CN103166580A - Radio frequency power amplification module and high power radio frequency power supply with heat dissipation air channel - Google Patents
Radio frequency power amplification module and high power radio frequency power supply with heat dissipation air channel Download PDFInfo
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- CN103166580A CN103166580A CN2011104100221A CN201110410022A CN103166580A CN 103166580 A CN103166580 A CN 103166580A CN 2011104100221 A CN2011104100221 A CN 2011104100221A CN 201110410022 A CN201110410022 A CN 201110410022A CN 103166580 A CN103166580 A CN 103166580A
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- radio frequency
- frequency power
- amplification module
- power amplification
- fan
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Abstract
The invention provides a radio frequency power amplification module which comprises a power amplifier and a radiator. The power amplifier and the radiator are connected in a fastening mode. An embedded groove used for embedding a fan is formed in the radiator. The size of the embedded groove is equal to the size of the embedded fan. The invention further provides a high power radio frequency power supply with a heat dissipation air channel. The high power radio frequency power supply with the heat dissipation air channel comprises a radio frequency power amplification module and a rack case. One side of the radio frequency power amplification module is tightly contacted with the side wall of the rack case, wherein the side of the radio frequency power amplification module is provided with heat dissipation teeth. The side wall of the rack case is provided with the fan which is embedded into the embedded groove. A wind direction of the fan blows from the inner side of the rack case to the outer side of the rack case. The fan embedded into the radio frequency power amplification module guarantees that heat produced by the power amplifier in the radio frequency power amplification module can be conducted immediately. A plurality of heat dissipation air channels are formed and isolate heat sources, and the heat produced by the radio frequency power amplification module can be rejected effectively.
Description
Technical field
The present invention relates to power technique fields, particularly a kind of radio frequency power amplification module and have the high-power RF power supply of heat dissipation wind channel.
Background technology
1500W and above high power solid state radio-frequency power supply are due to the mode of operation of radio frequency power amplification module and the impact of self cabinet in the market, what heat radiation was mainly adopted is water-cooling pattern, this mode has reduced the reliability of whole power supply on the one hand, and it is not very convenient using for the user on the other hand.When the radio-frequency power module was 1500W in power output, the dissipation energy that self produces can reach the heat of 400W left and right.The area of the radio-frequency power amplifier that this radio frequency power amplification module adopts is that 4 square centimeters of power densities that is to say that power amplifier self dissipates are 100W/cm
2If so can not in time to conduct so the impact on radio frequency amplifier will be fatal to high energy.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of high-power RF power supply that can reach the radio frequency power amplification module of great heat radiation effect and have heat dissipation wind channel.
For solving the problems of the technologies described above, the invention provides a kind of radio frequency power amplification module and comprise power amplifier and radiator; Described power amplifier and described radiator are fastenedly connected; Described radiator has the embedded groove that embeds fan, and the size of embedded groove equates with the fan of embedding.
Further, the joint face between described power amplifier and radiator is coated with heat-conducting silicone grease.
Further, described radiator is being provided with a plurality of radiation tooths with the discontiguous another side of described power amplifier.
Further, the distance between described radiation tooth does not wait, and in distance described power amplifier fixed position at a distance, the spacing between described radiation tooth is less, and more nearby, the spacing between described radiation tooth is larger in the described power amplifier of distance fixed position.
Further, described radiator is made by the high material of conductive coefficient.
Further, described radiator is made by fine aluminium.
The present invention also provides a kind of high-power RF power supply with heat dissipation wind channel to comprise radio frequency power amplification module, cabinet, described radio frequency power amplification module has a side of radiation tooth and the sidewall close contact of described cabinet, thereby forms the air channel between radiation tooth and described cabinet sidewall; Be provided with the fan that is embedded in described embedded groove on described cabinet sidewall, the wind direction of described fan is blown side outward by side direction cabinet in cabinet.
Further, the left side of described radio frequency power amplification module is provided with vertical clapboard, and the lower end of described radio frequency power amplification module is provided with diaphragm plate, described radio frequency power amplification module and described cabinet close contact.
Further, described diaphragm plate is provided with louvre over against the place of radio frequency power amplification module.
Further, the rear board of described cabinet is provided with fan, and the wind direction of this fan is from the export-oriented radio frequency power amplification module side-blown of cabinet.
The embedded fan of radio frequency power amplification module provided by the invention can guarantee that the heat that the radio frequency power amplification module intermediate power amplifier produces is conducted immediately.High-power RF power supply with heat dissipation wind channel provided by the invention by forming some heat dissipation wind channels, and thermal source is isolated, thereby the heat that can effectively radio frequency power amplification module be produced dispels the heat.
Description of drawings
The stereogram of the radio frequency power amplification module that Fig. 1 provides for the embodiment of the present invention.
Embodiment
Referring to Fig. 1, a kind of radio frequency power amplification module that the embodiment of the present invention provides comprises power amplifier and radiator 1.Power amplifier and radiator 1 are fastenedly connected.Radiator 1 has the embedded groove that can embed fan, and the size of embedded groove equates with the fan of embedding.Embedded fan comprises 10 centimetres, 12 centimetres even larger sized fans, and the rotating speed of fan can be from 1000 rev/mins to 6000 rev/mins, preferred 3500 rev/mins.Joint face between power amplifier and radiator 1 is coated with heat-conducting silicone grease.Radiator 1 is being provided with a plurality of radiation tooths with the discontiguous another side of power amplifier.Distance between radiation tooth does not wait, and at a distance, the spacing between radiation tooth is less in distance power amplifier fixed position, and more nearby, the spacing between radiation tooth is larger in distance power amplifier fixed position.Radiator is made by the high material of conductive coefficient, for example fine aluminium.In radiator 1, be embedded with fan 2, fan 2 can be fixed on radiator, also can be fixed on the cabinet sidewall that radio frequency power amplification module packs into, be the plane as long as guarantee to be embedded with the face of fan on radiator.The wind direction of fan 2 be from radiator outside radiator.
This radio frequency power amplification module can be applicable in the high-power RF power supply with heat dissipation wind channel.After the polishing of radio frequency power amplification module bottom with cabinet (for example, 3U or 4U cabinet) bottom close contact after, the heat that radio frequency power amplification module produces can conduct by cabinet, because the area of dissipation of cabinet with respect to the radiator of radio frequency power amplification module is larger, so the radiator of radio frequency power amplification module adds that the aluminum cabinet makes the integral heat sink better effects if of cabinet.After radio frequency power amplification module is put into cabinet, avoid occurring the vortes interference radiating effect for the stability of the wind speed that guarantees to dispel the heat, must do necessary heat dissipation wind channel in cabinet.Therefore, radio frequency power amplification module has a side of radiation tooth and the sidewall close contact of cabinet, thereby forms the air channel between radiation tooth and described cabinet sidewall.Be provided with the fan that is embedded in embedded groove on the cabinet sidewall, the wind direction of fan is blown side outward by side direction cabinet in cabinet, can guarantee that the heat energy that radio frequency power amplification module produces conducts enough rapidly cabinet efficiently through the air channel, avoid heat in the accumulating of cabinet, and then caused component failure or damage.
In addition, the left side of radio frequency power amplification module is provided with vertical clapboard.The lower end of radio frequency power amplification module is provided with diaphragm plate, thereby radio frequency power amplification module and other parts of cabinet are kept apart, and has reduced the impact of radio frequency power amplification module on other module in cabinet.Diaphragm plate is provided with louvre over against the place of radio frequency power amplification module.In addition, because the components and parts on the circuit board in radio frequency power amplification module are also that calorie source need to carry out certain heat radiation, can be blown by the export-oriented radio frequency power amplification module direction of cabinet by the fan that is arranged on the cabinet rear board, can alleviate to a certain extent the overheated problem of components and parts on the circuit board in radio frequency power amplification module.
It should be noted last that, above embodiment is only unrestricted in order to technical scheme of the present invention to be described, although with reference to example, the present invention is had been described in detail, those of ordinary skill in the art is to be understood that, can modify or be equal to replacement technical scheme of the present invention, and not breaking away from the spirit and scope of technical solution of the present invention, it all should be encompassed in the middle of claim scope of the present invention.
Claims (10)
1. a radio frequency power amplification module, is characterized in that, comprises
Power amplifier and radiator; Described power amplifier and described radiator are fastenedly connected; Described radiator has the embedded groove that embeds fan, and the size of embedded groove equates with the fan of embedding.
2. radio frequency power amplification module according to claim 1 is characterized in that:
Joint face between described power amplifier and radiator is coated with heat-conducting silicone grease.
3. radio frequency power amplification module according to claim 2 is characterized in that:
Described radiator is being provided with a plurality of radiation tooths with the discontiguous another side of described power amplifier.
4. radio frequency power amplification module according to claim 3 is characterized in that:
Distance between described radiation tooth does not wait, and in distance described power amplifier fixed position at a distance, the spacing between described radiation tooth is less, and more nearby, the spacing between described radiation tooth is larger in the described power amplifier of distance fixed position.
5. radio frequency power amplification module according to claim 4 is characterized in that:
Described radiator is made by the high material of conductive coefficient.
6. radio frequency power amplification module according to claim 4 is characterized in that:
Described radiator is made by fine aluminium.
7. the high-power RF power supply with heat dissipation wind channel of the described radio frequency power amplification module of integrated claim 3, is characterized in that, also comprises
Cabinet, described radio frequency power amplification module have a side of radiation tooth and the sidewall close contact of described cabinet, thereby form the air channel between radiation tooth and described cabinet sidewall; Be provided with the fan that is embedded in described embedded groove on described cabinet sidewall, the wind direction of described fan is blown side outward by side direction cabinet in cabinet.
8. high-power RF power supply according to claim 7 is characterized in that:
The left side of described radio frequency power amplification module is provided with vertical clapboard, and the lower end of described radio frequency power amplification module is provided with diaphragm plate, described radio frequency power amplification module and described cabinet close contact.
9. high-power RF power supply according to claim 8 is characterized in that:
Described diaphragm plate is provided with louvre over against the place of radio frequency power amplification module.
10. high-power RF power supply according to claim 9 is characterized in that:
The rear board of described cabinet is provided with fan, and the wind direction of this fan is from the export-oriented radio frequency power amplification module side-blown of cabinet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104100221A CN103166580A (en) | 2011-12-09 | 2011-12-09 | Radio frequency power amplification module and high power radio frequency power supply with heat dissipation air channel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104100221A CN103166580A (en) | 2011-12-09 | 2011-12-09 | Radio frequency power amplification module and high power radio frequency power supply with heat dissipation air channel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103166580A true CN103166580A (en) | 2013-06-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011104100221A Pending CN103166580A (en) | 2011-12-09 | 2011-12-09 | Radio frequency power amplification module and high power radio frequency power supply with heat dissipation air channel |
Country Status (1)
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| CN (1) | CN103166580A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2586334Y (en) * | 2002-12-09 | 2003-11-12 | 熊猫电子集团有限公司 | Forced air cooling device electromagnetically separated with inside of appliance |
| CN2627652Y (en) * | 2003-05-17 | 2004-07-21 | 刘建平 | Built-in combined type heat sink |
| CN2840168Y (en) * | 2005-10-27 | 2006-11-22 | 瑞传科技股份有限公司 | Radiating device |
| CN201418229Y (en) * | 2009-06-09 | 2010-03-03 | 索士亚科技股份有限公司 | A radiation device |
| CN101752356A (en) * | 2008-11-28 | 2010-06-23 | 富士电机***株式会社 | Cooling apparatus for semiconductor chips |
| CN201750666U (en) * | 2010-08-16 | 2011-02-16 | 李明烈 | Radiation base combined with fan and radiator equipped with the radiation base |
| CN102073357A (en) * | 2010-12-23 | 2011-05-25 | 北京中科大洋科技发展股份有限公司 | Low-noise machine case for integrated computer server |
-
2011
- 2011-12-09 CN CN2011104100221A patent/CN103166580A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2586334Y (en) * | 2002-12-09 | 2003-11-12 | 熊猫电子集团有限公司 | Forced air cooling device electromagnetically separated with inside of appliance |
| CN2627652Y (en) * | 2003-05-17 | 2004-07-21 | 刘建平 | Built-in combined type heat sink |
| CN2840168Y (en) * | 2005-10-27 | 2006-11-22 | 瑞传科技股份有限公司 | Radiating device |
| CN101752356A (en) * | 2008-11-28 | 2010-06-23 | 富士电机***株式会社 | Cooling apparatus for semiconductor chips |
| CN201418229Y (en) * | 2009-06-09 | 2010-03-03 | 索士亚科技股份有限公司 | A radiation device |
| CN201750666U (en) * | 2010-08-16 | 2011-02-16 | 李明烈 | Radiation base combined with fan and radiator equipped with the radiation base |
| CN102073357A (en) * | 2010-12-23 | 2011-05-25 | 北京中科大洋科技发展股份有限公司 | Low-noise machine case for integrated computer server |
Non-Patent Citations (1)
| Title |
|---|
| 郝国欣 等: "功率器件的散热设计方法", 《电子工程师》, vol. 31, no. 11, 30 November 2005 (2005-11-30) * |
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Application publication date: 20130619 |