CN103188862B - A kind of pcb board and preparation method thereof and electronic devices and components - Google Patents
A kind of pcb board and preparation method thereof and electronic devices and components Download PDFInfo
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Abstract
The present invention is applicable to pcb board and manufactures field, provide a kind of pcb board and preparation method thereof and electronic devices and components, pcb board comprises the basalis that can dispel the heat and lamination and is located at multiple circuit layers on basalis, be provided with insulation between adjacent circuit layer and the dielectric layer that can dispel the heat, each circuit layer is all by can the connector of conductive and heat-conductive be electrically connected with other each circuit layers.In pcb board of the present invention, dielectric layer have simultaneously insulation and heat conduction, heat radiation function, connector has the function of conduction and heat conduction simultaneously, each circuit layer is all connected by each circuit layer of connector and other, and then define complicated heat dissipation channel, the heat that chip and circuit layer produce can distribute a part by dielectric layer, and most of heat conducts to basalis smoothly by numerous heat dissipation channel and distributes.The present invention is compared with traditional pcb board, and its integration degree height radiating effect is splendid, is conducive to the Miniaturization Design of electronic product.
Description
Technical field
The invention belongs to pcb board and manufacture field, particularly relate to a kind of pcb board and preparation method thereof and comprise the electronic devices and components of this pcb board.
Background technology
The development trend of electronic product is high-performance and miniaturization, and this just proposes corresponding requirement to the pcb board as electronic devices and components supporter, require the size of pcb board as far as possible little, integrated level is higher.Simultaneously along with the function of electronic devices and components loading chip increases, the power of chip is increasing, the heat that pcb board produces gets more and more, if these heats can not be discharged in time, semiconductor chip Yin Wendu can be caused too high and inefficacy even damages, therefore pcb board should have again good heat conduction and heat radiation performance.Prior art is for realizing miniature requirement, and common way adopts organic material that pcb board is made sandwich construction, but traditional multi-layer PCB board non-refractory, and radiating effect is not good; For realizing excellent heat-resisting heat dispersion, common way selects aluminum oxide substrate to make pcb board, but such pcb board can only plane routing, cannot make sandwich construction, can not meet the requirement of high integration.
Summary of the invention
The object of the present invention is to provide a kind of pcb board, existing higher integrated level, can have good heat dispersion again.
The present invention realizes like this, a kind of pcb board, comprise the basalis that can dispel the heat and lamination and be located at multiple circuit layers on described basalis, be provided with insulation between each adjacent circuit layer and the dielectric layer that can dispel the heat, each circuit layer is all by can the connector of conductive and heat-conductive be electrically connected with other each circuit layers.
Another object of the present invention is to the manufacture method providing a kind of pcb board, described method comprises the steps:
Step S101: make the basalis that can dispel the heat;
Step S102: form the first circuit layer on described basalis;
Step S103: make on described first circuit layer multiple can the first connector of conductive and heat-conductive;
Step S104: form the first medium layer that can dispel the heat on described first circuit layer, and ensure that described first connector is not covered by described first medium layer;
Step S105: form second circuit layer on described first medium layer, and described second circuit layer is connected with described first circuit layer by part first connector;
Step S106: make on described second circuit layer multiple can the second connector of conductive and heat-conductive;
Step S107: form the second dielectric layer that can dispel the heat on described second circuit layer, and ensure that described second connector is not covered by described second dielectric layer with the first connector be not connected with described second circuit layer;
Step S108: form tertiary circuit layer on described second dielectric layer, and described tertiary circuit layer is connected with described second circuit layer and the first circuit layer with a part of first connector respectively by part second connector;
Step S109: according to the method repetitive operation of step S106 to S108, form N+1 circuit layer on N dielectric layer, and described N+1 circuit layer is connected with described N, N-1 to the first circuit layer respectively by part N, N-1 to the first connector;
Wherein, described N equals the quantity of default dielectric layer.
Another object of the present invention is to provide a kind of electronic devices and components, comprise pcb board and be arranged at the semiconductor chip on described pcb board, described pcb board adopts above-mentioned pcb board.
In pcb board of the present invention, dielectric layer has the function of insulation and heat radiation simultaneously, connector has the function of conduction and heat conduction simultaneously, each circuit layer is all connected by each circuit layer of connector and other, and then define complicated heat dissipation channel, the heat that chip and circuit layer produce can distribute a part by dielectric layer, and most of heat conducts to basalis smoothly by numerous heat dissipation channel and distributes.Therefore, pcb board provided by the invention is compared with traditional multi-layer PCB board, and its better heat-radiation effect, compared with traditional aluminum oxide substrate, its integration degree is high, is more conducive to the Miniaturization Design of electronic product.
Accompanying drawing explanation
Fig. 1 is the cross-sectional view of the pcb board that the embodiment of the present invention provides;
Fig. 2 is the flow chart of the manufacture method of the pcb board that the embodiment of the present invention provides;
Fig. 3 is the schematic diagram of the manufacture method of the pcb board that the embodiment of the present invention provides.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Fig. 1 shows the structural representation of the pcb board that the embodiment of the present invention provides, and for convenience of explanation, illustrate only part related to the present embodiment.
This pcb board comprises the basalis that can dispel the heat and lamination and is located at multiple circuit layers on described basalis, be provided with insulation between adjacent circuit layer and the dielectric layer that can dispel the heat, each circuit layer is all by can the connector of conductive and heat-conductive be electrically connected with other each circuit layers.Be appreciated that the circuit layer of most top layer can arrange some semiconductor chips.Concrete reference diagram 1, is disposed with the first circuit layer 102, first medium layer 103, second circuit layer 104, second dielectric layer 105, tertiary circuit layer 106, the 3rd dielectric layer 107 and the 4th circuit layer 108 on basalis 101.Wherein, the first circuit layer 102 with second and third, four circuit layers are electrically connected respectively by first connector 109; Second circuit layer 104 is electrically connected respectively by second connector 110 with third and fourth circuit layer; Tertiary circuit layer 106 is electrically connected with the 4th circuit layer 108 by the 3rd connector 111; Like this, any two circuit layers are all electrically connected by connector.In this pcb board structure, because each dielectric layer and each connector all can heat conduction, heat radiation, the heat that chip on 4th circuit layer 108 produces, three dielectric layer 107 of a part through below distributes, the heat do not distributed can continue to conduct to second dielectric layer 105 downwards, another part heat can conduct to downwards second dielectric layer 105 through the 3rd connector 111, then second dielectric layer 105 is continued through and the second connector 110 conducts downwards, equally, the heat that the circuit of every layer of circuit layer produces also is distributed by dielectric layer and connector or conducts, the most most of heat conduction is to basalis, the external world is dispersed into by basalis.
In pcb board described in the present embodiment, dielectric layer not only plays the effect of insulation, also there is heat conduction and heat radiation function, connector not only can make the line conduction of two circuit layers, also can heat conduction, and each circuit layer is all connected by each circuit layer of connector and other, defines complicated heat dissipation channel, the heat that chip and circuit layer produce can distribute a part by dielectric layer, and most of heat conducts to basalis smoothly by numerous heat dissipation channel and distributes.Therefore, the pcb board that the present embodiment provides is compared with traditional multi-layer PCB board, and its radiating effect is better, and compared with traditional aluminum oxide substrate, its integration degree is higher, is more conducive to Miniaturization Design.Therefore this pcb board is provided with excellent radiation performance and the high advantage of integration degree simultaneously.
Be appreciated that the circuit layer of this pcb board and the quantity of dielectric layer strictly do not limit, specifically can appropriate design according to actual needs.
In the present embodiment, pad 112 can also be set in the bottom of basalis 101, for pcb board being fixedly welded on the position of setting.This pad 112 specifically can adopt easily welding and the good palladium of thermal conductivity, ag material are made.Further, the thickness of pad 112 can be 10 ~ 40 μm, is specifically as follows 25 μm.
In the present embodiment, each circuit layer all can be provided with multiple circuit junction (not shown), for being connected with other circuit layers, the circuit junction on all different from two circuit layer in two ends of each connector is connected, and makes the line conduction of these two circuit layers.The present embodiment can also by changing the size of circuit junction to reach different radiating effects.
Further, the present embodiment can carry out appropriate design to the thickness of circuit layer and dielectric layer, makes the radiating effect of pcb board better, changes its resistance value by the thickness changing circuit layer, and then change caloric value, change its radiating effect by the thickness changing dielectric layer.Concrete, the thickness of each circuit layer can be 10 ~ 40 μm, and the thickness of each dielectric layer can be 50 ~ 300 μm.Further, when the thickness of each circuit layer is 25 μm, when the thickness of each dielectric layer is 240 μm, the radiating effect of whole pcb board is better.
Further, the thickness of basalis 101 can be 400 ~ 1000 μm, is specifically as follows 600 μm, better heat-radiation effect and can not waste material.
The design of the above-mentioned thickness about dielectric layer, circuit layer and basalis is applicable to the pcb board with any amount circuit layer and dielectric layer, but is particularly suitable for the pcb board with four layers of circuit layer and three layers of dielectric layer.
Further, in order to make the radiating effect of pcb board better, basalis 101 can be made up of ceramic material, and ceramic material specifically can comprise following component: principal component ceramic powders, and organic solvent, plasticizer, binding agent and dispersant.Wherein, the weight ratio of ceramic powders, organic solvent, plasticizer, binding agent and dispersant is 1: 0.8 ~ 1.2: 0.01 ~ 0.1: 0.1 ~ 0.3: 0.001 ~ 0.009.Be described in detail below in conjunction with specific embodiment.
embodiment one:
In the present embodiment, ceramic material comprises following component: ceramic powders, positive third fat of organic solvent acetic acid and isobutanol, plasticizer phthalic acid dibutyl ester, binding agent acrylic resin and dispersant polyethers, wherein, the weight ratio of ceramic powders, positive third fat of acetic acid, isobutanol, dibutyl phthalate, acrylic resin and polyethers is 1: 0.7: 0.1: 0.01: 0.1: 0.001.
embodiment two:
In the present embodiment, ceramic material comprises following component: ceramic powders, positive third fat of organic solvent acetic acid and isobutanol, plasticizer phthalic acid dibutyl ester, binding agent acrylic resin and dispersant polyethers, wherein, the weight ratio of ceramic powders, positive third fat of acetic acid, isobutanol, dibutyl phthalate, acrylic resin and polyethers is 1: 0.9: 0.3: 0.1: 0.3: 0.009.
embodiment three:
In the present embodiment, ceramic material comprises following component: ceramic powders, positive third fat of organic solvent acetic acid and isobutanol, plasticizer phthalic acid dibutyl ester, binding agent acrylic resin and dispersant polyethers, wherein, the weight ratio of ceramic powders, positive third fat of acetic acid, isobutanol, dibutyl phthalate, acrylic resin and polyethers is 1: 0.5: 0.2: 0.05: 0.2: 0.005.
Ceramic material described in above-described embodiment has lower dielectric constant, and the basalis be made up of this material has preferably heat dispersion.
Be appreciated that organic solvent, plasticizer, binding agent and dispersant can also other concrete materials of choose reasonable according to actual needs.
The above is the specific embodiment of pcb board provided by the invention.
Below provide the manufacture method of pcb board, Fig. 2,3 respectively illustrates flow chart and the schematic diagram of the manufacture method of the pcb board that the embodiment of the present invention provides.The manufacture method of this pcb board comprises the steps:
In step S101: make the basalis 301 that can dispel the heat, as Fig. 3-1;
In step s 102: on described basalis, form the first circuit layer 302, as Fig. 3-2;
In step s 103: make on described first circuit layer 302 multiple can the first connector 303 of conductive and heat-conductive;
In step S104: form the first medium layer 304 that can dispel the heat on described first circuit layer 302, and ensure that described first connector 303 is not covered by described first medium layer 304; As Fig. 3-3;
In step S105: form second circuit layer 305 on described first medium layer 304, and described second circuit layer 305 is connected, as Fig. 3-4 with described first circuit layer 302 by part first connector 303;
In step s 106: make on described second circuit layer 305 multiple can the second connector 306 of conductive and heat-conductive;
In step s 107: on described second circuit layer 305, form the second dielectric layer 307 that can dispel the heat, and ensure that described second connector 306 is not covered, as Fig. 3-5 by described second dielectric layer 307 with the first connector 303 be not connected with described second circuit layer 305;
In step S108: form tertiary circuit layer 308 on described second dielectric layer 307, and described tertiary circuit layer 308 is connected, as Fig. 3-6 with described second circuit layer 305 and the first circuit layer 302 with part first connector 303 respectively by part second connector 306;
In step S109: according to the method repetitive operation described in step S106 to S108, on N dielectric layer 309, form N+1 circuit layer 310, and described N+1 circuit layer 310 is connected with described N, N-1 to the first circuit layer 302 respectively by part N, N-1 to the first connector 303; As Fig. 3-7;
Wherein, described N equals the quantity of default dielectric layer.
It is to be noted that Fig. 3 illustrate only manufacture method schematic diagram when N equals 3, and be to be understood that, the pcb board that common electronic product uses is all extremely small, usually first bulk PCB substrate is made when making, then bulk PCB substrate is cut into several small-sized pcb boards that can directly use, therefore shown in Fig. 3 is only a PCB unit of bulk PCB substrate, the i.e. profile of a small-sized pcb board, and monoblock PCB substrate includes multiple PCB unit as shown in fig. 3 to 7.Therefore also should be appreciated that without the bulk PCB substrate cut also in protection scope of the present invention.
The present embodiment forms the first circuit layer successively on basalis, first medium layer, second circuit layer, second dielectric layer ... N+1 circuit layer, and make between any two circuit layers and can conduct electricity and the connector of heat conduction, certainly, this connector is arranged in dielectric layer, multiple circuit layer forms complicated line construction by connector, also form numerous heat dissipation channel simultaneously, the heat that semiconductor chip and each circuit layer produce, a part distributes by dielectric layer, major part heat conducts to basalis eventually through the heat dissipation channel be made up of connector and dielectric layer and distributes, this pcb board is compared with the aluminum oxide substrate of individual layer with traditional multi-layer PCB board, be provided with excellent heat dispersion and higher integrated level simultaneously.
Further, the method can also comprise the steps:
In step s 110: make pad 312, as Fig. 3-8 at the lower surface of basalis 301;
The mode of silk screen printing specifically can be adopted to make pad, and the thickness of pad 312 can be 10 ~ 40 μm, can be specifically 25 μm.
In step S111, according to the line of cut preset, the shaped article made by step S101 to S109 or S110 is cut;
Wherein, depth of cut can be 1/4 ~ 1/2 of substrate actual (real) thickness, is conducive to limited contraction between each PCB substrate in sintering process, ensures evenness and the systematicness of product.
In step S112, the pressure do not reacted with baseplate material is burnt plate and be placed on the product that made by above-mentioned steps, complete low temperature co-fired by pressure burning mode.
By the thickness and the weight that regulate pressure to burn plate, the pcb board of different sintering effect can be obtained.Concrete, the thickness that pressure burns plate can be 0.7 ~ 2.5mm, and be preferably 1.5mm, weight can be 25 ~ 65g, and be preferably 45g, now sintering effect is better, and pcb board can be made to have preferably hardness and toughness.
For the step S101 in said method, a kind of specific embodiment is proposed below:
embodiment four:
Step S101: making the basalis that can dispel the heat can be realized by following method:
First, slurry is configured
By ceramic powders, organic solvent, plasticizer, binding agent and dispersant by weight 1: 0.8 ~ 1.2: 0.01 ~ 0.1: 0.1 ~ 0.3: 0.001 ~ 0.009 Homogeneous phase mixing, and through planetary ball mill legal system form slurry;
Then, described slurry is made basalis.Casting technique specifically can be adopted to make.
Concrete, Material selec-tion and the consumption of ceramic powders, organic solvent, plasticizer, binding agent and dispersant can refer to above-described embodiment one to three, no longer describe in detail herein.
The basalis made by the method has preferably radiating effect.Adopt casting technique to make basalis, technique is simple and can ensure the smooth and even compact of basalis.
For above-mentioned steps S102 to S109, a kind of specific embodiment is proposed below:
embodiment five:
Step S102 specifically can realize like this: according to the circuit pattern printed circuit cable on the base layer preset, and forms circuit, and arranges multiple first circuit junction, and this first circuit junction is used for being connected with other each circuit layers.Further, reasonably design can also be carried out to make its heat-conducting effect better to the size of the first circuit junction.
On this basis, step S103 specifically can realize like this: making at each first circuit junction place can the first connector of conductive and heat-conductive, and this first connector is used for the first circuit layer and other each circuit layers to couple together.
In the present embodiment, step S104 specifically can realize like this: A, the first medium layer that formation can be dispelled the heat on the first circuit layer, and make first medium layer mutually concordant with the first connector to ensure that the first connector is uncovered, casting technique specifically can be adopted to form first medium layer; B, continue to increase the first connector, the material of making first connector specifically can be adopted at the top of the first connector to continue to make certain height and make the height of the first connector exceed first medium layer; C, continuation thicken first medium layer, specifically can adopt the material making first medium layer on first medium layer, continue to form certain thickness and the thickness of first medium layer is increased, and again mutually concordant with the first connector; In this step, casting technique can be adopted to form first medium layer; D, repeat step B-C, until the thickness of first medium layer reaches the thickness pre-set, and mutually concordant with the first connector, do not cover the first connector.
Such employing casting technique thickening first medium layer in layer, and repeatedly increase the first connector, the final smooth densification of first medium layer formed can be ensured, every layer of follow-up dielectric layer and connector all adopt the making that uses the same method, the pcb board surfacing of acquisition can be made, smooth, anti-extrusion, impact is strong.
In the present embodiment, step S105 is similar with the implementation method of step S103: according to the circuit pattern preset printed circuit cable form multiple second circuit contact for being connected with other circuit layers on first medium layer, and wherein part second circuit contact is connected one by one with part first connector; In manufacturing process, according to the position of part first connector, second circuit contact corresponding with it can be set, second circuit contact be connected one by one with this first connector, and then realize the electrical connection of first and second circuit layer.
Further, step S106 can realize like this: making at each second circuit contact place be not connected with the first connector can the second connector of conductive and heat-conductive; That is: except the part second circuit contact be connected with the first connector in step S105, make the second connector one by one at other second circuit contact places, this second connector is used for being connected one by one with other circuit layers of top.
In the present embodiment, step S107 and step S104 implementation method similar: A, on second circuit layer, form the second dielectric layer that can dispel the heat, and make second dielectric layer and the second connector and the first connector be not connected with described second circuit layer mutually concordant to ensure that described second connector is uncovered with the first connector be not connected with described second circuit layer; B, continue to increase the second connector and the first connector be not connected with second circuit layer; C, continuation thicken second dielectric layer, and make second dielectric layer mutually concordant with the first connector be not connected with second circuit layer with the second connector; D, repeat step B-C, until the thickness of second dielectric layer reaches the thickness pre-set, and do not cover the second connector and the first connector be not connected with described second circuit layer.
In the present embodiment, step S108 can realize like this: according to the circuit pattern preset printed circuit cable form multiple tertiary circuit contact for being connected with other circuit layers in second dielectric layer, and wherein part tertiary circuit contact is connected with part second connector, another part tertiary circuit contact is connected with part first connector.In this step, tertiary circuit layer and first and second circuit layer are coupled together.
In the present embodiment, making the 3rd connector can be continued, form the 3rd dielectric layer, the 4th circuit layer according to the method for step S106 to S108,4th circuit layer is electrically connected with tertiary circuit layer by part the 3rd connector, be electrically connected with second circuit layer by part second connector, be electrically connected with the first circuit layer by part first connector.Repeatable operation like this, can form the multilayer circuit layer designed in advance, and makes to be connected by corresponding connector between any two different circuit layers.And then form complicated line construction and heat dissipation channel.
The method that the present embodiment provides is easy to operate, and cost is low, and made product surface is smooth, and has good anti-extrusion, punching performance.
Pcb board provided by the invention has excellent heat dispersion and higher integrated level, is particularly suitable in various electronic product.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a pcb board, it is characterized in that, comprise the basalis that can dispel the heat and lamination and be located at least three circuit layers on described basalis, be provided with insulation between each adjacent circuit layer and the dielectric layer that can dispel the heat, each circuit layer is all by can the connector of conductive and heat-conductive be electrically connected with other each circuit layers.
2. pcb board as claimed in claim 1, it is characterized in that, described basalis is made up of ceramic material, and described ceramic material comprises following component: ceramic powders, organic solvent, plasticizer, binding agent and dispersant; Described organic solvent is made up of positive third fat of acetic acid and isobutanol, described plasticizer is dibutyl phthalate, described binding agent is acrylic resin, described dispersant is polyethers, and the weight ratio of positive third fat of described ceramic powders, acetic acid, isobutanol, dibutyl phthalate, acrylic resin and polyethers is 1:0.7 ~ 0.9:0.1 ~ 0.3:0.01 ~ 0.1:0.1 ~ 0.3:0.001 ~ 0.009.
3. pcb board as claimed in claim 1 or 2, it is characterized in that, the thickness of described each circuit layer is 10 ~ 40 μm; The thickness of described each dielectric layer is 50 ~ 300 μm; The thickness of described basalis is 400 ~ 1000 μm.
4. a manufacture method for pcb board, is characterized in that, described method comprises the steps:
Step S101: make the basalis that can dispel the heat;
Step S102: form the first circuit layer on described basalis;
Step S103: make on described first circuit layer multiple can the first connector of conductive and heat-conductive;
Step S104: form the first medium layer that can dispel the heat on described first circuit layer, and ensure that described first connector is not covered by described first medium layer;
Step S105: form second circuit layer on described first medium layer, and described second circuit layer is connected with described first circuit layer by part first connector;
Step S106: make on described second circuit layer multiple can the second connector of conductive and heat-conductive;
Step S107: form the second dielectric layer that can dispel the heat on described second circuit layer, and ensure that described second connector is not covered by described second dielectric layer with the first connector be not connected with described second circuit layer;
Step S108: form tertiary circuit layer on described second dielectric layer, and described tertiary circuit layer is connected with described second circuit layer and the first circuit layer with a part of first connector respectively by part second connector;
Step S109: according to the method repetitive operation of step S106 to S108, form N+1 circuit layer on N dielectric layer, and described N+1 circuit layer is connected with described N, N-1 to the first circuit layer respectively by part N, N-1 to the first connector;
Wherein, described N equals the quantity of default dielectric layer.
5. the manufacture method of pcb board as claimed in claim 4, is characterized in that, described step S101: make the basalis that can dispel the heat and be specially:
A, configuration slurry
By ceramic powders, organic solvent, plasticizer, binding agent and dispersant by weight 1:0.8 ~ 1.2:0.01 ~ 0.1:0.1 ~ 0.3:0.001 ~ 0.009 Homogeneous phase mixing, and through planetary ball mill legal system form slurry;
B, described slurry is made basalis.
6. the manufacture method of the pcb board as described in claim 4 or 5, is characterized in that, described step S102: on described basalis, form the first circuit layer be specially:
According to the circuit pattern preset printed circuit cable and arrange multiple first circuit junction on described basalis;
Described step S103: make multiple can the first connector of conductive and heat-conductive being specially on described first circuit layer:
Making at each first circuit junction place can the first connector of conductive and heat-conductive;
Described step S105: form second circuit layer on described first medium layer, and described second circuit layer to be connected with described first circuit layer by part first connector to be specially:
According to the circuit pattern preset printed circuit cable form multiple second circuit contact on described first medium layer, and wherein part second circuit contact is connected one by one with part first connector;
Described step S106: make multiple can the second connector of conductive and heat-conductive being specially on described second circuit layer:
Making at each second circuit contact place be not connected with described first connector can the second connector of conductive and heat-conductive;
Described step S108: form tertiary circuit layer on described second dielectric layer, and described tertiary circuit layer to be connected with described second circuit layer and the first circuit layer respectively by part second connector and part first connector to be specially:
According to the circuit pattern preset printed circuit cable form multiple tertiary circuit contact in described second dielectric layer, and wherein part tertiary circuit contact is connected one by one with part second connector, another part tertiary circuit contact is connected one by one with part first connector.
7. the manufacture method of the pcb board as described in claim 4 or 5, is characterized in that, described step S104: on described first circuit layer, form the first medium layer that can dispel the heat, and ensures that described first connector is not specially by described first medium layer covering:
A, the first medium layer that formation can be dispelled the heat on described first circuit layer, and make described first medium layer mutually concordant with the first connector to ensure that described first connector is uncovered;
B, continue to increase described first connector;
C, continuation thicken described first medium layer, and make described first medium layer mutually concordant with the first connector;
D, repeat described step B-C, until the thickness of described first medium layer reaches the thickness pre-set, and do not cover described first connector;
Described step S107: form the second dielectric layer that can dispel the heat on described second circuit layer, and ensure that described second connector is not covered by described second dielectric layer with the first connector be not connected with described second circuit layer and be specially:
A, the second dielectric layer that formation can be dispelled the heat on described second circuit layer, and make described second dielectric layer and the second connector and the first connector be not connected with described second circuit layer mutually concordant to ensure that described second connector is uncovered with the first connector be not connected with described second circuit layer;
B, continue to increase described second connector and the first connector be not connected with described second circuit layer;
C, continuation thicken described second dielectric layer, and make described second dielectric layer mutually concordant with the first connector be not connected with described second circuit layer with described second connector;
D, repeat described step B-C, until the thickness of described second dielectric layer reaches the thickness pre-set, and do not cover described second connector and the first connector be not connected with described second circuit layer.
8. the manufacture method of the pcb board as described in claim 4 or 5, is characterized in that, described method also comprises the steps: after step S109
Step S110: make pad at the lower surface of described basalis;
Step S111: the shaped article made by described step S101 to S109 or S110 is cut according to the line of cut preset;
Step S112: the pressure do not reacted with baseplate material is burnt plate and is placed on described shaped article, completes low temperature co-fired by pressure burning mode.
9. the manufacture method of pcb board as claimed in claim 8, it is characterized in that, in described step S111, depth of cut is 1/4 ~ 1/2 of described shaped article gross thickness.
10. electronic devices and components, comprise pcb board and are arranged at the semiconductor chip on described pcb board, it is characterized in that, described pcb board adopts the pcb board described in any one of claims 1 to 3.
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| CN105357859A (en) * | 2015-10-20 | 2016-02-24 | 上海斐讯数据通信技术有限公司 | Cooling structure and printed circuit board |
| CN106061105A (en) * | 2016-07-28 | 2016-10-26 | 广东欧珀移动通信有限公司 | PCB, PCB manufacturing method and mobile terminal |
| CN109936911A (en) * | 2017-12-18 | 2019-06-25 | 东莞文殊电子科技有限公司 | A kind of pcb board and preparation method thereof |
| CN115843158B (en) * | 2023-02-22 | 2023-05-12 | 遂宁睿杰兴科技有限公司 | Printed circuit board embedded with inductance magnetic core and manufacturing method thereof |
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| CN201639855U (en) * | 2010-04-09 | 2010-11-17 | 聚鼎科技股份有限公司 | Radiating printed circuit board structure |
| CN101983543A (en) * | 2008-03-31 | 2011-03-02 | 三菱电机株式会社 | Low-temperature fired ceramic circuit board |
| CN202435711U (en) * | 2011-12-30 | 2012-09-12 | 深圳振华富电子有限公司 | PCB (printed circuit board) and electronic component comprising same |
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| JP2001024335A (en) * | 1999-07-13 | 2001-01-26 | Sony Corp | Multilayer circuit board and its manufacture |
| JP2002290052A (en) * | 2001-03-23 | 2002-10-04 | Kyocera Corp | Multilayer wiring board |
| KR101090038B1 (en) * | 2004-07-21 | 2011-12-07 | 오끼 덴끼 고오교 가부시끼가이샤 | Multi-layered circuit board assembly |
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| GB2203290A (en) * | 1987-04-02 | 1988-10-12 | Int Computers Ltd | Manufacture of printed circuit boards |
| CN101983543A (en) * | 2008-03-31 | 2011-03-02 | 三菱电机株式会社 | Low-temperature fired ceramic circuit board |
| CN101686611A (en) * | 2008-09-28 | 2010-03-31 | 华为技术有限公司 | Multilayer circuit board, manufacture method thereof and communication equipment |
| CN201639855U (en) * | 2010-04-09 | 2010-11-17 | 聚鼎科技股份有限公司 | Radiating printed circuit board structure |
| CN202435711U (en) * | 2011-12-30 | 2012-09-12 | 深圳振华富电子有限公司 | PCB (printed circuit board) and electronic component comprising same |
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| CN103188862A (en) | 2013-07-03 |
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