CN103153033A - Printed circuit board cooling device - Google Patents
Printed circuit board cooling device Download PDFInfo
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- CN103153033A CN103153033A CN2013100955380A CN201310095538A CN103153033A CN 103153033 A CN103153033 A CN 103153033A CN 2013100955380 A CN2013100955380 A CN 2013100955380A CN 201310095538 A CN201310095538 A CN 201310095538A CN 103153033 A CN103153033 A CN 103153033A
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- printed circuit
- circuit board
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Abstract
The invention discloses a printed circuit board cooling device, which comprises an air inlet pipe, an air inlet interface and a flat air passage, wherein the flat air passage is arranged at the back side of a printed circuit board, one end of the air inlet pipe is connected with a main heat radiation air passage of a system of the printed circuit board, and the other end of the air inlet pipe is connected with the flat air passage through the air inlet interface. The air inlet pipe is used for introducing airflows in the main heat radiation air passage of the system of the printed circuit board into the flat air passage arranged at the back side of the printed circuit board, then, the airflows in the flat air passage are utilized for carrying out heat exchange with the printed circuit board, and the heat radiation on the printed circuit board is realized. The printed circuit board cooling device sufficiently utilizes the heat radiation resources of the system of the printed circuit board, such as the airflow in the main heat radiation air passage, so the additional arrangement of a fan or a blower is not needed, the cost is reduced, and the complexity of the structure of the heat radiation system is reduced. In addition, the heat radiation air passage is designed into a flat shape, so the dimension of the PCB (printed circuit board) can be reduced, the space is saved, and the miniaturization and the integration of devices are favorably realized.
Description
Technical field
The application relates to the printed-board technology field, particularly relates to the printed circuit plate cooling device.
Background technology
Along with the develop rapidly of semiconductor technology, electronic devices and components disposal ability and integrated level improve constantly, and the reducing of electronic device volume makes the heat dissipation problem of electronic devices and components more and more important with the increase of power.
PCB(Printed circuit board, printed circuit board (PCB)) components and parts of upper integrated various multi-form and different power consumption, its cooling system design not only is related to heat dispersion, more relates to the phase mutual interference between each radiating module, and the integral layout of system.
Traditional local radiating mode as shown in Figure 1, installing radiator 3 and fan 4 on the power component 2 of pcb board 1 are to solve the larger problem of the local device hear rate of pcb board.But, for the more pcb board of element, between each radiator, and can produce phase mutual interference, constructive interference between radiator and each element, even may produce electromagnetic interference to element.Simultaneously, the heat of the element that hear rate is larger has unavoidably part and conducts on pcb board, makes printed circuit board (PCB) bear larger heat radiation pressure, may cause that the pcb board local temperature is too high or thermal stress is excessive and loses efficacy.
Traditional integral heat sink mode side-looking structural representation as shown in Figure 2, pcb board 11 is placed in than in self size large air channel 12, utilize the air-flow of complete machine fan 13 to carry out integral heat sink to pcb board, make like this size of cooling system of pcb board larger, need simultaneously extra fan and accessory structure, cause cooling system structure complicated, make the design difficulty of cooling system increase, and cost is higher, is unfavorable for cooling system miniaturization and integrated.
Summary of the invention
For solving the problems of the technologies described above, the embodiment of the present application provides a kind of printed circuit plate cooling device, with structure complexity and the design difficulty of the cooling system that reduces pcb board, and reduces the cost of pcb board cooling system, and technical scheme is as follows:
The application provides a kind of printed circuit plate cooling device, comprising: blast pipe, air intake interface and flat air channel, and wherein, described flat air channel is arranged on the back side of described printed circuit board (PCB);
Described blast pipe one end connects the main heat dissipation wind channel of described printed circuit board (PCB) place system, and the other end connects described flat air channel by described air intake interface.
Preferably, described flat air channel be specially the described printed circuit board (PCB) back side with the flat board of the parallel placement of described printed circuit board (PCB), and be arranged on the first side shield of described dull and stereotyped both sides and the space that the second side shield surrounds.
Preferably, the parallel distance between described flat board and described printed circuit board (PCB) is for being at least 10mm.
Preferably, described the first side shield be connected the second side shield and be bolted or be connected by welding manner with described flat board.
Preferably, described air intake interface is bolted or is connected by welding manner with described flat board.
Preferably, above-mentioned printed circuit plate cooling device also comprises securing member, is provided with through hole on described securing member, is set on described blast pipe by described through hole; Described blast pipe is connected by the main heat dissipation wind channel of described securing member with described printed circuit board (PCB) place system.
Preferably, the side that described air intake interface is connected with described blast pipe is provided with several fresh air inlets that connects described blast pipe, a side that is connected with described flat air channel evenly is provided with several exhaust vents, and forms equivalent pressure cavity between described fresh air inlet and described exhaust vent.
Preferably, described blast pipe is plastic tube.
Preferably, the material of described the first side shield and described the second side shield is stainless steel metal or plastics.
The application also provides a kind of power supply, comprises printed circuit board (PCB), and above-mentioned printed circuit plate cooling device.
The technical scheme that is provided by above the embodiment of the present application as seen, described printed circuit plate cooling device, by blast pipe, the air-flow in the main heat dissipation wind channel of printed circuit board (PCB) place system is introduced in the flat air channel that is arranged on the printed circuit board (PCB) back side, the air-flow and the printed circuit board (PCB) that recycle in described flat air channel carry out heat exchange, realize the heat radiation to printed circuit board (PCB).This printed circuit plate cooling device takes full advantage of the radiating resource of printed circuit board (PCB) place system, such as the air-flow in main heat dissipation wind channel, thereby need not additionally to set up fan or blower fan, has reduced cost, has reduced the complexity of cooling system structure.And heat dissipation wind channel is designed to flat, thereby can reduce the size of pcb board, and conserve space is conducive to the miniaturization of components and parts and integrated.
Description of drawings
In order to be illustrated more clearly in the embodiment of the present application or technical scheme of the prior art, the below will do to introduce simply to the accompanying drawing of required use in embodiment or description of the Prior Art, apparently, the accompanying drawing that the following describes is only some embodiment that put down in writing in the application, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the structural representation that in prior art, pcb board adopts local radiating mode;
Fig. 2 is the structural representation that in prior art, pcb board adopts the integral heat sink mode;
Fig. 3 is the side schematic view of a kind of pcb board cooling device of the embodiment of the present application;
Fig. 4 is the structural representation of a kind of pcb board cooling device of the embodiment of the present application;
Fig. 5 is the structural representation of a kind of air intake interface of the embodiment of the present application.
Embodiment
In order to make those skilled in the art person understand better technical scheme in the application, below in conjunction with the accompanying drawing in the embodiment of the present application, technical scheme in the embodiment of the present application is clearly and completely described, obviously, described embodiment is only the application's part embodiment, rather than whole embodiment.Based on the embodiment in the application, those of ordinary skills are not making the every other embodiment that obtains under the creative work prerequisite, all should belong to the scope of the application's protection.
See also Fig. 3 and Fig. 4, all show the structural representation of a kind of pcb board cooling device of the embodiment of the present application, described pcb board cooling device comprises: blast pipe 101, air intake interface 102 and flat air channel 103, wherein, flat air channel 103 is arranged on the back side of pcb board 200.
The main heat dissipation wind channel of one end connecting PCB board place system of blast pipe 101, the other end connect an end in flat air channel 103 by described air intake interface 102, the other end in flat air channel is air outlet 110.
Preferably, as shown in Figure 3, blast pipe 101 is by the main heat dissipation wind channel of securing member 107 connecting PCB board place systems, be provided with through hole on described securing member 107, be set on blast pipe by this through hole, blast pipe is connected by the main heat dissipation wind channel of securing member 107 with pcb board place system, thereby with in the introducing of the air-flow in described main heat dissipation wind channel blast pipe 101.
During concrete enforcement, at parallel placement one flat board 104 in the pcb board back side, be provided with the first side shield 105 and the second side shield at described dull and stereotyped 104 long side, jointly surround flat air channel 103 by the back side of pcb board, dull and stereotyped the 104, first side shield 105 and the second side shield, be that pcb board is a plane that forms flat air channel, like this, the air-flow that flows through flat air channel can directly wash away the back side of pcb board and carry out the forced convertion heat radiation.This pcb board cooling device directly with the part of pcb board as heat dissipation wind channel, has not only improved radiating efficiency, and has reduced extra structural member.
The described printed circuit plate cooling device that the present embodiment provides, by blast pipe, the air-flow in the main heat dissipation wind channel of printed circuit board (PCB) place system is introduced in the flat air channel that is arranged on the printed circuit board (PCB) back side, the air-flow and the printed circuit board (PCB) that recycle in described flat air channel carry out heat exchange, realize the heat radiation to printed circuit board (PCB).This printed circuit plate cooling device takes full advantage of the radiating resource of printed circuit board (PCB) place system, such as the air-flow in the main heat dissipation wind channel of place system, thereby need not additionally to set up fan or blower fan, has reduced cost, has reduced the complexity of cooling system structure.And heat dissipation wind channel is designed to flat, thereby has reduced the size of pcb board, has saved the space, is conducive to the miniaturization of components and parts and integrated.
Preferably, the thickness in flat air channel (being the parallel distance between described flat board and pcb board) is at least 10mm, it will be appreciated by persons skilled in the art that the thickness in described flat air channel can arrange according to the size of heat dissipation capacity and pcb board.
Preferably, the first side shield 105 be connected that the side shield (not shown) all can be bolted or connect dull and stereotyped 104 by welding manner, the first side shield 105, the second side shield and dull and stereotyped 104 all can also be fixed on the frame of pcb board so that the first side shield 105 and the second side shield all with dull and stereotyped 104 seamless links.It will be appreciated by persons skilled in the art that the connected mode between the first side shield 105, the second side shield and dull and stereotyped 104 is not limited to above-mentioned mode, can also be other connected mode, and the application does not limit this.
Described dull and stereotyped 104 material can be metallic plate or plastics, and the material of described the first side shield 105 and the second side shield 106 is preferably stainless steel metal, can certainly be other material, and the application does not limit this.
As shown in Figure 5, air intake interface 102 is specifically as follows a cuboid cavity structure, is provided with several fresh air inlets 108 on a side that wherein is connected with blast pipe, connects several blast pipes by described several fresh air inlets 108.A side relative with described fresh air inlet 108 evenly is provided with several isodiametric apertures as exhaust vent 109, exhaust vent 109 directly connects with flat air channel, form equivalent pressure cavity 106 in described cuboid cavity, this equivalent pressure cavity has the effect of buffer gas, makes the gas uniform by exhaust vent.
Concrete, the course of work of the pcb board cooling device that the present embodiment provides is as follows:
Air-flow in pcb board cooling system master heat dissipation wind channel enters in the equivalent pressure cavity of air intake interface 102 through blast pipe 101, after air-flow cushions in equivalent pressure cavity, evenly enter flat air channel 103 through exhaust vent 109, form stable and uniform air-flow thin layer, the air-flow thin layer washes away the back side of pcb board 200, after carrying out heat exchange fully with pcb board 200, discharge via the air outlet 110 in flat air channel 103.
The pcb board cooling device that the application provides is according to following radiating principle formula
Q=h
Force* Δ T * A
Heat(formula 1)
In formula, Q is total heat loss through convection amount, i.e. the heat taken away from pcb board of air-flow; h
ForceBe the heat loss through convection coefficient, it is by the decision of the factors such as air velocity, air-flow physical property, pcb board structure, and for specific gas and pcb board, air velocity is larger, and the heat loss through convection coefficient is larger; Δ T is the poor of pcb board backside surface temperature and gas flow temperature; A
HeatBe pcb board backside heat area.
Can find out from formula 1, air velocity increases, temperature difference T increases, and area of dissipation A
HeatIncrease, all can make heat exchange amount Q increase, the application's pcb board cooling device utilizes the flow velocity of the area at the pcb board back side and thin layer air-flow to realize the radiating effect of efficient stable just.
The pcb board cooling device that the present embodiment provides, be provided with several fresh air inlets on the air intake interface, several blast pipes are connected on described fresh air inlet, high pressure draught in the main heat dissipation wind channel of pcb board place system is introduced in the air intake interface, cushion in the cuboid cavity of air intake interface, form stable air-flow, several isodiametric exhaust vents by the air intake interface evenly enter in flat air channel, form the air-flow thin layer of stable and uniform in flat air channel, thereby make the cooling effect of described pcb board cooling device more stable.
Referring to table 1, the test data table of comparisons that uses with the pcb board cooling device that does not use the embodiment of the present application to provide is provided, by the data in table as can be known, after the pcb board cooling device that employing the embodiment of the present application provides, can obviously reduce the ambient temperature of pcb board, after the pcb board cooling device that employing the embodiment of the present application provides, the cooling extent of the ambient temperature of pcb board reaches 11.68 ℃.
Table 1
Corresponding to above-mentioned printed circuit plate cooling device, the application also provides a kind of power supply, and described power supply comprises the printed circuit plate cooling device that printed circuit board (PCB) and above-described embodiment provide.
Need to prove, in this article, relational terms such as the first and second grades only is used for an entity or operation are separated with another entity or operating space, and not necessarily requires or hint and have the relation of any this reality or sequentially between these entities or operation.
The above is only the application's embodiment; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the application's principle; can also make some improvements and modifications, these improvements and modifications also should be considered as the application's protection range.
Claims (10)
1. a printed circuit plate cooling device, is characterized in that, comprising: blast pipe, air intake interface and flat air channel, and wherein, described flat air channel is arranged on the back side of described printed circuit board (PCB);
Described blast pipe one end connects the main heat dissipation wind channel of described printed circuit board (PCB) place system, and the other end connects described flat air channel by described air intake interface.
2. printed circuit plate cooling device according to claim 1, it is characterized in that, described flat air channel be specially the described printed circuit board (PCB) back side with the flat board of the parallel placement of described printed circuit board (PCB), and be arranged on the first side shield of described dull and stereotyped both sides and the space that the second side shield surrounds.
3. printed circuit plate cooling device according to claim 2, is characterized in that, the parallel distance between described flat board and described printed circuit board (PCB) is for being at least 10mm.
4. printed circuit plate cooling device according to claim 2, is characterized in that, described the first side shield be connected the second side shield and be bolted or be connected by welding manner with described flat board.
5. printed circuit plate cooling device according to claim 2, is characterized in that, described air intake interface is bolted or is connected by welding manner with described flat board.
6. printed circuit plate cooling device according to claim 1, is characterized in that, also comprises securing member, is provided with through hole on described securing member, is set on described blast pipe by described through hole; Described blast pipe is connected by the main heat dissipation wind channel of described securing member with described printed circuit board (PCB) place system.
7. printed circuit plate cooling device according to claim 1, it is characterized in that, the side that described air intake interface is connected with described blast pipe is provided with several fresh air inlets that connects described blast pipe, a side that is connected with described flat air channel evenly is provided with several exhaust vents, and forms equivalent pressure cavity between described fresh air inlet and described exhaust vent.
8. printed circuit plate cooling device according to claim 1, is characterized in that, described blast pipe is plastic tube.
9. printed circuit plate cooling device according to claim 1, is characterized in that, the material of described the first side shield and described the second side shield is stainless steel metal or plastics.
10. a power supply, is characterized in that, comprises printed circuit board (PCB), and the described printed circuit plate cooling device of claim 1-9 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100955380A CN103153033A (en) | 2013-03-22 | 2013-03-22 | Printed circuit board cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100955380A CN103153033A (en) | 2013-03-22 | 2013-03-22 | Printed circuit board cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103153033A true CN103153033A (en) | 2013-06-12 |
Family
ID=48550818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013100955380A Pending CN103153033A (en) | 2013-03-22 | 2013-03-22 | Printed circuit board cooling device |
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| Country | Link |
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| CN (1) | CN103153033A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109076719A (en) * | 2016-04-13 | 2018-12-21 | Zkw集团有限责任公司 | component cooling device |
| CN112533450A (en) * | 2020-12-01 | 2021-03-19 | 苏州浪潮智能科技有限公司 | Power supply conversion device for printed circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060120039A1 (en) * | 2004-12-08 | 2006-06-08 | Yassour Yuval | Integral heat-dissipation system for electronic boards |
| CN101692531A (en) * | 2009-09-28 | 2010-04-07 | 合肥阳光电源有限公司 | Outdoor power case |
| CN201639912U (en) * | 2010-03-31 | 2010-11-17 | 重庆三弓科技发展有限公司 | Radiator for high temperature circuit |
| CN102291966A (en) * | 2011-08-01 | 2011-12-21 | 广东威创视讯科技股份有限公司 | Back air cooling device for flat panel display |
-
2013
- 2013-03-22 CN CN2013100955380A patent/CN103153033A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060120039A1 (en) * | 2004-12-08 | 2006-06-08 | Yassour Yuval | Integral heat-dissipation system for electronic boards |
| CN101692531A (en) * | 2009-09-28 | 2010-04-07 | 合肥阳光电源有限公司 | Outdoor power case |
| CN201639912U (en) * | 2010-03-31 | 2010-11-17 | 重庆三弓科技发展有限公司 | Radiator for high temperature circuit |
| CN102291966A (en) * | 2011-08-01 | 2011-12-21 | 广东威创视讯科技股份有限公司 | Back air cooling device for flat panel display |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109076719A (en) * | 2016-04-13 | 2018-12-21 | Zkw集团有限责任公司 | component cooling device |
| US10638637B2 (en) | 2016-04-13 | 2020-04-28 | Zkw Group Gmbh | Component cooling device |
| CN109076719B (en) * | 2016-04-13 | 2021-01-26 | Zkw集团有限责任公司 | Component cooling device |
| CN112533450A (en) * | 2020-12-01 | 2021-03-19 | 苏州浪潮智能科技有限公司 | Power supply conversion device for printed circuit board |
| CN112533450B (en) * | 2020-12-01 | 2022-06-14 | 苏州浪潮智能科技有限公司 | Power supply conversion device for printed circuit board |
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Application publication date: 20130612 |