CN103185991A - Connecting device for liquid crystal display - Google Patents
Connecting device for liquid crystal display Download PDFInfo
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- CN103185991A CN103185991A CN2011104537110A CN201110453711A CN103185991A CN 103185991 A CN103185991 A CN 103185991A CN 2011104537110 A CN2011104537110 A CN 2011104537110A CN 201110453711 A CN201110453711 A CN 201110453711A CN 103185991 A CN103185991 A CN 103185991A
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- substrate
- coupling arrangement
- lcd
- public electrode
- electronic pads
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Abstract
The invention provides a connecting device for a liquid crystal display. The connecting device comprises a substrate with mesh openings and metal slurry positioned on the substrate. Hereby, the metal slurry is used as a connecting part and nonconductive materials such as sticky glue are prevented from being used, so that the problem of higher resistance of the connecting device is prevented. Meanwhile, the substrate with the mesh openings is used as a part for bearing the metal slurry, so that the problem of breakage of the metal slurry is prevented and reliability of the connecting device is ensured.
Description
Technical field
The present invention relates to the display technology field, particularly a kind of coupling arrangement for LCD.
Background technology
Thin Film Transistor-LCD (TFT-LCD) has low-voltage, little power consumption, shows advantages such as containing much information, be easy to colorize, occupied leading position in current monitor market.It has been widely used in the electronic equipments such as robot calculator, electronic notebook, mobile phone, video camera, HDTV.
Thin Film Transistor-LCD comprises array base palte and the color membrane substrates that box is formed, and is filled in the liquid crystal layer in the gap between array base palte and the color membrane substrates.Described Thin Film Transistor-LCD shows that the ultimate principle of image is: by applying the electric field that acts on the liquid crystal layer at described array base palte and color membrane substrates, control the orientation of described liquid crystal layer molecule, thereby control penetrated what of irradiation light of liquid crystal layer molecule, namely reached modulation by the purpose of the light intensity of liquid crystal layer.
Described color membrane substrates is provided with the public electrode of transmission common electric voltage, be provided with the electronic pads of transmission common electric voltage on the described array base palte equally, in order to make the common electric voltage on described color membrane substrates and the described array base palte have identical current potential, in the prior art, will the public electrode on the described color membrane substrates be connected with electronic pads on the described array base palte by coupling arrangement.
One of prior art has proposed, and utilizes metal wire to be electrically connected described public electrode and electronic pads, simultaneously, utilizes viscosity glue to make described metal wire be connected with described public electrode and electronic pads respectively physically.Metal wire has good electric conductivity, viscosity glue has good viscosity again, but, in described metal wire and described public electrode or described metal wire and described electronic pads junction, because the cause of viscosity glue, make that the resistance of these two contact positions is bigger, thereby influenced the performance of LCD.
For this reason, two of prior art has proposed again, utilizes silver slurry (silver paste) to connect described public electrode and electronic pads.Please refer to Fig. 1, it is to utilize the silver slurry to connect the public electrode of LCD and the structural representation of electronic pads in the prior art.As shown in Figure 1, in existing IPS mode LCD, comprising: array base palte 10 and be arranged at electronic pads 11 on the described array base palte 10; Color membrane substrates 12 and be arranged at public electrode 13 on the described color membrane substrates 12.After described array base palte 10 and 12 pairs of boxes of color membrane substrates, outside described electronic pads 11 and public electrode 13 are exposed to, at this, connect described electronic pads 11 and public electrode 13 by silver slurry 14.But, owing to have difference in height between described electronic pads 11 and the described public electrode 13, perhaps being referred to as step, described silver slurry 14 tends to rupture.As shown in Figure 1, at this, fracture takes place and is divided into the first silver medal slurry portion 140 that is connected with electronic pads 11 and the second silver medal slurry portion 141 that is connected with public electrode 13 in described silver slurry 14, has gap A between the described first silver medal slurry portion 140 and the second silver medal slurry portion 141, namely owing to this fracture defective, described electronic pads 11 can not be electrically connected with public electrode 13.Namely utilize the reliability of the silver slurry described public electrode of connection and electronic pads not high.
Summary of the invention
The object of the present invention is to provide a kind of coupling arrangement for LCD, to solve the big or lower problem of reliability of coupling arrangement resistance in the prior art.
For solving the problems of the technologies described above, the invention provides a kind of coupling arrangement for LCD, comprising:
Have the substrate of mesh; And
Be positioned at described suprabasil metal slurry.
Optionally, at described coupling arrangement for LCD, described substrate is metallic substrates or organism substrate.
Optionally, at described coupling arrangement for LCD, described metal slurry is the silver slurry.
Optionally, at described coupling arrangement for LCD, the density of described mesh is 20/cm
2～200/cm
2
Optionally, at described coupling arrangement for LCD, described mesh be shaped as circle.
Optionally, at described coupling arrangement for LCD, the diameter of described mesh is 15um～0.1mm.
Optionally, at described coupling arrangement for LCD, the thickness of described substrate is 0.05mm～0.5mm.
Optionally, at described coupling arrangement for LCD, described substrate be shaped as an arc surface.
Optionally, at described coupling arrangement for LCD, described substrate comprises an arc surface and two planes that are connected with two parallel sides of this arc surface respectively.
Optionally, at described coupling arrangement for LCD, described LCD comprises: array base palte and be arranged at electronic pads on the described array base palte; Color membrane substrates and be arranged at public electrode on the described color membrane substrates; Described coupling arrangement is connected with described electronic pads and public electrode respectively.
At the coupling arrangement for LCD provided by the invention, utilize the metal slurry as link, avoid using this type of non-conductive thing of viscosity glue, thereby prevented the bigger problem of coupling arrangement resistance.Simultaneously, utilization has the substrate of mesh as the parts of bearing metal slurry, thereby has prevented that the metal slurry from the problem of fracture taking place, and has guaranteed the reliability of coupling arrangement.
Description of drawings
Fig. 1 utilizes the silver slurry to connect the public electrode of LCD and the structural representation of electronic pads in the prior art;
Fig. 2 is the structural representation of the substrate that has mesh of the embodiment of the invention one;
Fig. 3 is the structural representation of the coupling arrangement of the embodiment of the invention one;
Fig. 4 utilizes the connection public electrode of the coupling arrangement LCD that the embodiment of the invention one provides and the structural representation of electronic pads;
Fig. 5 is the structural representation of the substrate that has mesh of the embodiment of the invention two;
Fig. 6 is the structural representation of the substrate that has mesh of the embodiment of the invention three.
Embodiment
Below in conjunction with the drawings and specific embodiments the coupling arrangement for LCD provided by the invention is described in further detail.According to the following describes and claims, advantages and features of the invention will be clearer.It should be noted that accompanying drawing all adopts very the form of simplifying, only in order to convenient, the purpose of the aid illustration embodiment of the invention lucidly.
Embodiment one
Please refer to Fig. 2, it is the structural representation of the substrate that has mesh of the embodiment of the invention one.As shown in Figure 2, have a plurality of mesh 200 on the described base 20.Then, please refer to Fig. 3, it is the structural representation of the coupling arrangement of the embodiment of the invention one.As shown in Figures 2 and 3, described coupling arrangement 2 comprises: have the substrate 20 of mesh 200; And the metal that is positioned in the described substrate 20 is starched.
Please refer to Fig. 4, connection public electrode of the coupling arrangement LCD utilizing the embodiment of the invention one and provide and the structural representation of electronic pads are provided for it.As shown in Figure 4, described LCD comprises: array base palte 40 and be arranged at electronic pads 41 on the described array base palte 40; Color membrane substrates 42 and be arranged at public electrode 43 on the described color membrane substrates 42.At this, after described array base palte 40 and 42 pairs of boxes of color membrane substrates, outside described electronic pads 41 and public electrode 43 were exposed to, then, the coupling arrangement 2 that just can utilize present embodiment to provide connected described electronic pads 41 and public electrode 43.
Concrete, a side of described coupling arrangement 2 is connected with described electronic pads 41, and the opposite side relative with this side of described coupling arrangement 2 is connected with public electrode 43.At this moment, the metal slurry that is positioned in the described substrate 20 will be connected with electronic pads 41 and public electrode 43 respectively by mesh 200, because metal slurry good electrical conductivity, with the link position of electronic pads 41 and public electrode 43, resistance is less, has avoided the excessive problem of junction resistance of using viscosity glue to bring.Simultaneously, the metal slurry can be connected reliably with electronic pads 41 and public electrode 43 again, has guaranteed the reliability that contact position connects.
In order to make the electroconductive molecule in the metal slurry to be connected with electronic pads 41 and public electrode 43 by mesh 200, simultaneously, this metal slurry again can and substrate 20 between have good switching performance, preferred, described mesh be shaped as circle, the diameter of this circle mesh is 15um～0.1mm.Under such mesh diameter, diameter be about the electroconductive molecule of the metal slurry of 10um can be effectively by mesh to electronic pads 41 and public electrode 43, simultaneously this metal slurry again can and mesh between capillarity play tangible effect, from and with mesh 200 between can be effectively, be connected reliably.In other embodiments of the invention, the shape of described mesh also can be ellipse, and at this moment, the minor axis length of this ellipse mesh 200 is preferably 15um～0.1mm.Certainly, in other embodiments of the invention, described mesh can also be other shapes, and the application does not do restriction to this.
Please continue with reference to figure 4, when utilizing this coupling arrangement 2 to connect electronic pads 41 and public electrode 43, part metals slurry 21 will be connected with electronic pads 41 and public electrode 43 respectively by mesh 200, thereby play the effect that connects electronic pads 41 and public electrode 43.Simultaneously, substrate 20 also carries the part metals slurry, because the carrying of substrate 20, metal is starched the problem that will can not rupture, and has guaranteed the reliability of coupling arrangement 2 thus.
Further, the density of described mesh 200 is 20/cm
2～200/cm
2At this, considered to have enough metal slurries to pass through mesh 200 to electronic pads 41 and public electrode 43, simultaneously, guarantee to carry in the described substrate 20 enough metal slurries again, make coupling arrangement 2 can connect electronic pads 41 and public electrode 43 effectively, reliably, effectively prevent the phenomenon of metal slurry fracture.
Further, described substrate 20 is metallic substrates or organism substrate.At first, such substrate has electric conductivity, and particularly metallic substrates has good electrical conductivity, thereby this substrate 20 is except the metal slurry that has carried main connection effect, it can also assist the connection effect, i.e. current potential between auxiliary conduction electrode pad 41 and the public electrode 43.
Secondly, metal or organism all have certain pliability, and the substrate 20 of making by metal or organism has possessed certain pliability equally.Known, it is poor to have certain height between electronic pads 41 and the public electrode 43, namely have certain " step ", can do adaptive distortion according to this difference in height and have certain flexible substrate 20, thereby improve the reliability of coupling arrangement 2, guarantee reliable, effectively connection between electronic pads 41 and the public electrode 43.
Consider to make substrate 20 can have good pliability that preferred, the thickness of described substrate 20 is 0.05mm～0.5mm.Yi Zhi, substrate 20 is blocked up will to influence its pliability, make this substrate 20 can not adapt to this " step " shape well, and if substrate 20 is thin excessively, will influence the reliability of substrate 20 again, namely be easy to take place bad accidents such as substrate 20 fractures, therefore, the inventor is after multinomial test and experiment, when the thickness of realizing substrate 20 is 0.05mm～0.5mm, namely flexible demand can be satisfied, the requirement of reliability can be satisfied again.
In the present embodiment, described metal slurry is the silver slurry, silver slurry have good electrical conductivity and and electronic pads 41 and public electrode 43 between have the connectivity of reliability, thereby can guarantee that coupling arrangement 2 connects electronic pads 41 and public electrode 43 effectively, reliably.
Embodiment two
The difference of present embodiment and embodiment one is, the shape difference of selected substrate.Please refer to Fig. 5, it is the structural representation of the substrate that has mesh of the embodiment of the invention two.As shown in Figure 5, in the present embodiment, substrate 50 has a plurality of mesh 500, described substrate 50 be shaped as an arc surface.In embodiment one, described substrate be shaped as a plane, when the shape of its need to fit " step ", what utilize is the pliability of substrate itself.And in the present embodiment, described substrate 50 be shaped as an arc surface, namely when forming this substrate, just consider the difference in height between electronic pads and the public electrode, make can fit difference in height between electronic pads and the public electrode of the shape of substrate 50, thereby guarantee the reliability of coupling arrangement.In addition, because the substrate 50 of described arc surface can be good at fit electronic pads and public electrode, namely need not to utilize the pliability of this substrate 50 to reach the purpose of " step " between applying electronic pads and the public electrode, at this moment, the thickness of described substrate 50 can reduce the technological requirement of substrate thin typeization, simultaneously thus greater than 0.5mm, also can improve the reliability of substrate 50, it is bad to prevent sole fault etc.
The coupling arrangement with substrate 50 that provides by present embodiment can connect electronic pads on the array base palte and the public electrode on the color membrane substrates better, can corresponding reference example one about the NM content of present embodiment, and present embodiment does not repeat them here.
Embodiment three
The difference of present embodiment and embodiment one is, the shape difference of selected substrate.Please refer to Fig. 6, it is the structural representation of the substrate that has mesh of the embodiment of the invention three.As shown in Figure 6, in the present embodiment, substrate 60 has a plurality of mesh 600, and described substrate 60 comprises an arc surface 61 and two planes 62 that are connected with 61 two parallel sides of this arc surface respectively.In embodiment one, described substrate be shaped as a plane, when the shape of its need to fit " step ", what utilize is the pliability of substrate itself.And in the present embodiment, described substrate 60 comprises an arc surface 61 and two planes 62 that are connected with 61 two parallel sides of this arc surface respectively, namely when forming this substrate, just consider the difference in height between electronic pads and the public electrode, utilize arc surface 61 to make can fit difference in height between electronic pads and the public electrode of the shape of substrate 60, thereby guarantee the reliability of coupling arrangement.Simultaneously, this substrate 60 can utilize two planes, 62 good and electronic pads and the public electrode applyings that are connected with 61 two parallel sides of this arc surface again, thereby further improves the reliability that coupling arrangement is connected with electronic pads and public electrode.In addition, because substrate 60 can be good at fit electronic pads and public electrode, namely need not to utilize the pliability of this substrate 60 to reach the purpose of " step " between applying electronic pads and the public electrode, at this moment, the thickness of described substrate 60 can reduce the technological requirement of substrate thin typeization, simultaneously thus greater than 0.5mm, also can improve the reliability of substrate 60, it is bad to prevent sole fault etc.
The coupling arrangement with substrate 60 that provides by present embodiment can connect electronic pads on the array base palte and the public electrode on the color membrane substrates better, can corresponding reference example one about the NM content of present embodiment, and present embodiment does not repeat them here.
Foregoing description only is the description to preferred embodiment of the present invention, is not any restriction to the scope of the invention, and any change, modification that the those of ordinary skill in field of the present invention is done according to above-mentioned disclosure all belong to the protection domain of claims.
Claims (10)
1. a coupling arrangement that is used for LCD is characterized in that, comprising:
Have the substrate of mesh; And
Be positioned at described suprabasil metal slurry.
2. the coupling arrangement for LCD as claimed in claim 1 is characterized in that, described substrate is metallic substrates or organism substrate.
3. the coupling arrangement for LCD as claimed in claim 1 is characterized in that, described metal slurry is the silver slurry.
4. as each the described coupling arrangement for LCD in the claim 1 to 3, it is characterized in that the density of described mesh is 20/cm
2～200/cm
2
5. as each the described coupling arrangement for LCD in the claim 1 to 3, it is characterized in that, described mesh be shaped as circle.
6. the coupling arrangement for LCD as claimed in claim 5 is characterized in that, the diameter of described mesh is 15um～0.1mm.
7. as each the described coupling arrangement for LCD in the claim 1 to 3, it is characterized in that the thickness of described substrate is 0.05mm～0.5mm.
8. as each the described coupling arrangement for LCD in the claim 1 to 3, it is characterized in that, described substrate be shaped as an arc surface.
9. as each the described coupling arrangement for LCD in the claim 1 to 3, it is characterized in that described substrate comprises an arc surface and two planes that are connected with two parallel sides of this arc surface respectively.
10. as each the described coupling arrangement for LCD in the claim 1 to 3, it is characterized in that described LCD comprises: array base palte and be arranged at electronic pads on the described array base palte; Color membrane substrates and be arranged at public electrode on the described color membrane substrates; Described coupling arrangement is connected with described electronic pads and public electrode respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110453711.0A CN103185991B (en) | 2011-12-29 | 2011-12-29 | Connecting device for liquid crystal display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110453711.0A CN103185991B (en) | 2011-12-29 | 2011-12-29 | Connecting device for liquid crystal display |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103185991A true CN103185991A (en) | 2013-07-03 |
| CN103185991B CN103185991B (en) | 2015-07-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110453711.0A Active CN103185991B (en) | 2011-12-29 | 2011-12-29 | Connecting device for liquid crystal display |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111679488A (en) * | 2020-06-29 | 2020-09-18 | 赣州市秋田微电子有限公司 | Conduction method of liquid crystal display ITO |
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| JPH10187102A (en) * | 1996-12-26 | 1998-07-14 | Casio Comput Co Ltd | Liquid crystal display device |
| JP2003248237A (en) * | 2003-01-09 | 2003-09-05 | Seiko Epson Corp | Liquid crystal display device |
| US20040174484A1 (en) * | 2001-03-15 | 2004-09-09 | Nec Lcd Technologies, Ltd. | Active matrix type liquid crystal display device and method of manufacturing the same |
| CN1529202A (en) * | 2000-05-25 | 2004-09-15 | ������������ʽ���� | Liquid crystal device, its manufacturing method and electronic apparatus |
| CN101697043A (en) * | 2009-06-24 | 2010-04-21 | 深超光电（深圳）有限公司 | Liquid crystal display panel |
| CN202421677U (en) * | 2011-12-29 | 2012-09-05 | 上海天马微电子有限公司 | Connecting device for liquid crystal display |
-
2011
- 2011-12-29 CN CN201110453711.0A patent/CN103185991B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10187102A (en) * | 1996-12-26 | 1998-07-14 | Casio Comput Co Ltd | Liquid crystal display device |
| CN1529202A (en) * | 2000-05-25 | 2004-09-15 | ������������ʽ���� | Liquid crystal device, its manufacturing method and electronic apparatus |
| US20040174484A1 (en) * | 2001-03-15 | 2004-09-09 | Nec Lcd Technologies, Ltd. | Active matrix type liquid crystal display device and method of manufacturing the same |
| JP2003248237A (en) * | 2003-01-09 | 2003-09-05 | Seiko Epson Corp | Liquid crystal display device |
| CN101697043A (en) * | 2009-06-24 | 2010-04-21 | 深超光电（深圳）有限公司 | Liquid crystal display panel |
| CN202421677U (en) * | 2011-12-29 | 2012-09-05 | 上海天马微电子有限公司 | Connecting device for liquid crystal display |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111679488A (en) * | 2020-06-29 | 2020-09-18 | 赣州市秋田微电子有限公司 | Conduction method of liquid crystal display ITO |
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|---|---|
| CN103185991B (en) | 2015-07-22 |
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