CN103179790B - 混压印刷电路板及其制作方法 - Google Patents
混压印刷电路板及其制作方法 Download PDFInfo
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- CN103179790B CN103179790B CN201110435736.8A CN201110435736A CN103179790B CN 103179790 B CN103179790 B CN 103179790B CN 201110435736 A CN201110435736 A CN 201110435736A CN 103179790 B CN103179790 B CN 103179790B
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- board
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- 238000003825 pressing Methods 0.000 title claims abstract description 9
- 238000002360 preparation method Methods 0.000 title 1
- 239000000463 material Substances 0.000 claims abstract description 41
- 238000004519 manufacturing process Methods 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 20
- 238000005553 drilling Methods 0.000 claims description 17
- 238000007906 compression Methods 0.000 claims description 11
- 238000005520 cutting process Methods 0.000 claims description 10
- 238000003801 milling Methods 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 8
- 238000001514 detection method Methods 0.000 claims description 7
- 238000004080 punching Methods 0.000 claims description 7
- 239000002253 acid Substances 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 6
- 238000007689 inspection Methods 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000012546 transfer Methods 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 238000012360 testing method Methods 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 238000000227 grinding Methods 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 206010023230 Joint stiffness Diseases 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010019 resist printing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201110435736.8A CN103179790B (zh) | 2011-12-21 | 2011-12-21 | 混压印刷电路板及其制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201110435736.8A CN103179790B (zh) | 2011-12-21 | 2011-12-21 | 混压印刷电路板及其制作方法 |
Publications (2)
Publication Number | Publication Date |
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CN103179790A CN103179790A (zh) | 2013-06-26 |
CN103179790B true CN103179790B (zh) | 2016-07-06 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201110435736.8A Active CN103179790B (zh) | 2011-12-21 | 2011-12-21 | 混压印刷电路板及其制作方法 |
Country Status (1)
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CN (1) | CN103179790B (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104519674B (zh) * | 2013-09-27 | 2018-10-09 | 北大方正集团有限公司 | 一种防止局部混压板错位方法 |
CN106163135A (zh) * | 2015-04-21 | 2016-11-23 | 深南电路股份有限公司 | 一种局部混压电路板结构及其加工方法 |
CN104952376B (zh) * | 2015-06-12 | 2017-07-28 | 信丰福昌发电子有限公司 | 一种改善小点距led灯板渗金短路的工艺 |
CN106170175B (zh) * | 2016-08-04 | 2019-04-26 | 同健(惠阳)电子有限公司 | 一种高保真高频线路板 |
CN108551730A (zh) * | 2018-04-08 | 2018-09-18 | 惠州市金百泽电路科技有限公司 | 一种提升层间对准度的多子板pcb混压方法 |
CN108684144A (zh) * | 2018-08-10 | 2018-10-19 | (株)韩国诺仪器株式会社 | 毫米波频段微带线电路的基体结构及其实现方法 |
CN111148352A (zh) * | 2019-12-25 | 2020-05-12 | 安徽中瑞通信科技股份有限公司 | 一种5g天线用pcb板制作工艺 |
CN113179594B (zh) * | 2021-03-15 | 2023-01-03 | 华宇华源电子科技(深圳)有限公司 | 一种局部高频电路板制作方法 |
CN113543472A (zh) * | 2021-06-16 | 2021-10-22 | 昆山沪利微电有限公司 | 一种复合电路板及其制作方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201733517U (zh) * | 2010-06-18 | 2011-02-02 | 深南电路有限公司 | 一种电路板 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001332853A (ja) * | 2000-05-24 | 2001-11-30 | Auto Network Gijutsu Kenkyusho:Kk | シート状配線ケーブルとプリント基板との接続方法 |
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2011
- 2011-12-21 CN CN201110435736.8A patent/CN103179790B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201733517U (zh) * | 2010-06-18 | 2011-02-02 | 深南电路有限公司 | 一种电路板 |
Non-Patent Citations (1)
Title |
---|
局部混压PCB制作工艺研究;华炎生等;《印刷电路信息》;20110410(第4期);文章第38页1.3.2,第40页3.2,第41页4.2,第43页5.4、图12 * |
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Publication number | Publication date |
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CN103179790A (zh) | 2013-06-26 |
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Effective date of registration: 20220624 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 5 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. |
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