CN103240230A - Non-damage detection system and method for coil outgoing line of intelligent card - Google Patents
Non-damage detection system and method for coil outgoing line of intelligent card Download PDFInfo
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- CN103240230A CN103240230A CN2013101872440A CN201310187244A CN103240230A CN 103240230 A CN103240230 A CN 103240230A CN 2013101872440 A CN2013101872440 A CN 2013101872440A CN 201310187244 A CN201310187244 A CN 201310187244A CN 103240230 A CN103240230 A CN 103240230A
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Abstract
The invention discloses a non-damage detection system and method for coil outgoing line of an intelligent card. The non-damage detection system comprises a production line, a shooting device, a data summarization processing device and a marking device, wherein the shooting device is arranged above the production line and connected with the data summarization processing device, and the marking device is connected with the data summarization processing device. According to above form, an inferior-quality product produced in the production can be effectively eliminated, and the production efficiency is improved.
Description
Technical field
The present invention relates to the REID field, particularly relate to a kind of lead-out wires of coil not damaged detection system and detection method of smart card.
Background technology
One of reliability factor that has influence on double-interface smart card is the intensity of lead-out wire, and the lead-out wire that generally has part in the process of groove milling sustains damage; At present in order to detect the damage of this lead-out wire, the technology that adopts generally is that video detection adds manual identified now, the photo of each lead-out wire that is taken by the real-time monitoring camera of operating personnel, thus find to have the lead-out wire of damage; But there is a great hidden danger in this method: the working experience and the professional quality that rely on the operating personnel fully; If a new operating personnel or this operating personnel since continuous operation fatigue cause and can't will have the lead-out wire of damage to identify, thereby cause the next procedure that circulates of defective product.When finally doing reliability testing and pinpoint the problems, caused the product rejection of property in batches; Because production efficiency is limited by manual identified, reduced the batch manufacturing feasibility of product greatly simultaneously.So there are the following problems for prior art: can't detect all defective substandard products accurately when being operated by new operating personnel; Can produce visual fatigue when the operating personnel works continuously, cause the defective substandard products to omit next procedure; Be subjected to personnel's restriction and can't form large-scale batch process.
Summary of the invention
At above-mentioned deficiency of the prior art, main purpose of the present invention provides a kind of lead-out wires of coil not damaged detection system and detection method of smart card, can be in process of production, comparing by system has solved the substandard products that human factor causes completely, and solves production efficiency problem.
For achieving the above object, the technical solution used in the present invention is: a kind of lead-out wires of coil not damaged detection system of smart card, comprise: production line, camera arrangement, data aggregation process device, labelling apparatus, described camera arrangement places described production line top, described camera arrangement connects described data aggregation process device, and described labelling apparatus connects described data aggregation process device.
A kind of detection method of lead-out wires of coil not damaged detection system of smart card comprises the steps:
All lead-out wires of coil that damage is arranged that step 1, collection have occurred in producing are taken pictures by camera arrangement, and information is deposited in the data aggregation process device as defective products comparison sample; The non-defective unit of lead-out wires of coil is taken pictures by camera arrangement, and information is deposited in the data aggregation process device as standard sample;
Step 2, is in process of production taken pictures to the lead-out wires of coil of each smart card lead-in wire, and real-time defective products comparison sample and standard sample with in the data aggregation process device are compared; Judge by the automatic comparison of data aggregation process device whether this lead-out wires of coil has damage;
The next procedure that circulates of step 3, the lead-out wires of coil non-defective unit that data aggregation process device was compared; The lead-out wires of coil that damage is arranged that data aggregation process device was compared is labeled as substandard products by labelling apparatus, rejects from production line.
The root that has problems of the prior art is defective and the damage of identifying and judging lead-out wire by the operating personnel, is vulnerable to the influence of each side in this process.And the present invention claps into digital photos with defect shape and the lead-out wires of coil non-defective unit of lead-out wires of coil after all groove millings earlier, and these digital photos are deposited in the data aggregation process device; The real-time in process of production lead-out wires of coil with each product is clapped into digital photos, is compared by data aggregation process device, and the lead-out wires of coil that the contrast back is good flows into next procedure, and the lead-out wires of coil of defective is done substandard products sign back and rejected.
The invention has the beneficial effects as follows: the present invention can be in process of production, and comparing by system has solved the substandard products that human factor causes completely, and the bad part eject that will produce in effectively will producing is enhanced productivity.
Description of drawings
Fig. 1 is the operating procedure schematic diagram of detection method of the lead-out wires of coil not damaged detection system of smart card of the present invention.
The specific embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present invention is described in detail, thereby so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that protection scope of the present invention is made more explicit defining.
See also Fig. 1, the embodiment of the invention: a kind of lead-out wires of coil not damaged detection system of smart card, comprise: production line, camera arrangement, data aggregation process device, labelling apparatus, described camera arrangement places described production line top, described camera arrangement connects described data aggregation process device, and described labelling apparatus connects described data aggregation process device.
The detection method of the lead-out wires of coil not damaged detection system of the described smart card of present embodiment comprises the steps:
All lead-out wires of coil that damage is arranged that step 1, collection have occurred in producing are taken pictures by camera arrangement, and information is deposited in the data aggregation process device as defective products comparison sample; The non-defective unit of lead-out wires of coil is taken pictures by camera arrangement, and information is deposited in the data aggregation process device as standard sample;
Step 2, is in process of production taken pictures to the lead-out wires of coil of each smart card lead-in wire, and real-time defective products comparison sample and standard sample with in the data aggregation process device are compared; Judge by the automatic comparison of data aggregation process device whether this lead-out wires of coil has damage;
The next procedure that circulates of step 3, the lead-out wires of coil non-defective unit that data aggregation process device was compared; The lead-out wires of coil that damage is arranged that data aggregation process device was compared is labeled as substandard products by labelling apparatus, rejects from production line.
The above only is embodiments of the invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (2)
1. the lead-out wires of coil not damaged detection system of a smart card, it is characterized in that, comprise: production line, camera arrangement, data aggregation process device, labelling apparatus, described camera arrangement places described production line top, described camera arrangement connects described data aggregation process device, and described labelling apparatus connects described data aggregation process device.
2. the detection method of the lead-out wires of coil not damaged detection system of smart card according to claim 1 is characterized in that, comprises the steps:
All lead-out wires of coil that damage is arranged that step 1, collection have occurred in producing are taken pictures by camera arrangement, and information is deposited in the data aggregation process device as defective products comparison sample; The non-defective unit of lead-out wires of coil is taken pictures by camera arrangement, and information is deposited in the data aggregation process device as standard sample;
Step 2, is in process of production taken pictures to the lead-out wires of coil of each smart card lead-in wire, and real-time defective products comparison sample and standard sample with in the data aggregation process device are compared; Judge by the automatic comparison of data aggregation process device whether this lead-out wires of coil has damage;
The next procedure that circulates of step 3, the lead-out wires of coil non-defective unit that data aggregation process device was compared; The lead-out wires of coil that damage is arranged that data aggregation process device was compared is labeled as substandard products by labelling apparatus, rejects from production line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101872440A CN103240230A (en) | 2013-05-20 | 2013-05-20 | Non-damage detection system and method for coil outgoing line of intelligent card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2013101872440A CN103240230A (en) | 2013-05-20 | 2013-05-20 | Non-damage detection system and method for coil outgoing line of intelligent card |
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| CN103240230A true CN103240230A (en) | 2013-08-14 |
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| CN2013101872440A Pending CN103240230A (en) | 2013-05-20 | 2013-05-20 | Non-damage detection system and method for coil outgoing line of intelligent card |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104900555A (en) * | 2015-04-29 | 2015-09-09 | 海太半导体（无锡）有限公司 | Semiconductor encapsulation testing device |
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| JPH02248845A (en) * | 1989-03-22 | 1990-10-04 | Kyodo Printing Co Ltd | Card surface defect inspecting device |
| CN101403708A (en) * | 2008-10-31 | 2009-04-08 | 广东正业科技有限公司 | External appearance defect examination method for circuit board |
| CN201225985Y (en) * | 2008-06-02 | 2009-04-22 | 天津杰普智能卡有限公司 | Vision sensing system for checking card appearance |
| CN101996405A (en) * | 2010-08-30 | 2011-03-30 | 中国科学院计算技术研究所 | Method and device for rapidly detecting and classifying defects of glass image |
| JP2012026908A (en) * | 2010-07-26 | 2012-02-09 | Kyodo Printing Co Ltd | Defect inspection method and defect inspection device |
| CN102637258A (en) * | 2012-04-01 | 2012-08-15 | 首钢总公司 | Method for creating online surface quality detection system defect library |
| CN102866166A (en) * | 2012-09-20 | 2013-01-09 | 天津嘉乐惠电子科技有限公司 | Automatic optic detecting system and method |
| CN102935430A (en) * | 2011-08-15 | 2013-02-20 | 东莞市锐祥智能卡科技有限公司 | Smart card automatic sorting equipment |
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2013
- 2013-05-20 CN CN2013101872440A patent/CN103240230A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02248845A (en) * | 1989-03-22 | 1990-10-04 | Kyodo Printing Co Ltd | Card surface defect inspecting device |
| CN201225985Y (en) * | 2008-06-02 | 2009-04-22 | 天津杰普智能卡有限公司 | Vision sensing system for checking card appearance |
| CN101403708A (en) * | 2008-10-31 | 2009-04-08 | 广东正业科技有限公司 | External appearance defect examination method for circuit board |
| JP2012026908A (en) * | 2010-07-26 | 2012-02-09 | Kyodo Printing Co Ltd | Defect inspection method and defect inspection device |
| CN101996405A (en) * | 2010-08-30 | 2011-03-30 | 中国科学院计算技术研究所 | Method and device for rapidly detecting and classifying defects of glass image |
| CN102935430A (en) * | 2011-08-15 | 2013-02-20 | 东莞市锐祥智能卡科技有限公司 | Smart card automatic sorting equipment |
| CN102637258A (en) * | 2012-04-01 | 2012-08-15 | 首钢总公司 | Method for creating online surface quality detection system defect library |
| CN102866166A (en) * | 2012-09-20 | 2013-01-09 | 天津嘉乐惠电子科技有限公司 | Automatic optic detecting system and method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104900555A (en) * | 2015-04-29 | 2015-09-09 | 海太半导体（无锡）有限公司 | Semiconductor encapsulation testing device |
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Application publication date: 20130814 |