CN103192503A - Die - Google Patents

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Publication number
CN103192503A
CN103192503A CN2013101263090A CN201310126309A CN103192503A CN 103192503 A CN103192503 A CN 103192503A CN 2013101263090 A CN2013101263090 A CN 2013101263090A CN 201310126309 A CN201310126309 A CN 201310126309A CN 103192503 A CN103192503 A CN 103192503A
Authority
CN
China
Prior art keywords
thermal insulation
insulation board
slide block
plate
cope match
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2013101263090A
Other languages
Chinese (zh)
Inventor
不公告发明人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Tengyuxin Metal Products Co Ltd
Original Assignee
Kunshan Tengyuxin Metal Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunshan Tengyuxin Metal Products Co Ltd filed Critical Kunshan Tengyuxin Metal Products Co Ltd
Priority to CN2013101263090A priority Critical patent/CN103192503A/en
Publication of CN103192503A publication Critical patent/CN103192503A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a die. The die comprises a top plate, an upper heat insulation plate, an upper shaping plate, a lower shaping plate, a lower heat insulation plate, a bottom plate and sliders, wherein the upper heat insulation plate is arranged on the lower surface of the top plate; the upper shaping plate is arranged on the lower surface of the upper heat insulation plate; the lower shaping plate is arranged on the lower surface of the upper shaping plate; a cavity communicated with a hot runner is defined between the upper shaping plate and the lower shaping plate; the lower heat insulation plate is arranged on the lower surface of the lower shaping plate; the bottom plate is arranged on the lower surface of the lower heat insulation plate; the sliders are arranged between the upper heat insulation plate and the lower heat insulation plate; and strokes of the sliders are more than 20mm. The die disclosed by the embodiment of the invention has the advantages of smoothness in die removal, high product yield and the like.

Description

Mould
Technical field
The present invention relates to a kind of mould.
Background technology
Injection mold is the important process equipment of producing various industrial products, along with plastic mould design industry developing rapidly and plasthetics aviation, boat too, the applying of industrial departments such as electronics, machinery, boats and ships and automobile, product is more and more higher to the requirement of mould, the requirement that traditional plastic mould method for designing can't adapt to model change and improve the quality.The computer aided engineering technology has become the valid approach of these weak links in plastic cement products exploitation, mould design and the product processing.
Summary of the invention
The invention provides a kind of mould, described mould comprises: top board; Last thermal insulation board, the described thermal insulation board of going up is located on the lower surface of described top board; Cope match plate, described cope match plate are located on the lower surface of described upward thermal insulation board; Following template, described following template is located on the lower surface of described cope match plate, limits the die cavity that is communicated with described hot flow path between wherein said cope match plate and the described following template; Following thermal insulation board, described thermal insulation board down are located on the lower surface of described template down; Base plate, described base plate are located on the lower surface of described thermal insulation board down; And slide block, described slide block is located between described last thermal insulation board and the described following thermal insulation board, and the stroke of described slide block is greater than 20 millimeters.
According to the mould of the embodiment of the invention stroke by making described slide block greater than 20 millimeters, thereby can increase the safe distance of described slide block, make product thus when ejecting, described slide block and product have sufficient distance, thereby can make product stripping smooth and easy, product can not pulled by described slide block, has improved the yield of product.Therefore, have according to the mould of the embodiment of the invention that the demoulding is smooth and easy, product yield advantages of higher.
Preferably, the stroke of described slide block is greater than 22 millimeters.
Preferably, the stroke of described slide block is greater than 24 millimeters.
Preferably, the stroke of described slide block is 24.5 millimeters.
Preferably, described slide block is located on the upper surface of described thermal insulation board down slidably.
Preferably, described top board, described thermal insulation board, described cope match plate, described template down, described thermal insulation board down and the described base plate gone up removably link together by bolt.
Preferably, described top board, described thermal insulation board, described cope match plate, described template down, described thermal insulation board down and the described base plate gone up removably link together by a plurality of described bolts.
Preferably, a plurality of described bolts are positioned on first circumference.
Preferably, a plurality of described bolts are distributed on described first circumference equally spacedly.
 
Description of drawings
Above-mentioned and/or additional aspect of the present invention and advantage are from obviously and easily understanding becoming the description of embodiment in conjunction with following accompanying drawing, wherein:
Fig. 1 is the structural representation according to the mould of the embodiment of the invention.
Mould 1, top board 20, slide block 30, last thermal insulation board 40, cope match plate 50, following template 60, following thermal insulation board 70, base plate 80.
The specific embodiment
Describe embodiments of the invention below in detail, the example of described embodiment is shown in the drawings, and wherein identical or similar label is represented identical or similar elements or the element with identical or similar functions from start to finish.Be exemplary below by the embodiment that is described with reference to the drawings, only be used for explaining the present invention, and can not be interpreted as limitation of the present invention.
Below with reference to the mould 1 of Fig. 1 description according to the embodiment of the invention.As shown in Figure 1, the mould 1 according to the embodiment of the invention comprises top board 20, last thermal insulation board 40, cope match plate 50, following template 60, following thermal insulation board 70, base plate 80 and slide block 30.
Last thermal insulation board 40 is located on the lower surface of top board 20, and cope match plate 50 is located on the lower surface of thermal insulation board 40.Following template 60 is located on the lower surface of cope match plate 50, wherein limits the die cavity that is communicated with hot flow path between cope match plate 50 and the following template 60.Following thermal insulation board 70 is located at down on the lower surface of template 60, and base plate 80 is located at down on the lower surface of thermal insulation board 70.Slide block 30 is located between thermal insulation board 40 and the following thermal insulation board 70, and the stroke of slide block 30 is greater than 20 millimeters.
According to the mould 1 of the embodiment of the invention stroke by making slide block 30 greater than 20 millimeters, thereby can increase the safe distance of slide block 30, make product thus when ejecting, slide block 30 has sufficient distance with product, thereby can make product stripping smooth and easy, product can not pulled by slide block 30, has improved the yield of product.Therefore, have according to the mould 1 of the embodiment of the invention that the demoulding is smooth and easy, product yield advantages of higher.
Preferably, the stroke of slide block 30 is greater than 22 millimeters.Can further increase the safe distance of slide block 30 thus, further increase the distance between slide block 30 and the product, thereby can make product stripping more smooth and easy, product can not pulled by slide block 30, has further improved the yield of product.
Further preferably, the stroke of slide block 30 is greater than 24 millimeters.Can further increase the safe distance of slide block 30 thus, further increase the distance between slide block 30 and the product, thereby can make product stripping more smooth and easy, product can not pulled by slide block 30, has further improved the yield of product.
Most preferably, the stroke of described slide block is 24.5 millimeters.Can further increase the safe distance of slide block 30 thus, further increase the distance between slide block 30 and the product, thereby can make product stripping more smooth and easy, product can not pulled by slide block 30, has further improved the yield of product.But also can avoid the oversize of mould 1, and then avoid increasing manufacturing cost and the manufacture difficulty of mould 1.
Particularly, slide block 30 is located at down on the upper surface of thermal insulation board 70 slidably.
Top board 20, last thermal insulation board 40, cope match plate 50, following template 60, following thermal insulation board 70 and base plate 80 can removably link together by bolt.Particularly, top board 20, last thermal insulation board 40, cope match plate 50, following template 60, following thermal insulation board 70 and base plate 80 can removably link together by a plurality of bolts.
Advantageously, a plurality of described bolts are positioned on first circumference.Preferably, a plurality of described bolts are distributed on described first circumference equally spacedly.Can improve the assembly precision of mould 1 thus.
In the description of this specification, concrete feature, structure, material or characteristics that the description of reference term " embodiment ", " some embodiment ", " example ", " concrete example " or " some examples " etc. means in conjunction with this embodiment or example description are contained at least one embodiment of the present invention or the example.In this manual, the schematic statement to above-mentioned term not necessarily refers to identical embodiment or example.And concrete feature, structure, material or the characteristics of description can be with the suitable manner combination in any one or more embodiment or example.
Although illustrated and described embodiments of the invention, those having ordinary skill in the art will appreciate that: can carry out multiple variation, modification, replacement and modification to these embodiment under the situation that does not break away from principle of the present invention and aim, scope of the present invention is limited by claim and equivalent thereof.

Claims (9)

1. a mould is characterized in that, comprising:
Top board;
Last thermal insulation board, the described thermal insulation board of going up is located on the lower surface of described top board;
Cope match plate, described cope match plate are located on the lower surface of described upward thermal insulation board;
Following template, described following template is located on the lower surface of described cope match plate, limits the die cavity that is communicated with described hot flow path between wherein said cope match plate and the described following template;
Following thermal insulation board, described thermal insulation board down are located on the lower surface of described template down;
Base plate, described base plate are located on the lower surface of described thermal insulation board down; With
Slide block, described slide block are located between described last thermal insulation board and the described following thermal insulation board, and the stroke of described slide block is greater than 20 millimeters.
2. mould according to claim 1 is characterized in that, the stroke of described slide block is greater than 22 millimeters.
3. mould according to claim 2 is characterized in that, the stroke of described slide block is greater than 24 millimeters.
4. mould according to claim 3 is characterized in that, the stroke of described slide block is 24.5 millimeters.
5. mould according to claim 1 is characterized in that, described slide block is located on the upper surface of described thermal insulation board down slidably.
6. mould according to claim 1 is characterized in that, described top board, described thermal insulation board, described cope match plate, described template down, described thermal insulation board down and the described base plate gone up removably link together by bolt.
7. mould according to claim 6 is characterized in that, described top board, described thermal insulation board, described cope match plate, described template down, described thermal insulation board down and the described base plate gone up removably link together by a plurality of described bolts.
8. mould according to claim 7 is characterized in that, a plurality of described bolts are positioned on first circumference.
9. mould according to claim 8 is characterized in that, a plurality of described bolts are distributed on described first circumference equally spacedly.
CN2013101263090A 2013-04-12 2013-04-12 Die Pending CN103192503A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2013101263090A CN103192503A (en) 2013-04-12 2013-04-12 Die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2013101263090A CN103192503A (en) 2013-04-12 2013-04-12 Die

Publications (1)

Publication Number Publication Date
CN103192503A true CN103192503A (en) 2013-07-10

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2013101263090A Pending CN103192503A (en) 2013-04-12 2013-04-12 Die

Country Status (1)

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CN (1) CN103192503A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103358469A (en) * 2013-08-03 2013-10-23 昆山市浩坤机械有限公司 Display mold
CN103358477A (en) * 2013-08-03 2013-10-23 昆山市浩坤机械有限公司 Mould for upper cover of ignition switch
CN103395170A (en) * 2013-08-03 2013-11-20 昆山市浩坤机械有限公司 Ignition switch upper cover mould
CN103395171A (en) * 2013-08-03 2013-11-20 昆山市浩坤机械有限公司 Ignition switch upper cover mould

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN200942580Y (en) * 2006-06-12 2007-09-05 比亚迪股份有限公司 Injection mould
CN203157042U (en) * 2013-04-12 2013-08-28 昆山腾宇鑫金属制品有限公司 Mold

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN200942580Y (en) * 2006-06-12 2007-09-05 比亚迪股份有限公司 Injection mould
CN203157042U (en) * 2013-04-12 2013-08-28 昆山腾宇鑫金属制品有限公司 Mold

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
马广等: "《模具CAD/CAM项目化实训教程》", 31 December 2009, article "滑块(行位)", pages: 158-159 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103358469A (en) * 2013-08-03 2013-10-23 昆山市浩坤机械有限公司 Display mold
CN103358477A (en) * 2013-08-03 2013-10-23 昆山市浩坤机械有限公司 Mould for upper cover of ignition switch
CN103395170A (en) * 2013-08-03 2013-11-20 昆山市浩坤机械有限公司 Ignition switch upper cover mould
CN103395171A (en) * 2013-08-03 2013-11-20 昆山市浩坤机械有限公司 Ignition switch upper cover mould

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20130710