CN103165212A - Base metal slurry material used for sheet-type resistor and preparation method thereof - Google Patents
Base metal slurry material used for sheet-type resistor and preparation method thereof Download PDFInfo
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- CN103165212A CN103165212A CN2011104192897A CN201110419289A CN103165212A CN 103165212 A CN103165212 A CN 103165212A CN 2011104192897 A CN2011104192897 A CN 2011104192897A CN 201110419289 A CN201110419289 A CN 201110419289A CN 103165212 A CN103165212 A CN 103165212A
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Abstract
The invention relates to a base metal slurry material used for a sheet-type resistor and a preparation method thereof. The base metal slurry material used for the sheet-type resistor comprises, by weight percentage, 40%-60% of base metal powder, 15%-40% of glass powder, 10%-30% of organic carrier and 5%-10% of solvents. The preparation method of the base metal slurry material used for the sheet-type resistor comprises the steps of organic carrier preparation, composition material preparation, slurry material preparation and slurry material production. Compared with the prior art, a mode of using combined powder formed by copper powder, zinc powder and yttrium powder as functional phase is used for preparing the base metal slurry material, the cost of resistor slurry materials is greatly reduced, meanwhile, in glass powder functional phase, through the composition of glass phase and the selection of compositions, the expansion coefficient of a resistor track layer formed by the glass powder functional phase and a base metal combined powder is basically matched with a ceramic matrix, and temperature coefficient is reduced. The base metal slurry material used for the sheet-type resistor can replace an existing imported precious metal resistor slurry material.
Description
Technical field
The present invention relates to a kind of metal paste and preparation method thereof, especially relate to a kind of chip resistor base metal slurry and preparation method thereof.
Background technology
Since entering 21 century, the high speed development of electronics and information industry constantly increases the demand of electronic component.The electronic devices and components that are used for surface mounting technology comprise chip resistor, chip capacitor, chip inductor, chip-Size semiconductor device and other chip products.Wherein having the call of chip resistor, account for more than 45% of whole chip components and parts.
The high speed development of electronic information technology has also obtained brand-new development to the technology that Element Technology constantly proposes new higher requirement, especially chip resistor, is promoting chip resistor and is entering into a period of upgrading rapidly.With regard to the developing direction of chip resistor, mainly contain following direction: subminaturization, environmental protection, high precision int, low-temperature coefficient flower and lowpriced metallization.
Chip resistor normally adopts with the ceramic substrate of 96%Al2O3 as heat radiating material, Ag-Pd as the oxide of conductor material, ruthenium and ruthenium as resistor material, glass glaze as encapsulating material, termination electronickelling tin etc.Be coated with the 30 multiple tracks productions such as silver-colored technology, a folding grain technology, electroplating technology and inspection process meticulously makes and forms by silk screen printing, sintering technology, laser resistor trimming technology, sliver technology, termination.
The resistance slurry that uses in the chip resistor manufacture process mostly is the U.S. and Japanese imported product, price is higher, reach more than 30,000 yuan/kilogram, and there are the problems such as temperature coefficient is higher, developing direction from chip resistor, how therefore the lowpriced metallization trend that is inevitable realize that the lowpriced metallization of low-temperature coefficient resistance slurry is an important problem.
Summary of the invention
Purpose of the present invention is exactly that the temperature coefficient that provides a kind of for the defective that overcomes above-mentioned prior art existence is lower, and greatly reduces chip resistor base metal slurry and preparation method thereof of resistance slurry cost.
Purpose of the present invention can be achieved through the following technical solutions:
A kind of chip resistor base metal slurry comprises following component and weight percent content:
Base metal powder 40-60;
Glass dust 15-40;
Organic carrier 10-30;
Solvent 5-10.
Described base metal powder is the composite powder of copper powder, zinc powder, yttrium powder composition, and the weight ratio of copper powder, zinc powder, yttrium powder is (55-40): (30-40): (15-20), the particle diameter of three kinds of metal powders is all less than 3 μ m.
Described glass dust is microcrystalline glass powder, comprises following component and weight percent content:
Bi
2O
3 50-70；
SiO
2 6-13；
B
2O
3 5-30；
ZnO 3-9；
TiO
2 1-10；
SrO 3-10；
Al
2O
3 5-14；
CaO 0-5。
Described organic carrier comprises following component and weight percent content:
Macromolecule resin 10-30
Solvent 70-90.
Described macromolecule resin is selected from one or more in ethyl cellulose, celluloid or rosin.
Described solvent is selected from one or more mixtures that mix with arbitrary proportion in butyl ether, 12 ester alcohol, ethylene glycol ethyl ether, turpentine oil, cyclohexanone or terpinol.
A kind of chip resistor preparation method of base metal slurry comprises the following steps:
(1) preparation of carrier: take macromolecule resin and solvent, then be heated and be warming up to 80 ℃ and constant temperature, until resin constant temperature is dissolved to 15000-35000cps, then with resin filtering and impurity removing on 300-400 purpose screen cloth, obtain carrier;
(2) get the raw materials ready according to following component and weight percent content:
(3) preparation of slurry: take base metal powder, glass dust, it is fully mixed in batch mixer with organic carrier, solvent, using high speed dispersor to carry out high speed dispersion, obtain uniform slurry;
(4) production of slurry: above-mentioned slurry is ground at three rollers grind, the fine setting by roller is controlled at below 15 μ m the slurry fineness, and viscosity is 25-35Pa.S, makes chip resistor base metal slurry.
Compared with prior art, the present invention prepares the base metal slurry by the composite powder that adopts copper powder, zinc powder, yttrium powder and form as the mode of function phase, greatly reduce the cost of resistance slurry, simultaneously, the glass dust function mutually in, form and the selection of component by glassy phase, the coefficient of expansion and the ceramic matrix that make it the resistor track layer that consists of with the base metal composite powder are complementary, and have reduced temperature coefficient.The noble metal resistance slurry of the alternative existing import of product of the present invention.
Embodiment
The present invention is described in detail below in conjunction with specific embodiment.
Embodiment 1
A kind of chip resistor preparation method of base metal slurry, the method comprises the following steps:
(1) preparation of carrier; Formulation vehicle 50Kg, take macromolecule resin 8Kg, butyl ether 22Kg and terpinol 20Kg, then be heated and be warming up to 80 ℃ and constant temperature, until resin constant temperature is dissolved to 25000-35000cps, with resin filtering and impurity removing on 300-400 purpose screen cloth, obtain carrier again;
(2) the common 100Kg that gets the raw materials ready, get the raw materials ready according to following component and content (wt%):
The base metal powder is the composite powder that copper powder, zinc powder, yttrium powder form, wherein copper powder: zinc powder: yttrium powder=52: 32: 16, the particle diameter of three kinds of powder are all less than 3 μ m.
Glass dust used is microcrystalline glass powder, and its component and content (wt%) are:
Solvent for use is butyl ether.
(3) preparation of slurry: take base metal powder, glass dust, it is fully mixed in batch mixer with organic carrier, solvent, using high speed dispersor to carry out high speed dispersion, obtain uniform slurry;
(4) production of slurry: above-mentioned slurry is ground at three rollers grind, the fine setting by roller is controlled at below 15 μ m the slurry fineness, and viscosity is 25-35Pa.S, makes chip resistor base metal slurry.
The mode of above-mentioned slurry by silk screen printing is printed on the ceramic matrix of chip resistor, carries out sintering, encapsulate and make finished product according to the normal process of present industry, made up existing deficiency with the slurry products made thereby.
Embodiment 2
A kind of chip resistor preparation method of base metal slurry, the method comprises the following steps:
(1) preparation of carrier: formulation vehicle 50Kg, take macromolecule resin 10Kg, butyl ether 20Kg and terpinol 20Kg, then be heated and be warming up to 80 ℃ and constant temperature, until resin constant temperature is dissolved to 25000-35000cps, with resin filtering and impurity removing on 300-400 purpose screen cloth, obtain carrier again;
(2) the common 100Kg that gets the raw materials ready, get the raw materials ready according to following component and content (wt%):
The base metal powder is the composite powder that copper powder, zinc powder, yttrium powder form, wherein copper powder: zinc powder: yttrium powder=50: 35: 15, the particle diameter of three kinds of powder are all less than 3 μ m.
Glass dust used is microcrystalline glass powder, and its component and content (wt%) are:
Solvent for use is turpentine oil.
(3) preparation of slurry: take base metal powder, glass dust, it is fully mixed in batch mixer with organic carrier, solvent, using high speed dispersor to carry out high speed dispersion, obtain uniform slurry;
(4) production of slurry: above-mentioned slurry is ground at three rollers grind, the fine setting by roller is controlled at below 15 μ m the slurry fineness, and viscosity is 25-35Pa.S, makes chip resistor base metal slurry.
Embodiment 3
A kind of chip resistor preparation method of base metal slurry, the method comprises the following steps:
(1) preparation of carrier: formulation vehicle 50Kg, take macromolecule resin 12.5Kg, butyl ether 17.5Kg and terpinol 20Kg, then be heated and be warming up to 80 ℃ and constant temperature, until resin constant temperature is dissolved to 25000-35000cps, with resin filtering and impurity removing on 300-400 purpose screen cloth, obtain carrier again;
(2) the common 100Kg that gets the raw materials ready, get the raw materials ready according to following component and content (wt%):
The base metal powder is the composite powder that copper powder, zinc powder, yttrium powder form, wherein copper powder: zinc powder: yttrium powder=45: 40: 15, the particle diameter of three kinds of powder are all less than 3 μ m.
Glass dust used is microcrystalline glass powder, and its component and content (wt%) are:
Solvent for use is turpentine oil.
(3) preparation of slurry: take base metal powder, glass dust, it is fully mixed in batch mixer with organic carrier, solvent, using high speed dispersor to carry out high speed dispersion, obtain uniform slurry;
(4) production of slurry: above-mentioned slurry is ground at three rollers grind, the fine setting by roller is controlled at below 15 μ m the slurry fineness, and viscosity is 25-35Pa.S, makes chip resistor base metal slurry.
Embodiment 4
A kind of chip resistor preparation method of base metal slurry, the method comprises the following steps:
(1) preparation of carrier: formulation vehicle 50Kg, take macromolecule resin 15Kg, butyl ether 20Kg and terpinol 15Kg, then be heated and be warming up to 80 ℃ and constant temperature, until resin constant temperature is dissolved to 25000-35000cps, with resin filtering and impurity removing on 300-400 purpose screen cloth, obtain carrier again;
(2) the common 100Kg that gets the raw materials ready, get the raw materials ready according to following component and content (wt%):
The base metal powder is the composite powder that copper powder, zinc powder, yttrium powder form, wherein copper powder: zinc powder: yttrium powder=40: 40: 20, the particle diameter of three kinds of powder are all less than 3 μ m.
Glass dust used is microcrystalline glass powder, and its component and content (wt%) are:
Solvent for use is turpentine oil.
(3) preparation of slurry: take base metal powder, glass dust, it is fully mixed in batch mixer with organic carrier, solvent, using high speed dispersor to carry out high speed dispersion, obtain uniform slurry;
(4) production of slurry: above-mentioned slurry is ground at three rollers grind, the fine setting by roller is controlled at below 15 μ m the slurry fineness, and viscosity is 25-35Pa.S, makes chip resistor base metal slurry.
Embodiment 5
A kind of chip resistor base metal slurry comprises following component and content:
Base metal powder 50kg, glass dust 20kg, organic carrier 24kg, solvent are ten diester alcohol 6kg.
Wherein, the base metal powder is the composite powder of copper powder, zinc powder, yttrium powder composition, and the weight ratio of copper powder, zinc powder, yttrium powder is the mixture of 55: 30: 15, and the particle diameter of three kinds of metal powders is all less than 3 μ m.The glass dust that uses is microcrystalline glass powder, comprises following component and content: Bi
2O
350kg, SiO
26kg, B
2O
330kg, ZnO3kg, TiO
21kg, SrO 3kg, Al
2O
35kg, CaO 2kg.Organic carrier comprises following component and content: macromolecule resin ethyl cellulose 20kg, solvent are ten diester alcohol 80kg.
The chip resistor preparation method of base metal slurry comprises the following steps:
(1) preparation of carrier: take macromolecule resin and solvent, then be heated and be warming up to 80 ℃ and constant temperature, until resin constant temperature is dissolved to 15000cps, then with resin filtering and impurity removing on 300 purpose screen cloths, obtain carrier;
(2) get the raw materials ready according to above component and content after, the preparation slurry;
(3) preparation of slurry: take base metal powder, glass dust, it is fully mixed in batch mixer with organic carrier, solvent, using high speed dispersor to carry out high speed dispersion, obtain uniform slurry;
(4) production of slurry: above-mentioned slurry is ground at three rollers grind, the fine setting by roller is controlled at below 15 μ m the slurry fineness, and viscosity is 25Pa.S, makes chip resistor base metal slurry.
Embodiment 6
A kind of chip resistor base metal slurry comprises following component and content:
Base metal powder 55kg, glass dust 25kg, organic carrier 12kg, solvent are ethylene glycol ethyl ether 8kg.
Wherein, the base metal powder is the composite powder of copper powder, zinc powder, yttrium powder composition, and the weight ratio of copper powder, zinc powder, yttrium powder is the mixture of 40: 40: 20, and the particle diameter of three kinds of metal powders is all less than 3 μ m.The glass dust that uses is microcrystalline glass powder, comprises following component and content: Bi
2O
350kg, SiO
27kg, B
2O
36kg, ZnO 4kg, TiO
26kg, SrO 10kg, Al
2O
314kg, CaO 3kg.Organic carrier comprises following component and content: macromolecule resin celluloid 25kg, solvent are ethylene glycol ethyl ether 75kg.
The chip resistor preparation method of base metal slurry comprises the following steps:
(1) preparation of carrier: take macromolecule resin and solvent, then be heated and be warming up to 80 ℃ and constant temperature, until resin constant temperature is dissolved to 35000cps, then with resin filtering and impurity removing on 400 purpose screen cloths, obtain carrier;
(2) get the raw materials ready according to above component and content after, the preparation slurry;
(3) preparation of slurry: take base metal powder, glass dust, it is fully mixed in batch mixer with organic carrier, solvent, using high speed dispersor to carry out high speed dispersion, obtain uniform slurry;
(4) production of slurry: above-mentioned slurry is ground at three rollers grind, the fine setting by roller is controlled at below 15 μ m the slurry fineness, and viscosity is 35Pa.S, makes chip resistor base metal slurry.
Claims (7)
1. a chip resistor base metal slurry, is characterized in that, this resistance slurry comprises following component and weight percent content:
Base metal powder 40-60;
Glass dust 15-40;
Organic carrier 10-30;
Solvent 5-10.
2. a kind of chip resistor base metal slurry according to claim 1, it is characterized in that, described base metal powder is the composite powder of copper powder, zinc powder, yttrium powder composition, the weight ratio of copper powder, zinc powder, yttrium powder is (55-40): (30-40): (15-20), the particle diameter of three kinds of metal powders is all less than 3 μ m.
3. a kind of chip resistor base metal slurry according to claim 1, is characterized in that, described glass dust is microcrystalline glass powder, comprises following component and weight percent content:
Bi
2O
3 50-70；
SiO
2 6-13；
B
2O
3 5-30；
ZnO 3-9；
TiO
2 1-10；
SrO 3-10；
Al
2O
3 5-14；
CaO 0-5。
4. a kind of chip resistor base metal slurry according to claim 1, is characterized in that, described organic carrier comprises following component and weight percent content:
Macromolecule resin 10-30
Solvent 70-90.
5. a kind of chip resistor base metal slurry according to claim 4, is characterized in that, described macromolecule resin is selected from one or more in ethyl cellulose, celluloid or rosin.
6. according to claim 1 or 4 described a kind of chip resistor base metal slurries, it is characterized in that, described solvent is selected from one or more mixtures that mix with arbitrary proportion in butyl ether, 12 ester alcohol, ethylene glycol ethyl ether, turpentine oil, cyclohexanone or terpinol.
7. the preparation method of a chip resistor use base metal slurry as claimed in claim 1, is characterized in that, the method comprises the following steps:
(1) preparation of carrier: take macromolecule resin and solvent, then be heated and be warming up to 80 ℃ and constant temperature, until resin constant temperature is dissolved to 15000-35000cps, then with resin filtering and impurity removing on 300-400 purpose screen cloth, obtain carrier;
(2) get the raw materials ready according to following component and weight percent content:
(3) preparation of slurry: take base metal powder, glass dust, it is fully mixed in batch mixer with organic carrier, solvent, using high speed dispersor to carry out high speed dispersion, obtain uniform slurry;
(4) production of slurry: above-mentioned slurry is ground at three rollers grind, the fine setting by roller is controlled at below 15 μ m the slurry fineness, and viscosity is 25-35Pa.S, makes chip resistor base metal slurry.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110419289.7A CN103165212B (en) | 2011-12-14 | 2011-12-14 | A kind of chip resistor base metal slurry and preparation method thereof |
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|---|---|---|---|
| CN201110419289.7A CN103165212B (en) | 2011-12-14 | 2011-12-14 | A kind of chip resistor base metal slurry and preparation method thereof |
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|---|---|
| CN103165212A true CN103165212A (en) | 2013-06-19 |
| CN103165212B CN103165212B (en) | 2016-01-13 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104464891A (en) * | 2014-12-26 | 2015-03-25 | 常熟联茂电子科技有限公司 | Carbon glue resistor sizing |
| CN105761777A (en) * | 2014-12-18 | 2016-07-13 | 上海宝银电子材料有限公司 | Filament silver paste for automobile glass and preparation method of filament silver paste |
| CN106211379A (en) * | 2016-06-30 | 2016-12-07 | 东莞珂洛赫慕电子材料科技有限公司 | A kind of carborundum ruthenium resistance slurry and preparation method thereof |
| CN106683746A (en) * | 2016-12-29 | 2017-05-17 | 广东羚光新材料股份有限公司 | Surface electrode silver paste for chip type resistor and preparation method for surface electrode silver paste |
| CN111446021A (en) * | 2019-01-17 | 2020-07-24 | 东莞珂洛赫慕电子材料科技有限公司 | Heating resistor slurry sintered in air and preparation method thereof |
| CN112309607A (en) * | 2019-07-31 | 2021-02-02 | 湖北中烟工业有限责任公司 | Slurry composition based on multiple subgroup elements and preparation method and application thereof |
| CN116130184A (en) * | 2023-02-25 | 2023-05-16 | 合肥工业大学 | High-precision thin film chip resistor for automobile |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002367804A (en) * | 2001-06-11 | 2002-12-20 | K-Tech Devices Corp | Resistor |
| CN1687992A (en) * | 2005-05-13 | 2005-10-26 | 范琳 | Electrode thick liquid without lead and silver and mfg. method thereof |
| CN1792927A (en) * | 2005-12-02 | 2006-06-28 | 上海宝银电子材料有限公司 | Special silver paste for rear screen glass de-fog of car and mfg. method thereof |
| CN1937856A (en) * | 2006-07-28 | 2007-03-28 | 王克政 | Rare earth basic-metal resistance size for metal base board based rare earth thick film circuit and its preparing process |
-
2011
- 2011-12-14 CN CN201110419289.7A patent/CN103165212B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002367804A (en) * | 2001-06-11 | 2002-12-20 | K-Tech Devices Corp | Resistor |
| CN1687992A (en) * | 2005-05-13 | 2005-10-26 | 范琳 | Electrode thick liquid without lead and silver and mfg. method thereof |
| CN1792927A (en) * | 2005-12-02 | 2006-06-28 | 上海宝银电子材料有限公司 | Special silver paste for rear screen glass de-fog of car and mfg. method thereof |
| CN1937856A (en) * | 2006-07-28 | 2007-03-28 | 王克政 | Rare earth basic-metal resistance size for metal base board based rare earth thick film circuit and its preparing process |
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| CN105761777A (en) * | 2014-12-18 | 2016-07-13 | 上海宝银电子材料有限公司 | Filament silver paste for automobile glass and preparation method of filament silver paste |
| CN105761777B (en) * | 2014-12-18 | 2017-12-01 | 上海宝银电子材料有限公司 | A kind of vehicle glass fine rule silver paste and preparation method thereof |
| CN104464891A (en) * | 2014-12-26 | 2015-03-25 | 常熟联茂电子科技有限公司 | Carbon glue resistor sizing |
| CN106211379A (en) * | 2016-06-30 | 2016-12-07 | 东莞珂洛赫慕电子材料科技有限公司 | A kind of carborundum ruthenium resistance slurry and preparation method thereof |
| CN106683746A (en) * | 2016-12-29 | 2017-05-17 | 广东羚光新材料股份有限公司 | Surface electrode silver paste for chip type resistor and preparation method for surface electrode silver paste |
| CN106683746B (en) * | 2016-12-29 | 2018-11-20 | 广东羚光新材料股份有限公司 | Plate resistor face electrode silver plasm and preparation method thereof |
| CN111446021A (en) * | 2019-01-17 | 2020-07-24 | 东莞珂洛赫慕电子材料科技有限公司 | Heating resistor slurry sintered in air and preparation method thereof |
| CN111446021B (en) * | 2019-01-17 | 2022-01-04 | 东莞珂洛赫慕电子材料科技有限公司 | Heating resistor slurry sintered in air and preparation method thereof |
| CN112309607A (en) * | 2019-07-31 | 2021-02-02 | 湖北中烟工业有限责任公司 | Slurry composition based on multiple subgroup elements and preparation method and application thereof |
| CN112309607B (en) * | 2019-07-31 | 2023-04-21 | 湖北中烟工业有限责任公司 | Slurry composition based on multiple subgroup elements and preparation method and application thereof |
| CN116130184A (en) * | 2023-02-25 | 2023-05-16 | 合肥工业大学 | High-precision thin film chip resistor for automobile |
| CN116130184B (en) * | 2023-02-25 | 2023-07-18 | 合肥工业大学 | High-precision thin film chip resistor for automobile |
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