CN103249265A - Blind hole filling method - Google Patents
Blind hole filling method Download PDFInfo
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- CN103249265A CN103249265A CN2013101911977A CN201310191197A CN103249265A CN 103249265 A CN103249265 A CN 103249265A CN 2013101911977 A CN2013101911977 A CN 2013101911977A CN 201310191197 A CN201310191197 A CN 201310191197A CN 103249265 A CN103249265 A CN 103249265A
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- resin
- blind hole
- printed circuit
- circuit board
- lamination
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Abstract
The invention relates to a blind hole filling method, which comprises the steps of powdering a layer of resin coated on a glass cloth of a prepreg used for lamination and removing the glass cloth to obtain resin powder in powder resin; making a leak plate for plugging holes, wherein leak holes corresponding to the positions of blind holes in a corresponding multilayer printed circuit board are formed in the leak plate for plugging the holes; before lamination, stacking, aligning and fixing the leak plate for plugging the holes with the corresponding multiplayer printed circuit board, spreading the obtained resin powder into the leak holes in the leak plate for plugging the holes to enable the blind holes in the multilayer printed circuit board to be fully filled with the resin powder, then sealing by using PI (polyimide) adhesive tapes on the resin powder and sticking the PI adhesive tapes on the leak plate for plugging the holes; using the prepreg to laminate the multilayer printed circuit board; and after lamination, removing the PI adhesive tapes, taking down the leak plate for plugging the holes, grinding the surface of the leak plate, removing cured resin powder which is accumulated at the mouths of the blind holes and grinding the mouths of the blind holes flat.
Description
Technical field
The present invention relates to printed circuit board and make the field, more particularly, the present invention relates to a kind of blind hole filling perforation method.
Background technology
The multilayer printed board of buried blind via design is arranged for some because the plate face mounts components and parts, require the plate face smooth, therefore the blind hole that mounts the position at components and parts generally all will be filled and led up processing, but the part plate is because designing requirement need be used mobile low prepreg (fluidity is lower than 10%) lamination.Fill discontented aperture depression during lamination in the blind hole, evenness is very poor, can't meet the demands, and adopt the filling holes with resin mode to make, because the prepreg that the resin that consent is used and lamination are used is not same resin system, the difference on the performance causes reliability to be affected.
Specifically, the part multilayer printed circuit board is because the electric property requirement has the buried blind via design in folded structure design; As shown in Figure 1, may there be top blind hole 1, buried blind via 2, bottom blind hole 3 and through hole 4 in the multilayer printed circuit board.If buried blind via 2 places are not are not filled and led up, the resin gummosis will be filled in the buried blind via when lamination.But the prepreg for low fluidity (less than 10%), because it is mobile poor, prepreg resin Heated Flow can not be filled in the aperture fully during lamination, causes the aperture depression big, can't satisfy the reliability requirement of printed board plate face aperture position high-flatness; As shown in Figure 2, form blind hole in the internal layer base material 5, hole wall plated with copper 6 is prepreg resin gummosis fill area 7 between the blind hole, and blind hole can form aperture depression 8.
At present, be to adopt liquid resin to fill blind hole at the solution of this defective, blind hole to be filled and led up, follow-up heavy copper is again electroplated and is made.Make by this mode, the blind hole position is filled and led up, and can reach the high-flatness requirement of plate face aperture position.
But, though employing liquid resin or copper cream consent can be populated with the hole, but because the prepreg that liquid resin or copper cream and multi-layer sheet lamination are used is not with a kind of resin system, at thermal endurance and thermal coefficient of expansion (Coefficient of Thermal Expand, CTE) differ greatly, be subjected to after the repeatedly thermal shock easily from producing the crack at the interface, the crack further expands and will directly cause the separation plate bursting of printed board, so the printed board reliability of this method processing is relatively poor.
Summary of the invention
Technical problem to be solved by this invention is at there being above-mentioned defective in the prior art, provide a kind of and can guarantee to fill uniform lazy flow prepreg blind hole filling perforation manufacture method in the blind hole under the situation that does not adopt liquid resin or copper cream consent, it has been eliminated blind hole and has filled discontented or the relatively poor problem of reliability.
According to the present invention, a kind of blind hole filling perforation method is provided, it comprises:
First step: one deck resin that applies on the glass cloth to the used prepreg of lamination is made powdery, and gets rid of glass cloth part wherein, obtains the powdered resin powder thus;
Second step: make the consent bushing, described consent is with being formed with the small opening corresponding with the position of blind hole on the corresponding multilayer printed circuit board on the bushing;
Third step: before the lamination lamination, with consent with bushing and with corresponding multilayer printed circuit board stacked align fixing, in the small opening of consent with bushing, spread the resin-oatmeal that obtains in the first step, make resin-oatmeal fill up the blind hole of multilayer printed circuit board fully, after this utilize the PI tape seal at resin-oatmeal, and the PI adhesive tape is sticked on consent with on the bushing;
The 4th step: utilize prepreg that multilayer printed circuit board is carried out lamination;
The 5th step: remove the PI adhesive tape behind the lamination, take off the consent bushing, the plate face is ground, remove the resin-oatmeal solidfied material that the blind hole mouth is piled up, and the aperture is polished.
Preferably, in first step, the prepreg that lamination is used is crumpled, one deck resin that applies on the prepreg glass cloth is twisted into powdery, the resin-oatmeal of rubbing with the hands filters with the fine mesh screen cloth, gets rid of glass cloth part wherein, and the resin-oatmeal that filters is collected.
Preferably, in second step, according to wanting bore position to hole at correspondence position at aluminium flake on the multilayer printed circuit board, make the consent bushing thus.
Preferably, the diameter of the small opening of aluminium flake brill is than the big 0.3-0.6mm of diameter of the blind hole on the printed circuit board.
Preferably, in the 4th step, utilize vacuum laminator by HTHP multilayer printed circuit board to be carried out lamination.
Preferably, in the 4th step, utilize vacuum laminator by HTHP multilayer printed circuit board to be carried out lamination according to the parameter of prepreg.
The same resin system resin-oatmeal of the bonding used prepreg of utilization of the present invention and interlayer is filled the printed board blind hole; Wherein bore small opening from consent with bushing, corresponding printed board blind hole position, small opening position obtains the bushing that potting resin is used; Resin-oatmeal is sprinkled in the plate in the blind hole with bushing by consent; The HTHP effect of lamination is fully solidified resin-oatmeal and is filled up aperture, and the raised area grinds away, thereby has reached the closely knit smooth effect of blind hole filling perforation.Thus, the invention provides a kind of uniform lazy flow prepreg blind hole filling perforation manufacture method of under the situation that does not adopt liquid resin or copper cream consent, just can guaranteeing to fill in the blind hole.
Description of drawings
By reference to the accompanying drawings, and by with reference to following detailed, will more easily more complete understanding be arranged and more easily understand its attendant advantages and feature the present invention, wherein:
Fig. 1 is the schematic diagram that schematically shows multilayer printed board buried blind via structure.
Fig. 2 is the schematic diagram that schematically shows the prepreg filling blind hole effect of lazy flow.
Fig. 3 schematically shows the flow chart of blind hole filling perforation method according to the preferred embodiment of the invention.
Fig. 4 and Fig. 5 schematically show the sectional view of the step of blind hole filling perforation method according to the preferred embodiment of the invention.
Need to prove that accompanying drawing is used for explanation the present invention, and unrestricted the present invention.Notice that the accompanying drawing of expression structure may not be to draw in proportion.And in the accompanying drawing, identical or similar elements indicates identical or similar label.
Embodiment
In order to make content of the present invention clear and understandable more, below in conjunction with specific embodiments and the drawings content of the present invention is described in detail.
The present invention is directed to the deficiency of above-mentioned consent mode on reliability, propose a kind of novel blind hole filling perforation mode.The HTHP mode is filled blind hole in laminating machine by spread resin-oatmeal (prepreg of using with the multi-layer sheet lamination is with a kind of resin system) in the blind hole position, both guaranteed to fill in the blind hole evenly, again because all adhesive linkages are with a kind of resin system, thermal endurance and CTE go up consistent, so the better reliability of printed board.
Specifically describe the preferred embodiments of the present invention below in conjunction with accompanying drawing 3 to Fig. 5.
Fig. 3 schematically shows the flow chart of blind hole filling perforation method according to the preferred embodiment of the invention.
Specifically, as shown in Figure 3, blind hole filling perforation method comprises according to the preferred embodiment of the invention:
First step S1: one deck resin that applies on the glass cloth to the used prepreg of lamination is made powdery, and gets rid of glass cloth part wherein, obtains the resin-oatmeal in the powdered resin thus;
Specifically, for example, in first step S1, can crumple the used prepreg of lamination, one deck resin that applies on the prepreg glass cloth is twisted into powdery, the resin-oatmeal of rubbing with the hands filters with fine mesh screen cloth (for example 310 orders), gets rid of glass cloth part wherein, and the resin-oatmeal that filters is collected;
The second step S2: make consent with bushing 10, described consent is with being formed with the small opening 11 corresponding with the position (position that will hole) of blind hole 101 on the corresponding multilayer printed circuit board 100 on the bushing.
Specifically, for example, in the second step S2, as shown in Figure 4, can make the consent bushing thus according to wanting bore position to hole at correspondence position at aluminium flake on the multilayer printed circuit board.Preferably, the diameter of the small opening that aluminium flake bores is than the big 0.3-0.6mm of diameter of the blind hole on the printed circuit board, so that fill out resin-oatmeal to bit manipulation.
Third step S3: before the lamination lamination, with consent with bushing 10 and with corresponding multilayer printed circuit board 100 stacked align fixing, in the small opening of consent with bushing 10, be sprinkling upon the resin-oatmeal 30 that obtains among the first step S1, make resin-oatmeal 30 fill up the blind hole 101 of multilayer printed circuit board 100 fully, after this utilize PI adhesive tape 20(namely at resin-oatmeal 30, Kapton Tape) seals, and PI adhesive tape 20 is sticked on consent with on the bushing 10, shown in the resin-oatmeal 30 and PI adhesive tape 20 of Fig. 5;
The 4th step S4: utilize 40 pairs of multilayer printed circuit boards of prepreg 100 to carry out lamination, as shown in Figure 5;
Wherein, in the 4th step S4, specifically can utilize vacuum laminator by HTHP multilayer printed circuit board 100 to be carried out lamination, and can carry out lamination according to the parameter that requires of prepreg 40;
The 5th step S5: remove PI adhesive tape 20 behind the lamination, take off consent with bushing 10, the plate face is ground, remove the resin-oatmeal solidfied material of 101 mouthfuls of accumulations of blind hole, and the aperture is polished; Just filled the filler with the bonding used prepreg 40 same resin systems of interlayer like this in the blind hole 101.
Above preferred embodiment of the present invention is utilized with the same resin system resin-oatmeal of the bonding used prepreg of interlayer and is filled the printed board blind hole; Wherein bore small opening from consent with bushing, corresponding printed board blind hole position, small opening position obtains the bushing that potting resin is used; Resin-oatmeal is sprinkled in the plate in the blind hole with bushing by consent; The HTHP effect of lamination is fully solidified resin-oatmeal and is filled up aperture, and the raised area grinds away, thereby has reached the closely knit smooth effect of blind hole filling perforation.
In addition, need to prove, unless otherwise indicated, otherwise the term in the specification " first ", " second ", " the 3rd " etc. describe each assembly of only being used for distinguishing specification, element, step etc., rather than are used for logical relation between each assembly of expression, element, the step or ordinal relation etc.
Be understandable that though the present invention with the preferred embodiment disclosure as above, yet above-described embodiment is not in order to limit the present invention.For any those of ordinary skill in the art, do not breaking away under the technical solution of the present invention scope situation, all can utilize the technology contents of above-mentioned announcement that technical solution of the present invention is made many possible changes and modification, or be revised as the equivalent embodiment of equivalent variations.Therefore, every content that does not break away from technical solution of the present invention according to any simple modification, equivalent variations and the modification that technical spirit of the present invention is done above embodiment, all still belongs in the scope of technical solution of the present invention protection.
Claims (6)
1. blind hole filling perforation method is characterized in that comprising:
First step: one deck resin that applies on the glass cloth to the used prepreg of lamination is made powdery, and gets rid of glass cloth part wherein, obtains the resin-oatmeal in the powdered resin thus;
Second step: make the consent bushing, described consent is with being formed with the small opening corresponding with the position of blind hole on the corresponding multilayer printed circuit board on the bushing;
Third step: before the lamination lamination, with consent with bushing and with corresponding multilayer printed circuit board stacked align fixing, in the small opening of consent with bushing, spread the resin-oatmeal that obtains in the first step, make resin-oatmeal fill up the blind hole of multilayer printed circuit board fully, after this utilize the PI tape seal at resin-oatmeal, and the PI adhesive tape is sticked on consent with on the bushing;
The 4th step: utilize prepreg that multilayer printed circuit board is carried out lamination;
The 5th step: remove the PI adhesive tape behind the lamination, take off the consent bushing, the plate face is ground, remove the resin-oatmeal solidfied material that the blind hole mouth is piled up, and the aperture is polished.
2. blind hole filling perforation method according to claim 1, it is characterized in that, in first step, the prepreg that lamination is used is crumpled, one deck resin that applies on the prepreg glass cloth is twisted into powdery, the resin-oatmeal of rubbing with the hands filters with the fine mesh screen cloth, gets rid of glass cloth part wherein, and the resin-oatmeal that filters is collected.
3. blind hole filling perforation method according to claim 1 and 2 is characterized in that, in second step, according to wanting bore position to hole at correspondence position at aluminium flake on the multilayer printed circuit board, makes the consent bushing thus.
4. blind hole filling perforation method according to claim 1 and 2 is characterized in that, the diameter of the small opening that aluminium flake bores is than the big 0.3-0.6mm of diameter of the blind hole on the printed circuit board.
5. blind hole filling perforation method according to claim 1 and 2 is characterized in that, utilizes vacuum laminator by HTHP multilayer printed circuit board to be carried out lamination in the 4th step.
6. blind hole filling perforation method according to claim 1 and 2 is characterized in that, utilizes vacuum laminator by HTHP multilayer printed circuit board to be carried out lamination according to the parameter of prepreg in the 4th step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310191197.7A CN103249265B (en) | 2013-05-21 | 2013-05-21 | A kind of blind hole filling perforation method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310191197.7A CN103249265B (en) | 2013-05-21 | 2013-05-21 | A kind of blind hole filling perforation method |
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| CN103249265A true CN103249265A (en) | 2013-08-14 |
| CN103249265B CN103249265B (en) | 2015-10-07 |
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| CN201310191197.7A Active CN103249265B (en) | 2013-05-21 | 2013-05-21 | A kind of blind hole filling perforation method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105636355A (en) * | 2016-03-07 | 2016-06-01 | 胜宏科技（惠州）股份有限公司 | Adhesive filling method for groove hole of metal substrate |
| CN107333397A (en) * | 2017-08-07 | 2017-11-07 | 胜宏科技（惠州）股份有限公司 | A kind of wiring board control deeply etching method |
| CN107734835A (en) * | 2017-11-14 | 2018-02-23 | 惠州市兴顺和电子有限公司 | Wiring board consent pressing structure and compression method |
| CN109561586A (en) * | 2017-09-27 | 2019-04-02 | 深圳市博敏电子有限公司 | High-frequency microwave multilayer board filling holes with resin method |
| CN111295052A (en) * | 2020-03-25 | 2020-06-16 | 深圳捷飞高电路有限公司 | Blind hole filling process and grinding device for high-density interconnected printed circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5795618A (en) * | 1991-07-23 | 1998-08-18 | Ibiden Co., Ltd | Polymerizable adhesive (comprising cured amino resin powder) for print ed circuit board |
| CN102244986A (en) * | 2010-05-13 | 2011-11-16 | 富葵精密组件(深圳)有限公司 | Hole plugging device and hole plugging method of circuit board |
| CN202351076U (en) * | 2011-12-09 | 2012-07-25 | 广东生益科技股份有限公司 | Automatic powder sampling device for detection and sampling of prepreg |
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2013
- 2013-05-21 CN CN201310191197.7A patent/CN103249265B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5795618A (en) * | 1991-07-23 | 1998-08-18 | Ibiden Co., Ltd | Polymerizable adhesive (comprising cured amino resin powder) for print ed circuit board |
| CN102244986A (en) * | 2010-05-13 | 2011-11-16 | 富葵精密组件(深圳)有限公司 | Hole plugging device and hole plugging method of circuit board |
| CN202351076U (en) * | 2011-12-09 | 2012-07-25 | 广东生益科技股份有限公司 | Automatic powder sampling device for detection and sampling of prepreg |
Non-Patent Citations (1)
| Title |
|---|
| 赵志平、周刚: "树脂塞孔工艺技术的研发", 《印制电路信息》, vol. 2010, no. 2, 28 February 2010 (2010-02-28) * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105636355A (en) * | 2016-03-07 | 2016-06-01 | 胜宏科技（惠州）股份有限公司 | Adhesive filling method for groove hole of metal substrate |
| CN107333397A (en) * | 2017-08-07 | 2017-11-07 | 胜宏科技（惠州）股份有限公司 | A kind of wiring board control deeply etching method |
| CN109561586A (en) * | 2017-09-27 | 2019-04-02 | 深圳市博敏电子有限公司 | High-frequency microwave multilayer board filling holes with resin method |
| CN107734835A (en) * | 2017-11-14 | 2018-02-23 | 惠州市兴顺和电子有限公司 | Wiring board consent pressing structure and compression method |
| CN111295052A (en) * | 2020-03-25 | 2020-06-16 | 深圳捷飞高电路有限公司 | Blind hole filling process and grinding device for high-density interconnected printed circuit board |
| CN111295052B (en) * | 2020-03-25 | 2021-06-01 | 深圳捷飞高电路有限公司 | Blind hole filling process and grinding device for high-density interconnected printed circuit board |
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| Publication number | Publication date |
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| CN103249265B (en) | 2015-10-07 |
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