CN103180923B - Fixture, process fixture, combination is kept to keep fixture and by adhesion holding means - Google Patents
Fixture, process fixture, combination is kept to keep fixture and by adhesion holding means Download PDFInfo
- Publication number
- CN103180923B CN103180923B CN201180050918.1A CN201180050918A CN103180923B CN 103180923 B CN103180923 B CN 103180923B CN 201180050918 A CN201180050918 A CN 201180050918A CN 103180923 B CN103180923 B CN 103180923B
- Authority
- CN
- China
- Prior art keywords
- fixture
- adhesion
- elastomeric element
- holding
- keep
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 75
- 230000033001 locomotion Effects 0.000 claims description 17
- 239000003990 capacitor Substances 0.000 description 39
- 239000000463 material Substances 0.000 description 34
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 25
- 229910052710 silicon Inorganic materials 0.000 description 25
- 239000010703 silicon Substances 0.000 description 25
- 239000002245 particle Substances 0.000 description 18
- 239000000853 adhesive Substances 0.000 description 17
- 230000001070 adhesive effect Effects 0.000 description 17
- 239000011248 coating agent Substances 0.000 description 17
- 238000000576 coating method Methods 0.000 description 17
- 229920001971 elastomer Polymers 0.000 description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 13
- 239000005060 rubber Substances 0.000 description 13
- 239000004575 stone Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- 238000003825 pressing Methods 0.000 description 10
- 230000005489 elastic deformation Effects 0.000 description 9
- 239000013536 elastomeric material Substances 0.000 description 9
- 238000007790 scraping Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- -1 politef Substances 0.000 description 8
- 238000012545 processing Methods 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 238000012546 transfer Methods 0.000 description 8
- 238000012856 packing Methods 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000009740 moulding (composite fabrication) Methods 0.000 description 6
- 230000033228 biological regulation Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229920002379 silicone rubber Polymers 0.000 description 5
- 239000004945 silicone rubber Substances 0.000 description 5
- 239000004698 Polyethylene Substances 0.000 description 4
- 238000007259 addition reaction Methods 0.000 description 4
- 238000013459 approach Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000007598 dipping method Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000037452 priming Effects 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229910002012 Aerosil® Inorganic materials 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000013013 elastic material Substances 0.000 description 2
- 150000002221 fluorine Chemical class 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 229950000845 politef Drugs 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 241000278713 Theora Species 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 125000000864 peroxy group Chemical group O(O*)* 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000012858 resilient material Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/04—Mountings specially adapted for mounting on a chassis
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
Abstract
The problem of the present application is, it is provided that although holding of can adhering according to anticipation by adhesion but also is able to easily make the holding fixture departed from by adhesion by the almost all kept of adhering, process fixture, combination keep fixture and by adhesion holding means.Solve the present application of this problem to relate to being configured to possessing jig main body (2) and be arranged at surface and the maximal roughness Ry(JIS B0601-1994 of jig main body (2)) be the holding fixture (1) of the elastomeric element (3) of 1.0 μm～6.0 μm, be configured to possess this holding fixture (1) and the process fixture of release piece, be configured to possess the combination of at least one this holding fixture (1) keep fixture and possess this combination keep fixture by adhesion holding means.
Description
Technical field
The present invention relates to keep fixture, process fixture, combination keeps fixture and by adhesion holding means, in more detail and
Speech, although relating to keep by adhesion according to anticipation adhesion but also being able to easily make by the almost all kept of adhering
The holding fixture that departed from by adhesion, process fixture, combination keeps fixture and by adhesion holding means.
Background technology
In the past, such as when manufacturing the miniature parts etc. such as chip capacitor (chip capacitor), use can be by energy
The adhesion such as miniature parts parts enough manufacturing this small parts etc. is held in the holding fixture on surface.Such as, patent documentation 1 institute
The fixture that keeps recorded is characterised by, " at least surface element is formed by having adhesive rubber elastic material, it is possible to utilize it
Adhesion strength and keep miniature parts in this elastomeric material surfaces contiguity " (with reference to the technical scheme 1 of patent documentation 1).In order to use
Such holding fixture manufactures miniature parts etc., and miniature parts is as the state being held in holding fixture by adhesion in adhesion
Lower supplied to various manufacturing processes etc..Further, the miniature parts etc. will made when adhesion is held in and keeps fixture
Take off from keeping fixture.
As from the method keeping fixture to take off miniature parts etc., such as, there is following method: make the miniature parts such as scraper
Scraping parts slide on elastomeric material surfaces, are thus taken off by the miniature parts etc. kept by adhesion.As such method,
In patent documentation 2, specifically there is following record: " processing method of a kind of electronic component possesses following operation: have supporting mass
Protect by the way of adhesion with this adhesion coating of the electronic component part keeper of the adhesion coating in the face being formed at supporting mass
Hold the operation of multiple electronic component；The electronic component being held in above-mentioned adhesion coating is implemented the operation of predetermined processing；And it is logical
Cross and utilize the front end of above-mentioned blade make adhesion coating depression and make blade towards adhesion coating surface direction relative movement in this condition
Make the operation that electronic component departs from from adhesion coating." (with reference to technical scheme 4 etc..).
In the method described in patent documentation 2, as shown in Fig. 3 of patent documentation 2, " utilized blade by then passing through
Front end make adhesion coating depression and make blade in this condition towards adhesion coating surface direction relative movement " mode and make electronic component
2 tilt and depart from, so setting the size of electronic component, the etat lacunaire of adhesion coating, the adhesion of adhesion coating if inappropriate
Power, the translational speed etc. of blade, make electronic unit overturning again be adhered to adhesion coating surface, it is impossible to according to anticipation the most sometimes
And take off this electronic component from adhesion coating.
It addition, as other method, patent documentation 3 has following record: " processing method of a kind of electronic component, it is special
Levy and be, comprise the following steps: prepare that there is sticky material layer, non-adhesive part or adhesion strength and be less than the low of sticky material layer
The step of the holding unit of sticky limit part；By making the end face of electronic component be adhered to the sticky material of above-mentioned holding unit
Layer and keep the step of this electronic component；And make scraping unit make above-mentioned non-along the surface of above-mentioned sticky material layer and court
Adhesion part or above-mentioned low sticky limit part move towards the direction tending to moving direction end, thus scrape from sticky material layer
The step of electronic component " (with reference to technical scheme 8 etc..).As the method described in patent documentation 3, even if making miniature parts
Scraping parts slide on elastomeric material surfaces, sometimes by adhesion also can overturning and be again adhered to adhesion coating surface, thus
Cannot easily take off miniature parts.
Especially because miniature parts etc. the most gradually tend to miniaturization, therefore the size of miniature parts etc. becomes more
Little, the most easily produce the problem that miniature parts as described above etc. is adhered again.
Patent documentation 1: Japanese Patent Publication 07-93247 publication
Patent documentation 2: Japanese Unexamined Patent Publication 2003-77772 publication
Patent documentation 3: Japanese Unexamined Patent Publication 2004-193366 publication
Summary of the invention
It is an object of the invention to, it is provided that although holding of can adhering according to anticipation by adhesion but also is able to easily
Holding fixture that the almost all making adhesion keep is departed from by adhesion, process fixture, combination keeps fixture and by adhesion
Holding means.
Present inventor finds, it is carried out adhesion and keeps and towards side will be pressed on elastomeric element by adhesion
In the holding fixture that pressing is disengaged it from by adhesion, if existing technology general knowledge is not make adhesion keep by adhesion
Cohesiveness apparent height is smooth, and holding of cannot adhering according to anticipation is by adhesion, if violating above-mentioned technology general knowledge and making adhesion
The surface on property surface has roughness to a certain degree, even if then making to be contacted with cohesiveness surface by adhesion, if but the most right
It carries out pressing, cannot adhere securely holding this by adhesion, if while it is true, but adhesion will be pressed on by adhesion
Property surface, then embody the adhesion strength almost identical with smooth cohesiveness surface it is thus possible to adhesion keep by adhesion, and
And by just can according to anticipation easily be made almost all by adhesion by what adhesion kept by adhesion towards side pressing
Departing from, the present inventor completes the present application based on as above new discovery.
So, present inventor finds, if making the surface on cohesiveness surface have roughness to a certain degree, then can
Enough obtain the high adhesion strength when pressing is by adhesion with high level and by the detachment of adhesion simultaneously, thus play in adhesion
The high detachment that cannot obtain in the adjustment of the simple adhesion strength on property surface, the present inventor completes based on as above new discovery
The present application.
The fixture that keeps as the present invention of the first method for solving above-mentioned problem is characterised by, is configured to tool
Standby: jig main body；And elastomeric element, this elastomeric element is arranged at the surface of above-mentioned jig main body, and its maximal roughness Ry
(JIS B0601-1994) is 1.0 μm～6.0 μm.
The preferred example of this holding fixture is, the concavo-convex equispaced Sm(JIS B0601-of above-mentioned elastomeric element
1994) it is 5.0 μm～15.0 μm.
The fixture that processes as the present invention of the second method for solving above-mentioned problem is characterised by, is configured to tool
Standby: holding fixture involved in the present invention；And release piece, this release piece enters along the surface of the elastomeric element of above-mentioned holding fixture
Row relative movement and make by adhere keep being departed from by adhesion.
Combination as the present invention of the third method for solving above-mentioned problem keeps fixture to be characterised by possessing:
First keeps fixture, and this first holding fixture is configured to the table possessing the first jig main body with being arranged at above-mentioned first jig main body
First elastomeric element in face；And second keep fixture, this second keep fixture be configured to include the second jig main body and setting
In second elastomeric element on the surface of above-mentioned second jig main body, above-mentioned first keeps fixture and above-mentioned second to keep fixture
At least one party is holding fixture involved in the present invention, and, above-mentioned second elastomeric element has more than above-mentioned first elastic
The adhesion strength of the adhesion strength of part.
This combination keeps the preferred example of fixture to be that above-mentioned second holding fixture is retaining clip involved in the present invention
Tool.
As being characterised by by adhesion holding means of the present invention of the fourth method for solving above-mentioned problem, tool
Standby combination involved in the present invention keeps fixture.
The effect of invention
Fixture is kept to possess jig main body and the surface being arranged at this jig main body and due to involved in the present invention
Large roughness Ry is 1.0 μm～the elastomeric element of 6.0 μm, if so elastomeric element will be pressed on by adhesion, then adhered
The surface of the contact surface of thing and elastomeric element is touched and is made to be held in elastomeric element by adhesion adhesion, on the other hand, if
Towards side press by adhesion, then peeled off from the surface of elastomeric element by the contact surface of adhesion so that by adhesion from
Elastomeric element departs from.
It addition, the involved in the present invention fixture that processes possesses holding fixture involved in the present invention, involved in the present invention
Combination keeps fixture to possess at least one holding fixture involved in the present invention, involved in the present invention by adhesion holding means
Possess combination involved in the present invention and keep fixture.
Although keeping by adhesion it is thus possible according to the invention to provide can adhere according to anticipation but also being able to hold
Holding fixture that the almost all making adhesion keep of changing places is departed from by adhesion, process fixture, combination keeps fixture and is glued
Thing holding means.
Accompanying drawing explanation
Fig. 1 is the brief perspective views keeping fixture being shown as the involved in the present invention example keeping fixture.
Fig. 2 is the brief front view processing fixture being shown as the involved in the present invention example processing fixture.
Fig. 3 is the letter of the combination holding fixture being shown as the example that combination involved in the present invention keeps fixture
Figure.
Fig. 4 is to be shown as being filled by adhesion holding by an example of adhesion holding means involved in the present invention
The brief description figure put.
Fig. 5 is to be shown in being kept by adhesion by an example of adhesion holding means as involved in the present invention
Device utilizes the first holding fixture and the brief description figure of the state keeping chip capacitor main body of dangling.
Fig. 6 is to be shown in being kept by adhesion by an example of adhesion holding means as involved in the present invention
The chip capacitor main body pendency that will be formed with electrode in device is held in the brief description figure of state of the first holding fixture.
Fig. 7 is to be shown in being kept by adhesion by an example of adhesion holding means as involved in the present invention
Pendency is held in brief towards the second state keeping fixture pressing of the chip capacitor main body of the first holding fixture by device
Explanatory diagram.
Fig. 8 is to be shown in being kept by adhesion by an example of adhesion holding means as involved in the present invention
The chip capacitor pendency formed arranging electrode in both ends application in device is held in the state of the second holding fixture
Brief description figure.
Detailed description of the invention
Holding fixture, process fixture, combination holding fixture involved in the present invention is held in for adhesion and is adhered
Thing holding means by adhesion, be enumerated can manufacture need by adhesion be held in these devices above-mentioned by adhesion
By adhesion parts, such as, list small appliance parts, small-sized machine component parts and small electronic component and use
Parts etc..Further, since the manufacture process of adhesion is also included by the conveying operation etc. of adhesion, so by adhesion also
Including by adhesion itself, such as small appliance, small-sized machine component and small electronic component etc..Therefore, in the present invention,
Without clearly distinguishing by adhesion and by adhesion parts.At these by adhesion, it is held in this as applicable by adhesion
Involved by invention keep fixture, process fixture, combination keep fixture and by adhesion holding means by adhesion, it is possible to
Enumerate small electronic component and/or small electronic component parts etc..As small electronic component and miniature electric zero
Part parts, such as, can enumerate capacitance sheet (sometimes referred to as chip capacitor.), inductive piece, resistor disc, FPC, wafer etc. become
Product or unfinished work etc. and/or can be manufactured these by the such as prism or cylinder of adhesion, one end, be there is flange
Prism or cylinder, both ends there are prism or the cylinder etc. of flange.
The involved in the present invention fixture that keeps is configured to the maximal roughness possessing jig main body He having in above-mentioned scope
The elastomeric element on the cohesiveness surface of Ry, it is possible to the cohesiveness table of elastomeric element will be held in by adhesion adhesion according to anticipation
Face, on the other hand, easily can be held in being taken off by adhesion of elastomeric element when necessary by adhesion.In order to be adhered
Thing adhesion is held in holding fixture involved in the present invention, will be pressed on the cohesiveness surface of elastomeric element by adhesion.Then,
The cohesiveness surface of the elastomeric element for being pressed by the contact surface by adhesion, such as, have above-mentioned maximal roughness
The mountain peak part generation elastic deformation of Ry and mountain valley part becomes smooth, the cohesiveness surface of this elastomeric element with by adhesion
Contact surface touches, and thus will be held in elastomeric element by adhesion adhesion.On the other hand, in order to the present invention will be held in by adhesion
Involved keeps being taken off by adhesion of fixture, from side pressing by adhesion so that this is tilted by adhesion.Then, occur
The mountain peak part of elastic deformation is restored and is made cohesiveness surface have maximal roughness Ry in above-mentioned scope, by adhesion
Contact surface easily from the surface of elastomeric element peel off, thus make to be departed from elastomeric element by adhesion.So, according to prior art
Technology general knowledge understand, if not making cohesiveness apparent height smooth, holding of cannot adhering is by adhesion, and in the present invention
But contrary with above-mentioned technology general knowledge, when the cohesiveness surface of elastomeric element has maximal roughness Ry in above-mentioned scope, energy
Enough simultaneously acquisition with high level presses by high adhesion strength during adhesion and by the detachment of adhesion, its result, although energy
Enough carry out adhesion holding according to anticipation to by adhesion, but also be able to easily make almost all be departed from by adhesion.
Referring to the drawings the holding fixture as the involved in the present invention example keeping fixture is illustrated.Such as figure
Shown in 1, this holding fixture 1 possesses jig main body 2 and elastomeric element 3, and this elastomeric element 3 is arranged at the surface of jig main body 2 also
Have and can carry out, to by adhesion, the cohesiveness surface that adhesion keeps.
As it is shown in figure 1, jig main body 2 supports elastomeric element 3 described later.As long as this jig main body 2 has smooth surface
As long as elastomeric element 3 can be supported, it is possible to be formed as various form based on various design alterations.Such as, such as Fig. 1 institute
Showing, this jig main body 2 has the disk-shaped flakes body of the size more than elastomeric element 3, from the ora terminalis of elastomeric element 3 near its ora terminalis
Prominent.This jig main body 2 can also be formed as the square disk-shaped flakes body that size is roughly the same with elastomeric element 3.
As long as jig main body 2 is formed by the material that can support elastomeric element 3, such as can list rustless steel with
And it is the metal formings such as metal thin plate, aluminium foil and Copper Foil such as aluminum, polyester, politef, polyimides, polyphenylene sulfide, poly-
Resin film or the resin plates etc. such as amide, Merlon, polystyrene, polypropylene, polyethylene and polrvinyl chloride.And then, folder
The duplexer that tool main body 2 can also be set to laminated multi-layer flaky material and be formed.
Elastomeric element 3 is designed as and keeps multiple by adhesion by adhesion plane contact and by adhesion,
Such as, as it is shown in figure 1, at the square discoid body that the surface forming of jig main body 2 is a circle less than jig main body 2.This elastic
Part 3 is such as formed by the solidfied material of the adhesive material with adhesion strength described later or this adhesive material, and whole surface becomes
For carrying out, to by adhesion, the cohesiveness surface that adhesion keeps.
Due to by the holding of adhering with being contacted by the surface of adhesion of the cohesiveness surface of elastomeric element 3 by adhesion,
Keep by the adhesion strength of adhesion so having to adhere.Specifically, elastomeric element 3 generally can have 1g/mm2~
60g/mm2Adhesion strength, it is possible to have 7g/mm2～60g/mm2Adhesion strength.The adhesion strength of elastomeric element 3 be utilize following
The value that " SHIN-ETSU HANTOTAI's polymeric method " is measured.In the method, prepare following load-measuring device, this load-measuring device
Possess: elastomeric element 3 is carried out the fixing absorption fixation device of level (such as, trade name: magnechuck, KET-1530B,
Japan's strength (KANETEC) (strain) manufactures) or vacuum attraction chuck (chuck plate) etc.；And pacify at measurement portion end
Equipped with the cylinder being formed as diameter 10mm and the contact be made up of rustless steel (SUS304) digital display ergometer (trade name:
ZP-50N, reaches (IMADA) (strain) according to dream and manufactures), elastomeric element 3 is fixed on the absorption fixation device of this load-measuring device
Or on vacuum attraction chuck, and measurement environment is set as 21 ± 1 DEG C, humidity 50 ± 5%.It follows that make to be installed in
State the above-mentioned contact of load-measuring device to decline with the speed of 20mm/min until with the measured location contacts of elastomeric element 3 being
Only, then, by the load of regulation and this contact to be pressed in the way of being perpendicular to measured portion measured position persistently 3 seconds
Clock.Herein, the load of above-mentioned regulation is set as 25g/mm2.It follows that pull above-mentioned contact to make with the speed of 180mm/min
Separate with measured position, now read by above-mentioned digital display ergometer measure gained pull separation load.In measured portion
The plurality of positions of position carries out this operation, and multiple is pulled separation load to carry out arithmetic average, and then the calculation that will be obtained to obtain
Art meansigma methods is as the adhesion strength of elastomeric element 3.
The maximal roughness Ry(JIS B0601-1994 on the cohesiveness surface of elastomeric element 3) it is 1.0 μm～6.0 μm.As
Really maximal roughness Ry of elastomeric element 3 is less than 1.0 μm, then the mountain peak part with maximal roughness is too small, and by adhesion
Contact surface excessively touch and cause being deteriorated by the detachment of adhesion, on the other hand, if the maximal roughness of elastomeric element 3
Ry is more than 6.0 μm, then the mountain peak part with maximal roughness is excessive, even if pressing is made mountain peak part generation bullet by adhesion
Property deformation, the flatness on cohesiveness surface is also deteriorated, so cannot keep by adhesion with the adhesion of high adhesion strength, thus, no matter
Excessive or too small, all cannot obtain high adhesion strength with high level and by the detachment of adhesion simultaneously.In order to higher water
Accurate obtain high adhesion strength simultaneously and by the detachment of adhesion thus reach the purpose of the present invention, preferably at most roughness Ry is
1.0 μm～5.0 μm, particularly preferably 2.0 μm～4.0 μm.Maximal roughness Ry is that cohesiveness surface is not carried out by adhesion
Maximal roughness Ry under the state that adhesion keeps, according to JIS B0601-1994, in cutoff (cut-off) 0.8mm, survey
At least position at 3 is measured under conditions of amount length 2.4mm etc., and obtain their arithmetic mean of instantaneous value.After can passing through
The methods stated etc. adjust maximal roughness Ry.
The concavo-convex equispaced Sm(JIS B0601-1994 on cohesiveness surface for elastomeric element 3) for, preferably
It is 5.0 μm～15.0 μm, more preferably 5.0 μm～11.0 μm, particularly preferably 6.0 μm～11.0 μm.If cohesiveness table
The concavo-convex equispaced Sm in face is in above-mentioned scope, then mountain peak part and mountain peak part (or mountain valley part and mountain valley portion
Point) between interval become required interval, so the cohesiveness surface being affected because of the elastic deformation of mountain peak part is flat
Smooth property improves further, it is possible to reach the purpose of the present invention well.The concavo-convex equispaced Sm on cohesiveness surface is viscous
The property surface is not to the concavo-convex equispaced Sm carried out by adhesion under the state that adhesion keeps, substantially according to JIS
Measuring method described in B0601-1994 and measure.Now, cutoff wavelength is 0.8mm, and evaluation length is 2.4mm,
Cutoff kind is Gauss distribution, and is the arithmetic mean of instantaneous value of at least 3.Cohesiveness can be adjusted by method described later etc.
The concavo-convex equispaced Sm on surface.
In order to reach the purpose of the present invention well, the centrage for the cohesiveness surface of elastomeric element 3 is average
For roughness Ra (JIS B0601-1994), preferably 0.1 μm～0.5 μm, particularly preferably 0.2 μm～0.4 μm.Adhesion
Property surface center line average roughness Ra be when cohesiveness surface not to carried out by adhesion adhesion keep in
Heart line average roughness Ra, foundation JIS B0601-1994 is the most right under conditions of cutoff 0.8mm, measurement length 2.4mm etc.
At least 3 position, places measure, and calculate their arithmetic mean of instantaneous value.Cohesiveness table can be adjusted by method described later etc.
The center line average roughness Ra in face.
In order to reach the purpose of the present invention well, for 10 mean roughness on the cohesiveness surface of elastomeric element 3
Rz(JIS B0601-1994) for, preferably 1.0 μm～5.0 μm, particularly preferably 2.0 μm～4.0 μm.Cohesiveness surface
10 mean roughness Rz be cohesiveness surface not to by adhesion carry out adhesion keep state under 10 average roughness
Spend Rz, foundation JIS B0601-1994 and at least 3 positions, place under conditions of cutoff 0.8mm, measurement length 2.4mm etc.
Measure, and calculate their arithmetic mean of instantaneous value.10 of cohesiveness surface can be adjusted by method described later etc. to put down
All roughness Rz.
Maximal roughness Ry, concavo-convex on the cohesiveness surface of elastomeric element 3 can be adjusted respectively by following method
Equispaced Sm, center line average roughness Ra and 10 mean roughness Rz.For instance, it is possible to enumerate following method, i.e.,
The cohesiveness surface of elastomeric element 3 is carried out the surface treatment method of known roughening treatment such as blasting treatment etc., makes apparatus
There is the mould having carried out the die cavity inner surface after surface processes in known roughening treatment that elastomeric element 3 is become
The method of type, make elastomeric element 3 or form the adhesive material of elastomeric element 3 containing sabulous method etc..
To making elastomeric element 3 or forming the adhesive material of elastomeric element 3 containing sabulous method (hereinafter referred to as originally
The method for coarsening surface of invention.) be briefly described.Shot-like particle used in method for coarsening surface involved in the present invention,
As long as particle, it is not particularly limited its shape, material etc., such as, can enumerate known particulate fillers etc..
Such as can enumerate the inorganic fillers such as Silicon stone system packing material as the shot-like particle meeting said reference.As silicon
Stone system packing material, such as can enumerate aerosil, fused silica etc. by the silicon dioxide of Dry synthesis,
The silicon dioxide by Moist chemical synthesis of precipitated silica and silica gel etc..Wherein, preferably aerosil, precipitation two
Silicon oxide.
No matter whether shot-like particle is Silicon stone system packing material, but from be difficult to condense and elastomeric element 3 substantially evenly
From the viewpoint of dispersion, preferably by Organic substance, the surface of shot-like particle is covered.Although the Organic substance covered by shot-like particle is permissible
It is low-molecular-weight organic compound, but preferably organic resin from the viewpoint of the dispersibility when mixing.As organic resin,
Such as can list polyethylene, polypropylene, polystyrene, polyester fiber, fluororesin (such as politef), polyamides Asia
Amine, polyphenylene sulfide, polyamide, Merlon etc..Wherein, high-fire resistance and the organic resin of durability are preferably played.As
Such Organic substance covers shot-like particle, such as, can enumerate the silicon dioxide etc. being coated with polyethylene.
No matter whether shot-like particle is Silicon stone system packing material, but from can make this shot-like particle elastomeric element 3 the most equal
Disperse and can be the most at least to maximal roughness Ry, concavo-convex equispaced Sm, centrage average roughness evenly
From the viewpoint of maximal roughness Ry in degree Ra and 10 mean roughness Rz is adjusted, preferably its mean diameter is 3 μ
M～30 μm, more preferably 3 μm～20 μm, particularly preferably 5 μm～10 μm.The measuring method of mean diameter is according to secondary grain
Footpath d50(laser method).
No matter whether shot-like particle is Silicon stone system packing material, but from can make this shot-like particle elastomeric element 3 the most equal
Disperse and can be the most at least to maximal roughness Ry, concavo-convex equispaced Sm, centrage average roughness evenly
From the viewpoint of maximal roughness Ry in degree Ra and 10 mean roughness Rz is adjusted, relative to forming elastomeric element
The rubber of 3 or 100 mass parts of resin, preferably contain the shot-like particle of 1～25 mass parts, particularly preferably in elastomeric element 3
The shot-like particle of 3～25 mass parts is contained in elastomeric element 3.Additionally, in order to make in elastomeric element 3 containing this shot-like particle, it is possible to
Enumerate the method etc. that the adhesive material forming elastomeric element 3 is added shot-like particle.
Hardness (JISK6253(A type durometer hardness meter) for the cohesiveness surface of elastomeric element 3) for, preferably 5
～50, particularly preferably 30～50.If cohesiveness surface is in the range of above-mentioned hardness, then will pressed on by adhesion
Cohesiveness surface and to its carry out adhesion keep time, the particularly mountain peak part on cohesiveness surface is susceptible to elastic deformation, makes
Cohesiveness surface more planarize such that it is able to touch with by the contact surface of adhesion more securely, and be prevented from by
The damage of adhesion and breakage etc..Furthermore it is possible to adjust the hardness of elastomeric element 3 by content of shot-like particle etc..
Preferred resilient members 3 has the thickness of about 0.05mm～5mm.If the thickness of this elastomeric element 3 is not enough
0.05mm, then the mechanical strength of elastomeric element 3 reduces, and the durability of elastomeric element 3 is not enough, on the other hand, if this elastic
The thickness of part 3 is more than 5mm, then elastomeric element 3 is difficult to elastic deformation, sometimes cannot easily from elastomeric element 3 take off by
Adhesion.
As long as by adhesive phase or priming coat, the adhesion strength of elastomeric element 3 or setting tool etc. by elastomeric element 3
It is fixed on the surface of jig main body 2, in keeping fixture 1, by adhesive phase or priming coat, elastomeric element 3 is fixed
Surface in jig main body 2.
As long as being formed elasticity by the solidfied material of the adhesive material or this adhesive material that can play above-mentioned adhesion strength
Parts 3, as sticky material, such as, can enumerate fluorine-type resin or fluorine class rubber, containing fluorine-type resin or fluorine class
Fluorine based composition, silicones or the silicone rubber of rubber, the silicon composition containing silicones or silicone rubber, polyurethanes elasticity
The various elastomers etc. such as body, natural rubber, styrene butadiene copolymers synthetic rubber.Wherein, preferably silicone rubber and/or
Addition reaction curing type cohesiveness silicon composition containing silicone rubber and peroxide curing type cohesiveness silicon composition.As
Above-mentioned addition reaction curing type cohesiveness silicon composition, such as, can enumerate described in Japanese Unexamined Patent Publication 2008-091659 publication
Containing silicon raw rubber (a), crosslinking component (b), adhesion strength improve agent (c), catalyst (d), the adhesion of Silicon stone system's packing material (e)
Property compositions.As above-mentioned peroxide curing type cohesiveness silicon composition, such as, can enumerate Japanese Unexamined Patent Publication 2008-
Described in No. 091659 publication containing silicon raw rubber (a), adhesion strength improve agent (c), Silicon stone system's packing material (e), organic peroxy
The cohesiveness compositions of compound (f).Adhesive material is made to solidify under suitable condition.Additionally, in order to utilize involved by the present invention
And method for coarsening surface adjust maximal roughness Ry and be allowed to be in above-mentioned scope, make these adhesive material contain regulation
The shot-like particle of amount.
For keeping fixture 1, owing to the cohesiveness surface of elastomeric element 3 has the maximal roughness in above-mentioned scope
Ry, so as mentioned above, it is possible to obtain reciprocal characteristic simultaneously that is pressing by high adhesion strength during adhesion and is glued
The detachment of thing such that it is able to reach the purpose of the present invention well.It addition, keep the whole of the cohesiveness surface of fixture 1
Surface has cohesiveness, easily can carry out adhesion holding to by adhesion if desired, so without accurately to being adhered
The adhesion holding position of thing positions, and productivity and operability are the most excellent.
Process fixture involved in the present invention is illustrated.Process fixture involved in the present invention possesses: institute of the present invention
The holding fixture related to；And release piece, this release piece is along the surface relative movement of the elastomeric element of this holding fixture so that quilt
What adhesion kept is departed from by adhesion.Process fixture involved in the present invention is preferred for situations below, such as in order to multiple
Carried out manufacturing by adhesion, carry, receive or inspection etc. and holding of temporarily adhering is above-mentioned multiple by adhesion, take off the most again
By adhesion keep by adhesion.The involved in the present invention holding fixture processing fixture is as it has been described above, such as can enumerate guarantor
Hold fixture 1 etc..
As long as the involved in the present invention release piece processing fixture has following embodiment, i.e. along keeping fixture
Elastomeric element surface relative to keep fixture carry out relative movement, thus make to be held in being glued of this holding fixture by adhering
Thing to depart from, such as, can suitably enumerate and have as follows by the release piece of impact portions, this can be collided by impact portions is adhered
Be held in keep fixture by adhesion and press this by adhesion.As such release piece, such as, can be that its front end is made
For above-mentioned by impact portions the blade of triangular prism shape of the overturning configuration of function, furthermore it is also possible to be that itself is as above-mentioned
The wire rod etc. of function by impact portions.The involved in the present invention release piece processing fixture is with the elastic with holding fixture
Part surface contact state or non-contacting state and carry out relative movement, preferably relatively move with non-contacting state
Dynamic.
Process fixture 4 as the involved in the present invention example processing fixture possesses holding fixture 1 and release piece
5.Keep fixture 1 as it has been described above, release piece 5 is as in figure 2 it is shown, be e.g. formed as the blade of the triangular prism shape of overturning configuration, its
Front end as above-mentioned by impact portions function.The elastomeric element 3 keeping fixture 1 it is held in from making to adhere in rows
Multiple disposably departed from by adhesion from the viewpoint of, for the length on the bearing of trend of this release piece 5 that is triangular prism
Height for, preferably it is more than the length of elastomeric element 3.Additionally, due to the front end of release piece 5 is collided as with by adhesion
The function by impact portions, so before in order to prevent being sustained damage by adhesion etc. and can be formed it by elastomeric material
Hold or make its front end be covered by the resilient material.
To process as a example by fixture 4, to use involved in the present invention process fixture and to the place processed by adhesion
One example of reason method (below, is sometimes referred to as a kind of operational approach.) illustrate.This one operational approach has makes disengaging
Part keeps the cohesiveness surface of fixture 1 to carry out relative movement along to by the adhesion holding that carries out adhering thus takes off by adhesion
Disengaging operation, preferably have and keep the cohesiveness surface of elastomeric element 3 of fixture 1 that this is glued by being pressed on by adhesion
Thing and carry out the holding operation that adhesion keeps.That is, this one operational approach is to being carried out adhesion holding by adhesion and will be glued
The method taken off by adhesion kept.
Above-mentioned adhesion operation is to be carried out this by adhesion on the cohesiveness surface being pressed on elastomeric element 3 by adhesion
The operation that adhesion keeps.In order to raised state will be remained by adhesion, at elastomeric element 3 at the holding fixture 1 processing fixture 4
On make multiple be arranged as under raised state by adhesion regulation pattern, and its bottom surface is pressed on keep fixture 1 elasticity
The cohesiveness surface of parts 3.Then, crimped with cohesiveness surface by the bottom surface of adhesion, as it has been described above, the mountain of elastomeric element 3
Peak part generation elastic deformation and make cohesiveness surface become smooth, utilize the adhesion strength on cohesiveness surface to be adhered multiple
Thing adhesion is held in elastomeric element 3.As carrying out, to by adhesion, the method that adhesion keeps in like fashion, such as, can enumerate day
Method etc. described in this JP 2008-091659 publication.Specifically, if will there is ratio by the axis of adhesion
Thickness that length is thin and be formed and can erect that configuration is onboard is placed in elastomeric element 3 for multiple arranging holes of being passed through by adhesion
State under, next arranging hole will be inserted into by adhesion, and use the most smooth plate-shaped member etc. to press towards elastomeric element 3
Press this by the free end of adhesion, then elastomeric element 3 is held in by adhesion by adhesion.
In this one operational approach, it is kept being taken off by adhesion of fixture 1 to adhesion be held in, makes release piece
5 along the cohesiveness surface relative movement keeping fixture 1 thus press by adhesion towards side.Specifically, with non-contacting side
Formula will be disengaged from part 5 and is configured at the cohesiveness near surface keeping fixture 1.Now, though release piece 5 not with keep fixture 1 table
Face contacts, as long as holding fixture involved in the present invention just can make according to anticipation to be departed from by adhesion.Make in like fashion
The release piece 5 of configuration relatively carries out advancing along cohesiveness surface moving, even if also it is towards by adhesion side shifting.Then, de-
The front end of off member 5 abuts with by the side of adhesion, presses towards above-mentioned direction that is side and is made it tilt by adhesion, bullet
Property deformation mountain peak part restored so that cohesiveness surface forms maximal roughness Ry in above-mentioned scope, so that quilt
The contact surface of adhesion is from the cohesiveness sur-face peeling of elastomeric element 3.So, by release piece 5 press by adhesion from holding
The elastomeric element 3 of fixture 1 departs from.So, utilization processes fixture 4 and the almost all by holding of being adhered can be made to be taken off by adhesion
From.
Additionally, the method described in patent documentation 2 is that " front end utilizing blade makes adhesion coating depression and makes in this condition
Blade carries out relative movement along adhesion coating surface direction " method, it addition, the method described in patent documentation 3 is " to make scraping list
Unit is along the surface of above-mentioned sticky material layer and towards making above-mentioned non-adhesive part or above-mentioned low sticky limit part tend to mobile
The method that side moves in adterminal direction and scrapes electronic component from sticky material layer ", but, even if making miniature parts scraping portion
Part slides on elastomeric material surfaces, sometimes by adhesion also can overturning and be again adhered to adhesion coating surface, thus cannot hold
Change places and take off miniature parts.If it addition, make scraping parts slide on elastomeric material surfaces, particularly when in order to reliably
Take off by adhesion by scraping parts strength press on elastomeric material surfaces and make it slide on this elastomeric material surfaces,
Or make scraping parts slide on elastomeric material surfaces swimmingly, the most sometimes because of miniature parts scraping parts to elastic material
Material surface is caused damage, is damaged.On the other hand, possess, due to the involved in the present invention fixture that processes, the present invention that detachment is excellent
Involved holding fixture, even if therefore by adhesion overturning, would not be sent out as long as it does not strongly press on cohesiveness surface
Life is adhered again, it is possible to make easily to be departed from from elastomeric element 3 by adhesion by the almost all of holding of being adhered and do not occur
Secondary adhesion, also without making release piece 5 slide on cohesiveness surface, presses on this cohesiveness surface without will be disengaged from part 5.
Therefore, process fixture involved in the present invention can highly prevent from, by release piece, elastomeric element is caused damage, especially prevents
Damage is caused on cohesiveness surface.
So, involved in the present invention keep fixture and process fixture involved in the present invention can be right according to anticipation
Multiple carried out adhesion by adhesion and keep, and can easily make to be held in by adhering and keep the almost all of fixture to be adhered
Thing departs from.Therefore, involved in the present invention keep fixture and process fixture involved in the present invention are applicable to such as be adhered
The manufacturing process of thing, scattered by the recovery etc. of adhesion.
Fixture is kept to illustrate combination involved in the present invention referring to the drawings.Combination retaining clip involved in the present invention
Tool possesses: first keeps fixture, consists of and includes the first jig main body and be arranged at the surface of above-mentioned first jig main body
First elastomeric element；And second keep fixture, consist of and include the second jig main body and be arranged at above-mentioned second fixture master
Second elastomeric element on the surface of body, first keeps fixture and second to keep at least one party in fixture to be involved in the present invention
Holding fixture, and the second elastomeric element has the adhesion strength of the adhesion strength more than the first elastomeric element.Involved by the present invention
And combination keep in fixture, preferably first keeps fixture and second to keep the second holding fixture in fixture to be institute of the present invention
The holding fixture related to, particularly preferred first keeps fixture and second to keep the both sides of fixture to be guarantor involved in the present invention
Hold fixture.In combination involved in the present invention keeps fixture, in addition to adhesion strength difference, first keeps fixture and second
Other structure keeping fixture is essentially identical.Combination involved in the present invention keeps fixture to be preferred for following situation, i.e. such as
In order to multiple process being implemented regulation by the both ends of adhesion the most successively are manufactured by adhesion etc., adhesion is being protected
After being held in the holding fixture being transferred to the opposing party by adhesion keeping fixture of a side, by being taken by adhesion after transfer
Under.
As it is shown on figure 3, keep the combination of an example of fixture to keep fixture 6 to have as combination involved in the present invention
Standby: first keep fixture 1A, consist of include the first jig main body 2A and be arranged at this first jig main body 2A surface and
The first elastomeric element 3A that adhesion keeps can be carried out to by adhesion；And second keep fixture 1B, consist of and include the
Two jig main body 2B and be arranged at this second jig main body 2B surface and can to by adhesion carry out adhesion keep second
Elastomeric element 3B.First keeps fixture 1A and second to keep fixture 1B essentially identical with the structure keeping fixture 1.
Fixture 1A and second is kept to keep in fixture 1B first, the first elastomeric element 3A and the second elastomeric element 3B tool
Have and can carry out, to by adhesion, the adhesion strength that adhesion keeps, generally can have 1g/mm2～60g/mm2Adhesion strength (according to
Above-mentioned " SHIN-ETSU HANTOTAI's polymeric method "), it is possible to have 7g/mm2～60g/mm2Adhesion strength.
And, the second elastomeric element 3B of the second holding fixture 1B has the viscous of the adhesion strength more than the first elastomeric element 3A
Put forth effort.First elastomeric element 3A and the second elastomeric element 3B has the relation of such adhesion strength, it is possible to be adhered
Thing keeps the first elastomeric element 3A of fixture 1A to transfer to the second elastomeric element 3B of the second holding fixture 1B from first.From can
From the viewpoint of being transferred to the second elastomeric element 3B by adhesion from the first elastomeric element 3A swimmingly and not making it come off, right
For the difference of the adhesion strength (above-mentioned " SHIN-ETSU HANTOTAI's polymeric method ") of the first elastomeric element 3A and the second elastomeric element 3B, it is preferably
15g/mm2～43g/mm2, more preferably 18g/mm2～35g/mm2, particularly preferably 20g/mm2～30g/mm2.Can pass through
The content etc. of content and shot-like particle that adhesion strength improves agent adjusts the first respective adhesion strength of elastomeric element 3A and 3B.
In combination keeps fixture 6, first keeps fixture 1A and second to keep fixture 1B to be all set as keeping fixture 1,
In other words, first keeps the first elastomeric element 3A and second of fixture 1A to keep the second elastomeric element 3B of fixture 1B all to have
Maximal roughness Ry in above-mentioned scope.If first keeps fixture 1A and second to keep fixture 1B to be all to maintain fixture 1, then
Adhesion can be carried out by adhesion according to anticipation keep multiple, and can be by the almost all that kept by adhesion by adhesion
The first elastomeric element 3A of fixture 1A is kept to second to keep fixture 1B by the raised state of holding of being adhered from first with it
Second elastomeric element 3B transfer.
Involved in the present invention is illustrated by adhesion holding means.Involved in the present invention is kept dress by adhesion
Put and possess combination holding fixture involved in the present invention.Referring to the drawings to as involved in the present invention by adhesion holding means
Being illustrated by adhesion holding means an of example.As shown in Figure 4, it is to possess to include by adhesion holding means 10
One keeps fixture 1A and second to keep the combination of fixture 1B to keep fixture, it is possible to keep and energy being carried out adhesion by adhesion
Enough fixture 1A will be kept by adhesion to transfer to the device of the second holding fixture 1B from first.Had by adhesion holding means 10
Standby combination keeps fixture identical with the structure of combination holding fixture 6.
As shown in Figure 4, being configured to by adhesion holding means 10, the first holding fixture 1A and the second holding fixture 1B can
It is arranged so that the first elastomeric element 3A and the second elastomeric element 3B is opposite each other.Thus, raised state ground such as it is able to maintain that
What adhesion was held in the first holding fixture 1A is transferred to the second holding fixture 1B by adhesion.Such first elastomeric element 3A
Configuration with the second elastomeric element 3B can be realized by the shift mechanism being made up of frame for movement, it is also possible to manually comes
Realize.
As shown in Figure 4, the face side being formed without the first elastomeric element 3A of jig main body 2A is fixed on supporting parts
14, these supporting parts 14 are arranged at from the end of supporting arm 13 keeping fixture shift unit 12 to extend downward, thus by the
One keeps fixture 1A to be supported on holding fixture shift unit 12.
This holding fixture shift unit 12 is installed on track 11, is configured to carry out in the horizontal direction along this track 11
Move and supporting arm 13 can be made to move along the vertical direction.Therefore, this holding fixture shift unit 12 it is supported in
First keep fixture 1A can by keep fixture shift unit 12 and in the horizontal direction and above-below direction moves freely.That is,
There is pendency keep to be shifted into such as dipping bath with leading by the first holding fixture 1A of the first elastomeric element 3A of adhesion
The top of electricity cream or be transplanted on suitable position such as second retaining clip other than over of dipping bath conductive paste from this position
The position of the top of tool 1B, and fixture 1B can be kept to decline towards second, and make to be become being held in second by adhesion
Keep the second elastomeric element 3B of fixture 1B, then make the first holding fixture 1A keep fixture 1B to rise from second.
And then, this holding fixture shift unit 12 is configured to axle centered by track 11 and is rotated around axle.
If keeping fixture shift unit 12 to be rotated in like fashion, then the state of fixture 1A can be kept to press first
Change into according to anticipation and utilize the first elastomeric element 3A pendency holding by the state of adhesion and to utilize the first elastomeric element 3A
Erect setting and keep by the state of adhesion.
It addition, as shown in Figure 4, the face side being formed without the second elastomeric element 3B of the second jig main body 2B is fixed in
Supporting parts 18, these supporting parts 18 are arranged at the end from the supporting arm 17 keeping fixture shift unit 16 to extend upward,
Thus the second holding fixture 1B is supported on holding fixture shift unit 16.
This holding fixture shift unit 16 is installed on the track 15 being substantially orthogonal with track 11, substantially with keep fixture
Mode that shift unit 12 is same and formed.Therefore, the second holding fixture 1B of this holding fixture shift unit 16 it is supported in
Can be by keeping fixture shift unit 16 and in the horizontal direction and above-below direction moves freely, and this second keeps fixture
1B can be rotated around axle by axle centered by track 15.
Keep fixture shift unit 12 and keep the motion of fixture shift unit 16 not to be specially limited, such as
Can enumerate following motion, this motion possesses: produce the driver element of driving force, such as motor；And by this horse
The output reached is delivered to track 11 or 15 and the transfer unit of supporting arm 13 or 17, such as gear, wire rod etc..This motion
Mechanism can be controlled by common personal computer etc., it is also possible to Non-follow control.
This is configured to by adhesion holding means 10, and first keeps fixture 1A and second to keep fixture 1B to be configured to
Make the first elastomeric element 3A and the second elastomeric element 3B opposite each other near the position that track 11 and track 15 intersect.Thus,
The second holding fixture 1B can be transferred to by adhesion by be held in the first holding fixture 1A by adhesion.
It follows that to using this by adhesion holding means 10 at the chip electricity as one of small electronic component parts
Container body forms electrode and is manufactured as the method for the chip capacitor of small electronic component and illustrates, and is glued this simultaneously
The effect thing holding means 10 illustrates.As it is shown in figure 5, this chip capacitor main body 7 is formed as four prisms cylinder, such as,
As shown in Figure 8, chip capacitor 9 is configured to be respectively formed with electrode 8 at the both ends of this chip capacitor main body 7.
Electrode 8 is formed in chip capacitor main body 7, first by sheet capacitor by adhesion holding means 10 in order to use
Device main body 7 adhesion is held in the first elastomeric element 3A.Specifically, holding fixture shift unit 12 axle centered by track 11 is made
It is rotated around axle, thus the first holding fixture 1A is configured so that the first elastomeric element 3A is above, such as, as
Upper described, use the above-mentioned configuration plate that erects that chip capacitor main body 7 presses on the first elastomeric element 3A.Then, first is elastic
Parts 3A carries out elastic deformation because of chip capacitor main body 7 thus becomes smooth, and then the guarantor that chip capacitor main body 7 adhered
It is held in the first elastomeric element 3A.
After in like fashion chip capacitor main body 7 being carried out adhesion and keeps, if as it is shown in figure 5, making holding fixture
Shift unit 12 axle centered by track 11 is rotated around axle, then be formed as multiple chip capacitor main body 7 and dangled
It is held in the state of the first elastomeric element 3A.It follows that make the holding fixture shift unit 12(not shown) do not scheme along track 11(
Show) to move in the horizontal direction, the multiple chip capacitor main bodys 7 making pendency keep are moved horizontally to dipping bath conductive paste
The top of (not shown), makes supporting arm 13 move downward and makes the bottom of chip capacitor main body 7 be impregnated into dipping bath with leading
In electricity cream.Make supporting arm 13 move upward after Pian Ke, make the conductive paste being coated on chip capacitor main body 7 be dried.Then,
As shown in Figure 6, it is the most equal that the bottom of each chip capacitor main body 7 being held in the first elastomeric element 3A at pendency forms size
Deng electrode 8.Now, owing to the first elastomeric element 3A will be held in, so impregnated in by adhesion adhesion according to anticipation
Among conductive paste and when conductive paste is mentioned, will not be come off or tilt from the first elastomeric element 3A by adhesion.
It follows that make holding fixture shift unit 12 move in the horizontal direction along track 11, make the first retaining clip
Tool 1A is moved horizontally to the top of the second holding fixture 1B, as it is shown in fig. 7, make first by making supporting arm 13 move downward
Fixture 1A is kept to keep fixture 1B to decline towards second.Make the first holding fixture 1A decline further, make adhesion be held in the first guarantor
The bottom of the chip capacitor main body 7 holding fixture 1A is crimped on the second elastomeric element 3B of the second holding fixture 2A.Then,
There is elastic deformation because of chip capacitor main body 7 thus become smooth in two elastomeric element 3B, plays ratio the first elastomeric element 3A
Big adhesion strength, so the chip capacitor main body 7 utilizing bigger adhesion strength and making adhesion be held in the first elastomeric element 3A
Bonding with the second elastomeric element 3B.If it follows that made on the first holding fixture 1A by making supporting arm 13 move upward
Rise, then the second elastomeric element 3B embodies desired adhesion strength and the second elastomeric element 3B has more than the first elastomeric element 3A
The adhesion strength of adhesion strength, thus chip capacitor main body 7 is adhered to the second elastomeric element 3B securely via electrode 8, sheet
Formula capacitor main body 7 residues in the first elastomeric element 3A of the first holding fixture 1A hardly and is an off this first elastomeric element
3A.In such manner, it is possible to keep fixture 1A to the second holding fixture 1B multiple chip capacitor main bodys 7 of transfer according to anticipation from first
Them are not made to come off or overturning.
It follows that make the holding fixture shift unit 16(not shown) not shown by track 15() centered by axle revolve around axle
Transhipment is dynamic, thus is formed as being held in chip capacitor main body 7 pendency the state of the second holding fixture 1B.Then, with above-mentioned
Mode is identical, is formed by coating conductive paste in the bottom of the chip capacitor main body 7 kept by pendency and make it be dried
Electrode 8.
So, as shown in Figure 8, the electrode 8 that size is almost impartial it is formed with at the respective both ends of chip capacitor main body 7
Chip capacitor 9 be held in the second elastomeric element 3B of the second holding fixture 1B with the state adhesion of pendency.And, such as profit
With keep along second the cohesiveness surface of fixture 1B carry out the release piece 5 of relative movement towards side pressing by adhesion be held in this
Two chip capacitors 9 keeping fixture 1B, thus occur the second elastomeric element 3B after elastic deformation to be restored so that above-mentioned
Chip capacitor 9 easily departs from from the second elastomeric element 3B and falls.
So, the combination involved by the application of the invention keeps fixture 6 and by adhesion holding means, it is possible to according to
Anticipation and be disposably held in the holding fixtures of a side by adhesion with the state adhesion erected by multiple, and will glued
Thing from a side keep fixture to the holding fixture of the opposing party shift time, it is possible to be effectively prevented by adhesion the guarantor of a side
Hold on fixture residual or overturning, it is possible in the case of keeping raised state constant by multiple by adhesion from the retaining clip of a side
Tool transfers to the holding fixture of the opposing party.That is, if using combination involved in the present invention keep fixture and kept by adhesion
Device, then can be with good productivity ratio manufacture by adhesion.
Holding fixture involved in the present invention, process fixture, combination keeps fixture and by adhesion holding means not
It is defined in above-mentioned example, various change can be carried out in the range of the purpose of the present application reaching.Such as, although
The whole surface of above-mentioned holding fixture 1 Elastic parts 3 is formed as cohesiveness surface, but as long as elastomeric element in the present invention
The surface of self be formed as cohesiveness surface at least partially.
Although jig main body 2 and elastomeric element 3 are all formed as rectangle in above-mentioned holding fixture 1, but jig main body
As long as and elastomeric element be formed as be suitable for miniature parts manufacture shape, can according to by the shape of adhesion, glued
The shape of thing holding means, manufacturing process, operability etc. and form arbitrary shape.Such as, fixture is kept just can to enumerate
The polygons such as square, rectangle, pentagon, hexagon, circle, ellipse, unsetting or by these combination of shapes above-mentioned
The plate body of the shape etc. become.It addition, the side, face of the side being formed without elastomeric element 3 of jig main body 2 can be planar shaped
Shape, it is also possible to be the three-dimensional shapes such as semicylindrical body.
Although above-mentioned holding fixture 1 possesses the jig main body 2 of the discoid body being square, but in the present invention, retaining clip
Tool can be partially formed supporting parts at elastomeric element.It addition, these supporting parts and elastomeric element can be by having bending
Property material formed.
Although above-mentioned holding fixture 1 is formed as square discoid body, but in the present invention, keep fixture can according to
Wait on the way and be suitably formed as the forms such as endless belt-shaped, the plate body of heavy wall, plates, elongate body.Such as, endless belt is formed as
The holding fixture of shape except its be integrally formed into endless belt-shaped in addition to, other structure be formed as substantially with above-mentioned holding fixture 1
Identical.Therefore, this holding fixture includes being formed as endless belt-shaped supporting parts and building up ring at the surface layer supporting parts
The elastomeric element of shape banding.
Although above-mentioned process fixture 4 is configured to possess holding fixture and release piece, but in the present invention, processes fixture
Can also possess the parts beyond these components or component, such as, can possess by the storage member of adhesion, release piece
Driver element, furthermore it is also possible to possess described in Japanese Unexamined Patent Publication 2008-091659 publication erecting configuration plate the most above-mentioned
Erect configuration plate and the pressing plate pressed towards the first holding fixture by adhesion arranging hole erecting configuration plate will be inserted into
Deng.
Although possess the first holding fixture 1A and second in combinations thereof keeps fixture 6 to keep fixture 1B, but at this
In invention, except first keeps fixture and second to keep in addition to fixture, combination keep fixture can also possess other parts or
Person's component, such as, can possess the 3rd holding fixture, above-mentioned release piece etc..
Although above-mentioned by adhesion holding means 10 in possess the first holding fixture 1A and second keep fixture 1B, but
In the present invention, in addition to first keeps fixture and second keeps fixture, can also be possessed it by adhesion holding means
Its parts or component, such as, can possess the 3rd holding fixture, above-mentioned release piece etc..
It addition, keep fixture 6 and above-mentioned by adhesion holding means 10 in combinations thereof, the first elastomeric element 3A and
Second elastomeric element 3B can be formed by identical adhesive material, it is also possible to is formed by different adhesive material.
And then, although to be arranged to show greatly right angle by adhesion holding means 10 middle orbit 11 and track 15 mutual above-mentioned
Intersect, but track can also be arranged to almost parallel with track in the present invention.
Although it addition, above-mentioned by adhesion holding means 10 in keep fixture shift unit 12 and 16 be configured to
Centered by track 11 and 15, axle is rotated around axle, but these keep fixture shift unit can also be configured to enter
Row rotary motion.In such a case it is possible to keeping fixture shift unit to be held in first to by the adhesion of chip capacitor main body
First holding fixture of elastomeric element supports, it is also possible to glued by chip capacitor by taking off from holding fixture shift unit
And be held in the second holding fixture of the second elastomeric element and chip capacitor is taken off from the second elastomeric element.
Embodiment
(embodiment 1)
The foursquare dish of a length of 120mm on a limit is cut out from corrosion resistant plate (SUS304 makes, and thickness is 0.5mm)
Shape body.After utilizing acetone that the surface of one side of this discoid body is carried out ungrease treatment, at the bottom of appropriate silicone rubber bonding
Paint (trade name " X-33-156-20 ", Shin-Etsu Chemial Co., Ltd manufactures) is coated on elastomeric element and forms region
(square of a length of 110mm on limit, this foursquare center is consistent with the center of discoid body), in the environment of 23 DEG C
It is dried, thus forms priming coat (thickness is 3 μm).Make jig main body 2 in like fashion.
As the adhesive material of formation elastomeric element 3, prepare the addition reaction curing type adhesion with following component
Property silicon composition.
Agent (c), the rubber composition of catalyst (d) is improved containing silicon raw rubber (a), crosslinking component (b), adhesion strength
(trade name " X-34-632A/B ", Shin-Etsu Chemial Co., Ltd manufactures) is 90 mass parts
The Silicon stone that mean diameter is 10 μm utilizing polyethylene to be covered on surface is that (silicon raw rubber (a) is 100 to 10 mass parts
Conversion content (the conversion content of record in the first table) during mass parts is 13 mass parts)
The jig main body 2 made is accommodated in metal die, to forming the die cavity formed on region at its elastomeric element
(one a length of 110mm on limit, thickness are the cube of 0.8mm) pours into a mould ready addition reaction curing type cohesiveness silicon group
Compound, 120 DEG C, carry out Transfer molding under conditions of 10MPa, it follows that 200 DEG C, make it under conditions of 4 hours
Solidification further, thus form elastomeric element 3 on the surface of jig main body 2 and be made for keeping fixture 1.
(embodiment 2)
In addition to the mean diameter of above-mentioned Silicon stone is changed to 6 μm, other condition and step substantially with embodiment 1 phase
With, and be thus made for keeping fixture 1.
(embodiment 3～5)
Except the content of above-mentioned Silicon stone is changed to 3 mass parts respectively, (silicon raw rubber (a) is that conversion during 100 mass parts contains
Amount is 4 mass parts), 7 mass parts (silicon raw rubber (a) be conversion content during 100 mass parts be 9 mass parts) and 14 mass parts
Beyond (silicon raw rubber (a) be conversion content during 100 mass parts be 18 mass parts), other condition and step substantially with enforcement
Example 1 is identical, and is thus made for keeping fixture 1.
(comparative example 1 and 2)
Except the content of above-mentioned Silicon stone being changed to 0 mass parts and 21 mass parts (when silicon raw rubber (a) is 100 mass parts
Conversion content be 27 mass parts) beyond, other condition and step are the most same as in Example 1, and thus be made for protect
Hold fixture.
(measurement on cohesiveness surface)
Based on above-mentioned measuring method to the adhesion keeping fixture being respectively prepared in each embodiment and each comparative example
Property maximal roughness Ry on surface, concavo-convex equispaced Sm, adhesion strength and hardness are measured respectively, and it measures gained
Result as shown in the first table.
(cohesiveness evaluation)
To about 25,000 rectangular-shaped by adhesion (vertical 0.3mm × horizontal 0.3mm × high 0.6mm) in the same way
Arrange, by be respectively prepared in each embodiment and each comparative example keep fixture elastomeric element cohesiveness surface by
It is pressed on each end face by adhesion (vertical 0.3mm × horizontal 0.3mm), and is evaluated by the tacky state of adhesion.Its knot
Really, the holding fixture of embodiment 1～5 can be adhered and be kept most by adhesion, the particularly holding of embodiment 3 and 4
Fixture can be adhered and be kept most by adhesion.On the other hand, the holding fixture of comparative example 1 and 2 cannot be adhered holding
Most by adhesion.
(detachment evaluation)
Evaluating essentially identical with above-mentioned cohesiveness, what general about 25,000 was rectangular-shaped (is indulged 0.3mm × horizontal stroke by adhesion
0.3mm × high 0.6mm) it is held in, with erectility adhesion, the holding fixture being respectively prepared in each embodiment and each comparative example
Elastomeric element,.Additionally, this elastomeric element is pressed on by adhesion mandatory by the holding fixture of comparative example 1 and 2 securely
Ground carries out adhesion and keeps.So, after being remained raised state by adhesion adhesion, so that elastomeric element and cohesiveness table
The discontiguous mode in face makes the blade of polyformaldehyde move along cohesiveness surface thus will be struck off by adhesion.Its result, implements
Keep fixture to make whole disengaging by adhesion that adhesion keeps of example 1～5 and do not make elastomeric element 3 sustain damage, show
Go out out the highest detachment.On the other hand, the holding fixture of comparative example 1 and 2, if particularly comparative example 1 holding fixture not
The blade making polyformaldehyde moves when contacting or be pressed against cohesiveness surface with cohesiveness surface and then cannot make
Departed from by adhesion by what adhesion kept, and be temporarily disengaged from be the most again adhered to cohesiveness surface by adhesion, its
Detachment is the most abundant.
(transferability evaluation)
Utilize that makes in embodiment 3 to keep fixture and holding fixture (the gluing of elastomeric element made in embodiment 5
The difference puted forth effort is 22g/mm2) carried out being tested by the transfer of adhesion.Specifically, evaluate essentially identical with above-mentioned cohesiveness,
Will about 25,000 rectangular-shaped being held in raised state adhesion by adhesion (vertical 0.3mm × horizontal 0.3mm × high 0.6mm)
The elastomeric element keeping fixture made in embodiment 5.It follows that make the elasticity keeping fixture made in embodiment 3
Parts are positioned at the top keeping fixture of embodiment 5 and steadily decline.Make the elastomeric element keeping fixture of embodiment 3 and in reality
The surface of the elastomeric element keeping fixture executing example 5 erects multiple rectangular-shaped being contacted by the upper end of adhesion of setting.
It follows that after having gone through the most again 3 seconds, make the fixture that keeps of embodiment 3 rise upward with the speed of 180mm/min.
Rise and make it depart from from the holding fixture of embodiment 5.Rectangular-shaped is adhered by the fixture that keeps of the embodiment 3 after departing from
The hold mode of thing is observed, and result shows: residue in embodiment 5 keeps fixture rectangular-shaped by adhesion
The 0.5% of lazy weight entirety, demonstrates the highest transferability.
Table 1
Probability is utilized in industry
Holding fixture involved in the present invention, process fixture, combination keeps fixture and can by adhesion holding means
It is applicable to miniature parts etc. is manufactured by adhesion, carries, receives or the occasion of inspection etc..
The explanation of reference
1 ... keep fixture；1A ... first keeps fixture；1B ... second keeps fixture；2 ... jig main body；2A ... the first folder
Tool main body；2B ... the second jig main body；3 ... elastomeric element；3A ... the first elastomeric element；3B ... the second elastomeric element；4 ... process
Fixture；5 ... release piece；6 ... combination keeps fixture；7 ... chip capacitor main body；8 ... electrode；9 ... chip capacitor；10 ... quilt
Adhesion holding means；11,15 ... track；12,16 ... keep fixture shift unit；13,17 ... supporting arm；14,18 ... supporting
Parts.
Claims (5)
1. one kind keeps fixture, it is characterised in that
Described holding fixture is configured to possess:
Jig main body；And
Elastomeric element, this elastomeric element is arranged at the surface of described jig main body, and has based on JIS B0601-1994 standard
The cohesiveness surface that maximal roughness Ry is 1.0 μm～6.0 μm,
The concavo-convex equispaced Sm based on JIS B0601-1994 standard of described elastomeric element is 5.0 μm～15.0 μm, institute
10 the mean roughness Rz based on JIS B0601-1994 standard stating elastomeric element are 2.0 μm～4.0 μm.
2. one kind processes fixture, it is characterised in that
Described process fixture is configured to possess:
Holding fixture described in claim 1；And
Release piece, this release piece carries out relative movement along the surface of the elastomeric element of described holding fixture and makes to be kept by adhering
Departed from by adhesion.
3. a combination keeps fixture, it is characterised in that
Described combination keeps fixture to possess:
First keeps fixture, and this first keeps fixture be configured to possess the first jig main body and be arranged at described first jig main body
First elastomeric element on surface；And
Second keeps fixture, and this second keeps fixture be configured to possess the second jig main body and be arranged at described second jig main body
Second elastomeric element on surface,
Described first keeps fixture and described second to keep at least one party of fixture to be the holding fixture described in claim 1,
Further,
Described second elastomeric element has the adhesion strength of the adhesion strength more than described first elastomeric element.
Combination the most according to claim 3 keeps fixture, it is characterised in that
Described second holding fixture is the holding fixture described in claim 1.
5. one kind by adhesion holding means, it is characterised in that
Described possessed the combination holding fixture described in claim 3 or 4 by adhesion holding means.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-251007 | 2010-11-09 | ||
| JP2010251007 | 2010-11-09 | ||
| PCT/JP2011/005727 WO2012063405A1 (en) | 2010-11-09 | 2011-10-13 | Retaining jig, handling jig, set of retaining jigs, and adhered material retaining device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103180923A CN103180923A (en) | 2013-06-26 |
| CN103180923B true CN103180923B (en) | 2016-12-07 |
Family
ID=46050577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180050918.1A Active CN103180923B (en) | 2010-11-09 | 2011-10-13 | Fixture, process fixture, combination is kept to keep fixture and by adhesion holding means |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5936230B2 (en) |
| KR (1) | KR101853806B1 (en) |
| CN (1) | CN103180923B (en) |
| TW (1) | TWI556274B (en) |
| WO (1) | WO2012063405A1 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6135150B2 (en) * | 2013-01-25 | 2017-05-31 | Tdk株式会社 | Removal method of electronic parts |
| JP6000182B2 (en) * | 2013-04-01 | 2016-09-28 | 日本ゼオン株式会社 | Method for producing sheet for lithium ion secondary battery electrode |
| CN105321734A (en) * | 2014-07-28 | 2016-02-10 | 黄武 | Production method of micro part slice |
| JP2018078132A (en) * | 2016-11-07 | 2018-05-17 | 信越ポリマー株式会社 | Holding jig for precision part, and method for manufacturing the same |
| JP7156755B2 (en) * | 2018-04-18 | 2022-10-19 | 信越ポリマー株式会社 | Adhesive substrate and method for separating objects from the adhesive substrate |
| JP7180828B2 (en) * | 2018-10-31 | 2022-11-30 | 信越ポリマー株式会社 | holding jig |
| JP2022104308A (en) | 2020-12-28 | 2022-07-08 | エルジー ディスプレイ カンパニー リミテッド | Transmission system, transmission cable, transmission method, and display device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100419930C (en) * | 2001-08-31 | 2008-09-17 | 株式会社村田制作所 | Electronic element processing apparatus and electronic element processing method |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0793247B2 (en) * | 1992-02-10 | 1995-10-09 | 株式会社村田製作所 | Holding jig for small parts and holding method |
| JP4049545B2 (en) * | 2001-03-22 | 2008-02-20 | 日本碍子株式会社 | SiC heat treatment jig |
| JP4186611B2 (en) * | 2002-12-11 | 2008-11-26 | 株式会社村田製作所 | Electronic component holding jig and electronic component handling method |
| JP2004203465A (en) * | 2002-12-26 | 2004-07-22 | Shin Etsu Polymer Co Ltd | Molding for use in miniature electronic component holding/conveying jig etc., miniature electronic component holding/conveying jig using the same, and manufacturing method therefor |
| JP4662285B2 (en) * | 2006-12-14 | 2011-03-30 | 信越ポリマー株式会社 | Holding jig, electrode forming apparatus, and electrode forming method |
| JP4678784B2 (en) * | 2006-12-28 | 2011-04-27 | 信越ポリマー株式会社 | Holding jig, a set of holding jigs, and an adherend holding device |
| JP4418032B2 (en) * | 2007-09-11 | 2010-02-17 | キヤノンアネルバ株式会社 | Electrostatic chuck |
| KR100977851B1 (en) * | 2008-01-21 | 2010-08-24 | 주식회사 진우엔지니어링 | An apparatus for forming a electrode |
| JP2010186982A (en) * | 2009-01-13 | 2010-08-26 | Shin Etsu Polymer Co Ltd | Holding/removing jig and handling jig |
-
2011
- 2011-10-13 CN CN201180050918.1A patent/CN103180923B/en active Active
- 2011-10-13 WO PCT/JP2011/005727 patent/WO2012063405A1/en active Application Filing
- 2011-10-13 JP JP2012542792A patent/JP5936230B2/en active Active
- 2011-10-13 KR KR1020137013609A patent/KR101853806B1/en active IP Right Grant
- 2011-11-03 TW TW100140163A patent/TWI556274B/en active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100419930C (en) * | 2001-08-31 | 2008-09-17 | 株式会社村田制作所 | Electronic element processing apparatus and electronic element processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI556274B (en) | 2016-11-01 |
| KR20140053814A (en) | 2014-05-08 |
| CN103180923A (en) | 2013-06-26 |
| JPWO2012063405A1 (en) | 2014-05-12 |
| JP5936230B2 (en) | 2016-06-22 |
| TW201243172A (en) | 2012-11-01 |
| KR101853806B1 (en) | 2018-05-04 |
| WO2012063405A1 (en) | 2012-05-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103180923B (en) | Fixture, process fixture, combination is kept to keep fixture and by adhesion holding means | |
| KR20010012758A (en) | Method of manufacturing a patterned array of solder bumps | |
| US5383997A (en) | Method of handling electronic component chips | |
| Yang et al. | Self‐healing, reconfigurable, thermal‐switching, transformative electronics for health monitoring | |
| JP2012514873A5 (en) | ||
| EP1942365A3 (en) | Driving circuit for a liquid crystal display device, method of manufacturing the same, and display device having the same | |
| CN102714920A (en) | Heating device and production method for mounted body | |
| KR101930302B1 (en) | Solder transfer sheet | |
| KR102125261B1 (en) | Transfer plate for microchip transfer device | |
| US20180213652A1 (en) | Electrically isolated assembly and method for the electrical isolation of an assembly | |
| JPH07191089A (en) | Electrode assembly | |
| JP2005005650A (en) | Holding tool of small-sized electronic component, and method for forming electrode of small-sized electronic component | |
| US20040124119A1 (en) | Carrier tape for use in the automated parts-implanting machine for carrying parts therewith | |
| TWI791644B (en) | Adhesive substrate manufacturing method | |
| JP5877088B2 (en) | Small electronic component handling equipment and handling method | |
| JP5240937B2 (en) | Small parts handling jig and small parts handling equipment | |
| JP4771645B2 (en) | Electronic component chip holder and electronic component chip handling method | |
| EP3424284A1 (en) | Electronic device and method of making the same using surface mount technology and an anisotropic conductive adhesive useful in the method | |
| JP2011142273A (en) | Holding/removing jig and handling jig | |
| EP2017882A3 (en) | Conductive ball mounting method and apparatus | |
| JP2010186982A (en) | Holding/removing jig and handling jig | |
| JP7180828B2 (en) | holding jig | |
| JP2013042064A (en) | Holding jig, handling device of small electronic component, and handling method and manufacturing method using the same | |
| JP4947728B2 (en) | Holding transfer jig and a set of holding transfer jig | |
| CN104241145B (en) | Method for manufacturing semiconductor module in the case of using carrier is adhered to |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |