CN103177974B - Process for manufacturing discrete electronic component of copper sheet electrode - Google Patents
Process for manufacturing discrete electronic component of copper sheet electrode Download PDFInfo
- Publication number
- CN103177974B CN103177974B CN201110451233.XA CN201110451233A CN103177974B CN 103177974 B CN103177974 B CN 103177974B CN 201110451233 A CN201110451233 A CN 201110451233A CN 103177974 B CN103177974 B CN 103177974B
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- Prior art keywords
- chip
- pressing mold
- lead frame
- conduit
- pressing
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Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 18
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 18
- 239000010949 copper Substances 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title abstract description 13
- 238000005520 cutting process Methods 0.000 claims abstract description 60
- 238000004806 packaging method and process Methods 0.000 claims abstract description 24
- 239000000084 colloidal system Substances 0.000 claims abstract description 12
- 238000003825 pressing Methods 0.000 claims description 81
- 239000011469 building brick Substances 0.000 claims description 27
- 238000003860 storage Methods 0.000 claims description 11
- 238000012856 packing Methods 0.000 claims description 10
- 239000000969 carrier Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 7
- 241000567030 Ampulloclitocybe clavipes Species 0.000 description 3
- 206010043101 Talipes Diseases 0.000 description 3
- 201000011228 clubfoot Diseases 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000009740 moulding (composite fabrication) Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention relates to a process for manufacturing a discrete electronic component of a copper sheet electrode. A plurality of chips are respectively arranged on a plurality of chip bearing seats of a wire support and electrically connected with the chip bearing seats via guide connection layers, a plurality of welding lines are respectively electrically connected with a plurality of pins and the chips of the wire support, the wire support is arranged on a mould-sealed mould group, the chips, the welding lines and a plurality of longitudinal connecting ribs between the chip bearing seats and the pins are sealed via packaging colloid, then, the mould-sealed mould group is removed, the wire support is arranged on a press-fit mould group, the longitudinal connecting ribs of the wire support are removed via a high-rotating-speed cutter by the aid of a lower cutting channel and an upper cutting channel of the press-fit mould group, and then a plurality of the discrete electronic components are formed. The technical scheme solves the technical problem that the pins are deformed or broken caused by the condition of bad cabriole legs in the prior process for manufacturing the electronic component, thereby influencing the manufacture process yield, and simplifying the manufacture process.
Description
Technical field
The present invention relates to a kind of discrete type electronic building brick manufacturing process of copper plate electrode.
Background technology
Refer to shown in Figure 17, existing known a kind of passive component packaging structure 10, is by pin 11 bending formings, and is electrically connected another electronic building brick by this pin 11.
Because this passive component packaging structure 10 is to be electrically connected another electronic building brick by this pin 11, therefore its volume is larger, and be not suitable for the market demand that existing electronic goods is light, thin, short, little, in addition because this passive component packaging structure 10 is in manufacture process, easily produce the bad situation of clubfoot, cause pin distortion, serious even pin fracture, affecting quality yield very large, is also the place that current passive component encapsulation affects yield most critical.
Because the defect that above-mentioned existing passive component packaging structure exists, the inventor is based on being engaged in this type of product design manufacture abundant practical experience and professional knowledge for many years, positive research and innovation in addition, to founding a kind of discrete type electronic building brick manufacturing process of new copper plate electrode, can improve general existing passive component packaging structure, make it have more practicality.Through constantly research, design, and after repeatedly studying sample and improving, finally create the present invention who has practical value.
Summary of the invention
Main purpose of the present invention is, overcome the defect that existing passive component packaging structure exists, and provide a kind of discrete type electronic building brick manufacturing process of new copper plate electrode, technical problem to be solved is to solve existing known electronic building brick to be encapsulated in manufacturing process, easily produce the bad situation of clubfoot, and cause pin distortion or fracture, affect manufacturing process yield.
The object of the invention to solve the technical problems realizes by the following technical solutions.The discrete type electronic building brick manufacturing process of a kind of copper plate electrode proposing according to the present invention, wherein comprises:
One lead frame is provided, this lead frame is to have a plurality of horizontal connection ribs, a plurality of longitudinal connection ribs, a plurality of conductive carriers unit and a plurality of respectively interval trough between this conductive carrier unit and this horizontal connection rib that is positioned at, this horizontal connection rib and this longitudinal connection rib are to be chessboard to arrange, and this conductive carrier unit is between adjacent longitudinal connection rib, respectively this conductive carrier unit is to have a chip bearing, one pin and one is positioned at the clearance space between this chip bearing and this pin, respectively this chip bearing of this conductive carrier unit and this pin are to be connected to different longitudinal connection ribs, this chip bearing and this pin are not to be connected with this horizontal connection rib, a plurality of chips are provided, and respectively this chip is to comprise the conductive layer that the second connection pad and that the first connection pad, that a upper surface, a lower surface, be positioned at this upper surface is positioned at this lower surface is positioned at this lower surface, and this conductive layer is to be electrically connected this second connection pad, this chip is arranged at respectively to respectively this chip bearing of this conductive carrier unit, and this chip is to be electrically connected respectively this chip bearing with this conductive layer, form a plurality of bonding wires, to be electrically connected respectively this first connection pad of this chip respectively and this pin respectively, one mould envelope set of molds is provided, it comprises a bed die and a mold, this lead frame is to be arranged on this bed die, this mold is to have a plurality of transverse moment connected in stars, this mold is to be arranged on this lead frame, and be arranged at this lead frame those chips, those bonding wires, at those the longitudinal connection ribs between those chip bearings and those pins and those clearance spaces, be to be placed between this transverse moment connected in star and this bed die, with a packing colloid, be filled in this transverse moment connected in star, to seal those chips, this bonding wire and this longitudinal connection rib and this clearance space between this chip bearing and this pin, remove this mould envelope set of molds, so that this lead frame is formed with a plurality of horizontal rectangle packaging bodies, one pressing mold group is provided, it comprises pressing mold on pressing mold and, this lower pressing mold has a plurality of lower pressing bases and a plurality of lower cutting conduit, this lower pressing base and this lower cutting conduit are for being spaced, on this, pressing mold has a plurality of upper pressing bases and a plurality of upper cutting conduit, on this pressing base and on this cutting conduit be for being spaced, and this lower pressing base is to going up pressing base, this lower cutting conduit is to going up cutting conduit, the wire erection that this is had to a plurality of horizontal rectangle packaging bodies is placed in this lower pressing mold and on this between pressing mold, and this lower pressing mold and on this pressing mold be this lead frame of pressing, wherein respectively this lower pressing base and respectively on this pressing base be this packing colloid of conflicting, and respectively this longitudinal connection rib is to cut between conduit on those lower cutting conduits and this, and with a cutting tool, prolonging cutting conduit and this lower cutting conduit on this and moving, to remove this longitudinal connection rib of this lead frame, with form a plurality of lists from electronic building brick.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The discrete type electronic building brick manufacturing process of aforesaid copper plate electrode, wherein the rotating speed of this cutting tool is more than 30000rpm.
The discrete type electronic building brick manufacturing process of aforesaid copper plate electrode, wherein those lower cutting conduits have one first width, and respectively on this, cutting groove road has one second width, and this second width is not less than this first width.
The discrete type electronic building brick manufacturing process of aforesaid copper plate electrode, wherein on this, pressing mold separately has at least one storage tank, and on those, cutting conduit is to be communicated with this storage tank, and those lower cutting conduits of this lower pressing mold are to be arranged in this storage tank.
The present invention compared with prior art has obvious advantage and beneficial effect.By technique scheme, the discrete type electronic building brick manufacturing process of copper plate electrode of the present invention can reach suitable technological progress and practicality, and has the extensive value in industry, and it at least has following advantages:
Avoid existing known electronic building brick in package fabrication process, easily produce the bad situation of clubfoot, and cause pin distortion or rupture, affect the situation of manufacturing process yield, and can once encapsulate a plurality of electronic building bricks by mould envelope set of molds, and utilize the upper cutting conduit of pressing mold group and longitudinal connection rib that lower cutting conduit cut and removed lead frame, with form single from electronic building brick, and single from electronic building brick be held between the upper pressing base and lower pressing base of pressing mold group, in order to follow-up access and collection, in addition the discrete type electronic building brick manufacturing process of copper plate electrode of the present invention is compared the advantage that has more simplified manufacturing technique and reduce fraction defective with known techniques.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technological means of the present invention, and can be implemented according to the content of specification, and for above and other objects of the present invention, feature and advantage can be become apparent, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, be described in detail as follows.
Accompanying drawing explanation
Fig. 1 is according to a preferred embodiment of the present invention, the vertical view of a lead frame.
Fig. 2 is according to a preferred embodiment of the present invention, the partial enlarged drawing of this lead frame.
Fig. 3 is according to a preferred embodiment of the present invention, the schematic diagram of a chip.
Fig. 4 is according to a preferred embodiment of the present invention, and this chip is arranged at the schematic diagram of this lead frame.
Fig. 5 is according to a preferred embodiment of the present invention, and this wire erection is placed in the schematic diagram of a mould envelope set of molds.
Fig. 6 is according to a preferred embodiment of the present invention, and this mould seals the mold bottom view of set of molds.
Fig. 7 is according to a preferred embodiment of the present invention, and a packing colloid is filled in the schematic diagram of this mould envelope set of molds.
Fig. 8, according to a preferred embodiment of the present invention, forms the schematic diagram of horizontal rectangle packaging body in this lead frame.
Fig. 9, according to a preferred embodiment of the present invention, forms the vertical view of horizontal rectangle packaging body in this lead frame
Figure 10 is according to a preferred embodiment of the present invention, and this wire erection that is formed with horizontal rectangle packaging body is placed in the schematic diagram of a pressing mold group.
Figure 11 is according to a preferred embodiment of the present invention, the lower pressing mold vertical view of this pressing mold group.
Figure 12 is according to a preferred embodiment of the present invention, the upper pressing mold vertical view of this pressing mold group.
Figure 13 is according to a preferred embodiment of the present invention, and this wire erection that is formed with horizontal rectangle packaging body is placed in the cutaway view of this pressing mold group.
Figure 14 is according to a preferred embodiment of the present invention, and this wire erection that is formed with horizontal rectangle packaging body is placed in the vertical view of this pressing mold group.
Figure 15 is according to a preferred embodiment of the present invention, and this wire erection that is formed with horizontal rectangle packaging body is placed in the cutaway view that the cut cutter of this pressing mold group removes longitudinal connection rib.
Figure 16, according to a preferred embodiment of the present invention, forms the cutaway view of electronic building brick.
A kind of known passive component packaging structure schematic diagram of Figure 17.
10: passive component packaging structure
11: pin
100: lead frame 110: horizontal connection rib
120: longitudinal connection rib 130: conductive carrier unit
131: chip bearing 132: pin
133: clearance space 140: interval trough
200: chip 210: upper surface
211: the first connection pads
220: 221: the second connection pads of lower surface
230: conductive layer
300: bonding wire 400: packing colloid
500: mould envelope set of molds 510: bed die
520: mold 521: transverse moment connected in star
600: pressing mold group 610: lower pressing mold
611: lower pressing base 612: lower cutting conduit
620: upper pressing mold 621: upper pressing base
622: above cut conduit 623: storage tank
700: cutting tool
A: horizontal rectangle packaging body
H1: the first width H2: the second width
Embodiment
For further setting forth the present invention, reach technological means and the effect that predetermined goal of the invention is taked, below in conjunction with accompanying drawing and preferred embodiment, discrete type electronic building brick manufacturing process to the copper plate electrode proposing according to the present invention, its embodiment, method, step, feature and effect thereof, be described in detail as follows.
Refer to shown in Fig. 1 and Fig. 2, first, one lead frame 100 is provided, this lead frame 100 is to have a plurality of horizontal connection ribs 110, a plurality of longitudinal connection ribs 120, a plurality of conductive carriers unit 130 and a plurality of interval trough 140 that is positioned at 110 of respectively this conductive carrier unit 130 and this horizontal connection rib, described horizontal connection rib 110 and described longitudinal connection rib 120 are to be chessboard to arrange, and this conductive carrier unit 130 is between adjacent longitudinal connection rib 120, respectively this conductive carrier unit 130 is to have a chip bearing 131, one pin 132 and one is positioned at the clearance space 133 of 132 of this chip bearing 131 and this pins, refer to shown in Fig. 2, respectively this chip bearing 131 of this conductive carrier unit 130 and this pin 132 are to be connected to different longitudinal connection ribs 120, this chip bearing 131 and this pin 132 are not to be connected with this horizontal connection rib 110.
Refer to shown in Fig. 3, a plurality of chips 200 are provided, respectively this chip 200 is to comprise the conductive layer 230 that the second connection pad 221 and that the first connection pad 211, that a upper surface 210, a lower surface 220, be positioned at this upper surface 210 is positioned at this lower surface 220 is positioned at this lower surface 220, and this conductive layer 230 is to be electrically connected this second connection pad 221.
Refer to shown in Fig. 4, then, those chips 200 are arranged at respectively to respectively this chip bearing 131 of this conductive carrier unit 130, and this chip 200 is to be electrically connected respectively this chip bearing 131 with this conductive layer 230.
Referring again to Fig. 4, then, form a plurality of bonding wires 300, to be electrically connected respectively this first connection pad 211 of this chip 200 respectively and this pin 132 respectively.
Refer to Fig. 2, Fig. 4, Fig. 5, shown in Fig. 6 and Fig. 7, one mould envelope set of molds 500 is provided, it comprises a bed die 510 and a mold 520, this lead frame 100 is to be arranged on this bed die 510, this mold 520 is to have a plurality of transverse moment connected in stars 521, this mold 520 is to be arranged on this lead frame 100, and be arranged at this chip 200 of this lead frame 100, this bonding wire 300, at this longitudinal connection rib 120 between this chip bearing 131 and this pin 132 and this clearance space 133, be to be placed between this transverse moment connected in star 521 and this bed die 510, those transverse moment connected in stars 521 and this bed die 510 of this mold 520, to form colloid runner.
Shown in Fig. 7, with a packing colloid 400, be filled in above-mentioned transverse moment connected in star 521, to seal said chip 200, this bonding wire 300 and this longitudinal connection rib 120 and this clearance space 133 between this chip bearing 131 and this pin 132.
Refer to shown in Fig. 8 and Fig. 9, afterwards, remove this mould envelope set of molds 500, so that this lead frame 100 is formed with a plurality of horizontal rectangle packaging body A.
Refer to Figure 10, shown in Figure 11 and Figure 12, then, one pressing mold group 600 is provided, it comprises pressing mold 620 on pressing mold 610 and, this lower pressing mold 610 has a plurality of lower pressing bases 611 and a plurality of lower cutting conduit 612, this lower pressing base 611 is for being spaced with this lower cutting conduit 612, on this, pressing mold 620 has a plurality of upper pressing bases 621 and a plurality of upper cutting conduit 622, on this pressing base 621 with this on cutting conduit 622 be for being spaced, and this lower pressing base 611 is to going up pressing base 621, this lower cutting conduit 612 is to going up cutting conduit 622, in the present embodiment, on this, pressing mold 620 separately has at least one storage tank 623, on this, cutting conduit 622 is to be communicated with this storage tank 623, and this lower cutting conduit 612 of this lower pressing mold 610 is to be arranged in this storage tank 623.
Refer to shown in Figure 13, then, the lead frame 100 that this is had to a plurality of horizontal rectangle packaging body A is arranged at this lower pressing mold 610 and on this between pressing mold 620, and this lower pressing mold 610 with this on pressing mold 620 are these lead frames 100 of pressing, wherein respectively this lower pressing base 611 and respectively on this pressing base 621 are these packing colloids 400 of conflicting, and respectively this longitudinal connection rib 120 is to cut between conduit 622 on this lower cutting conduit 612 and this, in the present embodiment, this lower cutting conduit 612 has one first width H1, respectively on this, cutting conduit 622 has one second width H2, this second width H2 is not less than this first width H1, in order to this lower pressing base 611, support this horizontal rectangle packaging body A.
Refer to shown in Figure 13 and Figure 14, then, with a cutting tool 700, prolonging cutting conduit 622 and this lower cutting conduit 612 on this moves, the rotating speed of this cutting tool is more than 30000rpm, it is can remove this longitudinal connection rib 120 of this lead frame 100 moment and be positioned at the packing colloid 400 on those longitudinal connection ribs 120, refer to shown in Figure 15 and Figure 16, with this cutting tool 700, remove this longitudinal connection rib 120 of this lead frame 100, with form a plurality of lists from electronic building brick B, in the present embodiment, because this second width H2 of cutting conduit 622 on this is not less than respectively this first width H1 of this lower cutting conduit 612, therefore when this cutting tool 700 cutting conduit 622 and this lower cutting conduit 612 on this move to remove this longitudinal connection rib 120 of this lead frame 100, this lower pressing base 611 of this lower pressing mold 610 has been to provide the shearing resistance fulcrum of this horizontal rectangle packaging body A, it can avoid this packing colloid 400 and this longitudinal connection rib 120 to burst apart because of cutting scissors stress, in addition, because this lower cutting conduit 612 of this lower pressing mold 610 is to be positioned at this storage tank 623, therefore after cutting manufacturing technology completes, be to be conducive to access and collection, the discrete type electronic building brick manufacturing process of copper plate electrode of the present invention and known techniques are compared the advantage that has more simplified manufacturing technique and reduce fraction defective.
The above, it is only preferred embodiment of the present invention, not the present invention is done to any pro forma restriction, although the present invention discloses as above with preferred embodiment, yet not in order to limit the present invention, any those skilled in the art, do not departing within the scope of technical solution of the present invention, when can utilizing the technology contents of above-mentioned announcement to make a little change or being modified to the equivalent embodiment of equivalent variations, in every case be the content that does not depart from technical solution of the present invention, any simple modification of above embodiment being done according to technical spirit of the present invention, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (4)
1. a manufacturing process for the discrete type electronic building brick of copper plate electrode, is characterized in that comprising:
One lead frame, this lead frame is to have a plurality of horizontal connection ribs, a plurality of longitudinal connection ribs, a plurality of conductive carriers unit and a plurality of respectively interval trough between this conductive carrier unit and this horizontal connection rib that is positioned at, this horizontal connection rib and this longitudinal connection rib are to be chessboard to arrange, and this conductive carrier unit is between adjacent longitudinal connection rib, respectively this conductive carrier unit is to have a chip bearing, one pin and one is positioned at the clearance space between this chip bearing and this pin, respectively this chip bearing of this conductive carrier unit and this pin are to be connected to different longitudinal connection ribs, this chip bearing and this pin are not to be connected with this horizontal connection rib,
A plurality of chips, respectively this chip is to comprise the conductive layer that the second connection pad and that the first connection pad, that a upper surface, a lower surface, be positioned at this upper surface is positioned at this lower surface is positioned at this lower surface, this conductive layer is to be electrically connected this second connection pad;
This chip is arranged at respectively to respectively this chip bearing of this conductive carrier unit, and this chip is to be electrically connected respectively this chip bearing with this conductive layer;
Form a plurality of bonding wires, to be electrically connected respectively this first connection pad of this chip respectively and this pin respectively;
One mould envelope set of molds, it comprises a bed die and a mold, this lead frame is to be arranged on this bed die, this mold is to have a plurality of transverse moment connected in stars, this mold is to be arranged on this lead frame, and be arranged at this lead frame this chip, this bonding wire, at this longitudinal connection rib between this chip bearing and this pin and this clearance space, be to be placed between this transverse moment connected in star and this bed die;
With a packing colloid, be filled in this transverse moment connected in star, to seal this chip, this bonding wire and this longitudinal connection rib and this clearance space between this chip bearing and this pin;
Remove this mould envelope set of molds, so that this lead frame is formed with a plurality of horizontal rectangle packaging bodies;
One pressing mold group is provided, it comprises pressing mold on pressing mold and, this lower pressing mold has a plurality of lower pressing bases and a plurality of lower cutting conduit, this lower pressing base and this lower cutting conduit are for being spaced, on this, pressing mold has a plurality of upper pressing bases and a plurality of upper cutting conduit, on this pressing base and on this cutting conduit be for being spaced, and this lower pressing base is to going up pressing base, this lower cutting conduit is to going up cutting conduit;
The wire erection that this is had to a plurality of horizontal rectangle packaging bodies is placed in this lower pressing mold and on this between pressing mold, and this lower pressing mold and on this pressing mold be this lead frame of pressing, wherein respectively this lower pressing base and respectively on this pressing base be this packing colloid of conflicting, and respectively this longitudinal connection rib is to cut between conduit on this lower cutting conduit and this; And
With a cutting tool, prolonging cutting conduit and this lower cutting conduit on this and moving, to remove this longitudinal connection rib of this lead frame, with form a plurality of lists from electronic building brick.
2. the discrete type electronic building brick manufacturing process of copper plate electrode as claimed in claim 1, the rotating speed that it is characterized in that this cutting tool is more than 30000rpm.
3. the discrete type electronic building brick manufacturing process of copper plate electrode as claimed in claim 1, is characterized in that respectively this lower cutting conduit has one first width, and respectively on this, cutting groove road has one second width, and this second width is not less than this first width.
4. the discrete type electronic building brick manufacturing process of copper plate electrode as claimed in claim 1, it is characterized in that on this, pressing mold separately has at least one storage tank, on this, cutting conduit is to be communicated with this storage tank, and this lower cutting conduit of this lower pressing mold is to be arranged in this storage tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110451233.XA CN103177974B (en) | 2011-12-23 | 2011-12-23 | Process for manufacturing discrete electronic component of copper sheet electrode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110451233.XA CN103177974B (en) | 2011-12-23 | 2011-12-23 | Process for manufacturing discrete electronic component of copper sheet electrode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103177974A CN103177974A (en) | 2013-06-26 |
| CN103177974B true CN103177974B (en) | 2014-10-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110451233.XA Active CN103177974B (en) | 2011-12-23 | 2011-12-23 | Process for manufacturing discrete electronic component of copper sheet electrode |
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| Country | Link |
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| CN (1) | CN103177974B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1549341A (en) * | 2003-05-20 | 2004-11-24 | 矽品精密工业股份有限公司 | Non pin semiconductor package parts and production process constituted with conducting wire frame |
| CN101226890A (en) * | 2007-01-18 | 2008-07-23 | 南茂科技股份有限公司 | Blanking type encapsulation constitution without external pin and manufacturing method thereof |
| CN101540289A (en) * | 2008-03-19 | 2009-09-23 | 飞思卡尔半导体公司 | Semiconductor integrated circuit package and method for packaging semiconductor integrated circuit |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3429246B2 (en) * | 2000-03-21 | 2003-07-22 | 株式会社三井ハイテック | Lead frame pattern and method of manufacturing semiconductor device using the same |
| JP2003086750A (en) * | 2001-09-11 | 2003-03-20 | Rohm Co Ltd | Method for manufacturing electronic device |
| JP3789443B2 (en) * | 2003-09-01 | 2006-06-21 | Ｎｅｃエレクトロニクス株式会社 | Resin-sealed semiconductor device |
-
2011
- 2011-12-23 CN CN201110451233.XA patent/CN103177974B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1549341A (en) * | 2003-05-20 | 2004-11-24 | 矽品精密工业股份有限公司 | Non pin semiconductor package parts and production process constituted with conducting wire frame |
| CN101226890A (en) * | 2007-01-18 | 2008-07-23 | 南茂科技股份有限公司 | Blanking type encapsulation constitution without external pin and manufacturing method thereof |
| CN101540289A (en) * | 2008-03-19 | 2009-09-23 | 飞思卡尔半导体公司 | Semiconductor integrated circuit package and method for packaging semiconductor integrated circuit |
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| CN103177974A (en) | 2013-06-26 |
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Effective date of registration: 20231017 Address after: No. 789 Kangfu Road, Nantong High tech Industrial Development Zone, Nantong City, Jiangsu Province Patentee after: LIZHI ELECTRONICS (NANTONG) CO.,LTD. Address before: Jiangsu province Hanpu High-tech Industrial Zone Development Zone Kunshan Road, No. 989 Patentee before: LIZ ELECTRONICS (KUNSHAN) Co.,Ltd. |