CN103182749A - Cutting method for sheet-type polycrystalline materials - Google Patents
Cutting method for sheet-type polycrystalline materials Download PDFInfo
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- CN103182749A CN103182749A CN2011104499316A CN201110449931A CN103182749A CN 103182749 A CN103182749 A CN 103182749A CN 2011104499316 A CN2011104499316 A CN 2011104499316A CN 201110449931 A CN201110449931 A CN 201110449931A CN 103182749 A CN103182749 A CN 103182749A
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- cutting
- polycrystalline materials
- polycrystalline
- cutting method
- sheet
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
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Priority Applications (1)
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CN2011104499316A CN103182749A (en) | 2011-12-29 | 2011-12-29 | Cutting method for sheet-type polycrystalline materials |
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CN2011104499316A CN103182749A (en) | 2011-12-29 | 2011-12-29 | Cutting method for sheet-type polycrystalline materials |
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CN103182749A true CN103182749A (en) | 2013-07-03 |
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CN2011104499316A Pending CN103182749A (en) | 2011-12-29 | 2011-12-29 | Cutting method for sheet-type polycrystalline materials |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010017130A1 (en) * | 2000-01-26 | 2001-08-30 | Hitoshi Ohmori | Apparatus and method for cutting ingots |
JP2001246617A (en) * | 2000-03-07 | 2001-09-11 | Canon Inc | Method and device for cutting crystal |
US20070251516A1 (en) * | 2006-04-28 | 2007-11-01 | Nieber Albert R | Precision slicing of large work pieces |
CN102049818A (en) * | 2009-10-28 | 2011-05-11 | 上海日进机床有限公司 | Cutting method for crystalline silicon ingot |
CN102285011A (en) * | 2011-08-07 | 2011-12-21 | 江西金葵能源科技有限公司 | Method for cutting solar-grade polycrystalline silicon sheets by using diamond wires |
CN102294757A (en) * | 2011-08-08 | 2011-12-28 | 江西金葵能源科技有限公司 | Method for splicing short mono-crystal rods cut by using diamond wire |
-
2011
- 2011-12-29 CN CN2011104499316A patent/CN103182749A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010017130A1 (en) * | 2000-01-26 | 2001-08-30 | Hitoshi Ohmori | Apparatus and method for cutting ingots |
JP2001246617A (en) * | 2000-03-07 | 2001-09-11 | Canon Inc | Method and device for cutting crystal |
US20070251516A1 (en) * | 2006-04-28 | 2007-11-01 | Nieber Albert R | Precision slicing of large work pieces |
CN102049818A (en) * | 2009-10-28 | 2011-05-11 | 上海日进机床有限公司 | Cutting method for crystalline silicon ingot |
CN102285011A (en) * | 2011-08-07 | 2011-12-21 | 江西金葵能源科技有限公司 | Method for cutting solar-grade polycrystalline silicon sheets by using diamond wires |
CN102294757A (en) * | 2011-08-08 | 2011-12-28 | 江西金葵能源科技有限公司 | Method for splicing short mono-crystal rods cut by using diamond wire |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: YOUYAN OPTOELECTRONIC NEW MATERIAL CO., LTD. Free format text: FORMER OWNER: BEIJING CENTRAL INST.OF THE NONFERROUS METAL Effective date: 20130929 Free format text: FORMER OWNER: YOUYAN OPTOELECTRONIC NEW MATERIAL CO., LTD. Effective date: 20130929 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 100088 XICHENG, BEIJING TO: 065001 LANGFANG, HEBEI PROVINCE |
|
TA01 | Transfer of patent application right |
Effective date of registration: 20130929 Address after: 065001 hi tech Development Zone, Hebei, Langfang Applicant after: Youyan Photoelectric New Material Co.,Ltd. Address before: 100088 Beijing city Xicheng District Xinjiekou Avenue No. 2 Applicant before: General Research Institute for Nonferrous Metals Applicant before: Youyan Photoelectric New Material Co.,Ltd. |
|
C05 | Deemed withdrawal (patent law before 1993) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130703 |