CN103184031B - LED packaging glue and preparation method thereof - Google Patents
LED packaging glue and preparation method thereof Download PDFInfo
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- CN103184031B CN103184031B CN201310115529.3A CN201310115529A CN103184031B CN 103184031 B CN103184031 B CN 103184031B CN 201310115529 A CN201310115529 A CN 201310115529A CN 103184031 B CN103184031 B CN 103184031B
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Abstract
The invention relates to LED packaging glue and a preparation method thereof, and belongs to the field of glues. The preparation method comprises the following steps: firstly, adding first vinyl silicone oil and first vinyl MQ silicon resin in a reaction vessel and stirring , and adding platinum catalyzer to the reaction vessel under the condition of normal temperature and vacuum to obtain separation base glue of group A; secondly, adding methyl hydrogen silicone oil, second vinyl silicone oil and second vinyl MQ silicon resin in sequence to the reaction vessel and stirring, and adding 1-Ethynyl-1-cyclohexanol and tackifier in sequence under the condition of normal temperature and vacuum to obtain separation base glue of group B; and finally, mixing the separation base glue of group A obtained in step a and the separation base glue of group B obtained in step b at mass radio of 0.5:1 to 2:1, and solidifying to obtain the LED packaging glue. The LED packaging glue provided by the invention has the advantages of good liquidity, high transparence, good flexibility, good weathering resistance, non-yellowing, adaptability to high-and-low temperature and the like.
Description
Technical field
The present invention relates to adhesive area, especially relate to a kind of LED packaging plastic and preparation method thereof.
Background technology
The effects such as LED lamp bar joint sealant is widely used in the soft lamp bar of LED surface encapsulation, and the special embedding of the LED illuminator lamps such as hard lamp bar, super flux LED lamp bar, Wall-shaped lamp, plays the waterproof insulation protection to electronic component, the protection against the tide of painting layer circuit board.
Current this employing of the soft lamp bar of LED matrix epoxy encapsulation glue on the market, PU urethane encapsulation glue, condensed type (10:1) or silica gel (4:1), but the shortcoming such as these packaging plastics exist that yellowing resistance is poor, resistant of high or low temperature is poor or tear strength is poor, this type of packaging plastic have high transparent, snappiness good and good weatherability, the feature of not flavescence and fabulous high and low temperature resistance.The single component silica gel of a Japanese SHIN-ETSU HANTOTAI using on the market in addition, cohesiveness and snappiness are fine, but because add the powders such as white carbon black in glue, light transmission is very poor, and transmittance is less than 90%.
Summary of the invention
For the deficiencies in the prior art, problem to be solved by this invention is a kind of good fluidity of proposition, transparency is high, snappiness good, the LED packaging plastic that good weatherability, not flavescence and high and low temperature resistance are strong.
For solving the problems of the technologies described above, the technical solution used in the present invention is:
A preparation method for LED packaging plastic, comprises the steps:
A) preparation of A component base glue: adding mass percent in reaction vessel is that the first vinyl MQ silicone resin that the first vinyl silicone oil of 15%～25% and mass percent are 74.5%～83% stirs, under 20～25 DEG C of vacuum conditions of normal temperature, the platinum catalyst that is 0.5～2% by mass percent adds reaction vessel, obtains A component base glue;
B) preparation of B component base glue: add successively the second vinyl MQ silicone resin that mass percent is 20%～30% Methyl Hydrogen Polysiloxane Fluid, mass percent is 14.95%～16.95% the second vinyl silicone oil and mass percent are 50%～60% to stir in reaction vessel, under 20～25 DEG C of vacuum conditions of normal temperature, be the tackifier that 0.05% ethynylcyclohexanol and mass percent are 3%～5% to adding successively mass percent in reaction vessel, obtain B component base glue;
C) preparation of LED packaging plastic: to make B component base glue in A component base glue and step b be that 0.5:1～2:1 mixes according to mass ratio by making in step a, after solidifying, makes LED packaging plastic.
Preferably, the vinyl degree of the second vinyl MQ silicone resin in the first vinyl MQ silicone resin, the described step b in described step a is 1.0%～2.5%.
Further, the vinyl degree of the second vinyl MQ silicone resin in the first vinyl MQ silicone resin, the described step b in described step a is 2.3%.
Preferably, in described step b, tackifier are the one in KE-102, SC-101, BA-402, PH-3, Alink25.
Preferably, in described step c, the mass ratio of A glue and B glue is 1:1.
Preferably, in described step c, condition of cure is solidification value while being 20 DEG C～30 DEG C, and be 12～24h set time, or solidification value is while being 80 DEG C, and be 1～2h set time.
A kind of LED packaging plastic, comprise A component base glue and B component base glue, described A component base glue comprises (each component by percentage to the quality): the first vinyl silicone oil 15%～25%, the first vinyl MQ silicone resin 74.5%～83%, platinum catalyst 0.5～2%, described B component base glue comprises (each component by percentage to the quality): Methyl Hydrogen Polysiloxane Fluid 20%～30%, the second vinyl silicone oil 14.95%～16.95%, the second vinyl MQ silicone resin 50%～60%, ethynylcyclohexanol 0.05% and tackifier.
Preferably, described tackifier are the one in KE-102, SC-101, BA-402, PH-3, Alink25, and the mass percent of described tackifier is 3%～5%.
Preferably, described A component base glue comprises (each component by percentage to the quality): the first vinyl silicone oil 20%, the first vinyl MQ silicone resin 79%, platinum catalyst 1%, described B component base glue comprises (each component by percentage to the quality): Methyl Hydrogen Polysiloxane Fluid 25%, the second vinyl silicone oil 15.95%, the second vinyl MQ silicone resin 55%, ethynylcyclohexanol 0.05%, tackifier 4%.
The invention has the beneficial effects as follows: the prepared LED packaging plastic of the present invention has following features:
1, good waterproof performance, does not whiten, and product soaked bright light experiment in 6 months is unchanged;
2, not xanthochromia, solidify after heat-resisting, good ultraviolet resistance, can be within the scope of-50 DEG C～250 DEG C life-time service;
3, solidify after high, the good bending property of high, the tensile strength of transparency, tear strength;
4, can with the close adhesion such as silica gel sleeve pipe, pcb board.
Embodiment
Example of the present invention is can not limit the present invention to explanation of the present invention, and any change and adjustment in implication and the scope suitable with the present invention, all should think within the scope of the invention.
Below in conjunction with embodiment, the present invention will be further described.
Embodiment 1
A preparation method for LED packaging plastic, is characterized in that, comprises the steps:
A) preparation of A component base glue: adding mass percent in reaction vessel is the first vinyl MQ silicone resin that the first vinyl silicone oil of 15% and mass percent are 83%, under 20～25 DEG C of conditions of normal temperature, vacuumize stirring, wait to stir, the platinum catalyst that is 2% by mass percent adds reaction vessel, obtains A component base glue;
B) preparation of B component base glue: add successively the second vinyl MQ silicone resin that mass percent is 20% Methyl Hydrogen Polysiloxane Fluid, mass percent is 14.95% the second vinyl silicone oil and mass percent are 60% in reaction vessel, under 20～25 DEG C of conditions of normal temperature, it is vacuumized to stirring, wait to stir, be the tackifier that 0.05% ethynylcyclohexanol and mass percent are 5% to adding successively mass percent in reaction vessel, obtain B component base glue;
C) preparation of LED packaging plastic: to make B component base glue in A component base glue and step b be, after 0.5:1 solidifies, to make LED packaging plastic according to mass ratio by making in step a.
Vinyl silicone oil is the low molecular weight polysiloxane with vinyl on part Siliciumatom, and it can be the main raw material of add-on type liquid silicon rubber, silicon gel etc.; Properties-correcting agent/plastics additive/the supporting material of rubber unvulcanizate, plays matrix effect in the present invention, and the viscosity of the first vinyl silicone oil and the second vinyl silicone oil is 500cs in the present embodiment.
A kind of silicone resin that MQ silicone resin is made up of simple function group Si-O unit (M unit) and four-functional group Si-O unit (SiQZ is called for short Q unit), has the tight globe of bilayer structure.Vinyl MQ silicone resin is that vinyl is the capping group of MQ silicone resin, and it can improve curing performance, makes in the present invention solidifying agent, increases degree of crosslinking, improves hardness and intensity.The first vinyl MQ silicone resin and second its contents of ethylene of vinyl MQ silicone resin are 1.0% in the present embodiment.
Methyl Hydrogen Polysiloxane Fluid is the dimethyl silicone oil that contains part methyl hydrogen silica structure unit, and it can make whipping agent of antiseized separant and linking agent and foam silicone rubber etc., makees in the present invention linking agent.
Ethynylcyclohexanol is white crystal or colourless transparent liquid, and fusing point is 30～32 DEG C, and boiling point is 180 DEG C, it can be used as silicon rubber inhibitor, storage stabilizing agent, the stablizer of ink, paint and coating, also can be used as the inhibiter of acid solution, play in the present invention inhibitor.
Tackifier have a variety of, comprise KE-102, SC-101, BA-402, PH-3, Alink25.Wherein KE-102 originates from the good synthetic materials of Guangzhou Kang Gu company limited, SC-101 and originates from Jiangsu Bo Cheng Chemical Co., Ltd., BA-402 and originate from that Shanghai Shu Nian Chemical Co., Ltd. is originated from Beijing hundred high new chemical materials company limited, PH-3, Alink25 originates from Mai Tu company of the U.S., the inventor all did test to above several tackifier, the performance of the obtained packaging plastic of SC-101 that wherein Bo Cheng Chemical Co., Ltd. in Jiangsu produces is more excellent, therefore the preferred SC-101 of the present embodiment, tackifier effect is in the present invention the viscous force that improves B component base glue.
The condition of cure of step c is 20 DEG C of solidification values in the present embodiment, set time 12h.
Embodiment 2
Identical with embodiment 1, difference is:
In step a: (by percentage to the quality) first vinyl silicone oil is 20%, the first vinyl MQ silicone resin is 79%, platinum catalyst is 1%, and wherein the content of the first vinyl MQ silicone resin medium vinyl is 2.3%;
In step b: (by percentage to the quality) Methyl Hydrogen Polysiloxane Fluid is 25%, the second vinyl silicone oil is 15.95%, the second vinyl MQ silicone resin is 55%, ethynylcyclohexanol is 0.05%, SC-101 is 4%.
In step c: the mass ratio of A component base glue and B component base glue is 1:1, and its condition of cure is 25 DEG C of solidification values, set time 18h.
Embodiment 3
Identical with embodiment 1, difference is:
In step a: (by percentage to the quality) first vinyl silicone oil is 25%, the first vinyl MQ silicone resin is 74.5%, platinum catalyst is 0.5%, and wherein the content of the first vinyl MQ silicone resin medium vinyl is 2.3%;
In step b: (by percentage to the quality) Methyl Hydrogen Polysiloxane Fluid is 30%, the second vinyl silicone oil is 16.95%, the second vinyl MQ silicone resin is 50%, ethynylcyclohexanol is 0.05%, SC-101 is 3%.
In step c: the mass ratio of A component base glue and B component base glue is 2:1, and its condition of cure is 30 DEG C of solidification values, set time 24h.
Embodiment 4
Identical with embodiment 2, difference is:
In step c: the mass ratio of A component base glue and B component base glue is 1:1, and its condition of cure is 80 DEG C of solidification values, set time 1h.
Embodiment 5
Identical with embodiment 4, difference is:
In step c: the mass ratio of A component base glue and B component base glue is 1:1, and its condition of cure is 80 DEG C of solidification values, set time 1.5h.
Embodiment 6
Identical with embodiment 4, difference is:
In step c: the mass ratio of A component base glue and B component base glue is 1:1, and its condition of cure is 80 DEG C of solidification values, set time 2h.
Embodiment 7
To embodiment 1～embodiment 6 make A component base glue and B component base glue survey respectively solidify before its physicals (comprising viscosity and outward appearance), in embodiment 1～embodiment 6, A component base glue and the concrete test result of B component base glue are in table 1.Table 1 is A component base glue and B component base glue quantitative measurement result table in embodiment 1～embodiment 6.
As shown in table 1:
Table 1
LED packaging plastic after embodiment 1～embodiment 6 is solidified does performance test, and embodiment 1～embodiment 6 makes the specific performance test result of LED packaging plastic in table 2.Table 2 makes LED packaging plastic the performance test results table for embodiment 1～embodiment 6.
As shown in table 2:
Table 2
Can be found out by table 1 and table 2, the physicals of solidifying front A component base glue and B component base glue of embodiment 2 and embodiment 5 is better, the properties of the LED packaging plastic after solidifying is also better, Best Curing is that solidification value is 25 DEG C, set time 18h, or solidification value is 80 DEG C, be 1.5h set time.
LED packaging plastic prepared by the present invention, compared with like product on the market, has good fluidity, an advantage such as transparency is high, snappiness good, good weatherability, not flavescence and high and low temperature resistance.
The foregoing is only preferred embodiment of the present invention, in order to limit the present invention, within the spirit and principles in the present invention not all, any amendment of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (7)
1. a preparation method for LED packaging plastic, is characterized in that, comprises the steps:
A) preparation of A component base glue: adding mass percent in reaction vessel is that the first vinyl MQ silicone resin that the first vinyl silicone oil of 15%～25% and mass percent are 74.5%～83% stirs, under 20～25 DEG C of vacuum conditions of normal temperature, the platinum catalyst that is 0.5～2% by mass percent adds reaction vessel, obtains A component base glue;
B) preparation of B component base glue: add successively the second vinyl MQ silicone resin that mass percent is 20%～30% Methyl Hydrogen Polysiloxane Fluid, mass percent is 14.95%～16.95% the second vinyl silicone oil and mass percent are 50%～60% to stir in reaction vessel, under 20～25 DEG C of vacuum conditions of normal temperature, be the tackifier that 0.05% ethynylcyclohexanol and mass percent are 3%～5% to adding successively mass percent in reaction vessel, obtain B component base glue;
C) preparation of LED packaging plastic: to make B component base glue in A component base glue and step b be that 0.5:1～2:1 mixes according to mass ratio by making in step a, after solidifying, makes LED packaging plastic;
Wherein, the vinyl degree of the second vinyl MQ silicone resin in the first vinyl MQ silicone resin, the described step b in described step a is 2.3%.
2. the preparation method of LED packaging plastic as claimed in claim 1, it is characterized in that: in described step b, tackifier are the one in SC-101, PH-3, Alink 25, SC-101 originates from Jiangsu Bo Cheng Chemical Co., Ltd., PH-3 originates from Shanghai Shu Nian Chemical Co., Ltd., and Alink 25 originates from Mai Tu company of the U.S..
3. the preparation method of LED packaging plastic as claimed in claim 1, is characterized in that: in described step c, the mass ratio of A glue and B glue is 1:1.
4. the preparation method of LED packaging plastic as claimed in claim 1, is characterized in that: in described step c, condition of cure is solidification value while being 20 DEG C～30 DEG C, and be 12～24h set time, or solidification value is while being 80 DEG C, and be 1～2h set time.
5. the LED packaging plastic that as claimed in claim 1 prepared by preparation method, it is characterized in that: it comprises A component base glue and B component base glue, each component of described A component base glue comprises by percentage to the quality: the first vinyl silicone oil 15%～25%, the first vinyl MQ silicone resin 74.5%～83%, platinum catalyst 0.5～2%, each component of described B component base glue comprises by percentage to the quality: Methyl Hydrogen Polysiloxane Fluid 20%～30%, the second vinyl silicone oil 14.95%～16.95%, the second vinyl MQ silicone resin 50%～60%, ethynylcyclohexanol 0.05% and tackifier 3%～5%, wherein, the first vinyl MQ silicone resin, the vinyl degree of the second vinyl MQ silicone resin is 2.3%.
6. LED packaging plastic as claimed in claim 5, it is characterized in that: described tackifier are the one in SC-101, PH-3, Alink 25, SC-101 originates from Jiangsu Bo Cheng Chemical Co., Ltd., and PH-3 originates from Shanghai Shu Nian Chemical Co., Ltd., and Alink 25 originates from Mai Tu company of the U.S..
7. LED packaging plastic as claimed in claim 6, it is characterized in that: each component of described A component base glue comprises by percentage to the quality: the first vinyl silicone oil 20%, the first vinyl MQ silicone resin 79%, platinum catalyst 1%, each component of described B component base glue comprises by percentage to the quality: Methyl Hydrogen Polysiloxane Fluid 25%, the second vinyl silicone oil 15.95%, the second vinyl MQ silicone resin 55%, ethynylcyclohexanol 0.05%, tackifier 4%.
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| CN201310115529.3A CN103184031B (en) | 2013-04-03 | 2013-04-03 | LED packaging glue and preparation method thereof |
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| CN201310115529.3A CN103184031B (en) | 2013-04-03 | 2013-04-03 | LED packaging glue and preparation method thereof |
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| CN103184031B true CN103184031B (en) | 2014-10-15 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104004493B (en) * | 2014-03-04 | 2015-12-09 | 张光增 | A kind of low-temperature curing high transparency silica gel and preparation method thereof |
| CN104479622B (en) * | 2014-11-27 | 2016-06-15 | 深圳市森日有机硅材料股份有限公司 | A kind of preparation method of lcd screen protecting film liquid silastic |
| WO2016090574A1 (en) * | 2014-12-10 | 2016-06-16 | 深圳市森日有机硅材料有限公司 | Fully transparent liquid silicone rubber composition |
| CN104762058B (en) * | 2015-04-14 | 2017-02-22 | 复旦大学 | Silica gel liquid crystal display adhesive and application method thereof |
| CN104774586B (en) * | 2015-04-14 | 2017-02-08 | 复旦大学 | Novel liquid crystal screen adhesive and using method thereof |
| CN104774585B (en) * | 2015-04-14 | 2017-02-08 | 复旦大学 | Adhesive for liquid crystal display and use method thereof |
| CN105255440B (en) * | 2015-11-05 | 2017-09-29 | 杭州福斯特应用材料股份有限公司 | A kind of flexible LED lamp bar organic silicon potting adhesive and preparation method thereof |
| CN107854202A (en) * | 2017-11-15 | 2018-03-30 | 苏州爱慕内衣有限公司 | A kind of personal reparation silica gel justice breast and preparation method thereof |
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|---|---|---|---|---|
| WO2004083334A2 (en) * | 2003-03-17 | 2004-09-30 | Dow Corning Corporation | Solventless silicone pressure sensitive adhesives with improved high temperature cohesive strength |
| CN102965069A (en) * | 2012-11-16 | 2013-03-13 | 烟台德邦先进硅材料有限公司 | Vulcanization-proof LED (light-emitting diode) packaging silica gel |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004083334A2 (en) * | 2003-03-17 | 2004-09-30 | Dow Corning Corporation | Solventless silicone pressure sensitive adhesives with improved high temperature cohesive strength |
| CN102965069A (en) * | 2012-11-16 | 2013-03-13 | 烟台德邦先进硅材料有限公司 | Vulcanization-proof LED (light-emitting diode) packaging silica gel |
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