uses non-conductive dielectric material, such as politef, epoxy resin etc., and the material that dielectric layer 26,27 uses can be hardboard or soft board, it is not restricted, can as the case may be depending on, these materials have that relative dielectric constant is low and the little feature of loss, thus have the low-loss effect of fall.
In the present embodiment, the upper and lower two-layer outer surface of hop 13 being additionally provided with protective layer 24,25, protective layer uses antioxidation Ins. ulative material, such as ink etc., plays and prevents transmission line from aoxidizing, and the effect of insulation.Concrete, protective layer 25,24 is respectively arranged on the outer surface on signal stratum 28,29, and protective layer 25,24 is mutually bonding with signal stratum 28,29 respectively.
In the present embodiment, mutually bonding by adhesive structure 22 between the dielectric layer 26,27 of signal core about 21 both sides.Adhesive structure 22 is separate two parts, and two parts of adhesive structure 22 lay respectively at the both sides of signal core 21 horizontal direction, and without the top of signal core 21, two parts of adhesive structure 22 all and are provided with gap 30 between the both sides of signal core 21.In bonding bonding processes, dielectric layer 26,27 is mutually bonding with the top and bottom of adhesive structure 22 respectively, and due to temperature and the application of vacuum of pressing, signal core 21 will be closely linked with dielectric layer under application of vacuum.So, the impact of signal core 21 is reduced by adhesives, and the insertion loss of transmission signal also reduces.Owing to passing in hop 13, there is multi-layer bonded layer; for connecting dielectric layer and dielectric layer; or dielectric layer and protective layer, signal stratum and dielectric layer, signal stratum and protective layer; bonding employing bonded structure 22 between dielectric layer 26,27 and signal core 21, other can use the bonding of prior art away from the adhesive linkage structure of signal core 21 or use the described bonded structure of this enforcement 22.Other uses circuit board mode away from the adhesive linkage structure of signal core 21 in the present embodiment, uses lamination, and light paints etchingization depositing process, and certain transmission line realizes technology mode and do not limits.
In the present embodiment, hop 13 is additionally provided with some vias 23, in some vias 23, carries out metal process, for connecting the two-layer signal stratum 28,29 of signal core 21 upper and lower sides.Certainly, the quantity of via 23 and arrangement position can as the case may be depending on, be not restricted.
Certainly; a kind of embodiment of the low-loss transmission line of above-described fall; signal stratum also can be provided only with one layer and be positioned at the side of signal core; after the opposite side of signal core is bonding with dielectric layer, dielectric layer is mutually the most bonding with protective layer, is not restricted; now without arranging via on hop 13; be illustrated in figure 4 embodiments of the invention two, herein a kind of embodiment, the number of plies of signal stratum and dielectric layer as the case may be depending on.
In sum, the invention provides the low-loss transmission line of a kind of fall, including hop and the blank area being arranged at hop two ends, blank area is connected with the impedance device of mobile terminal.Wherein, hop includes signal core, at least one of which signal stratum, at least one of which dielectric layer, at least one of which protective layer and bonded structure.Signal core is used for transmitting signal；Signal stratum is arranged at the one or both sides of signal core；Dielectric layer is arranged at the one or both sides of signal core, and between signal stratum and signal core, mutually bonding between dielectric layer with signal core and signal stratum；Protective layer is arranged on the outer surface of transmission line, plays insulation, antioxidative effect；Bonded structure is for the dielectric layer of the upper and lower both sides of bonding signal core, and bonded structure includes separate two parts and is positioned at the both sides of signal core horizontal direction, and being provided with gap between bonded structure and signal core.The present invention uses two bonded structures being mutually independently located at signal core both sides, it is ensured that be spaced from each other between signal core and bonded structure, reduces the adhesives impact on signal core, thus efficiently reduces the insertion loss of transmission line.
Those skilled in the art should be understood that the present invention can be implemented without departing from the spirit or scope of the present invention with other concrete forms many.Although also have been described embodiments of the invention, it should be understood that the present invention should not be limited to these embodiments, those skilled in the art can change and modifications as made within spirit and scope of the invention that appended claims defines.
Claims (4)
1. one kind is dropped low-loss transmission line, it is characterised in that the low-loss transmission line of this fall includes hop and is arranged at the blank area at described hop two ends, and described blank area is connected with the impedance device of mobile terminal；Wherein, described hop includes:
Signal core, is used for transmitting signal, and described signal core is made up of one or more metallic conductors；
At least one of which signal stratum, is a metallic plate, and described signal stratum is arranged at the one or both sides of described signal core；
At least one of which dielectric layer, is arranged at the one or both sides of described signal core, and between described signal stratum and described signal core, mutually bonding between described dielectric layer with described signal core and described signal stratum；
Bonded structure, for the two layer medium layer of the bonding upper and lower both sides of described signal core, described bonded structure includes separate two parts and is positioned at the both sides of horizontal direction of described signal core, and is provided with gap between described bonded structure and described signal core；
The upper and lower both sides of described signal core are equipped with signal stratum, and it is equipped with dielectric layer between described signal core and described signal stratum, described signal sandwich layer fits tightly with the dielectric layer of upper and lower both sides, and described signal core is closely linked under application of vacuum with described dielectric layer；Being provided with some vias on described hop, described via is for connecting the signal stratum of the upper and lower both sides of described signal core.
The low-loss transmission line of fall the most according to claim 1, it is characterised in that be provided with protective layer on the outer surface of described hop, described protective layer is mutually bonding with described signal ground or described dielectric layer.
The low-loss transmission line of fall the most according to claim 2, it is characterised in that described protective layer uses antioxidation insulant.
The low-loss transmission line of fall the most according to claim 1, it is characterised in that described dielectric layer uses non-conductive dielectric material.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310125750.7A CN103259070B (en) | 2013-04-12 | 2013-04-12 | The low-loss transmission line of a kind of fall |
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| CN201310125750.7A CN103259070B (en) | 2013-04-12 | 2013-04-12 | The low-loss transmission line of a kind of fall |
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| CN103259070A CN103259070A (en) | 2013-08-21 |
| CN103259070B true CN103259070B (en) | 2016-08-03 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105703065A (en) * | 2015-08-14 | 2016-06-22 | 京信通信技术(广州)有限公司 | Printed cable and preparation method thereof, connection cable and electrically-adjustable antenna system |
| CN108110422A (en) * | 2017-12-08 | 2018-06-01 | 中国船舶重工集团公司第七二四研究所 | A kind of PMI foam medium plate strip lines of low-loss lightweight structure |
| CN108601204A (en) * | 2018-05-25 | 2018-09-28 | 上海安费诺永亿通讯电子有限公司 | A kind of low-loss flat transmission line |
| KR101934676B1 (en) * | 2018-07-24 | 2019-01-03 | 주식회사 기가레인 | Transmission line having improved bending durability |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08288718A (en) * | 1995-04-14 | 1996-11-01 | Murata Mfg Co Ltd | Production of strip line cable |
| CN1136209A (en) * | 1995-03-03 | 1996-11-20 | 株式会社村田制作所 | Antenna-integrated strip line cable |
| CN1176504A (en) * | 1996-06-03 | 1998-03-18 | 株式会社村田制作所 | Multi-layer thin-film electrode, high-frequency transmission line, high-frequency resonator, and high-frequency filter |
| US5770988A (en) * | 1995-08-23 | 1998-06-23 | Murata Manufacturing Co., Ltd. | Thin-film multilayered electrode and method of fabricating same |
| JP2007081658A (en) * | 2005-09-13 | 2007-03-29 | Toshiba Corp | Strip line and its manufacturing method |
| CN101925996A (en) * | 2008-01-24 | 2010-12-22 | 布鲁尔科技公司 | Device wafer reversibly is installed in method on the carrier substrate |
| CN102986308A (en) * | 2010-12-03 | 2013-03-20 | 株式会社村田制作所 | High-frequency signal line |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100987191B1 (en) * | 2008-04-18 | 2010-10-11 | (주)기가레인 | printed circuit board removing bonding sheet around signal transmission line |
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2013
- 2013-04-12 CN CN201310125750.7A patent/CN103259070B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1136209A (en) * | 1995-03-03 | 1996-11-20 | 株式会社村田制作所 | Antenna-integrated strip line cable |
| JPH08288718A (en) * | 1995-04-14 | 1996-11-01 | Murata Mfg Co Ltd | Production of strip line cable |
| US5770988A (en) * | 1995-08-23 | 1998-06-23 | Murata Manufacturing Co., Ltd. | Thin-film multilayered electrode and method of fabricating same |
| CN1176504A (en) * | 1996-06-03 | 1998-03-18 | 株式会社村田制作所 | Multi-layer thin-film electrode, high-frequency transmission line, high-frequency resonator, and high-frequency filter |
| JP2007081658A (en) * | 2005-09-13 | 2007-03-29 | Toshiba Corp | Strip line and its manufacturing method |
| CN101925996A (en) * | 2008-01-24 | 2010-12-22 | 布鲁尔科技公司 | Device wafer reversibly is installed in method on the carrier substrate |
| CN102986308A (en) * | 2010-12-03 | 2013-03-20 | 株式会社村田制作所 | High-frequency signal line |
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