CN103203958B - A kind of manufacture craft of electroforming template - Google Patents
A kind of manufacture craft of electroforming template Download PDFInfo
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- CN103203958B CN103203958B CN201210010734.9A CN201210010734A CN103203958B CN 103203958 B CN103203958 B CN 103203958B CN 201210010734 A CN201210010734 A CN 201210010734A CN 103203958 B CN103203958 B CN 103203958B
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- Prior art keywords
- electroforming
- exposure
- manufacture craft
- treatment
- electroformed layer
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Abstract
A kind of manufacture craft of electroforming template.This kind of manufacture craft is intended to making printing surface has raised step（up step）, and raised step（up step）Region has opening figure, and PCB surface has recess step（down step）, and recess step（down step）The astomous electroforming template in region.Its preparation technology flow is：The electroformed layer of electroforming first：Core treatment → pre-treatment（Oil removing, pickling, sandblasting）→ pad pasting 1 → 1 → surface development of exposure, 1 → electroforming 1；The electroformed layer of electroforming second（Form PCB surface recess step（down step））：Pre-treatment（Pickling, sandblasting）→ pad pasting 2 → 2 → surface development of exposure, 2 → electroforming 2 → stripping；Electroforming printing surface raised step（up step）：Printing mask → 3 → surface development of exposure, 3 → electroforming 3 → take off film → stripping → subsequent treatment（Oil removing, pickling）.The electroforming template prepared by process above, raised step（up step）The figure opening in region is high with the aligning accuracy of the first electroformed layer opening；The thickness evenness COV of template is within 10%；Plate face one-level light；There is good adhesion between each electroformed layer, it is difficult for drop-off.
Description
Technical field
The present invention relates to a kind of manufacture craft of electroforming template, belong to material manufacture and manufacture field.It is specifically related to a kind of
A kind of printing surface has raised step in preparing SMT fields using electroforming（up step）, PCB surface there is recess step（down
step）Mask used for printing plate manufacture craft.
Background technology
Pursued with electronic product and minimized, the piercing insert element for using in the past cannot reduce；Electronic product function
It is more complete, the integrated circuit for being used（IC）Cannot punctured element, particularly on a large scale, highly integrated IC, it has to use table
Face surface mount elements, therefore stencil print process has obtained rapid development in electronics manufacturing, SMT printings are exactly typical case.Template
Buying be not only the first step of SMT assembly technologies, it is also a most important step.The major function of template is to aid in tin cream
Deposition, it is therefore an objective to which the material of accurate quantity is transferred on tabula rasa accurate position.Tin cream is blocked in fewer in template, is deposited on
It is more on circuit board.Therefore the port quality requirement to template is more smooth better.But, for some special pcb boards, such as
When having some privileged sites on pcb board and needing the amount of tin cream to require more or less than other positions, it is necessary to correspondence mould
The position of plate is thickeied or reduction processing, and in general, up regions need to make figure, and down regions need not make figure
Shape.
Printing stencil is the mould for print solder paste, and steel mesh is typically used at present.And traditional handicraft is by laser cutting
The punching block opening size quality of fabrication techniques can not reach requirement, and board surface quality is also not good enough.
Carrying out the preparation of template using electrotyping forming is, due to electrotyping forming be it is a kind of be incremented by rather than the technique successively decreased,
Therefore the metal form that its making is obtained has unique sealing characteristics, so as to reduce the need cleaned to Xi Qiao and template bottom surface
Will.The technique provides the positioning of almost Perfect, does not have the limitation of geometry, with inherent trapezoidal smooth hole wall and low surface
Tension force, improves tin cream release.By the substrate that perforate is formed at（Or core）Upper lithographic glue, it is then former one by one
Son, electroforming goes out template around photoresist layer by layer.
For the technology for locally thickening, what it focused on up step graphics fields is opened on substrate graphics field
Aperture position precision will height, it is big in combination with power for the auxiliary flow distribution plate of up step graphics fields share current, it is no
Then the life-span will substantially reduce.
Therefore, how more preferably, quickly produce printing surface using electroforming process there is up steps, PCB surface to have down
The electroforming metal template of step is a significant challenge.
The content of the invention
Present invention seek to address that above technical problem, invents a kind of manufacture craft of electroforming template.By the electroforming process system
The standby metal form for obtaining, its printing surface has raised step（up step）, PCB surface has recess step（down step）,
And plane domain and up step regions are respectively provided with figure opening, and down step regions are without figure opening.And obtained up
The figure opening in step regions has aligning accuracy high with the first electroformed layer opening.
A kind of manufacture craft of electroforming template, its technological process is as follows：
（1）The electroformed layer of electroforming first：Core treatment → pre-treatment（Oil removing, pickling, sandblasting）→ pad pasting 1 → exposure 1 → mono-
Face development 1 → electroforming 1；
（2）The electroformed layer of electroforming second（Form PCB surface down step）：Pre-treatment（Pickling, sandblasting）→ pad pasting 2 → exposure 2
2 → electroforming of → surface development 2 → stripping；
（3）Electroforming printing surface up step：Printing mask → exposure 3 → surface development, 3 → electroforming, 3 → leg film → stripping
→ subsequent treatment（Oil removing, pickling）.
Specifically, each step in its technological process is as follows：
（1）Electroforming ground floor electroformed layer：
A. core treatment：The stainless steel of 0.3mm thickness is selected as core, and substrate is cut into required size；
B. pre-treatment：The steel disc that will be cut carries out two sides blasting treatment, surface roughness is improved, so as to improve pad pasting
When dry film and steel disc adhesion；
C. one side pad pasting 1：Selection adhesive force dry film high, pad pasting is carried out in mandrel surface；
D. one side exposure 1：Institute's patch dry film is exposed, exposure area is opening figure region, retains exposure dry film；
E. surface development 1：Unexposed dry film is developed and is removed；
F. electroforming 1：Electroforming material is deposited on without dry film region, clones the opening figure consistent with exposure figure.
（2）The electroformed layer of electroforming second：
A. pre-treatment:First electroformed layer surface acid-washing, sandblasting, to improve between the second electroformed layer and the first electroformed layer
Adhesion
B. pad pasting 2:Continue pad pasting in the first electroforming layer surface, by the lateral opening contrapositions of CCD, accurate contraposition second layer electroforming
Layer and the opening figure of the first electroformed layer, it is ensured that the positional precision deviation control between two-layer is at ± 10 μm.
C. 2 are exposed:The dry film in the down step regions of exposure second layer opening figure region and PCB surface, as electroforming
The diaphragm of the second layer.
D. surface development 2:Unexposed dry film is developed and is removed;
E. electroforming 2:In immersion electrotyping bath, the electroforming second layer, because there is exposure dry film in down step regions, so
After one layer of electroforming, a sunk area is formed
F. peel off:Electroformed layer is stripped down from core;
（3）Electroforming printing surface up step：
A. mask is printed：PCB surface is contacted with mandrel surface, the pad pasting on printing surface；
B. 3 are exposed：The opening figure in the region beyond wanted electroforming up step and up step regions is exposed；
C. surface development 3：Unexposed dry film is removed in development, it would be desirable to deposit the region of electroforming material（That is up step areas
Domain）It is exposed；
D. electroforming 3：Ready shunting auxiliary template（Described flow distribution plate, i.e., stainless with core size identical
Method on steel plate by being cut by laser cuts out, a size identical through hole identical with up step regional locations, plays and shares
Electric current, the effect for mitigating edge effect.）Align onto the first electroformed layer, the first electroformed layer, flow distribution plate are fixed to winged bar together
On, electrotyping bath is immersed, control electroforming up step thickness.Three electroforming are carried out, in unexposed area（I.e. without dry film region）Deposition
Electroforming material, forms the up step of printing surface；
E. leg film：Dry film is torn, Membrane cleaning is taken off；
F. peel off:Electroformed layer is stripped down from core；
G. subsequent treatment：By the oil removing of electroforming template, pickling.
Thus produce stepped formwork as shown in Figure 3,4, and this kind of printing process of printing stencil such as Fig. 1,2 institutes
Show, the recess step of PCB surface, its Main Function is to avoid pcb board elevated regions, it is to avoid printing process template deformation, in such as 1
6 shown in, and the raised step of printing surface, its Main Function is the lower tin amount for increasing printing on welding copper platform on pcb board,
For the welding of big element.
During electroforming, by pre-treatment increase blast time, increase the modes such as soak time before electroforming improve two coating it
Between adhesion, prevent coating from coming off, by testing ready-made anode baffle come control electric current density line, be allowed in graphics field
In the range of the first electroformed layer deposit thickness uniformity COV within 10%；Ensure coating matter by adjusting the amount of electroforming additive
Amount, such as coating are bright, pin-free, pit；By controlling development point good to reach coating opening hole wall quality during development, without hair
Thorn, plating.
Wherein, the specific process parameters range of each step is as follows：
Pre-treating technology parameter is as follows：
| The oil removing time | 1~2min |
| Pickling time | 1~2min |
| Blast time 1 | 2~3min |
| Blast time 2 | 5~10min |
| Pressure（pis） | 1~5 |
Exposure imaging technological parameter is as follows：
| Core size（mm） | 800*600*1.8 |
| 1 amount of exposure（mj） | 1000~2000 |
| Time for exposure 1（s） | 800~2500 |
| The time of surface development 1（s） | 120~240 |
| 2 amounts of exposure（mj） | PCB surface 1000~1200 |
| 3 amounts of exposure（mj） | Printing surface 1200~2000 |
| Time for exposure 2（s） | PCB surface 800~1500 |
| Time for exposure 2（s） | Printing surface 1500~2500 |
| The time of surface development 2/3（s） | 90~120 |
Electroforming process parameter is as follows：
Thus produce stepped formwork as shown in Figure 3,4, and this kind of printing process of printing stencil such as Fig. 1,2 institutes
Show.
The stepped formwork prepared by preparation technology mixed above, with following beneficial effect：
（1）The recess step of PCB surface, its Main Function is to avoid pcb board elevated regions, it is to avoid printing process template deformation
（6 in Fig. 1）；
（2）The raised step of printing surface, its Main Function is the lower tin for increasing printing on welding copper platform on pcb board
Amount, for the welding of big element（6 in Fig. 2）；
（3）During electroforming, two coating are improved by increasing the modes such as soak time before pre-treatment increase blast time, electroforming
Between adhesion, prevent coating from coming off；
（4）By testing ready-made anode baffle come control electric current density line, the first electricity in the range of graphics field is allowed to
COV is within 10% for cast layer deposit thickness uniformity；
（5）Ensure quality of coating by adjusting the amount of electroforming additive, such as coating is bright, pin-free, pit；
（6）By controlling development point, impulse- free robustness, plating good to reach coating opening hole wall quality during development.
Brief description of the drawings
Of the invention above-mentioned and/or additional aspect and advantage will become from description of the accompanying drawings below to embodiment is combined
Substantially and be readily appreciated that.
Fig. 1 .PCB faces down regions sectional view
1-PCB substrates
2- templates
3- welds base station
4- planes opening
Elevated regions on 5-PCB plates
6-PCB faces down regions
7- printing surfaces
8-PCB faces
The opening sectional view in Fig. 2 printing surface up regions
1-PCB substrates
2- templates
3a- welds base station
3b- welds base station
4- planes opening
5- printing surface up regions
The opening in 6- printing surface up regions
7- printing surfaces
8-PCB faces
Fig. 3 mould printings face up schematic diagrames
1- templates
2- stencil planes opening
3- mould printings face up regions
4- mould printings face up region openings
5- mould printings face
Fig. 4 template PCB surface down schematic diagrames
1- templates
2- stencil planes opening
3- template PCB surface down regions
4- template PCB surfaces
Specific embodiment
Embodiments of the invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from start to finish
Same or similar label represents same or similar element or the element with same or like function.Below with reference to attached
It is exemplary to scheme the embodiment of description, is only used for explaining the present invention, and is not considered as limiting the invention.
A kind of manufacture craft of electroforming template, its technological process is as follows：
（1）The electroformed layer of electroforming first：Core treatment → pre-treatment（Oil removing, pickling, sandblasting）→ pad pasting 1 → exposure 1 → mono-
Face development 1 → electroforming 1；
（2）The electroformed layer of electroforming second（Form PCB surface down step）：Pre-treatment（Pickling, sandblasting）→ pad pasting 2 → exposure 2
2 → electroforming of → surface development 2 → stripping；
（3）Electroforming printing surface up step：Printing mask → exposure 3 → surface development, 3 → electroforming, 3 → leg film → stripping
→ subsequent treatment（Oil removing, pickling）.
Its concrete technology flow process is as follows：
Substrate is cut into required size by selection 1.8mm stainless steels as core, and the steel disc that will be cut is carried out
Two sides blasting treatment, improves surface roughness, so as to improve the adhesion of dry film and steel disc during pad pasting.
The dry film that adhesive force must be selected high, prevents from falling film phenomenon during electroforming.After choosing dry film, in core
Surface carries out pad pasting.
Institute's patch dry film is exposed, exposure area is opening figure region, and exposure dry film is used as the guarantor during electroforming
Sheath, prevents material deposition.
Unexposed dry film is developed and is removed, into electroforming process, electroforming material is deposited on without dry film region, is cloned and exposure
The consistent opening figure of light figure.
After the completion of first time electroforming, pad pasting is continued in the first electroforming layer surface, by the lateral opening contrapositions of CCD, accurate contraposition the
The opening figure of two layers of electroformed layer and the first electroformed layer, it is ensured that the positional precision deviation between two-layer is controlled at ± 10 μm.
The dry film in the down step regions of exposure second layer opening figure region and PCB surface, as the guarantor of the electroforming second layer
Cuticula.
The development of unexposed dry film is removed and immersed in electrotyping bath, the electroforming second layer exposes because down step regions are present
Light dry film, so after one layer of electroforming, forming a sunk area.
After the electroforming second layer terminates, electroformed layer is stripped down from core, cast layer is overturn, by PCB surface and mandrel surface
Contact, the pad pasting on printing surface, because the up step region areas of wanted electroforming are smaller, press mold is repeated in pad pasting, is protected
Card dry film is close to the first electroformed layer, that is, ensure that up step regions are not easily disconnected from.
Then the opening figure exposure in the region beyond wanted electroforming up step and up step regions is black, development is removed not
Exposure dry film, it would be desirable to deposit the region of electroforming material（That is up step regions）It is exposed.
Because up step region areas are smaller, current density line is concentrated during electroforming, can cause electroforming up step regions
Edge effect is serious, so ready shunting auxiliary template is carefully aligned onto the first electroformed layer, is careful not to scratch figure
Shape and electroformed layer, the first electroformed layer, one piece of flow distribution plate are fixed on winged bar, immerse electrotyping bath, control electroforming up step thickness.
Described flow distribution plate, i.e., with core size identical stainless steel plate on by be cut by laser method cut out one
Identical with up step regional locations, size identical through hole plays a part of share current, mitigates edge effect.
Three electroforming are carried out, in unexposed area（I.e. without dry film region）Deposition electroforming material, forms the up of printing surface
step。
After the completion of three electroforming, electroformed layer is stripped down from core, take off Membrane cleaning.
Wherein, one group of preferred technological parameter is：
Pre-treating technology parameter：
| The oil removing time | 2min |
| Pickling time | 2min |
| Blast time 1 | 3min |
| Blast time 2 | 8min |
| Pressure（pis） | 3 |
Exposure imaging technological parameter：
| Core size（mm） | 800*600*1.8 |
| 1 amount of exposure（mj） | 1500 |
| Time for exposure 1（s） | 1500 |
| The time of surface development 1（s） | 200 |
| 2 amounts of exposure（mj） | PCB surface 1000 |
| 3 amounts of exposure（mj） | Printing surface 1500 |
| Time for exposure 2（s） | PCB surface 1000 |
| Time for exposure 2（s） | Printing surface 2000 |
| The time of surface development 2/3（s） | 100 |
Electroforming process parameter：
Thus produce stepped formwork as shown in Figure 3,4, and this kind of printing process of printing stencil such as Fig. 1,2 institutes
Show, the recess step of PCB surface, its Main Function is to avoid pcb board elevated regions, it is to avoid printing process template deformation, in such as 1
6 shown in, and the raised step of printing surface, its Main Function is the lower tin amount for increasing printing on welding copper platform on pcb board,
For the welding of big element.
During electroforming, by pre-treatment increase blast time, increase the modes such as soak time before electroforming improve two coating it
Between adhesion, prevent coating from coming off, by testing ready-made anode baffle come control electric current density line, be allowed in graphics field
In the range of the first electroformed layer deposit thickness uniformity COV within 10%；Ensure coating matter by adjusting the amount of electroforming additive
Amount, such as coating are bright, pin-free, pit；By controlling development point good to reach coating opening hole wall quality during development, without hair
Thorn, plating.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that：Not
Can these embodiments be carried out with various changes, modification, replacement and modification in the case of departing from principle of the invention and objective, this
The scope of invention is limited by claim and its equivalent.
Claims (10)
1. a kind of manufacture craft of electroforming template, its technological process is as follows：
（1）The electroformed layer of electroforming first：Core treatment → pre-treatment → pad pasting 1 → 1 → surface development of exposure, 1 → electroforming 1；
（2）The electroformed layer of electroforming second：Pre-treatment → pad pasting 2 → 2 → surface development of exposure, 2 → electroforming 2 → stripping；
（3）Electroforming printing surface raised step：Printing mask → exposure 3 → surface development, 3 → electroforming, 3 → leg film → stripping → after
Continuous treatment；The wherein pre-treatment of the electroformed layer of electroforming first includes oil removing, pickling, the step of sandblasting 1；The electroformed layer of electroforming second is formed
PCB faces recess step；The pre-treatment of the electroformed layer of electroforming second includes pickling, sandblasting 2.
2. manufacture craft according to claim 1, it is characterised in that the printing surface of the metal form for preparing has convex
Play step（up step）, PCB surface has recess step（down step）.
3. manufacture craft according to claim 1, it is characterised in that the metal form plane domain and projection for preparing
Stepped area is respectively provided with opening figure, and recess step region imperforation figure.
4. manufacture craft according to claim 1, it is characterised in that mould material is any one in pure nickel, ferronickel.
5. manufacture craft according to claim 1, it is characterised in that electroforming printing surface raised step（up step）Region
And will be lateral opening by CCD para-position before the electroformed layer of electroforming second, it is ensured that during each layer of electroforming the positional precision of each layer opening ±
10μm。
6. manufacture craft according to claim 1, it is characterised in that electroforming printing surface raised step（up step）Region
When, the current density that additional conductive plate comes dispersion of dry film location edge need to be made；Wherein additional conductive plate is flow distribution plate.
7. manufacture craft according to claim 1, it is characterised in that pre-treating technology parameter is as follows：
。
8. manufacture craft according to claim 1, it is characterised in that exposure imaging technological parameter is as follows：
。
9. manufacture craft according to claim 1, it is characterised in that there is activating process before electroforming；Have wherein before electroforming 1
There is 1 step of activation, there are 2 steps of activation before electroforming 2, there are 3 steps of activation before electroforming 3；Wherein electroforming process parameter is as follows：
。
10. manufacture craft according to claim 1, it is characterised in that the metal form deposit thickness for preparing is uniform
COV is within 10% for property.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010734.9A CN103203958B (en) | 2012-01-16 | 2012-01-16 | A kind of manufacture craft of electroforming template |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010734.9A CN103203958B (en) | 2012-01-16 | 2012-01-16 | A kind of manufacture craft of electroforming template |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103203958A CN103203958A (en) | 2013-07-17 |
| CN103203958B true CN103203958B (en) | 2017-06-13 |
Family
ID=48751453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210010734.9A Expired - Fee Related CN103203958B (en) | 2012-01-16 | 2012-01-16 | A kind of manufacture craft of electroforming template |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103203958B (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5442730A (en) * | 1993-10-08 | 1995-08-15 | International Business Machines Corporation | Adaptive job scheduling using neural network priority functions |
| US5685491A (en) * | 1995-01-11 | 1997-11-11 | Amtx, Inc. | Electroformed multilayer spray director and a process for the preparation thereof |
| EP1002647A3 (en) * | 1998-11-17 | 2001-02-21 | Eastman Kodak Company | Method and article for electroforming process for an ink jet nozzle plate |
| US6981318B2 (en) * | 2002-10-22 | 2006-01-03 | Jetta Company Limited | Printed circuit board manufacturing method |
| WO2011053093A2 (en) * | 2009-11-02 | 2011-05-05 | 엘지이노텍 주식회사 | Printing plate for liquid crystal display and manufacturing method thereof, method for printing using same, and method for manufacturing replication master mold and printing plate using same |
-
2012
- 2012-01-16 CN CN201210010734.9A patent/CN103203958B/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| CN103203958A (en) | 2013-07-17 |
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