CN103194337A - Cleaning agent - Google Patents
Cleaning agent Download PDFInfo
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- CN103194337A CN103194337A CN2013101190352A CN201310119035A CN103194337A CN 103194337 A CN103194337 A CN 103194337A CN 2013101190352 A CN2013101190352 A CN 2013101190352A CN 201310119035 A CN201310119035 A CN 201310119035A CN 103194337 A CN103194337 A CN 103194337A
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- cleaning agent
- out system
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- inhibiter
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Abstract
The invention discloses a cleaning agent. The cleaning agent comprises the following materials in percentage by weight: 1 to 6% of potassium silicate, 2 to 7% of tripoly-sodium silicate, 1 to 5% of sodium carbonate, 0.5 to 3% of potassium oleate, 0.5 to 3% of alkaryl polyether, 0.5 to 3% of sodium gluconate, 0.5 to 3% of tetrasodium ethylenediamine tetraacetate, 0.5 to 3% of an antifoaming agent, 0.5 to 3% of a corrosion inhibitor, and the balance of water. According to the mode mentioned above, the cleaning agent provided by the invention has the formula adopting components without smell and toxicity, the residual scaling powder and the residual rosin can be permanently decomposed and fallen, the residual greasy dirt can be removed and dissolved, and the foam can be effectively removed; and the cleaning agent has the corrosion protection effect, is remarkable in the cleaning effect and is durable, and is an environment-friendly cleaning agent with reasonable price and high cost performance.
Description
Technical field
The present invention relates to a kind of clean-out system, particularly relate to a kind of for the residual clean-out system of cleaning scaling powder, rosin and greasy dirt.
Background technology
Electronic circuit surface installation technique (SMT) is a kind ofly will not have on the surface that pin or short leg surface-assembled components and parts are installed in the surface of printed circuit board (PCB) or other substrate, by methods such as Reflow Soldering or the immersed solder circuit load technology of welding assembly in addition.Along with developing rapidly of SMT industry, can produce a large amount of used reflow ovens, wave-soldering furnace, nipper, production line and various device component in process of production, there are soldering flux, rosin and greasy dirt residual in these equipment, need clean-out system maintenance in time and cleaning.
Numerous domestic producer uses the clean-out system of Germany and U.S.'s brand more at present, but the foreign brands price is expensive, increases production cost.Though homemade clean-out system low price, cleaning performance is poor, and access times are short, are easy to generate foam, need wash with massive laundering, and the cleaning process taste is big, has serious corrodibility, in cleaning process equipment is produced detrimentally affect.
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of clean-out system, this clean-out system reasonable price and cost performance height.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of clean-out system is provided, comprises that the weight percent that material is formed is: potassium silicate 1-6%, three sodium polysilicate 2-7%, yellow soda ash 1-5%, potassium oleate 0.5-3%, alkaryl polyethers 0.5-3%, Sunmorl N 60S 0.5-3%, tetrasodium ethylenediamine tetraacetate 0.5-3%, defoamer 0.5-3%, inhibiter 0.5-3%, water surplus.
In a preferred embodiment of the present invention, described clean-out system comprises that the weight percent that material is formed is: potassium silicate 2-5%, three sodium polysilicate 3-6%, yellow soda ash 2-4%, potassium oleate 1-2%, alkaryl polyethers 1-2%, Sunmorl N 60S 1-3%, tetrasodium ethylenediamine tetraacetate 0.5-2%, defoamer 0.5-1.5%, inhibiter 0.5-1.5%, water surplus.
In a preferred embodiment of the present invention, described clean-out system comprises that the weight percent that material is formed is: potassium silicate 4%, three sodium polysilicates 5%, yellow soda ash 3%, potassium oleate 1%, alkaryl polyethers 2%, Sunmorl N 60S 2%, tetrasodium ethylenediamine tetraacetate 1%, defoamer 1%, inhibiter 1%, water surplus.
In a preferred embodiment of the present invention, described water is industrial pure water.
In a preferred embodiment of the present invention, described defoamer is silicone oil oleic acid stearic acid.
In a preferred embodiment of the present invention, described inhibiter is benzotriazole.
The invention has the beneficial effects as follows: clean-out system of the present invention, prescription all adopts free from extraneous odour nontoxicity composition, can decompose the welding assisted agent residuals that comes off lastingly, rosin is residual, it is residual to remove the dissolving greasy dirt, effectively eliminate foam, have anticorrosion ability, cleaning performance is remarkable, durable in use, be the high environment-friendly cleaning agent of a kind of reasonable price and cost performance.
Embodiment
Below preferred embodiment of the present invention is described in detail, thereby so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that protection scope of the present invention is made more explicit defining.
Embodiment one:
Described clean-out system comprises that the weight percent that material is formed is: potassium silicate 2%, three sodium polysilicates 3%, yellow soda ash 4%, potassium oleate 2%, alkaryl polyethers 2%, Sunmorl N 60S 2%, tetrasodium ethylenediamine tetraacetate 1%, silicone oil oleic acid stearic acid 1%, benzotriazole 1%, industrial pure water surplus.
After the client buys described clean-out system and water being carried out volume ratio is that 1:3 mixes use, greatly reduces upkeep cost, has reduced transportation cost.
Embodiment two:
Described clean-out system comprises that the weight percent that material is formed is: potassium silicate 4%, three sodium polysilicates 5%, yellow soda ash 3%, potassium oleate 1%, alkaryl polyethers 2%, Sunmorl N 60S 2%, tetrasodium ethylenediamine tetraacetate 1%, defoamer 1%, inhibiter 1%, water surplus.
Embodiment three:
Described clean-out system comprises that the weight percent that material is formed is: potassium silicate 6%, three sodium polysilicates 6%, yellow soda ash 2%, potassium oleate 0.5%, alkaryl polyethers 2%, Sunmorl N 60S 2%, tetrasodium ethylenediamine tetraacetate 1%, defoamer 1%, inhibiter 1%, water surplus.
The clean-out system that the present invention discloses can decompose the welding assisted agent residuals that comes off, rosin is residual lastingly, and it is residual to remove the dissolving greasy dirt, performance is efficient, cleaning performance is remarkable, and is durable in use, can substitute the M6319US of U.S. KYZEN, the similar imported products such as SP200 of ZESTRON.Tension force by compounded technology reduction clean-out system surface water strengthens the promoting agent adsorptive power, reduces sedimentary formation, effectively eliminates foam, in order to avoid in cleaning process equipment is produced detrimentally affect, realizes the anti-corrosion protection to the metal object surface.
The above only is embodiments of the invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes description of the present invention to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (6)
1. clean-out system, it is characterized in that, comprise that the weight percent that material is formed is: potassium silicate 1-6%, three sodium polysilicate 2-7%, yellow soda ash 1-5%, potassium oleate 0.5-3%, alkaryl polyethers 0.5-3%, Sunmorl N 60S 0.5-3%, tetrasodium ethylenediamine tetraacetate 0.5-3%, defoamer 0.5-3%, inhibiter 0.5-3%, water surplus.
2. clean-out system according to claim 1, it is characterized in that, comprise that the weight percent that material is formed is: potassium silicate 2-5%, three sodium polysilicate 3-6%, yellow soda ash 2-4%, potassium oleate 1-2%, alkaryl polyethers 1-2%, Sunmorl N 60S 1-3%, tetrasodium ethylenediamine tetraacetate 0.5-2%, defoamer 0.5-1.5%, inhibiter 0.5-1.5%, water surplus.
3. clean-out system according to claim 2, it is characterized in that, comprise that the weight percent that material is formed is: potassium silicate 4%, three sodium polysilicates 5%, yellow soda ash 3%, potassium oleate 1%, alkaryl polyethers 2%, Sunmorl N 60S 2%, tetrasodium ethylenediamine tetraacetate 1%, defoamer 1%, inhibiter 1%, water surplus.
4. according to the arbitrary described clean-out system of claim 1-3, it is characterized in that described water is industrial pure water.
5. according to the arbitrary described clean-out system of claim 1-3, it is characterized in that described defoamer is silicone oil oleic acid stearic acid.
6. according to the arbitrary described clean-out system of claim 1-3, it is characterized in that described inhibiter is benzotriazole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2013101190352A CN103194337A (en) | 2013-04-08 | 2013-04-08 | Cleaning agent |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN2013101190352A CN103194337A (en) | 2013-04-08 | 2013-04-08 | Cleaning agent |
Publications (1)
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CN103194337A true CN103194337A (en) | 2013-07-10 |
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CN2013101190352A Pending CN103194337A (en) | 2013-04-08 | 2013-04-08 | Cleaning agent |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104233336A (en) * | 2014-09-29 | 2014-12-24 | 无锡阳工机械制造有限公司 | Dedicated alkaline rust removal liquid for nonferrous metals |
CN105087182A (en) * | 2014-05-12 | 2015-11-25 | 花王株式会社 | Circuit substrate cured with solder, a manufacturing method of circuit substrate equipped with electronic part, and cleaning agent composition for fluxing agent |
CN106118926A (en) * | 2016-06-16 | 2016-11-16 | 深圳市唯特偶新材料股份有限公司 | A kind of used in electronic industry is entirely without halogen VOC free aqueous cleaning agent |
CN106318692A (en) * | 2016-08-23 | 2017-01-11 | 南京南炼宏泰技术开发有限公司 | Environment friendly industrial oil stain cleaning agent and preparing method thereof |
CN107059025A (en) * | 2017-06-19 | 2017-08-18 | 苏州锐耐洁电子科技新材料有限公司 | A kind of metal cleaner with antirust function |
CN108377615A (en) * | 2018-03-15 | 2018-08-07 | 昆山长优电子材料有限公司 | Copper face for PCB pattern transfer pre-treatment processing procedures is bonded solution |
CN113584495A (en) * | 2021-07-07 | 2021-11-02 | 浙江新龙实业有限公司 | Method for cleaning brass-red copper welded pipe |
Citations (4)
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CN1316495A (en) * | 2001-04-30 | 2001-10-10 | 山东大学 | Water-base composite detergent for printed circuit board |
CN101838595A (en) * | 2010-05-22 | 2010-09-22 | 湖南嘉业达电子有限公司 | Water-soluble recyclable cleaning liquid and preparation method thereof |
CN102051286A (en) * | 2011-01-18 | 2011-05-11 | 广州瀚源电子科技有限公司 | Water-based cleaning agent for rosin solder paste |
CN102816660A (en) * | 2012-09-11 | 2012-12-12 | 广东普赛特电子科技股份有限公司 | Nano water-based cleaning agent and preparing method thereof |
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2013
- 2013-04-08 CN CN2013101190352A patent/CN103194337A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1316495A (en) * | 2001-04-30 | 2001-10-10 | 山东大学 | Water-base composite detergent for printed circuit board |
CN101838595A (en) * | 2010-05-22 | 2010-09-22 | 湖南嘉业达电子有限公司 | Water-soluble recyclable cleaning liquid and preparation method thereof |
CN102051286A (en) * | 2011-01-18 | 2011-05-11 | 广州瀚源电子科技有限公司 | Water-based cleaning agent for rosin solder paste |
CN102816660A (en) * | 2012-09-11 | 2012-12-12 | 广东普赛特电子科技股份有限公司 | Nano water-based cleaning agent and preparing method thereof |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105087182A (en) * | 2014-05-12 | 2015-11-25 | 花王株式会社 | Circuit substrate cured with solder, a manufacturing method of circuit substrate equipped with electronic part, and cleaning agent composition for fluxing agent |
CN104233336A (en) * | 2014-09-29 | 2014-12-24 | 无锡阳工机械制造有限公司 | Dedicated alkaline rust removal liquid for nonferrous metals |
CN106118926A (en) * | 2016-06-16 | 2016-11-16 | 深圳市唯特偶新材料股份有限公司 | A kind of used in electronic industry is entirely without halogen VOC free aqueous cleaning agent |
CN106318692A (en) * | 2016-08-23 | 2017-01-11 | 南京南炼宏泰技术开发有限公司 | Environment friendly industrial oil stain cleaning agent and preparing method thereof |
CN106318692B (en) * | 2016-08-23 | 2018-07-03 | 南京南炼宏泰技术开发有限公司 | Environment-friendly type industrial greasy dirt cleaning agent and preparation method thereof |
CN107059025A (en) * | 2017-06-19 | 2017-08-18 | 苏州锐耐洁电子科技新材料有限公司 | A kind of metal cleaner with antirust function |
CN108377615A (en) * | 2018-03-15 | 2018-08-07 | 昆山长优电子材料有限公司 | Copper face for PCB pattern transfer pre-treatment processing procedures is bonded solution |
CN113584495A (en) * | 2021-07-07 | 2021-11-02 | 浙江新龙实业有限公司 | Method for cleaning brass-red copper welded pipe |
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Application publication date: 20130710 |