CN103178348B - Meta Materials flexible substrate package device - Google Patents
Meta Materials flexible substrate package device Download PDFInfo
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- CN103178348B CN103178348B CN201110439966.1A CN201110439966A CN103178348B CN 103178348 B CN103178348 B CN 103178348B CN 201110439966 A CN201110439966 A CN 201110439966A CN 103178348 B CN103178348 B CN 103178348B
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- backboard
- packaging system
- header board
- middle splint
- meta materials
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Abstract
The present invention gives a kind of packaging system for encapsulating Meta Materials flexible base board, including header board, backboard, the multiple middle splint being in described in described header board between backboard and multiple fixing bar, the groove for placing Meta Materials flexible base board it is provided with in described middle splint, wherein, being both provided with corresponding multiple through hole in described header board, described backboard and the plurality of middle splint, described fixing bar is fixed together described header board, described backboard and the plurality of middle splint by described through hole.Packaging system according to the present invention so that Meta Materials end properties is from the impact of Embedding Material, and utilizes framework packaged type that the micro structure of Meta Materials will not be affected by Bending Deformation, thus improves the performance of Meta Materials product.
Description
[technical field]
The present invention relates to Meta Materials field, more particularly to a kind of Meta Materials flexible substrate package device.
[background technology]
Meta Materials due to superior performance, higher cost performance, is applied more and more widely instantly
In commercial production.Different from common material, the elementary cell of Meta Materials is all made, and
It is special that the spatial arrangements of these artificial elementary cells and distribution also can be carried out according to specific industrial requirement
Arrangement and setting, thus obtain needed for properties of product (such as electromagnetic response characteristic).
Its use can be expanded by multi-layer metamaterial flexible base board being packaged obtained Meta Materials
Field, such as, can be applicable to more harsh environment, and reach with Meta Materials rigid substrates be difficult to reach
The function arrived.This Novel meta-material with special electromagnetic response characteristic often has in commercial Application
There is special using value, thus there is great market value.
By multi-layer metamaterial substrate is packaged in particular manner, it is possible to obtain required electricity
Magnetic response performance.First, that substrate can be caused to have is certain for the microstructured ar-rangement of metamaterial substrate itself
Electromagnetic response characteristic；Secondly, by repeatedly arranging multilamellar, there is same microstructure or different micro-knot
The substrate of structure also controls the distance between different substrate, then can produce different electromagnetic field responses.By
This is visible, multi-layer metamaterial substrate arrangement mode and each layer metamaterial substrate between distance,
The character of the Meta Materials of multi-layer metamaterial substrate composition can be had a huge impact.
Therefore, the requirement to the packaging technology of multilager base plate, is the highest in actual industrial production.
The method for packing of Application comparison a kind of multi-layer metamaterial flexible base board is to utilize silica gel at present
Material carries out embedding to the flexible base board having arranged stratification.But, there is many asking in this method
Topic, and the performance of the Meta Materials obtained manufactured by having severely impacted.
First, after utilizing silica gel material that multilayer flexible substrate is carried out embedding, all fill around substrate
Expire silica gel material, so that the dielectric constant of whole finished product is too high, will be typically higher than 3.0.This makes
The electromagnetic response character of the finished product obtained by deviate from expected value, has severely impacted the property of Meta Materials
Matter.
Secondly, use the finished product that silica gel material obtains after multilager base plate is carried out embedding in BENDING PROCESS
In, inner side substrate is different due to the tensile force being subject to outside substrate, and level of stretch is different, generation
Deformation also differs, so that the relative position of micro structure changes, thus affects material property.
[summary of the invention]
It is an object of the invention to provide a kind of Meta Materials flexible substrate package device, utilize this packaging system
The electromagnetic response characteristic of the Meta Materials finished product prepared keeps constant, and its dielectric constant will not be as prior art
Equally affected by Embedding Material.Additionally, utilize this packaging system prepare Meta Materials finished product due to
Using the mode of framework encapsulation, the micro structure of metamaterial substrate will not be affected by Bending Deformation, from
And ensure that the performance of Meta Materials product.
In order to realize this goal of the invention, the technical solution used in the present invention is, one is used for encapsulating super material
Material flexible base board packaging system, described packaging system includes header board, backboard, be in described header board and
Multiple middle splint between described backboard, described middle splint is provided with groove, is used for placing super
Material flexibility substrate, multiple fixing bars, wherein, described header board, described backboard and the plurality of centre
Be both provided with corresponding multiple through hole on clamping plate, described fixing bar by described through hole described header board,
Described backboard and the plurality of middle splint are fixed together.
Preferably, being arranged on the through hole on described header board is all manhole.
Preferably, described middle splint is provided with rectangular openwork part.
Preferably, the through hole being arranged on described header board is manhole.
Preferably, described backboard and described middle splint are respectively provided with at least two for
Fixing manhole.
Preferably, described backboard and described middle splint are respectively provided with multiple strip to lead to
Hole.
Preferably, described fixing bar can slide under external force in described strip through hole.
Preferably, the degree of depth of described groove determines according to the thickness of described flexible base board.
Preferably, the intensity of described header board and described backboard can assist in fixing bar and is fixed, and energy
Enough bendings under external force.
Preferably, described middle splint is made up of silica gel.
Preferably, described fixing bar is bolt.
The Meta Materials flexible substrate package device of the present invention, owing to employing the mode of framework encapsulation, makes
Medium between the substrate of internal layer becomes air, greatly reduces the dielectric constant of medium.Additionally,
The present invention passes through to arrange the screw hole of slip on clamping plate and backboard, so that during Bending Deformation
Metamaterial substrate from the impact of stress, it is ensured that the relative position of micro structure keeps constant, thus
Improve the performance of Meta Materials.
As can be seen here, the packaging system of the basic present invention, it is possible to obtain there is more preferable electromagnetic response special
The Meta Materials finished product of property, not only eliminates the impact on dielectric constant produced by silica gel material,
And eliminate the impact material property of Meta Materials finished product produced owing to being bent to form, thus greatly
Improve greatly Meta Materials end properties.
[accompanying drawing explanation]
Fig. 1 is that the three-dimensional of the flexible substrate package instrument according to the present invention solves composition.
Fig. 2 is the sectional view of the header board according to the present invention.
Fig. 3 is the sectional view of the middle splint according to the present invention.
Fig. 4 is the sectional view of the backboard according to the present invention.
[detailed description of the invention]
The present invention is described in detail with embodiment below in conjunction with the accompanying drawings.
As it is shown in figure 1, according to one embodiment of present invention, this packaging system includes header board 110,
Multiple middle splint 210 and backboard 310 and multiple fixing bar 410.
Wherein, header board 110 and backboard 310 use flexibility but there is the material of some strength and make.
Use this material prepare header board 110 and backboard 310 can either carry out a certain degree of curved under external force
Song, its intensity the most enough bears the active force of fixing bar.The thickness of header board 110 and backboard 310 can root
Arrange according to needs, to keep certain flexibility and certain intensity.Middle splint 210 mainly uses
The material such as silica gel with preferable flex capability is made.
Fig. 1 also show be provided with on header board 110, middle splint 210 and backboard 310 multiple accordingly
Through hole, and fixing bar 410 respectively by these through holes header board 110, middle splint 210 and backboard
310 are fixed together.Fixing bar 410 typically can be selected for bolt, it is possible to selects what other were used for fixing to consolidate
Determine instrument.
Fig. 2-4 is header board 110, middle splint 210 and the sectional view of backboard 310 respectively.Fig. 2-4 is more
The layout of the through hole clearlying show on each plate.
As in figure 2 it is shown, be internally provided with multiple manhole at header board 110, these manholes are big
A rectangle is surrounded on body.Fixing bar 410 can be by these manholes through header board 110.
Fig. 3 is the sectional view of middle splint 210.As it is shown on figure 3, be provided with in middle splint 210
Rectangular groove 203, is used for placing flexible base board.The big I of groove 203 is according to flexible base board
Size customizes.In other words, the groove 203 of particular size is applicable to the flexible base board of particular size.
The degree of depth of groove 203 depends on the thickness of flexible base board.Since so, when bending, flexible
Substrate is not owing to being extruded by clamping plate.
Additionally, middle splint 210 is additionally provided with hollow space 206.This make multiple flexible base board it
Between medium be air, thus instead of the silica gel that dielectric constant commonly used in prior art is bigger
Material, thus reduce the encapsulating material impact on metamaterial substrate performance.
According to Fig. 3, between hollow space 206 and groove 203, it is disposed with multiple through hole equably
204 and 205.Through hole on backboard 310 shown in Fig. 4 is arranged and the middle splint 210 shown in Fig. 3
On through hole arrange identical.
It should be noted that in middle splint 210 and backboard 310, be respectively at top edge and under
The through hole in the centre position at edge is configured to circle, and other through holes are then configured to strip.This
The purpose that sample is arranged is:
1) through hole 204 and 304 and the rigid rod 410 that passes through can fix the flexible base board of different layers
To keep its position to be relatively fixed, prevent from misplacing between the flexible base board of different layers in bending,
To guarantee that micro structure is relatively fixed；
2) in BENDING PROCESS, the rigid rod being fixed on header board, except by through hole 204 and 304
Beyond two, its tip all can be expanded, and the elongate in shape of through hole 205 and 305 can be firm
The mobile offer space of property bar tail end, so that substrate can occur relative shifting with clamping plate in BENDING PROCESS
Dynamic, the flexible base board of such outer layer will not be stretched the effect of stress and deform, and the substrate of internal layer
Then will not be squeezed and deform.
Use flexible substrate package device according to an embodiment of the invention that Meta Materials flexible base board is entered
During row encapsulation, first, laid for the flexible base board being printed on Meta Materials in groove 203.Such as institute above
Stating, groove 203 matches with the size of flexible base board, in order to make the flexible base board can be compact
Be placed in groove 203.
After placing flexible base board in the groove of each middle splint 210, press from both sides in the middle of all of
Plate 210 merges.Then, header board 110 and backboard 310 are placed on the both sides of middle splint bundle, use
Multiple fixing bars 410 are each passed through these through holes to be come header board 110, backboard 310 and middle splint 210
It is fixed up.
In the above-described embodiments, only the present invention is carried out exemplary description, but people in the art
Member can be without departing from the spirit and scope of the present invention to this after reading present patent application
Bright carry out various amendment.
Claims (8)
1. for encapsulating a packaging system for Meta Materials flexible base board, including:
Header board,
Backboard,
The multiple middle splint being between described header board and described backboard, described middle splint is arranged
Fluted, it is used for placing Meta Materials flexible base board,
Multiple fixing bars,
Wherein, described header board, described backboard and the plurality of middle splint are both provided with accordingly the most
Individual through hole, described fixing bar by described through hole described header board, described backboard and the plurality of in
Between Boards wall together, what described backboard and the plurality of middle splint were correspondingly arranged is described logical
Kong Jun includes that at least two is for fixing manhole and multiple strip through hole.
2. packaging system as claimed in claim 1, it is characterised in that set in described middle splint
It is equipped with rectangular openwork part.
3. packaging system as claimed in claim 1, it is characterised in that be arranged on described header board
Through hole be manhole.
4. packaging system as claimed in claim 1, it is characterised in that described fixing bar is in external force
Can slide in described strip through hole under Zuo Yong.
5. packaging system as claimed in claim 1, it is characterised in that the degree of depth root of described groove
Determine according to the thickness of described flexible base board.
6. packaging system as claimed in claim 1, it is characterised in that described header board and the described back of the body
The intensity of plate can assist in fixing bar and is fixed, and can bend under external force.
7. packaging system as claimed in claim 1, it is characterised in that described middle splint is by silica gel
Make.
8. packaging system as claimed in claim 1, it is characterised in that described fixing bar is bolt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110439966.1A CN103178348B (en) | 2011-12-26 | 2011-12-26 | Meta Materials flexible substrate package device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110439966.1A CN103178348B (en) | 2011-12-26 | 2011-12-26 | Meta Materials flexible substrate package device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103178348A CN103178348A (en) | 2013-06-26 |
| CN103178348B true CN103178348B (en) | 2016-09-28 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110439966.1A Active CN103178348B (en) | 2011-12-26 | 2011-12-26 | Meta Materials flexible substrate package device |
Country Status (1)
| Country | Link |
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| CN (1) | CN103178348B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2914517Y (en) * | 2006-01-16 | 2007-06-20 | 毅嘉电子（苏州）有限公司 | Image module of soft board attaching photographic chip |
| CN101281618A (en) * | 2008-05-27 | 2008-10-08 | 北京海升天达科技有限公司 | Smart card and method for manufacturing the same |
| CN101286462A (en) * | 2008-05-27 | 2008-10-15 | 北京海升天达科技有限公司 | Sealing apparatus, sealing method and encapsulation method of integrated circuit chip |
| CN201197223Y (en) * | 2008-05-27 | 2009-02-18 | 北京海升天达科技有限公司 | Fixture equipment for circuit board |
| CN201774744U (en) * | 2010-08-03 | 2011-03-23 | 厦门新福莱科斯电子有限公司 | Auxiliary tool clamp for gluing supplementary material on flexible printed circuit (FPC) |
| CN102083273A (en) * | 2009-11-28 | 2011-06-01 | 比亚迪股份有限公司 | Method for laminating covering film of flexible printed circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100314040A1 (en) * | 2009-06-10 | 2010-12-16 | Toyota Motor Engineering & Manufacturing North America, Inc. | Fabrication of metamaterials |
-
2011
- 2011-12-26 CN CN201110439966.1A patent/CN103178348B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2914517Y (en) * | 2006-01-16 | 2007-06-20 | 毅嘉电子（苏州）有限公司 | Image module of soft board attaching photographic chip |
| CN101281618A (en) * | 2008-05-27 | 2008-10-08 | 北京海升天达科技有限公司 | Smart card and method for manufacturing the same |
| CN101286462A (en) * | 2008-05-27 | 2008-10-15 | 北京海升天达科技有限公司 | Sealing apparatus, sealing method and encapsulation method of integrated circuit chip |
| CN201197223Y (en) * | 2008-05-27 | 2009-02-18 | 北京海升天达科技有限公司 | Fixture equipment for circuit board |
| CN102083273A (en) * | 2009-11-28 | 2011-06-01 | 比亚迪股份有限公司 | Method for laminating covering film of flexible printed circuit board |
| CN201774744U (en) * | 2010-08-03 | 2011-03-23 | 厦门新福莱科斯电子有限公司 | Auxiliary tool clamp for gluing supplementary material on flexible printed circuit (FPC) |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103178348A (en) | 2013-06-26 |
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