CN1032263A - Solid aluminium electrolytic capacitor and manufacture method thereof - Google Patents
Solid aluminium electrolytic capacitor and manufacture method thereof Download PDFInfo
- Publication number
- CN1032263A CN1032263A CN 88106531 CN88106531A CN1032263A CN 1032263 A CN1032263 A CN 1032263A CN 88106531 CN88106531 CN 88106531 CN 88106531 A CN88106531 A CN 88106531A CN 1032263 A CN1032263 A CN 1032263A
- Authority
- CN
- China
- Prior art keywords
- capacitor
- manufacture method
- core bag
- capacitor core
- foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
A kind of aluminum foil type solid electrolytic capacitor, the distance between the two-layer aluminium foil of its capacitor are between 10 to 60 microns, and the electrolyte in the capacitor core bag is immersed in thermal decomposition, forms solid electrolyte between two-layer aluminium foil.
The manufacture method of aluminum foil type solid electrolytic capacitor, in temperature be between 200 to 260 ℃, the time is that the electrolyte that is added with the manganese dioxide fine powder with thermal decomposition under the condition between 20 to 40 minutes forms dielectric substrate, mix lithium or electricity consumption chemical reaction process in the dielectric substrate and repair pellumina.
The manufacture method of chip lithium solid electrolytic capacitor, with near the fixing center in the enclosure of capacitor core bag, perhaps the metal shell of the capacitor core bag the lead-in wire and the capacitor core bag of packing into is connected into and is electrically connected with resin.
Description
The present invention relates to a kind of solid aluminium electrolytic capacitor and manufacture method thereof.
Common solid electrolytic capacitor is made like this, promptly be 10 to 100 microns atomized aluminium or analog with particle diameter, sinter cylinder or sintered sheets into, and sintered body in being the electrochemical reaction solution of weak acid, main component carried out anodization, make the sintered body surface form oxide-film, the thermal decomposition manganese nitrate forms manganese dioxide (solid electrolyte) on oxide-film then.But this solid electrolytic capacitor is not convoluted, thereby is difficult to make large value capacitor.In order to make the capacitor with larger capacity, it is bigger that the size of capacitor just becomes, and cost can not be satisfactory.
Recommended another kind of solid dry-type electrolytic capacitor, constitute the anode and the negative electrode of capacitor with aluminium foil or tantalum paper tinsel, and make it to carry out electrochemical reaction etching and processing, between anode foils of passing through electrochemical treatments and Cathode Foil, insert barrier paper, be wound into the capacitor core bag then, make the manganese nitrate thermal decomposition of immersing in the capacitor core bag, make and form manganese dioxide (referring to the open NO.33-5177 of Japan Patent) on anode foils and the Cathode Foil.The impedance operator of this class capacitor is higher than 500kH in frequency range
ZThe time bad especially, and the volume of this class capacitor must become greatly, thus it is practical that this capacitor is difficult to.
The purpose of this invention is to provide a kind of solid aluminium electrolytic capacitor that under high frequency, has the good resistance characteristic.
Another object of the present invention is that a kind of solid aluminium electrolytic capacitor that reduces the leakage conductance electric current is provided.
The present invention also has a purpose to be, a kind of manufacture method that has the solid aluminium electrolytic capacitor of good resistance characteristic under high frequency is provided.
Another object of the present invention is that a kind of manufacture method with solid aluminium electrolytic capacitor of high moisture resistance is provided.
A further object of the invention is that a kind of manufacture method with chip solid aluminium electrolytic capacitor of fine practicality and high qualification rate is provided.
In order to achieve the above object, provide a kind of according to solid aluminium electrolytic capacitor of the present invention, it comprises that one deck has the anode foils of oxide-film on its surface, one deck Cathode Foil, with the separator of isolating anode aluminium foil and cathode aluminum foil, two-layer aluminium foil and separator are wound into the capacitor core bag, and the distance between the two-layer aluminium foil of being determined by separation layer thickness in the capacitor remains between 10 to 60 microns, and the electrolyte that thermal decomposition is immersed in the capacitor core bag forms solid electrolyte between two-layer aluminium foil.
According to the present invention, a kind of manufacture method of solid aluminium electrolytic capacitor also is provided, technical process comprises: (a) one deck anode aluminium foil, one deck cathode aluminum foil and the separator between them are wound into the capacitor core bag together, (b) dipping manganese nitrate electrolyte in the capacitor core bag, (c) in temperature be between 200 ℃ to 260 ℃, time thermal decomposition electrolyte under the condition between 20 to 40 minutes, between electrode foil, form the manganese dioxide solid electrolyte layer.
According to the present invention, the another kind of manufacture method of solid aluminium electrolytic capacitor is provided, technical process comprises: (a) one deck anode aluminium foil, one deck cathode aluminum foil are wound into the capacitor core bag with the separator of isolating anode aluminium foil and cathode aluminum foil, (b) in the capacitor core bag, flood the manganese nitrate electrolyte that is added with the manganese dioxide fine powder, (c) between electrode foil, form solid electrolyte layer with the thermal decomposition method of electrolyte.
According to the present invention, a kind of manufacture method of solid aluminium electrolytic capacitor also is provided, technical process comprises: (a) one deck anode aluminium foil, one deck cathode aluminum foil are wound into the capacitor core bag with the separator of isolating anode aluminium foil and cathode aluminum foil, and the distance between the said aluminium foil remains between 10 to 60 microns, (b) dipping manganese nitrate electrolyte in the capacitor core bag, (c) electrolyte of thermal decomposition immersion, between said aluminium foil, form solid electrolyte layer, (d) in said solid electrolyte layer, mix lithium.
According to the present invention, the another kind of manufacture method of solid aluminium electrolytic capacitor is provided, its operation comprises: (a) with one deck anode aluminium foil, one deck cathode aluminum foil is wound into the capacitor core bag with the separator of isolating said anode aluminium foil and cathode aluminum foil, (b) dipping manganese nitrate electrolyte in the capacitor core bag, (c) thermal decomposition electrolyte, between electrode foil, form the manganese dioxide solid electrolyte layer, (d) before the formation solid electrolyte is finished, carrying out electrochemical reaction in weak acid solution once more handles, so that the broken parts of oxide-film on the reparation aluminium foil, (e) in the capacitor core bag, flood the manganese nitrate solution that is added with carbon dust, form manganese dioxide layer once more, (f) dipping is added with the manganese nitrate solution of carbon dust, institute adds the carbon dust amount greatly more than forming the manganese dioxide operation once more with added carbon dust amount in the manganese nitrate solution in this moment manganese nitrate solution, then with the carbon roasting on solid electrolyte layer.
According to the present invention, a kind of manufacture method of solid electrolytic capacitor also is provided, its operation comprises: (a) one deck anode aluminium foil, one deck cathode aluminum foil are wound into the capacitor core bag with the separator of isolating said anode aluminium foil and cathode aluminum foil, (b) thermal decomposition electrolyte, between electrode foil, form solid electrolyte layer, (c) add an amount of resin at the bottom of the shell that the capacitor core bag is fixed on opening that is, (d) capacitor core is packaged in the shell, (f) capsule mouth makes its sealing with a certain amount of same resin in addition.
According to the present invention, the manufacture method of another kind of solid aluminium electrolytic capacitor is provided, the operation that comprises has: (a) with one deck anode aluminium foil, one deck cathode aluminum foil is wound into the capacitor core bag with the separator of isolating said anode aluminium foil and cathode aluminum foil, said each layer aluminium foil all has the good lead-in wire of a root bead, (b) between said aluminium foil, form solid electrolyte layer, (c) the capacitor core bag is put into the metal shell of opening, (d) inner surface with metal shell in will going between with a kind of bonding agent makes and is electrically connected, and (e) with insulating resin metal shell is sealed.
Other purposes of the present invention and advantage, the accompanying drawing with reference to most preferred embodiment of the present invention will describe it in detail below.
In the accompanying drawing:
Fig. 1 is the capacitor manufacturing process FB(flow block) according to first most preferred embodiment of the present invention;
Fig. 2 is the perspective view according to solid aluminium electrolytic capacitor of the present invention;
Fig. 3 (a) and 3(b) be respectively capacitor divide the core to wrap in behind the dipping process and roasting after the schematic sectional view that amplified;
Fig. 4 is the impedance characteristic figure according to the capacitor of first most preferred embodiment manufacturing of the present invention;
Fig. 5 is according to the capacitance of first most preferred embodiment capacitor of the present invention curve chart with frequency change;
Fig. 6 is the impedance characteristic figure according to first most preferred embodiment capacitor of the present invention;
Fig. 7 is the manufacturing process flow block diagram according to second most preferred embodiment capacitor of the present invention;
Fig. 8 (a) and 8(b) be respectively the constructed profile that capacitor divides after the core bag dipping and roasting has been amplified afterwards;
Fig. 9 is the impedance frequency characteristic curve chart according to the capacitor of second most preferred embodiment manufacturing of the present invention;
Figure 10 is the manufacturing process flow block diagram according to the 3rd most preferred embodiment capacitor of the present invention;
Figure 11 is the impedance frequency characteristic curve chart according to the capacitor of the 3rd most preferred embodiment manufacturing of the present invention;
Figure 12 is the manufacturing process flow block diagram according to the 4th most preferred embodiment capacitor of the present invention;
Figure 13 is the impedance frequency characteristic curve chart according to the capacitor of the 4th most preferred embodiment manufacturing of the present invention;
Figure 14 is the manufacturing process flow block diagram according to the capacitor of the 5th most preferred embodiment of the present invention;
Figure 15 (a) and 15(b) be respectively perspective view according to chip capacitor of the present invention;
Figure 16 is the perspective view according to another kind of chip capacitor of the present invention;
Figure 17 (a) and 17(b) be respectively perspective view and front view according to another chip capacitor of the present invention;
Figure 18 (a) 18(b) be respectively perspective view and end-view according to another kind of chip capacitor of the present invention;
Figure 19 (a) and 19(b) be respectively perspective view and end-view according to another chip capacitor of the present invention;
Figure 20 (a) and 20(b) be respectively perspective view and end view according to another kind of chip capacitor of the present invention;
Figure 21 is the sectional view according to another kind of capacitor of the present invention;
Figure 22,23,24 and 25 is respectively the capacitor sectional view of the various lead wire connection method that provide according to the present invention.
Referring now to accompanying drawing,, the appropriate section of same numbers representative in whole accompanying drawings that marks in the accompanying drawing, Fig. 1 provides the manufacture method FB(flow block) according to a kind of solid aluminium electrolytic capacitor of first most preferred embodiment of the present invention, and Fig. 2 illustrates according to first most preferred embodiment of the present invention and makes the structure that male elaborate terpene has enough scape 0.
At first, the aluminium foil 1 and 2 of high-purity (99.99% or higher) through etching processing, carries out electrochemically cleaning to aluminium foil in etching process S1, so that increase effective surface area.Then in the 2nd procedure S2, in electrolyte, carry out electrochemical treatments (electrochemical reaction processing), form oxide-film (aluminum oxide film) 1a on two surfaces of layer of aluminum film.With the aluminium foil of handling through over etching and electrochemical reaction 1 as anode foils 1, and another layer only through the aluminium foil 2 of over etching as the Cathode Foil 2 staggered relatively with anode foils 1, two-layer Manila paper is placed between paper tinsel 1 and the paper tinsel 2 as separator 3 respectively and is placed on another surface of Cathode Foil 2.Then in coiling operation S3 with the paper tinsel 1 that is stacked together and 2 and separator 3 do cylindrical roll around, make capacitor core bag 10 as shown in Figure 2.Standard digital 4,6 and 5,7 is represented aluminum lead and the lead-out wire that is connected 4,6 respectively. Aluminum lead 4,6 is connected respectively to aluminium foil 1,2 after electrochemical reaction is handled.
Then, the capacitor core bag 10 usefulness manganese nitrate solutions 8 that constitute are like this carried out impregnation process, the schematic diagram shown in Fig. 3 (a).The manganese nitrate solution 8 of separator 3 both sides interconnects by separator 3.Then capacitor core bag 10 is heated thermal decomposition manganese nitrate and deposit solid electrolyte manganese dioxide layer 9, the schematic diagram shown in Fig. 3 (b) in air.In operation S4, dipping operation and pyrolosis operation are carried out several times repeatedly, form fine and close manganese dioxide layer 9.Manganese dioxide layer 9 on Manila paper 3 two sides interconnects by separator 3.Be dispersed among graphite (carbon) the powder immersion manganese dioxide layer 9a and the space between the Cathode Foil 2 in the manganese nitrate solution, carbon-coating (not drawing) roasting is on dielectric substrate.Then carry out electrochemical treatments in electrolyte, so that make because the oxide-film damage that formation manganese dioxide layer 9 carries out causing in the thermal decomposition process obtains repairing, this operation that forms is again finished in the 5th procedure S5 usually.Forming to handle to make the leakage conductance electric current obviously reduce again.In the 6th procedure S6, the capacitor core bag of making in this way is with in the resin-cast or the aluminum metal case of packing into, or in the resin enclosure of packing into, seals with the such encapsulant of epoxy resin then, and capacitor core is packed into capacitor.
In this capacitor arrangement, separator 3 prevents anode foils 1 and Cathode Foil 2 Mechanical Contact mutually, and a layer paper tinsel separates by constant distance, prevents the short circuit of two-layer utmost point paper tinsel, and guarantees under high pressure not breakdown.In addition, the present inventor also finds, the thickness of separator is to the very big influence that is formed with of the main manganese dioxide layer that plays cathodic process.The present invention determines between paper tinsel 1 and the paper tinsel 2 the suitably method of distance with the thickness of separator 3, to scheme to improve impedance operator, just is based on such fact.
Fig. 4 has provided the impedance frequency characteristic curve chart of the capacitor of making by first kind of most preferred embodiment, and as the function of separation layer thickness, the static capacity of this capacitor is 1 microfarad (μ f), and rated voltage is 16 volts.Curve 4A, 4B, 4C, 4D and 4E among Fig. 4 is respectively the capacitor of 10,30,50,60 and 100 microns (μ m) corresponding to separation layer thickness, and as shown in Figure 4, along with the reduction of separation layer thickness, it is good more that the impedance frequency characteristic of capacitor becomes.But the actual separation layer thickness that uses is that 100 microns capacitor has high impedance, because its impedance is greater than 10 ohm when 1 megahertz.On the contrary, another kind of separation layer thickness is 60 microns a capacitor, its impedance at 1 megahertz to being lower than 1 ohm, therefore very suitable.
Fig. 5 has provided solid aluminium electrolytic capacitor at 0.1kH
ZThe time static capacity rate of change frequency characteristic, each capacitor volume is 1 μ f, rated voltage is 16 volts, function as separation layer thickness, 5A to 5E in the curve is respectively 10,30,50,60 and 100 microns capacitor corresponding to separation layer thickness, as shown in Figure 5, when the upper frequency, along with the frequency characteristic of the reduction static capacity rate of change of separation layer thickness keeps good.For separation layer thickness is 100 microns capacitor, at 10kH
ZUnder near the frequency, the static capacity rate of change increases rapidly, makes the actual use difficulty of its capacitor.On the contrary, separation layer thickness reaches 60 microns another kind of capacitor, and the static capacity change rate curve that is had little by little has increase slightly, does not therefore have any problem in actual use.
Fig. 6 shows the impedance operator of the solid aluminium electrolytic capacitor of making according to first kind of most preferred embodiment of the present invention, the impedance operator of the ordinary capacitor that compares with it of having drawn simultaneously.Curve 6A is to be that 30 microns, capacitance are that 10 microfarads, rated voltage are the impedance operator of 16 volts solid aluminium electrolytic capacitor according to separation layer thickness of the present invention among Fig. 6, and curve 6B, 6C and 6D are respectively that (capacitance is 10 microfarads to common tantalum capacitor, rated voltage is 16 volts), (capacitance is 10 microfarads to common solid aluminium electrolytic capacitor, rated voltage is 10 volts) and with the impedance operator of tcnq salt as the capacitor of the common solid electrolytic capacitor of organic semi-conductor (capacitance is 10 microfarads, and rated voltage is 25 volts).As can be seen from the figure, impedance operator according to the solid aluminium electrolytic capacitor of first kind of most preferred embodiment of the present invention is better than common tantalum capacitor and solid aluminium electrolytic capacitor, especially under high frequency its impedance operator with make the organic semi-conductor solid electrolytic capacitor with tcnq salt the same good.
Table 1 has provided that (capacitance is 10 microfarads according to the solid aluminium electrolytic capacitor of first kind of most preferred embodiment of the present invention, rated voltage is 16 volts) the short circuit disqualification rate that records and the relation between the separation layer thickness, the sample number of each separation layer thickness is 50.
The data of compiling in the table 1 show, the short circuit disqualification rate reduces and increases with separation layer thickness, and disqualification rate is up to 8.26% when thickness is 5 microns, and disqualification rate is also lower than 1% when thickness is 10 microns.
According to data shown in Fig. 4 to Fig. 6 and the table 1, preferably the separation layer thickness scope of determining distance between the two-layer electrolysis paper tinsel is between 10 to 60 microns, and the best is between 30 to 60 microns.
As explained above, under high frequency, be greatly improved especially according to the impedance operator of solid aluminium electrolytic capacitor of the present invention, and can not increase the volume of capacitor, therefore, its applicable frequency is from 100kH
ZTo 10MH
Z, because therefore the manganese dioxide of this capacitor about using price as one of TCNQ price percentage can produce capacitor with low cost, the frequency characteristic that it has is good equally with the frequency characteristic of the common solid electrolytic capacitor of use organic semi-conductor.
Fig. 7 has provided the manufacturing approach craft FB(flow block) of the solid aluminium electrolytic capacitor that makes moderate progress according to the present invention's impedance frequency characteristic second kind of most preferred embodiment, its capacitance.
The manufacture method that capacitor core bag 10 usefulness are identical with first kind of most preferred embodiment is made.At first, in the 1st procedure S11, the aluminium foil of high-purity (99.99% or higher) is carried out etching processing, make the aluminium foil electrochemically cleaning, so that increase effective surface area, then in the 2nd procedure S12, in electrolyte, carry out electrochemical treatments and on a surface of layer of aluminum film, form oxide-film 1a(aluminum oxide film).Then, use the aluminium foil of handling through over etching and electrochemical reaction 1 to make anode foils 1, and only through another film 2 of over etching as the Cathode Foil 2 staggered relatively with anode foils 1, two-layer Manila paper is placed on another surface of making separator 3 and paper tinsel 2 between paper tinsel 1 and the paper tinsel 2 respectively.Then, in the 3rd procedure S13, with the paper tinsel 1 that stacks and 2 and separator 3 be wound into cylindrically, constitute capacitor core bag 10 as shown in Figure 2.
Then, capacitor core bag 10 is heat-treated, and makes the Manila paper carbonization as separator 3, forms thinner fiber and makes density reduce (operation S14).In the heat treatment, temperature is between 150 ℃ to 300 ℃, and the time is suitable between 10 to 40 minutes.Owing to carry out this heat treatment, the manganese nitrate quantity that immerses in the capacitor core bag may increase, thereby the characteristic of capacitor is improved.
Then, with capacitor core bag 10 usefulness manganese nitrates 8 impregnation process of making like this, as the schematic diagram of Fig. 8 (a).The manganese dioxide solution 8 of separator 3 ' two sides is by separator 3 ' interconnect.Then, capacitor core bag 10 heats in air, makes the manganese nitrate thermal decomposition deposition become solid electrolyte manganese dioxide layer 9, the schematic diagram shown in Fig. 8 (b).The manganese dioxide layer 9 of separator west side face is by separator 3 ' interconnect.Preface S15 constitutes fine and close manganese dioxide layer 9 repeatedly several times in dipping and the thermal decomposition.In addition, be dispersed in graphite (carbon) the powder immersion manganese dioxide layer 9 and the space between the Cathode Foil 2 in the manganese nitrate solution, carbon-coating (not shown) sintering is on dielectric substrate.Then, damage, in electrolyte, carry out electrochemical treatments, in the 6th procedure S16, finish again forming usually in order to repair to forming the heat treatment that manganese dioxide layer carries out the manganese dioxide layer 9 that thermal decomposition causes.Forming to handle to make the leakage conductance electric current significantly reduce again.In the capacitor core bag 10 usefulness resin-casts of making in this way or pack into aluminium or the similar metal shell, or in the resin enclosure of packing into, with the such bonding agent sealing of epoxy resin, capacitor core is packed into capacitor (operation S17) again.
In the manufacture method of solid aluminium electrolytic capacitor, the thermal decomposition condition of manganese nitrate is very big to the formation influence of manganese dioxide layer.If heat decomposition temperature is too low, manganese nitrate thermal decomposition meeting occurs significantly so-called " decomposing insufficient " state; If temperature is too high, manganese nitrate decomposes too many, so-called " decomposing excessively " state can occur.On the other hand, if thermal decomposition time is too short, manganese nitrate still is in and decomposes insufficient state; If the resolving time is oversize, can become " decomposing excessively " state.Insufficient or decomposition all can not obtain enough manganese dioxide layers as solid electrolyte excessively down in such decomposition, so the performance of capacitor, degenerates as tg δ or impedance meeting.
Table 2 has provided the thermal decomposition condition and capacitance is 10 microfarads, and rated voltage is the relation between 16 volts the solid aluminium electrolytic capacitor characteristic.The sample size of each test is 50.Decomposition temperature changes between 180 ℃ to 280 ℃, and the time changed between 10 to 50 minutes.The value of tg δ and impedance is respectively at 1kH in the table 2
ZAnd 100kH
ZRecord down.Value by tg δ and impedance is made an appraisal to capacitor, if tg δ less than 0.04, impedance is less than 0.4 ohm, its evaluation is good (zero); If tg δ is between 0.4 and 0.5 ohm, then be evaluated as not so good (△); If tg δ is 0.051 or bigger, impedance is 0.51 ohm or bigger, then is evaluated as bad (*).In addition, find the optimum condition decomposition temperature between 200 to 260 ℃, the resolving time is between 20 to 40 minutes.
Table 2
Temperature (℃) time (minute) tg δ impedance (Ω) evaluation
180????10????0.091????1.18????×
180????20????0.083????0.96????×
180????30????0.079????0.84????×
180????40????0.073????0.84????×
180????50????0.070????0.82????×
200????10????0.071????0.84????×
200????20????0.046????0.49????△
200????30????0.042????0.48????△
200????40????0.038????0.45????○
200????50????0.049????0.53????×
220????10????0.065????0.76????×
220????20????0.043????0.48????△
220????30????0.036????0.39????○
220????40????0.030????0.33????○
220????50????0.051????0.57????×
240????10????0.053????0.63????×
240????20????0.037????0.39????○
240????30????0.023????0.29????○
240????40????0.025????0.30????○
240????50????0.054????0.58????×
260????10????0.053????0.61????×
260????20????0.030????0.32????○
260????30????0.032????0.35????○
260????40????0.040????0.40????△
260????50????0.050????0.67????×
280????10????0.053????0.62????×
280????20????0.057????0.67????×
280????30????0.061????0.70????×
280????40????0.064????0.79????×
280????50????0.072????0.91????×
Fig. 9 shows the impedance frequency characteristic that obtains under various decomposition conditions, the corresponding respectively thermal decomposition condition of curve 9A, 9B and 9C is: 180 ℃, and 30 minutes; 280 ℃, 30 minutes and 240 ℃, 30 minutes.Last decomposition condition provided best impedance operator in 240 ℃, 30 minutes.
Figure 10 has provided the manufacturing approach craft FB(flow block) according to the third most preferred embodiment of the present invention.
Figure 10 compares with the Fig. 7 that provides second kind of most preferred embodiment manufacture method and shows, unique difference is to adopt in dipping operation (S25) to be added with manganese dioxide (M
nO
2) manganese nitrate solution of fine powder makes impregnating agent.Usually in the third most preferred embodiment, the manganese dioxide fine powder gives earlier to be added in the manganese nitrate solution, although manganese dioxide itself is also made with the thermal decomposition manganese nitrate.Add of constitute the very big influence of the quantity of manganese dioxide to manganese dioxide layer.
Other operation S21-S24 and S26-S28 are respectively corresponding to the operation S11-S17 among Fig. 7.
Table 3 provides be manganese dioxide fine powder addition (Wt%) with at 100kH
ZThe impedance relationship that records is measured every group of 50 capacitors down, and its rated voltage is that 16 volts, capacitance are 10 microfarads, and wherein the addition from 0 to 10% of each group manganese dioxide fine powder differs 2% between each group.
The result of table 3 shows that addition is the most favourable to impedance operator between about 4 to 6Wt%.
What Figure 11 provided is the relation of impedance frequency characteristic and manganese dioxide powder addition, and wherein the addition that curve 11A, 11B, 11C, 11D, 11E and 11F are corresponding respectively is 0,2,4,6,8 and 10%.
Figure 11 also shows the addition of manganese dioxide fine powder, preferably is defined in the scope between about 4 to 6wt%.
With about 4 to 6wt% manganese dioxide fine powder, the frequency characteristic of solid aluminium electrolytic capacitor can make moderate progress, and particularly the frequency characteristic under high frequency can be improved, but need not increase the volume of capacitor.And, because do not need to increase new operation, so this technology is also favourable to reducing product cost, and very practical.
Figure 12 has provided the manufacturing approach craft FB(flow block) by the capacitor of the 4th kind of most preferred embodiment of the present invention.
The 4th kind of most preferred embodiment is characterised in that, immerses after the manganese nitrate thermal decomposition in the capacitor core bag, carried out lithium doping operation S36.Then, in the space between manganese dioxide layer 9 and Cathode Foil 2 roasting one deck carbon (operation S37).Operation S11-S14, S16 and S17(Fig. 7 of other operation S31-S34, S38 and S39 and second kind of most preferred embodiment) substantially the same.
In operation S36, established manganese dioxide layer immerses by in the composite electrolytic solution of lithium chloride, propene carbonate and dimethyl ether the lithium plate with electrode with conduct as active electrode (active electrod) in the capacitor core bag 10, and each core bag adds 0.1 to 0.3 milliampere constant current in electrolyte.In this technical process, the Li in the electrolyte
+Ion diffuses into manganese dioxide (M under solid conditions
nO
2) lattice in, thereby following reaction has appearred, make the M of tetravalence
nBe reduced into the M of trivalent
n
And then in technology S37 with the carbon-coating roasting on dielectric substrate.
During capacitor is made, after forming manganese dioxide layer 9 structures, mix the conductivity that lithium can improve manganese dioxide layer, and improve the characteristic of capacitor.
Table 4 has provided with the difference of mixing lithium technology and need not mix the capacitor specific characteristics that lithium technology makes.Rated voltage is that 16 volts, capacitance are the capacitor of 10 microfarads, 50 every group, and at 100kH
ZUnder measure impedance, at 120kH
ZUnder measure tg δ, go out mean value with measured numerical computations.
Clearly show that from table 4 impedance and the tg δ that mix the capacitor of lithium all have clear improvement than the capacitor of not mixing lithium.
Figure 13 has provided the impedance frequency characteristic (13B) of using the impedance frequency characteristic (13A) of the capacitor of mixing lithium technology and need not mixing the capacitor of lithium technology manufacturing.Figure 13 clearlys show that the impedance operator of mixing the capacitor of lithium technology manufacturing when usefulness is greatly improved, and particularly the impedance operator under the high frequency is greatly improved.
As mentioned above, mix the conductivity that lithium has improved manganese dioxide layer, and improve the impedance frequency characteristic of capacitor.
Figure 14 has provided the capacitor manufacture method process flow diagram according to the 5th kind of most preferred embodiment of the present invention.
Then, in the 4th procedure S44, handle, repair the aluminium foil scar that in cutting aluminium foil limit or similar technology, causes and the damaged portion (i.e. the improvement of Qie Bianing) of film with the electrochemical reaction in the weak acid electrolyte.
Then, in the 5th procedure S45, capacitor core bag 10 is through Overheating Treatment, make as separator 3 ' the Manila paper carbonization, cause thinner fiber and reduce density, treatment conditions be temperature between 150 ℃ to 350 ℃, the time is between 10 to 40 minutes.
Then, capacitor core bag 10 is handled (operation S46) through electrochemical reaction, repairs by the oxide-film of cause thermal damage.
Then, the capacitor core bag 10 usefulness manganese nitrate solutions of making are like this flooded.Then, capacitor core bag 10 in air in temperature is between 200 ℃ to 260 ℃, the time is to heat under the condition between 20 to 40 minutes, makes the manganese nitrate thermal decomposition of immersing the core bag, deposition one deck solid electrolyte manganese dioxide layer (operation S47).Dipping and thermal decomposition process form with foregoing most preferred embodiment same repeatedly several times
Close manganese dioxide layer.In manganese dioxide formation technology or before the formation of manganese dioxide solid electrolyte is finished, solid electrolyte layer carries out handling identical electrochemical reaction with the electrochemical reaction of operation S42 and handles (centre-formation) (operation S48).Like this, repaired the oxide-film cause thermal damage that thermal decomposition causes.
Then, under the essentially identical condition of above-mentioned thermal decomposition condition, finish another thermal decomposition process (operation S49) of using the manganese nitrate that is added with graphite (carbon) powder, so that improve the structure (manganese nitrate thermal decomposition) of manganese dioxide solid electrolytic layer 9.In addition, with be dispersed in the manganese nitrate solution, quantity than in the manganese nitrate thermal decomposition process with putting much bigger graphite (carbon) powder, immerse in the space between solid electrolyte layer 9 and the Cathode Foil 2, with the essentially identical condition of above-mentioned thermal decomposition condition under burning carbon, on solid electrolyte, form carbon-coating (carbon-coating roasting) (operation S49).Carbon-coating is filled the space between solid electrolyte 9 and the Cathode Foil 2, the contact resistance value between them is reduced, and protected solid electrolyte layer 9.Then,, in electrolyte, finish electrochemical treatments, promptly form again (operation S50) in order to repair the oxide-film fire damage that above-mentioned carbon-coating roasting (S49) causes.
The capacitor core bag 10 usefulness resin-casts of making like this (resin immersion), perhaps the capacitor core of making is packaged into aluminium shell or metalloid shell, or the resin enclosure of packing into, with epoxy resin or materials similar sealing (body seal or resin-sealed) (operation S51), make capacitor then.
What table 5 provided is leakage conductance electric current and edge-cutting manufacture technology (operation S44), centre-formation (operation S48) and form relation between the short circuit spoilage of (operation S49) various combinations again, in the table zero and * represent that respectively each procedure is to have adopted or not adopt.The rated voltage of measuring whole samples is that 16 volts, capacitance are 10 microfarads.
Leakage conductance electric current shown in the table 5 is the mean value of the leakage conductance electric current of 50 samples, and the short circuit disqualification rate is meant the big sample ratio to milliampere order of magnitude of leakage conductance electric current in 100 samples.
Table 5 clearly illustrates that, if cut edge form again, centre-formation and form these operations again and all carried out, then leakage conductance electric current and short circuit ratio all have the best and improve (No. 5 examples).Comparative example 5 and 7 shows that centre-formation operation has obviously played effect to improving leakage current and short circuit ratio.
In this most preferred embodiment, since before the carbon calcination process and solid electrolyte layer form before (operation S49) finished centre-formation processing (operation S48), oxide-film fire damage among the pyrolosis operation S47 can be repaired fully, can inhibition and the electrochemical reaction of solid electrolyte and carbon-coating.
In above-mentioned most preferred embodiment, though set forth the manufacture method of coiling shape capacitor, the present invention also is applied to chip capacitor (surface-mount capacitor), is described below:
Figure 15 (a) and 15(b) illustrated be chip capacitor.The cylindrical capacitor 20 of band cylinder blanket 21 assembles, and its capacitor core bag is made by the present invention.A little rectangular sheet 22 is fixed on the cylindrical surface 20a of capacitor 20.Rectangular sheet 22 usefulness fluorine resins, silicones, polyimide resin or similar material are made, its size is about 4mm * 5mm, and thickness is 0.2mm, and uses heat resistant adhesive, two-sided coated band as epoxy resin, UV resin or a kind of pressure-sensitive adhesive is bonded on the surperficial 20a of capacitor 20.If the position of small pieces at room temperature can not moved, when solder reflows, can not come off, then any bonding agent all can use.
The cylindrical capacitor 20 that has sheet 22 can be as the chip capacitor of energy horizontal positioned.
Shown in Figure 16 is the chip capacitor 20 that has the same type of heat-resistant sheet 24, and heat-resistant sheet 24 has a curved inner surface along side 20a.This heat-resistant sheet can be made with forming technology.Heat-resistant sheet 24 is contained on the printed circuit board (PCB) capacitor securely, and can prevent to cause the capacitor package to break and the damage of capacitor specific characteristics by the heat that printed circuit board (PCB) transmits.
Figure 17 (a) and 17(b) a kind of chip capacitor is shown, first 25 that is installed is used for capacitor 20 is securely fixed on the printed circuit board (PCB), can do to absorb the plane for second 26 that is adorned, when capacitor is installed on the printed circuit board (PCB), as sucker.The 2nd 26 thickness is 0.2 to 0.3 millimeter, the size identical with first 25, for example, with fast dried adhering with epoxy resin on capacitor 20.When the shaping absorbing surface, the absorbing surface that sucker not necessarily will have a curved surface with chip capacitor to adapt.And, need be with special dish, but to be used to install chip capacitor with a common disk, such chip capacitor does not need to distinguish its end face and bottom surface.Second 26 usefulness Corvic, polyimide resin, fluorine resin or similar material give earlier and making.
Figure 18 (a) and 18(b) illustrated be with Figure 17 (a) and identical chip capacitor 17(b), second 28 curved surface that has along capacitor 20 peripheral 20a just.Can make with forming technology for second 28 that has such curved surface.
Figure 19 (a) and 19(b) illustrated be Figure 17 (a) and 17(b) shown in identical capacitor 20, just adorned the separation sleeve 29 that lower plane 29a and last plane 29b are arranged, replaced Figure 17 (a) and 17(b) shown in two sheets 25,26 of using of capacitor.The plane 29a of capacitor 20 can be placed on the printed circuit board (PCB), and another plane 29b is as absorbing the plane.Because capacitor 20 has last plane and lower plane, it can be installed as the common chip capacitor that rectangular cross section is arranged with common installation sheet.
Figure 20 (a) and 20(b) shown in capacitor have one to be roughly on foursquare 31 end face 20b that sticks on capacitor 20.The lead-in wire 23 of sheet 31 and bending can support the main body of capacitor 20, makes the surface of its a little higher than printed circuit board (PCB).Therefore, capacitor 20 can be attached on the printed circuit board (PCB) with the bottom of sheet 31, and makes capacitor and printed circuit board (PCB) that a space be arranged and be securely fixed on the printed circuit board (PCB).
In the packaging technology of the aluminium foil type manufacture for solid electrolytic capacitor shown in those operations S6, S28, S39 or the S51 among Fig. 1,10,12 and 14, be that capacitor core shown in Figure 2 is packaged into shell, and with resin-sealed.Make the position deviation center of capacitor core bag if sealing resin fills up, cause short trouble to take place easily.Therefore, using when resin-sealed, need the capacitor core bag is temporarily fixing in the enclosure.In sealing technology, insert shell with the small amount of thermal plastic resin, and heating melts resin, then capacitor core is packaged into shell, the cooling resin makes the capacitor core bag fixing in the enclosure.Fill up thermoplastic resin then in the enclosure and make its sealing.
But there is following point in this sealing technology: at first, this technology does not have to consider to be used for the moisture resistance of the temporary transient resin of fixing.And moisture is easy to be penetrated into the contact interface layer between resin bed and shell or lead-in wire, and water is sucked in the capacitor core bag.Because water has the electrolyte effect, the electrostatic capacitance amount is increased.Therefore, temporarily fixing and sealing needs with two kinds of resins.
Have enough scape 0 by the male elaborate terpene of Na my extensive kind of garden bright-coloured Wei in the above-mentioned most preferred embodiment, in pack into aluminum metal case or the resin enclosure, as shown in figure 21.In shell 41, put into thermosetting resin 42 in advance, its amount be approximately shell 41 internal volume 10.Capacitor core bag 40 is packed into behind the shell, with shell 41 heating, makes resin 42 sclerosis, and its condition is: kept 10 minutes under 80-90 ℃ of temperature.Capacitor core bag 40 just temporarily is fixed in the shell 41 like this.Fill opening 44 places of shell 41 to shell 41 with thermosetting resin 43 then, thermosetting resin 43 is with a kind of resin with thermosetting resin 42.Then heat shell make it the sclerosis, for example, condition is: 50 to 110 ℃ following retention times of temperature between 6 to 10 hours.
The heating-up temperature of the thermosetting resin 43 of can 41 openings 44 is wished low as much as possible, so that remove the resin that is bonded on the lead-in wire 46,47 easily in following cleaning.
As mentioned above, use with a kind of resin with the capacitor core bag temporarily fixing in the enclosure and sealing the shell aperture that fixes the capacitor core bag is housed.And can prevent that moisture from advancing in the capacitor core bag 40 from external penetration, because therefore the not suction of capacitor core bag can prevent that the electrostatic capacitance amount from increasing.In addition, owing to fixing and sealing has temporarily been used with a kind of resin, manufacturing process has been shortened.
In this embodiment, the temporary transient fixing and sealing good same a kind of resin of moisture resistance of capacitor core bag.And can prevent that moisture from entering from external penetration.Therefore capacitor core Bao Buhui suction is so can keep its original characteristic.
Usually, the manufacture method of such chip capacitor is, with the lead deformation of solid aluminium electrolytic capacitor, will go between and the metal lead-out tablet welds together, with other part of resin-cast capacitor and welding.But such welding sequence requires complicated processing, so operating efficiency and production rate are low.In addition, the resin-cast operation needs main equipment, and this main equipment has become to reduce the difficult point of cost.
Shown in Figure 22 and 23 according to chip capacitor example of the present invention, solved the problems referred to above. Capacitor core bag 60,70 is made as aforesaid capacitor core bag 10.Lead-in wire 61 and 62 is contained in same one side of the capacitor core bag 60 in the shell shown in Figure 22, and the 71 and 72 different ends that are placed in core bag 70 that go between are received in connecting operation on the aluminium foil in the shell shown in Figure 23.
In the shell shown in Figure 22, lead-in wire 61 will be cut to such an extent that be shorter than the height of the metal shell 63 that the capacitor core bag is housed.Then, the liquid epoxies 64 that will have a good moisture resistivity is put into the bottom of metal shell 63.Then, capacitor core bag 60 is packed in the metal shell 63, and the core bag is bonded on the metal shell 63 with resin with heat curing process.To bond together than the short lead-in wire 61 and the inner surface of metal shell with high temperature resistant 270 ℃ or higher electrically conducting adhesive 65 then.Then, use the opening that has the liquid epoxies 66 casting metal shells 63 of good moisture resistivity with bonding usefulness same a kind of, and make resin 66 thermmohardenings body seal.Pass the lead-in wire 62 of encapsulant 66, give earlier making, it as insulating part 67 with
The lead wire of casing insulation is the same, 62 contacts with metal shell 63 in order to prevent to go between.
In the shell of Figure 23, short lead-in wire 71 is made " L " shape, fusing point is the bottom that 270 ℃ or higher scolder 74 are placed on metal shell 73, and make its fusing, then capacitor core bag 70 is put into metal shell 73, with scolder 74 L shaped lead-in wire 71 and metal shell 73 are welded together like this, then with the opening of good epoxy resin 75 cans 73 of moisture resistivity, the above-mentioned epoxy resin that uses in epoxy resin 73 and the chip capacitor shown in Figure 22 is identical.Pass another root lead-in wire 72 of encapsulant 75 and make lead wire, the metal wiring film that its picture insulate with insulating part 76 and shell 73.
Figure 24 and 25 provides is example through remodeling, with welding or similar approach, metal wiring film 68 and 77 is welded in before the metal shell 63,73, with metal wiring film be fixed on the insulating material 67 that is positioned at the bottom of the shell ' and 76 ' on.Two metal wiring films 62,68 and 72,77 can be laid at grade securely.
In this embodiment sample in the capacitor core bag lead-in wire one is welded together with metal shell, so metal shell can be used as the prolongation of electrode.So the unnecessary resin-cast that carries out, and, can make inexpensive minitablets or capacitor.
The present invention is not exceeding the embodiment that also has other mode under its feature real situation.Described most preferred embodiment just to the explanation rather than the restriction to inventing of invention, invents scope required for protection and stipulate with appended claim, and whole changes that meaning comprised of claim is also in claimed scope in civilian.
Claims (30)
1, a kind of solid aluminium electrolytic capacitor comprises:
One deck forms the anode aluminium foil of oxide-film on one surface, one deck cathode aluminum foil, with the separator of isolating said anode and cathode aluminum foil, two-layer aluminium foil and separator are wound into the capacitor core bag, distance in the capacitor core bag of being determined by separation layer thickness between the two-layered foil remains between 10 to 60 microns, and the electrolyte that thermal decomposition is immersed in the capacitor core bag forms solid electrolyte between two-layer aluminium foil.
2, a kind of manufacture method of solid aluminium electrolytic capacitor, the operation that comprises has:
One deck anode aluminium foil and one deck cathode aluminum foil, reeling with the separator of isolating said anode and cathode aluminum foil forms the capacitor core bag,
Dipping manganese nitrate electrolyte in the capacitor core bag,
In temperature is between 200 to 260 ℃, and the time is under the condition between 20 to 40 minutes, and thermal decomposition electrolyte forms the manganese dioxide solid electrolyte layer between electrode foil.
According to the manufacture method of claim 2, it is characterized in that 3, said separator is through heat treatment and the Manila paper of carbonization.
4,, also comprise operation with resin-cast capacitor core bag according to the manufacture method of claim 2.
5,, comprise that also the capacitor core bag is encapsulated into the operation of metal shell according to the manufacture method of claim 2.
6, a kind of manufacture method of solid aluminium electrolytic capacitor, the operation that comprises has:
With one deck anode aluminium foil and one deck cathode aluminum foil, reeling with the separator of isolating said anode and cathode aluminum foil forms the capacitor core bag, and the oxide-film of formation is arranged on a surface of anode foils,
Dipping is added with the manganese nitrate electrolyte of manganese dioxide fine powder in the capacitor core bag,
Heat divides thermal electrolysis liquid to form solid electrolyte layer between electrode foil.
7, according to the manufacture method of claim 6, it is characterized in that, add manganese dioxide amount be electrolyte weight 4 to 6wt% between.
8,, also be included as the electrochemical reaction treatment process that aluminium foil is cut edge and gone up the formation oxide-film and carry out according to the manufacture method of claim 6.
9, according to the manufacture method of claim 6, wherein said separator is through Overheating Treatment and the Manila paper of carbonization.
10, according to the manufacture method of claim 6, it is characterized in that, said thermal decomposition be in temperature be between 200 to 260 ℃, the time handles under the condition between 20 to 40 minutes.
11,, also comprise operation with resin-cast capacitor core bag according to the manufacture method of claim 6.
12,, comprise that also the capacitor core bag is sealed in the operation in the metal shell according to the manufacture method of claim 6.
13, a kind of manufacture method of solid aluminium electrolytic capacitor, the operation that comprises has:
One deck anode aluminium foil and one deck cathode aluminum foil, reeling with the separator of isolating said anode and cathode aluminum foil forms the capacitor core bag, and the distance between the said aluminium foil remains between 10 to 60 microns,
Dipping manganese nitrate electrolyte in the capacitor core bag,
Thermal decomposition electrolyte forms solid electrolyte layer between said aluminium foil,
Mix lithium in the solid electrolyte layer.
According to the manufacture method of claim 13, it is characterized in that 14, said separator is through heat treatment and the Manila paper of carbonization.
15, according to the manufacture method of claim 13, it is characterized in that, said thermal decomposition be in temperature be between 200 to 260 ℃, the time is to handle under the condition between 20 to 40 minutes.
16,, also comprise operation with resin-cast capacitor core bag according to the manufacture method of claim 13.
17,, comprise that also the capacitor core bag is sealed in the operation in the metal shell according to the manufacture method of claim 13.
18, a kind of manufacture method of solid aluminium electrolytic capacitor, the operation that comprises has:
One deck anode aluminium foil, one deck cathode aluminum foil, reeling with the separator of isolating said anode and cathode aluminum foil forms the capacitor core bag, and the oxide-film of formation is arranged on a surface of anode foils,
Dipping manganese nitrate electrolyte in the capacitor core bag,
Thermal decomposition electrolyte forms the manganese dioxide solid electrolyte layer between electrode foil,
Before the formation solid electrolyte is finished, in weak acid solution, carry out electrochemical reaction once more and handle, so that repair the damaged portion of oxide-film on the aluminium foil,
Dipping adds the manganese nitrate solution of carbon dust in the capacitor core bag, forms manganese dioxide layer once more,
Dipping is added with the manganese nitrate solution of carbon dust, in this moment manganese nitrate solution added carbon dust amount greatly more than forming the manganese dioxide layer operation once more with added carbon dust amount in the manganese nitrate solution, then with the carbon roasting on solid electrolyte layer.
19,, also be included in the electrochemical reaction treatment process that aluminium foil is cut edge and gone up the formation oxide-film and carry out according to the manufacture method of claim 18.
20, according to the manufacture method of claim 18, wherein said separator is through heat treatment and the Manila paper of carbonization.
21, according to the manufacture method of claim 18, it is characterized in that, form the thermal decomposition process in the operation of manganese dioxide the said first time, its treatment conditions be temperature between 200 to 260 ℃, the time is between 20 to 40 minutes.
22, according to the manufacture method of claim 18, it is characterized in that, form said thermal decomposition in the manganese dioxide operation once more, be temperature between 200 to 260 ℃, the time handles under the condition between 20 to 40 minutes.
23,, also comprise operation with resin-cast capacitor core bag according to the manufacture method of claim 18.
24,, also comprise the capacitor core bag is sealed in operation in the metal shell according to the manufacture method of claim 18.
25, a kind of manufacture method of solid aluminium electrolytic capacitor, the operation that comprises has:
One deck anode aluminium foil, one deck cathode aluminum foil, reeling with the separator of isolating said anode and cathode aluminum foil forms the capacitor core bag,
Between electrode foil, form solid electrolyte layer,
The quantity of resin of fixed capacitor core bag is put into the outer casing bottom of opening,
Capacitor core is packaged in the shell,
It is with resin that the capacitor core bag is fixing in the enclosure,
Add an amount of fixedly usefulness resin-sealed shell aperture of the same race again.
26, according to the manufacture method of claim 25, the wherein said fixing moisture resistance of getting well that all has with resin and sealing resin.
27, according to the manufacture method of claim 25, wherein the resin that moisture resistance is good is an epoxy resin.
28, a kind of manufacture method of solid aluminium electrolytic capacitor, the operation that comprises has:
One deck anode aluminium foil, one deck cathode aluminum foil, reeling with the separator of isolating said anode and cathode aluminum foil forms the capacitor core bag, the lead-in wire that each layer aluminium foil all has a root bead to connect,
Between electrode foil, form solid electrolyte layer,
The capacitor core bag is put into the metal shell of opening,
An inner surface with metal shell in will going between with a kind of bonding agent makes and is electrically connected,
With insulating resin sealed capacitor opening.
29, according to the manufacture method of claim 28, wherein said bonding agent is a scolder.
According to the manufacture method of claim 28, it is characterized in that 30, bonding agent is an electrically conducting adhesive.
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19613087A JPS6439708A (en) | 1987-08-05 | 1987-08-05 | Aluminum solid electrolytic capacitor |
| JP196130/87 | 1987-08-05 | ||
| JP198938/87 | 1987-08-08 | ||
| JP302797/87 | 1987-11-30 | ||
| JP18476787U JPH0187526U (en) | 1987-12-03 | 1987-12-03 | |
| JP184767/87 | 1987-12-03 | ||
| JP315755/87 | 1987-12-14 | ||
| JP319322/87 | 1987-12-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1032263A true CN1032263A (en) | 1989-04-05 |
| CN1011841B CN1011841B (en) | 1991-02-27 |
Family
ID=26502700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 88106531 Expired CN1011841B (en) | 1987-08-05 | 1988-08-05 | Solid aluminium electrolytic capacitor and process for making same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1011841B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101303937B (en) * | 2007-05-09 | 2010-09-01 | 郑州泰达电子材料科技有限公司 | Solid electrolytic capacitor and method for preparing the same |
| CN1860568B (en) * | 2003-09-30 | 2010-10-13 | 富士重工业株式会社 | Organic electrolytic capacitor |
| CN107978453A (en) * | 2017-11-22 | 2018-05-01 | 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) | Chemical polymerization solution, conducting polymer solid sheet type aluminum electrolytic capacitor and preparation method thereof |
-
1988
- 1988-08-05 CN CN 88106531 patent/CN1011841B/en not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1860568B (en) * | 2003-09-30 | 2010-10-13 | 富士重工业株式会社 | Organic electrolytic capacitor |
| CN101303937B (en) * | 2007-05-09 | 2010-09-01 | 郑州泰达电子材料科技有限公司 | Solid electrolytic capacitor and method for preparing the same |
| CN107978453A (en) * | 2017-11-22 | 2018-05-01 | 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) | Chemical polymerization solution, conducting polymer solid sheet type aluminum electrolytic capacitor and preparation method thereof |
| CN107978453B (en) * | 2017-11-22 | 2019-07-26 | 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) | Conducting polymer solid sheet type aluminum electrolytic capacitor and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1011841B (en) | 1991-02-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1030359C (en) | Mass production method for the manufacture of surface mount solid state capacitor and resulting capacitor | |
| CN1236507C (en) | Electrochemical device | |
| CN1210734C (en) | Capacitor | |
| CN1111885C (en) | High performance double layer capacitors including aluminium carbon composite electrodes | |
| CN1253386A (en) | Non liquid state electrolyte battery and its manufacturing method | |
| CN1297236A (en) | Solid electrolytic capacitor and its mfg. method | |
| CN1217430C (en) | Battery and electric double-layer capacitor | |
| JP2003163138A (en) | Solid electrolytic capacitor and its manufacturing method | |
| CN1238855A (en) | Multi-electrode double layer capactor | |
| JP2007200950A (en) | Multilayer solid-state electrolytic capacitor | |
| US4876451A (en) | Aluminum solid electrolytic capacitor and manufacturing method thereof | |
| CN1076857C (en) | Solid electrolytic capacitor and its mfg. method | |
| JP2004047886A (en) | Solid electrolytic capacitor and its manufacturing method | |
| CN1638180A (en) | Electrochemical cell | |
| CN1661742A (en) | Electrochemical device and method of manufacturing electrochemical device | |
| CN1633721A (en) | Secondary battery | |
| CN1460274A (en) | Solid electrolytic capacitor and method of mfg. capacitor | |
| CN1032263A (en) | Solid aluminium electrolytic capacitor and manufacture method thereof | |
| CN1462485A (en) | Power storage device | |
| CN1185661C (en) | Aluminium electrolytic capacitor and mfg. method thereof | |
| JPH05151951A (en) | Battery with nonaqueous electrolytic solution | |
| JPS63110717A (en) | Leadless electronic component and solid electrolytic capacitor and manufacture of the same | |
| CN1224249A (en) | Thin sealed battery and producing method thereof | |
| CN1482692A (en) | Energy accumulating apparatus and method for manufacturing the same | |
| JP5909387B2 (en) | Electrochemical element and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C13 | Decision | ||
| GR02 | Examined patent application | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C15 | Extension of patent right duration from 15 to 20 years for appl. with date before 31.12.1992 and still valid on 11.12.2001 (patent law change 1993) | ||
| OR01 | Other related matters | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |