CN103236486B - Led封装方法、封装结构及使用该封装结构的led灯 - Google Patents
Led封装方法、封装结构及使用该封装结构的led灯 Download PDFInfo
- Publication number
- CN103236486B CN103236486B CN201310139480.5A CN201310139480A CN103236486B CN 103236486 B CN103236486 B CN 103236486B CN 201310139480 A CN201310139480 A CN 201310139480A CN 103236486 B CN103236486 B CN 103236486B
- Authority
- CN
- China
- Prior art keywords
- encapsulation
- led
- line
- glue
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005538 encapsulation Methods 0.000 title claims abstract description 110
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000003292 glue Substances 0.000 claims abstract description 8
- 241000218202 Coptis Species 0.000 claims description 17
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 17
- 238000009413 insulation Methods 0.000 claims description 11
- 238000004806 packaging method and process Methods 0.000 claims description 11
- 239000004033 plastic Substances 0.000 claims description 11
- 125000006850 spacer group Chemical group 0.000 claims description 11
- 239000011230 binding agent Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 238000005253 cladding Methods 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000009477 glass transition Effects 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 230000008901 benefit Effects 0.000 abstract description 5
- 239000007767 bonding agent Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 238000012856 packing Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18165—Exposing the passive side of the semiconductor or solid-state body of a wire bonded chip
Landscapes
- Led Device Packages (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310139480.5A CN103236486B (zh) | 2013-04-22 | 2013-04-22 | Led封装方法、封装结构及使用该封装结构的led灯 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310139480.5A CN103236486B (zh) | 2013-04-22 | 2013-04-22 | Led封装方法、封装结构及使用该封装结构的led灯 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103236486A CN103236486A (zh) | 2013-08-07 |
CN103236486B true CN103236486B (zh) | 2017-04-26 |
Family
ID=48884515
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310139480.5A Active CN103236486B (zh) | 2013-04-22 | 2013-04-22 | Led封装方法、封装结构及使用该封装结构的led灯 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103236486B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107611077B (zh) * | 2017-09-21 | 2020-02-21 | 深圳市环基实业有限公司 | 一种ic封装处理装置以及处理方法 |
CN110739277A (zh) * | 2019-09-11 | 2020-01-31 | 珠海格力电器股份有限公司 | 一种封装结构及其制造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1534803A (zh) * | 1996-06-26 | 2004-10-06 | ��˹��ķ�����а뵼��ɷ��������Ϲ� | 具有发光变换元件的发光半导体器件 |
CN202142578U (zh) * | 2011-06-22 | 2012-02-08 | 郑州光维新电子有限公司 | 大功率led灯银基健合丝封装结构 |
CN102751423A (zh) * | 2011-04-21 | 2012-10-24 | 三星Led株式会社 | 发光器件封装件及其制造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6821821B2 (en) * | 1996-04-18 | 2004-11-23 | Tessera, Inc. | Methods for manufacturing resistors using a sacrificial layer |
DE102006033701B4 (de) * | 2006-07-20 | 2012-02-23 | Infineon Technologies Ag | Herstellungsverfahren für ein elektronisches Bauelement in VQFN-Bauweise |
KR100999746B1 (ko) * | 2009-02-17 | 2010-12-08 | 엘지이노텍 주식회사 | 발광 디바이스 패키지 및 그 제조방법 |
JP5035356B2 (ja) * | 2010-01-26 | 2012-09-26 | 株式会社デンソー | 樹脂封止型電子装置およびその製造方法 |
-
2013
- 2013-04-22 CN CN201310139480.5A patent/CN103236486B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1534803A (zh) * | 1996-06-26 | 2004-10-06 | ��˹��ķ�����а뵼��ɷ��������Ϲ� | 具有发光变换元件的发光半导体器件 |
CN102751423A (zh) * | 2011-04-21 | 2012-10-24 | 三星Led株式会社 | 发光器件封装件及其制造方法 |
CN202142578U (zh) * | 2011-06-22 | 2012-02-08 | 郑州光维新电子有限公司 | 大功率led灯银基健合丝封装结构 |
Also Published As
Publication number | Publication date |
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CN103236486A (zh) | 2013-08-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170123 Address after: The Lake District of Xiamen City, Fujian province 361010 Fang Hubei two road 1511, 7 floor 701 unit Applicant after: XIAMEN LEEDARSON LIGHTING GROUP Co.,Ltd. Address before: 363999 Xingda Road, Fujian city of Zhangzhou province Changtai Xingtai County Development Zone Applicant before: LEEDARSON LIGHTING Co.,Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190731 Address after: 363999 Fujian city of Zhangzhou province Changtai Xingtai County Development Zone Patentee after: Zhangzhou Alpha Photoelectric Technology Co.,Ltd. Address before: The Lake District of Xiamen City, Fujian province 361010 Fang Hubei two road 1511, 7 floor 701 unit Patentee before: XIAMEN LEEDARSON LIGHTING GROUP Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20231101 Address after: 363999 Xingtai Industrial Park, Changtai County Economic Development Zone, Zhangzhou City, Fujian Province Patentee after: LEEDARSON LIGHTING Co.,Ltd. Address before: 363999 Xingtai Development Zone, Changtai County, Zhangzhou City, Fujian Province Patentee before: Zhangzhou Alpha Photoelectric Technology Co.,Ltd. |