CN103173821B - A kind for the treatment of process improving the coat binding strength of tungstenalloy - Google Patents
A kind for the treatment of process improving the coat binding strength of tungstenalloy Download PDFInfo
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- CN103173821B CN103173821B CN201310099265.7A CN201310099265A CN103173821B CN 103173821 B CN103173821 B CN 103173821B CN 201310099265 A CN201310099265 A CN 201310099265A CN 103173821 B CN103173821 B CN 103173821B
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Abstract
The present invention relates to a kind for the treatment of process improving tungsten alloy layer bonding strength.Mainly solve prior art and there is poor bonding strength at tungstenalloy plating process, coating easily comes off, to such an extent as to the problem causing antiseptic property to reduce.Electrolytic coating is second time electroplating, and step is as follows: first, carries out pre-treatment to tungstenalloy; adopt hydrofluoric acid treatment, then electroplate one deck nickel, thickness is 1 microns; cleaning, drying, then carries out heat in the sintering oven being full of protective gas, insulation for some time; after cooling; secondly, then do activating pretreatment, in the outer electronickelling again of this electrolytic coating or electroplate other metal; reach the total thickness of needs, carry out after plating cleaning, drying.Because this technique adopts the mode of twice plating, heat makes pre-plating layer and the abundant metallic molecule rapid diffusion of tungstenalloy, strengthen the bonding force of coating and tungstenalloy, again electroplate the bonding strength that both improve coating and tungstenalloy, maintain again coating light aesthetic property and preservative property.
Description
Technical field
The present invention relates to a kind for the treatment of process improving tungsten alloy layer bonding strength.
Background technology
Tungstenalloy is easily oxidized in malaria or in hot environment, the general Nickel Plating Treatment in surface is anticorrosion, but because tungstenalloy is all that powder metallurgy is produced, many pores, theoretical compactness is inadequate, and the chemical property of tungsten is very stable, there is faint effect to tungsten in major part acid except hydrofluoric acid, and treatment before plating difficulty is large, cause coating and tungstenalloy bonding force inadequate, bad and the easy delamination of coating of compactness of electroplating, does not reach preservative effect.
Summary of the invention
In order to overcome deficiency in background technology and defect, the invention provides a kind for the treatment of process improving tungsten alloy layer bonding strength, solve prior art and there is poor bonding strength at tungstenalloy plating process, coating easily comes off, to such an extent as to the problem causing antiseptic property to reduce.
Technical scheme of the present invention is: a kind for the treatment of process improving tungsten alloy layer bonding strength, need at the foreign-plated certain thickness nickel of tungstenalloy, electrolytic coating is second time electroplating, step is as follows: first, pre-treatment is carried out to tungstenalloy, adopt hydrofluoric acid treatment, then one deck nickel is electroplated, thickness is 20% ~ 40% of total thickness, cleaning, drying, then in the sintering oven being full of protective gas, heat is carried out, insulation for some time, after cooling, secondly, do activating pretreatment again, again electroplating layer of metal coating and thickness outward at this electrolytic coating is 60% ~ 80% reach total thickness, clean after plating, dry.
Second time electrolytic coating is nickel or nickelalloy.
In sintering oven, temperature is 800 ~ 900 degree.
Total thickness is 3 μm, first time plating 1 μm.
Beneficial effect of the present invention: because this technique adopts the mode of twice plating, heat makes coating and the abundant metallic molecule rapid diffusion of tungstenalloy, strengthen the bonding force of coating and tungstenalloy, this had both improve the bonding strength of coating and tungstenalloy, maintained again coating light aesthetic property and the preservative property of nickel plating.
Embodiment
Be described further for embodiments of the invention below:
A kind for the treatment of process improving tungsten alloy layer bonding strength, need at the foreign-plated certain thickness nickel of tungstenalloy, electrolytic coating is second time electroplating, step is as follows: first, pre-treatment is carried out to tungstenalloy, adopt hydrofluoric acid treatment, then one deck nickel is electroplated, thickness is 20% ~ 40% of total thickness, the total thickness that the present embodiment adopts is 3um, first time electroplates 1um, this thickness can prevent delamination, come off, the associativity of both guarantees, associativity is best, cleaning, drying, then in the sintering oven being full of protective gas, heat is carried out, due to tungstenalloy and nickel fusing point comparatively Gao Jun more than 1400 degree, heat makes coating and the abundant metallic molecule rapid diffusion of tungstenalloy, strengthen the bonding force of coating and tungstenalloy.Insulation for some time, can according to the corresponding regulating time length of product size, after cooling, secondly, do activating pretreatment again, because the surface treatment being coating nickel is more convenient, again electroplate layer of metal layer outward at this electrolytic coating, the metal level of the present embodiment second time plating is nickel or nickelalloy and thickness is 60% ~ 80% reach total thickness, carries out cleaning, drying after plating.
In the present invention, in sintering oven, temperature is 800 ~ 900 degree.Heating temperatures to 800 ~ 900 degree in sintering oven, can promote the bonding strength of tungstenalloy and coating in this temperature, associativity is strong, and use properties is good, and stability is high.
In the present invention, nickel coating total thickness is 3 μm.First time plating about 1um, the second plating about 2um, total thickness of coating can plate the coating of different thickness as required, first time plating 20% ~ 40%, second time plating 60% ~ 80%.
Embodiment should not be considered as the restriction to invention, but any improvement done based on spirit of the present invention, all should within protection scope of the present invention.
Claims (3)
1. one kind is improved the treatment process of tungsten alloy layer bonding strength, need at the foreign-plated certain thickness nickel of tungstenalloy, it is characterized in that: electrolytic coating is second time electroplating, total thickness is 3 μm, step is as follows: first, pre-treatment is carried out to tungstenalloy, adopt hydrofluoric acid treatment, then one deck nickel is electroplated, thickness is first time plating 1 μm, cleaning, drying, then in the sintering oven being full of protective gas, heat is carried out, insulation for some time, after cooling, secondly, do activating pretreatment again, again layer of metal coating is electroplated outward and thickness is 2 μm reaches total thickness at this electrolytic coating, clean after plating, dry.
2. a kind for the treatment of process improving tungsten alloy layer bonding strength according to claim 1, is characterized in that second time electrolytic coating is nickel or nickelalloy.
3. a kind for the treatment of process improving tungsten alloy layer bonding strength according to claim 1 or 2, is characterized in that in sintering oven, temperature is 800 ~ 900 degrees Celsius.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310099265.7A CN103173821B (en) | 2013-03-26 | 2013-03-26 | A kind for the treatment of process improving the coat binding strength of tungstenalloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310099265.7A CN103173821B (en) | 2013-03-26 | 2013-03-26 | A kind for the treatment of process improving the coat binding strength of tungstenalloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103173821A CN103173821A (en) | 2013-06-26 |
| CN103173821B true CN103173821B (en) | 2016-04-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310099265.7A Active CN103173821B (en) | 2013-03-26 | 2013-03-26 | A kind for the treatment of process improving the coat binding strength of tungstenalloy |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2443651A (en) * | 1944-12-05 | 1948-06-22 | Westinghouse Electric Corp | Process of electroplating on tungsten |
| CN101704160A (en) * | 2009-12-03 | 2010-05-12 | 西安交通大学 | Heterogeneous metal connecting method for tungsten, copper and alloy thereof |
| CN102345145A (en) * | 2011-09-30 | 2012-02-08 | 成都四威高科技产业园有限公司 | Method for electroplating surface of molybdenum and copper alloy |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS531137A (en) * | 1976-06-24 | 1978-01-07 | Sumitomo Electric Industries | Nickel plating method onto tungsten |
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2013
- 2013-03-26 CN CN201310099265.7A patent/CN103173821B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2443651A (en) * | 1944-12-05 | 1948-06-22 | Westinghouse Electric Corp | Process of electroplating on tungsten |
| CN101704160A (en) * | 2009-12-03 | 2010-05-12 | 西安交通大学 | Heterogeneous metal connecting method for tungsten, copper and alloy thereof |
| CN102345145A (en) * | 2011-09-30 | 2012-02-08 | 成都四威高科技产业园有限公司 | Method for electroplating surface of molybdenum and copper alloy |
Non-Patent Citations (1)
| Title |
|---|
| 钨合金表面化学镀镍工艺;张颖等;《电镀与涂饰》;20060315;第25卷(第3期);第8-12页 * |
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| CN103173821A (en) | 2013-06-26 |
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