CN103152980A - Bookend type hard-soft combined circuit board and manufacturing method thereof - Google Patents
Bookend type hard-soft combined circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN103152980A CN103152980A CN201310094367XA CN201310094367A CN103152980A CN 103152980 A CN103152980 A CN 103152980A CN 201310094367X A CN201310094367X A CN 201310094367XA CN 201310094367 A CN201310094367 A CN 201310094367A CN 103152980 A CN103152980 A CN 103152980A
- Authority
- CN
- China
- Prior art keywords
- soft board
- board
- soft
- combined circuit
- hard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention relates to a bookend type hard- soft combined circuit board, which comprises a soft board and a hard board, wherein the hard board is connected with the soft board, and conducting wires are distributed on the hard board and the soft board; the soft board comprises at least two layers, and the soft board is connected in parallel correspondingly to a hard board interface; and the middle position of the soft board adopts an arch structure. The invention also relates to a manufacturing method of the bookend type hard-soft combined circuit board. When copper deposition is carried out on the surface of the hard board, a layer of copper tape is respectively stuck on the surface layer of the bent outer surface soft board group and the bottom layer of the inner surface soft board group on the soft board in a manual mode. In the application of multiple layers of soft boards and hard boards, flaws, open circuits, short circuits or other functional failure phenomena cannot be generated. Moreover, the installation is convenient, the stability is good, and the connection is reliable.
Description
Technical field
The present invention relates to the circuit board technology field, especially relate to a kind of book end type flexible and hard combined circuit board and manufacture method.
Background technology
Along with the development of science and technology, increasing electric device trends towards miniaturization, ultrathin development, and wiring board is correspondingly being brought into play more and more important effect.And flexible and hard combined circuit board has the adaptive faculty of endurance and the flexible circuit board of rigidity wiring board concurrently, and its quantity is just in cumulative year after year.Compare general wiring board, that flexible and hard combined circuit board has advantages of is lightweight, interlayer is thin, transmission path is short, the conducting aperture is little, noise is few, reliability is high.
At present, the making of flexible and hard combined circuit board is to light, thin, short, little development.During the heavy copper of soft or hard electronic circuit board, the corrosion that the soft board part can not be born heavy copper liquid, the method that generally adopts hardboard to seal.And the book end type Rigid Flex can't adopt the method due to the reason of soft board projection.Simple electroplating protection adhesive tape holds equally can't stand heavy copper corrosion and fragmentation, so can not prevent that soft board partly is corroded.
Summary of the invention
The present invention provides a kind of being convenient to install in order to address the above problem, good stability, the reliable book end type flexible and hard combined circuit board of connection and manufacture method.
In order to address the above problem, the technical solution used in the present invention is: a kind of book end type flexible and hard combined circuit board and manufacture method, comprise soft board, hardboard, described hardboard is connected with soft board, be distributed with wire on described hardboard and soft board, described soft board is for two-layer at least, and the corresponding hardboard interface of described soft board is in parallel join, and centre position, soft board place is arcuate configuration.
In order abnormal conditions not occur when bending fold uses, the centre position, bending outer surface soft board group place of described soft board is arcuate configuration, and the centre position, bending inner surface soft board group place of described soft board is also arcuate configuration.
In order further can abnormal conditions not occur when bending fold uses, the middle soft board group of described soft board is with respect to bending inner surface soft board group also outside arcuate configuration.
In order further can abnormal conditions can not occur when bending fold uses, the bending inner surface soft board group at described soft board place is shorter than the length of middle soft board group, described in the middle of the soft board group shorter than the length of bending outer surface soft board group.
A kind of manufacture method of book end type flexible and hard combined circuit board, following making step:
Each organizes internal layer making → outer pressing → boring → surface clean → subsides electroplating protection adhesive tape and copper adhesive tape → heavy copper → tear electroplating protection adhesive tape and copper adhesive tape → electro-coppering → subsides light-sensitive surface → exposure → development → outer-layer circuit etching → outer layer insulation → surface treatment → moulding.
In order to protect soft board, described when the hardboard surface is sunk copper, first electroplating protection adhesive tape and copper adhesive tape are pasted in the top layer of the bending outer surface soft board group on soft board and the bottom of inner surface soft board group.
Of the present invention producing effect is: make soft or hard avoid the corrosion of heavy copper liquid in conjunction with the soft board part of electronic circuit board when sinking copper.
Description of drawings
Fig. 1 is the structural representation of book end type flexible and hard combined circuit board of the present invention and preparation method thereof;
Fig. 2 is the cutaway view of book end type flexible and hard combined circuit board of the present invention and manufacture method;
In figure: soft board group, 24-bending outer surface soft board group in the middle of 1-hardboard, 2-soft board, 21-wire, 22-bending inner surface soft board group, 23-.
Embodiment
Below in conjunction with accompanying drawing, book end type flexible and hard combined circuit board of the present invention and manufacture method are described in further detail:
As shown in Figure 1: a kind of book end type flexible and hard combined circuit board of the present invention and manufacture method, comprise hardboard 1, soft board 2, hardboard 1 is connected with soft board 2, and is distributed with wire 21 on hardboard 1 and soft board 2, soft board 2 for two-layer at least, can be three layers, four layers, four layers or more multi-layered.Corresponding hardboard 1 interface of soft board 2 is in parallel join, and because each organizes the reason that soft board length increases progressively successively, centre position, soft board place is arcuate configuration, like this when soft board 2 when bending fold uses, each organize between soft board not can be because of the difference of crooked process radius inside and outside generation stress, crackle occurs, open circuit, short circuit or other disabler phenomenons, and be convenient to install, good stability, connect reliable.
As shown in Figure 2: bending outer surface soft board group 24 centre positions, place of soft board 2 are arcuate configuration, and bending inner surface soft board group 22 centre positions, place of soft board 2 are also arcuate configuration.Simultaneously, the middle soft board group 23 of soft board 2 is with respect to bending inner surface soft board group also outside arcuate configuration.Simultaneously, the bending inner surface soft board group 22 at soft board 2 places is shorter than the length of middle soft board group 23, and middle soft board group 23 is shorter than the length of bending outer surface soft board groups 24.Like this, can guarantee better that also soft board 2 when bending fold uses, avoids Interlaminar Crack or circuit crackle or open circuit, also improve the ease for operation of reliability and assembling.
A kind of manufacture method of book end type flexible and hard combined circuit board, part steps wherein is as follows:
Each is organized internal layer and makes: complete and respectively organize circuit and insulation making, combination;
Outer pressing: the internal layer of respectively organizing that circuit is completed presses together;
Boring: go to bore plated-through-hole with machine;
Clean: clean and deoxidation;
Paste electroplating protection adhesive tape: to the sealing of soft board zone electricity consumption plating protective tapes
Copper-surfaced adhesive tape: one deck electroplating protection adhesive tape and copper adhesive tape are pasted in the top layer of the bending outer surface soft board group 24 on soft board and the bottom of inner surface soft board group 22, can effectively protect like this and damage soft board to the heavy copper of hardboard the time;
Heavy copper: use the method for chemical deposition at the copper coating of boring;
Tear electroplating protection adhesive tape and copper adhesive tape: with electroplating protection adhesive tape and the removal of copper adhesive tape on soft board surface;
Electro-coppering: electro-plating method thickening plated-through-hole copper is thick
Paste light-sensitive surface: cover all outer copper faces;
The exposure: the photopolymerization principle, by egative film with the polymerization of required line pattern light-sensitive surface;
Develop: remove not polymeric part of light-sensitive surface;
Etching: remove the copper that light-sensitive surface is not protected part, form required line pattern;
Outer layer insulation: the outer welding resistance insulation of silk screen printing;
Surface treatment: outer dew copper is anti-oxidation, corrosion treatment;
Moulding: the outer molded line of milling completes.
Claims (6)
1. book end type flexible and hard combined circuit board, comprise soft board, hardboard, described hardboard is connected with soft board, be distributed with wire on described hardboard and soft board, described soft board is for two-layer at least, it is characterized in that: the corresponding hardboard interface of described soft board is in parallel join, and centre position, soft board place is arcuate configuration.
2. book end type flexible and hard combined circuit board according to claim 1, it is characterized in that: the centre position, bending outer surface soft board group place of described soft board is arcuate configuration, the centre position, bending inner surface soft board group place of described soft board is also arcuate configuration.
3. book end type flexible and hard combined circuit board according to claim 2 is characterized in that: the middle soft board group of described soft board is with respect to bending inner surface soft board group also outside arcuate configuration.
4. 2,3 arbitrary described book end type flexible and hard combined circuit boards according to claim 1,, it is characterized in that: the bending inner surface soft board group at described soft board place is shorter than the length of middle soft board group, described in the middle of the soft board group shorter than the length of bending outer surface soft board group.
5. the manufacture method of a book end type flexible and hard combined circuit board comprises the following making step that is:
Each organizes internal layer making → outer pressing → boring → surface clean → subsides electroplating protection adhesive tape and copper adhesive tape → heavy copper → tear electroplating protection adhesive tape and copper adhesive tape → electro-coppering → subsides light-sensitive surface → exposure → development → outer-layer circuit etching → outer layer insulation → surface treatment → moulding.
6. the manufacture method of book end type flexible and hard combined circuit board according to claim 5; it is characterized in that: described the hardboard surface is sunk before copper, first electroplating protection adhesive tape and copper adhesive tape are pasted in the top layer of the bending outer surface soft board group on soft board and the bottom of inner surface soft board group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310094367XA CN103152980A (en) | 2013-03-23 | 2013-03-23 | Bookend type hard-soft combined circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310094367XA CN103152980A (en) | 2013-03-23 | 2013-03-23 | Bookend type hard-soft combined circuit board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103152980A true CN103152980A (en) | 2013-06-12 |
Family
ID=48550768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310094367XA Pending CN103152980A (en) | 2013-03-23 | 2013-03-23 | Bookend type hard-soft combined circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103152980A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105578739A (en) * | 2016-02-25 | 2016-05-11 | 广东欧珀移动通信有限公司 | Circuit board and terminal |
| WO2016107133A1 (en) * | 2014-12-29 | 2016-07-07 | 中兴通讯股份有限公司 | Directly thermally conductive rigid-flexible combination circuit board |
| CN105979698A (en) * | 2016-07-15 | 2016-09-28 | 广州杰赛科技股份有限公司 | Rigid-flex circuit board and preparation method thereof |
| CN107155265A (en) * | 2017-05-26 | 2017-09-12 | 维沃移动通信有限公司 | A kind of rigid-flex combined board preparation method, rigid-flex combined board and mobile terminal |
| CN114286516A (en) * | 2021-12-13 | 2022-04-05 | 深圳市易超快捷科技有限公司 | Manufacturing method of split-tail stepped electric-thick golden finger rigid-flexible printed circuit board |
| CN114336112A (en) * | 2021-12-10 | 2022-04-12 | 中国科学院深圳先进技术研究院 | Method for connecting soft and hard interfaces between flexible conductive material and hard conductive material |
| CN114449755A (en) * | 2021-12-27 | 2022-05-06 | 江西弘信柔性电子科技有限公司 | High-toughness combined rigid-flex board |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003101165A (en) * | 2001-09-27 | 2003-04-04 | Nippon Mektron Ltd | Flexible printed board having cable section |
| JP2006324406A (en) * | 2005-05-18 | 2006-11-30 | Sharp Corp | Flexible/rigid multilayer printed circuit board |
| CN101031185A (en) * | 2006-02-27 | 2007-09-05 | 株式会社藤仓 | Connection configuration for rigid substrates |
| JP2007335567A (en) * | 2006-06-14 | 2007-12-27 | Fujikura Ltd | Printed circuit board |
| CN201114998Y (en) * | 2007-09-27 | 2008-09-10 | 惠州市蓝微电子有限公司 | A soft and hard combination board structure |
| CN202401013U (en) * | 2011-11-29 | 2012-08-29 | 常熟市富邦胶带有限责任公司 | Composite high-temperature adhesive tape |
| CN203136330U (en) * | 2013-03-23 | 2013-08-14 | 广州安费诺诚信软性电路有限公司 | Book clip type softness and hardness combined circuit board |
-
2013
- 2013-03-23 CN CN201310094367XA patent/CN103152980A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003101165A (en) * | 2001-09-27 | 2003-04-04 | Nippon Mektron Ltd | Flexible printed board having cable section |
| JP2006324406A (en) * | 2005-05-18 | 2006-11-30 | Sharp Corp | Flexible/rigid multilayer printed circuit board |
| CN101031185A (en) * | 2006-02-27 | 2007-09-05 | 株式会社藤仓 | Connection configuration for rigid substrates |
| JP2007335567A (en) * | 2006-06-14 | 2007-12-27 | Fujikura Ltd | Printed circuit board |
| CN201114998Y (en) * | 2007-09-27 | 2008-09-10 | 惠州市蓝微电子有限公司 | A soft and hard combination board structure |
| CN202401013U (en) * | 2011-11-29 | 2012-08-29 | 常熟市富邦胶带有限责任公司 | Composite high-temperature adhesive tape |
| CN203136330U (en) * | 2013-03-23 | 2013-08-14 | 广州安费诺诚信软性电路有限公司 | Book clip type softness and hardness combined circuit board |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016107133A1 (en) * | 2014-12-29 | 2016-07-07 | 中兴通讯股份有限公司 | Directly thermally conductive rigid-flexible combination circuit board |
| CN105578739A (en) * | 2016-02-25 | 2016-05-11 | 广东欧珀移动通信有限公司 | Circuit board and terminal |
| CN105979698A (en) * | 2016-07-15 | 2016-09-28 | 广州杰赛科技股份有限公司 | Rigid-flex circuit board and preparation method thereof |
| CN107155265A (en) * | 2017-05-26 | 2017-09-12 | 维沃移动通信有限公司 | A kind of rigid-flex combined board preparation method, rigid-flex combined board and mobile terminal |
| CN107155265B (en) * | 2017-05-26 | 2019-07-26 | 维沃移动通信有限公司 | A kind of rigid-flex combined board production method, rigid-flex combined board and mobile terminal |
| CN114336112A (en) * | 2021-12-10 | 2022-04-12 | 中国科学院深圳先进技术研究院 | Method for connecting soft and hard interfaces between flexible conductive material and hard conductive material |
| CN114336112B (en) * | 2021-12-10 | 2023-10-03 | 中国科学院深圳先进技术研究院 | Method for connecting soft and hard interfaces between flexible conductive material and hard conductive material |
| CN114286516A (en) * | 2021-12-13 | 2022-04-05 | 深圳市易超快捷科技有限公司 | Manufacturing method of split-tail stepped electric-thick golden finger rigid-flexible printed circuit board |
| CN114286516B (en) * | 2021-12-13 | 2023-09-29 | 深圳市易超快捷科技有限公司 | Manufacturing method of tail-separating ladder electric-thickness golden finger soft and hard combined plate |
| CN114449755A (en) * | 2021-12-27 | 2022-05-06 | 江西弘信柔性电子科技有限公司 | High-toughness combined rigid-flex board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103152980A (en) | Bookend type hard-soft combined circuit board and manufacturing method thereof | |
| US9277640B2 (en) | Flexible printed circuit board and method for manufacturing same | |
| JP4614278B2 (en) | Electronic circuit unit and manufacturing method thereof | |
| CN103188886B (en) | A kind of printed circuit board and preparation method thereof | |
| CN101925253A (en) | Printed circuit board and drilling method thereof | |
| CN104349575B (en) | Flexible PCB and preparation method thereof | |
| CN103369868B (en) | A kind of manufacture method of pcb board and pcb board | |
| CN106231816A (en) | A kind of manufacture method of golden fingerboard without lead wire | |
| CN104427783A (en) | A flexible printed circuit board having golden fingers and manufacturing method thereof | |
| CN106304607A (en) | Rigid-flex combined board and preparation method thereof | |
| CN105451442B (en) | Rigid-flexible circuit board and production method | |
| CN204362415U (en) | Automobile audio half flex circuit application | |
| CN103687331A (en) | Method for improving binding force of rigid-flexible combination board flexible board covering film | |
| CN104105337A (en) | Circuit board with high-density circuits and method for manufacturing the circuit board | |
| CN103781292A (en) | Circuit board and manufacturing method thereof | |
| CN101547573B (en) | Method for manufacturing circuit board with offset structure | |
| CN102263350B (en) | Connector and manufacturing method thereof | |
| CN203136330U (en) | Book clip type softness and hardness combined circuit board | |
| CN112770541B (en) | Processing method for improving surface roughness of flexible circuit board and flexible circuit board | |
| CN105307387B (en) | A kind of high multilayered rigidity and flexibility combined impedance plate of large scale and preparation method thereof | |
| CN105657971B (en) | Built-in type component packaging structure and preparation method thereof | |
| US10653015B2 (en) | Multilayer circuit board and method of manufacturing the same | |
| CN106548945A (en) | The manufacture method and chip package base plate of chip package base plate | |
| CN202652706U (en) | Printed circuit board in process | |
| CN206164830U (en) | Loudspeaker module group |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130612 |
|
| RJ01 | Rejection of invention patent application after publication |