CN103246913B - A kind of method for producing IC smart cards - Google Patents
A kind of method for producing IC smart cards Download PDFInfo
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- CN103246913B CN103246913B CN201310203142.3A CN201310203142A CN103246913B CN 103246913 B CN103246913 B CN 103246913B CN 201310203142 A CN201310203142 A CN 201310203142A CN 103246913 B CN103246913 B CN 103246913B
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Abstract
The invention discloses a kind of method for producing IC smart cards, pass through IC smart cards produced by the invention, the difference in height on its IC Modular surface and card body surface is the thickness of first surface layer material, simultaneously because the thickness deviation very little of the first surface layer material of same model, so the cup depth of IC modules is controllable, deviation very little.The present invention solves height inconsistence problems of the IC modules in card body, solves in batch production, it is impossible to ensures the problem of IC modules are lower than card body surface.
Description
Technical field
The present invention relates to areas of information technology, relate in particular to a kind of method for producing IC smart cards.
Background technology
At present, producing contact IC smart cards and the production method of double interface I C smart cards has two kinds, and one kind is groove milling
Method, one kind are laminatings.
IC intelligent card matrixes are laminated by groove milling method first, then mill out IC module slots with slotter in card primary surface, will
The IC modules that hot melt adhesive film is posted at the back side are put into wherein, then by hot pressing, melt the hot melt adhesive film of IC module backsides, by IC
Module and card base is bonded together, and finally gives contact IC smart cards or double interface I C smart cards.Wherein double interface I C modules
Before being put into, the pad in IC modules should also weld together with the metal antenna on card matrix material.
Laminating is first on some layer materials of composition card base, goes out IC modules hole, then in sequence one by one
It is stapled, and by IC Module-embeddings hole, then card is laminated and rushed, finally obtain contact IC smart cards or double interface I C intelligence
Can card.Wherein double interface I C modules before lamination, should also weld together with the metal antenna on card matrix material.
The cup depth control of IC modules within a smart card, is always to be denounced by people.How IC moulds is kept in production
The cup depth of block within a smart card is consistent, and it is difficult to solve the problems, such as to be one, sees Fig. 7.The IC modular structures of one depression, can
To avoid IC modules due to being rubbed repeatedly in consumer's hand, caused by surface contact it is impaired or stain, and contact
Phenomenon that is impaired or staiing loose contact when bringing use；And the life-span of IC smart cards can be extended.
Groove milling method is by milling out IC module slots on card base, then by IC Module-embeddings method therein.But due to
Two reasons cause the cup depth of IC modules to be difficult to control, and one is due to that the precision of slotter does not reach requirement, second, each
The temperature and pressure of hot pressing is out of contior very accurate, causes the variable thickness after the hot melt adhesive film hot pressing of module backside, most
Cause the depression deviation of IC modules very big eventually.
Laminating is that the first surface layer that punching has IC modules hole is enclosed in IC modules, and surface layer keeps a height with IC modules
Degree, is then laminated.So, although can make the surface of IC modules and height that card primary surface maintains like, and high-volume is raw
The uniformity of both difference in height is can guarantee that during production, but the requirement lower than card primary surface of IC Modular surfaces can not be met.
The content of the invention
In view of the above-mentioned problems, the mesh of the present invention is inconsistent in order to solve the IC module cup depths in existing IC smart cards
The problem of, and can very easily adjust this cup depth.
To achieve these goals, technical scheme is as follows：
A kind of method for producing IC smart cards, it is characterised in that comprise the following steps,
A, protection hole is gone out in positive printing layer, for being enclosed on the top of T-shaped IC modules；
B, IC module protection glue hole is gone out on IC module protection layers, for entangling T-shaped IC modules bottom Protection glue；
It is C, positive printing layer, IC module protections layer, back up layer and second surface layer material is stapled in sequence,
Now protection hole, the combination of IC module protection glue hole form IC modules hole；Then T-shaped IC modules are inserted in IC modules hole and solid
It is fixed, keep T-shaped IC Modular surfaces equal with front printing layer surface；
D, first surface layer material goes out the hollow out corresponding with IC modules hole according to the size of T-shaped IC modules front surface
Pattern, the pierced pattern include the covering material part not being broken completely, and the covering material part only retains some tie points,
Covering material part is connected by the tie point with the remainder of first surface layer material；
E, first surface layer material is covered in card primary surface, and make it that pierced pattern is corresponding with IC modules；
F, and then hot pressing and punching card are carried out, obtains individual IC smart card；
G, the tie point of the covering material part not being broken completely of pierced pattern is blocked；Will be residual above T-shaped IC modules
The covering material part of the pierced pattern stayed removes, and hollow hole is formed, so as to expose the front surface of T-shaped IC modules.
In step, positive printing layer can be that two layers or some layer materials are superimposed together, to ensure the depth of protection hole
Degree is identical with the thickness of the top half of IC modules.
In stepb, IC module protections layer is the IC module protection layers being made up of some layer materials, its thickness and IC modules
Bottom Protection glue consistency of thickness.
In the present invention, if IC modules are double interface modules, before step E, it is also necessary to by the pad in IC modules
It is electrically connected with the antenna on card base.
In the present invention, pierced pattern includes the hollow out gap of interruption and surrounds the covering defined by hollow out gap
Material part；The physical dimension in the hollow out gap is more than or equal to IC module sizes, and inner dimensions are less than the size of IC modules.
In the present invention, the tie point method for cutting of the pierced pattern covering material part, can be laser ablation, milling
Knife milling is disconnected or cutting knife is cut.
The IC Modular surfaces of the present invention and the thickness that the difference in height on card body surface is first surface layer material, simultaneously because together
The thickness deviation very little of the first surface layer material of one model, so the cup depth of IC modules is controllable, deviation very little.
The cup depth of IC modules, it can be adjusted by the thickness of first surface layer material, the first surface layer of different-thickness
Material, the different IC smart cards of IC module cup depths can be produced.
The present invention solves height inconsistence problems of the IC modules in card body, solves in batch production, it is impossible to ensure
The problem of IC modules are lower than card body surface.
The features of the present invention see this case schema and the following preferably detailed description of embodiment and obtain clearly
Solution.
Brief description of the drawings
Fig. 1 is that first surface layer material is punched into the schematic diagram after hollow hole in present example；
Fig. 2 is the schematic diagram of pierced pattern in present example；
Fig. 3 is that each layer binds sequential schematic in present example；
Fig. 4 is individual embodiment in present example, and first surface layer not yet cuts the schematic diagram of openwork part；
Fig. 5 is individual embodiment in present example, the schematic diagram after first surface layer is cut and rejects openwork part；
Fig. 6 is IC module position sections in present example（Not yet cut and openwork part of draining）Schematic diagram.
Fig. 7 is present example IC module position sections（It is cleaved to fall openwork part side by side）Schematic diagram.
Label declaration in figure：
10. 11. second surface layer material of first surface layer material, 12. positive printing layer 13.IC module protection layers
14. the covering material part 24. of 22. hollow out gap of back up layer 20. pierced pattern, 21. tie point 23. is engraved
The IC module protections of 25. hollow out gap 50. protection hole of inward flange 30.IC 40. card bases of module of empty gap outward flange 51.
Glue hole
Embodiment
In order that the technical means, the inventive features, the objects and the advantages of the present invention are easy to understand, tie below
Close specific embodiment and the present invention is expanded on further.
Referring to Fig. 7, a kind of IC smart cards, including card base 40, T-shaped IC modules 30 and first surface layer material 10, card base 40
On be provided with IC modules hole, and IC module sizes are corresponding with the IC modules hole, after IC modules are arranged in IC modules hole, IC moulds
Block surface 10 is equal with card primary surface.First surface layer material is covered on card primary surface, and is set on first surface layer material
There is the hollow hole corresponding with IC modules.The thickness of first surface layer material is not more than 0.15mm.The cup depth of IC modules, can
Adjusted by the thickness of first surface layer material, the first surface layer material of different-thickness, it is deep that IC modules depression can be produced
Spend different IC smart cards.
In the present embodiment, card base includes positive printing layer 12, IC module protections layer 13, back up layer 14, the second table
Surface material 11.
Referring to Fig. 1-6, the production method of the IC smart cards comprises the following steps：
Step 1：Protection hole is gone out in positive printing layer 12, for being enclosed on IC modules（T-shaped）Top, and front print
The thickness of brush layer and the consistency of thickness on IC modules top.
Step 2：IC module protection glue hole is gone out on IC module protections layer 13, for entangling IC modules bottom Protection glue；
The thickness of IC module protection layers and IC modules bottom Protection glue consistency of thickness.
Step 3：According to the size of IC modules on first surface layer material 10, the hollow out corresponding with hollow hole is gone out
Pattern 20, as shown in Figure 1.First surface layer material selects the transparent PVC film of 0.05mm thickness.Pierced pattern includes engraving for interruption
Empty gap 22 and the covering material part 23 that defines is surrounded by hollow out gap；If the reservation involvement of covering material part 23
Contact 21, covering material part are connected by the tie point with the remainder of first surface layer material.Outside hollow out gap
The size of edge 24 is more than or equal to IC module sizes, and the size of hollow out gap outward flange 25 is less than the size of IC modules.
Step 4：Positive printing layer 12, IC module protections layer 13, back up layer 14 and second surface layer material 11 are pressed
It is stapled according to order, IC modules are inserted in IC modules hole, and it is tentatively fixed.Keep T-shaped IC Modular surfaces and positive printing layer
Surface is equal.If IC modules are double interface modules, also need to the pad in IC modules 30, and on IC module protections layer 13
Antenna be electrically connected.
Step 5：First surface layer material is covered in card primary surface so that pierced pattern and IC modules 30 can be one a pair
Should, as shown in Figure 4.
Step 6：Stapled material is put into laminating machine and heats pressurization, an obtained card matrix material greatly is rushed again
Card, obtains individual IC smart card.
Step 7：Pass through etching laser machining（Can also or cutting knife cutting disconnected using milling cutter milling）, by first surface layer material
The tie point 21 of pierced pattern covering material part blow；And vacuum withdraw device is used, engraved what is remained above IC modules
Null pattern covering material part 23 removes, and hollow hole is formed, so as to expose IC modules.
So far, contact IC smart cards or the production of double interface I C smart cards finish.
Certainly, card base can also be the good monoblock type card base of hot pressing, and IC modules hole is processed on the card base, and will
IC modules are fixed on IC modules hole, then insert IC modules in IC modules hole, and tentatively fixed, the first surface that will be processed
Layer material is covered in the surface of positive printing layer, and make it that pierced pattern is corresponding with IC modules；Then hot pressing is carried out again, is obtained
To individual IC smart card；The tie point of the covering material part not being broken completely of pierced pattern is blocked；By above IC modules
The covering material part of the pierced pattern of residual removes, and hollow hole is formed, so as to expose IC modules.
In the present invention, the difference in height on IC Modular surfaces and card body surface is the thickness of first surface layer material, is come relatively
Say it is a fixed value, when producing the IC smart cards of same model, because the thickness of the first surface layer material of same model is inclined
Poor very little, so the cup depth of IC modules is controllable, deviation very little.
General principle, principal character and the advantages of the present invention of the present invention has been shown and described above.The technology of the industry
For personnel it should be appreciated that the present invention is not limited to the above embodiments, that described in above-described embodiment and specification is the present invention
Principle, various changes and modifications of the present invention are possible without departing from the spirit and scope of the present invention, these change and
Improvement is both fallen within the range of claimed invention.The protection domain of application claims by appended claims and its
Equivalent defines.
Claims (6)
- A kind of 1. method for producing IC smart cards, it is characterised in that comprise the following steps,A, protection hole is gone out in positive printing layer, for being enclosed on the top of T-shaped IC modules；B, IC module protection glue hole is gone out on IC module protection layers, for entangling T-shaped IC modules bottom Protection glue；C, it is positive printing layer, IC module protections layer, back up layer and second surface layer material is stapled in sequence, now Protection hole, the combination of IC module protection glue hole form IC modules hole；Then T-shaped IC modules are inserted in IC modules hole and fixed, guarantor It is equal with front printing layer surface to hold T-shaped IC Modular surfaces；D, first surface layer material goes out the pierced pattern corresponding with IC modules hole according to the size of T-shaped IC modules front surface, The pierced pattern includes the covering material part not being broken completely, and the covering material part only retains some tie points, covers Material part is connected by the tie point with the remainder of first surface layer material；E, first surface layer material is covered in card primary surface, and make it that pierced pattern is corresponding with IC modules；F, and then hot pressing and punching card are carried out, obtains individual IC smart card；G, the tie point of the covering material part not being broken completely of pierced pattern is blocked；By residual above T-shaped IC modules The covering material part of pierced pattern removes, and hollow hole is formed, so as to expose the front surface of T-shaped IC modules.
- 2. the method for production IC smart cards according to claim 1, it is characterised in that if IC modules are double interface modules, Then before step E, it is also necessary to which the pad in IC modules and the antenna on card base are electrically connected.
- 3. the method for production IC smart cards according to claim 1, it is characterised in that pierced pattern includes the hollow out of interruption Gap and the covering material part that defines is surrounded by hollow out gap；The physical dimension in the hollow out gap is more than or equal to IC moulds Block size, inner dimensions are less than the size of IC modules.
- 4. the method for production IC smart cards according to claim 1, it is characterised in that the pierced pattern covering material portion The tie point method for cutting divided, can be laser ablation, milling cutter milling is disconnected or cutting knife is cut.
- 5. the method for production IC smart cards according to claim 1, it is characterised in that in step, positive printing layer is Some layer materials are superimposed together, to ensure that the depth of protection hole is identical with the thickness of the top half of IC modules.
- 6. the method for production IC smart cards according to claim 1, it is characterised in that in stepb, IC module protection layers For the IC module protection layers being made up of some layer materials, its thickness and IC modules bottom Protection glue consistency of thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310203142.3A CN103246913B (en) | 2013-05-28 | 2013-05-28 | A kind of method for producing IC smart cards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310203142.3A CN103246913B (en) | 2013-05-28 | 2013-05-28 | A kind of method for producing IC smart cards |
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| Publication Number | Publication Date |
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| CN103246913A CN103246913A (en) | 2013-08-14 |
| CN103246913B true CN103246913B (en) | 2018-04-03 |
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| CN201310203142.3A Active CN103246913B (en) | 2013-05-28 | 2013-05-28 | A kind of method for producing IC smart cards |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5888624A (en) * | 1994-02-04 | 1999-03-30 | Giesecke & Devrient Gmbh | Data carrier with an electronic module and a method for producing the same |
| CN102063631A (en) * | 2010-12-22 | 2011-05-18 | 上海浦江智能卡***有限公司 | Method for manufacturing intelligent card with double-interface chip |
| CN102073898A (en) * | 2010-12-22 | 2011-05-25 | 上海浦江智能卡***有限公司 | Manufacturing method for dual-interface smart card INLAY |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009545801A (en) * | 2006-08-01 | 2009-12-24 | マイクロ−ディー リミテッド | Method for making a smart card, a smart card made by this method, and an LCD specifically for use with such a smart card |
-
2013
- 2013-05-28 CN CN201310203142.3A patent/CN103246913B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5888624A (en) * | 1994-02-04 | 1999-03-30 | Giesecke & Devrient Gmbh | Data carrier with an electronic module and a method for producing the same |
| CN102063631A (en) * | 2010-12-22 | 2011-05-18 | 上海浦江智能卡***有限公司 | Method for manufacturing intelligent card with double-interface chip |
| CN102073898A (en) * | 2010-12-22 | 2011-05-25 | 上海浦江智能卡***有限公司 | Manufacturing method for dual-interface smart card INLAY |
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| CN103246913A (en) | 2013-08-14 |
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