CN103146355B - A kind of heat-sink material - Google Patents
A kind of heat-sink material Download PDFInfo
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- CN103146355B CN103146355B CN201110403877.1A CN201110403877A CN103146355B CN 103146355 B CN103146355 B CN 103146355B CN 201110403877 A CN201110403877 A CN 201110403877A CN 103146355 B CN103146355 B CN 103146355B
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Abstract
The invention discloses a kind of heat-sink material of digital electronic device.At least comprise a carrier and phase-change microcapsule.Described carrier is foam material, solid-state material, liquid material or body of paste material.Described phase-change microcapsule is with crust; Described phase-change microcapsule comprises one or more phase change materials.By phase-change microcapsule doping in the carrier, its application, not by the restriction of environment, space size, can be arranged at the position that digital electronic device needs arbitrarily to absorb heat to heat-sink material provided by the present invention.The feature that can also rise and fall for digital electronic device transient heat in addition controls effectively, possesses very strong practicality.
Description
Technical field
The present invention relates to a kind of heat-sink material, particularly a kind of heat-sink material that can be used for electronics.
Background technology
Along with the continuous renewal of digital technique, mobile digital equipment based on central processing unit (CPU) and integrated circuit (IC) chip (IC), as mobile phone, manuscript copy, notebook computer etc., its data operation speed increases, and product integrated level improves small product size simultaneously and reduces.These increased the difficulty to digital equipment heating parts heat radiation.
It is conflict that electronics volume reduces with increasing heat-sinking capability, needs to obtain a reasonable balance.Especially to the mobile phone of service intermittent, design heat sink conception by the most extreme heating situation, design can be made to become unrealistic and uneconomical.Because most of mobile phone all can only carry out thermal design by average duration of service, the heating in short-term causing mobile phone can produce in extended telephone conversation, brings uncomfortable sensation to user, affects the reputation of product.Therefore, for mobile phone short-time overheating phenomenon seek new feasible way.
For eliminating the waste heat of the short-time overheating of interval type working equipment, the great majority heat absorption scheme of the prior art outside aspect such as shape, selection is all that be only only applicable to a certain specific heating element, range of application is narrow according to heating element making itself.
Summary of the invention
In view of this, the invention provides a kind of feature that can either effectively rise and fall for digital electronic device transient heat and carry out thermal peak control, again not by the heat-sink material of electronic devices and components internal space restriction.
Based on above-mentioned purpose heat-sink material provided by the invention, comprise carrier and the microcapsule containing at least one phase change material, described uniform microcapsule is distributed in described carrier.
Described carrier is at least one in following material: foam material, solid-state material, liquid material, body of paste material.Described foam material can be bipeltate or other foaming polymer material.Described solid-state material can be heat conductive rubber, cushioning material or other resilient material.Described liquid material can be heat conduction liquid rubber, liquid organic polymer or other liquid elastomer.Described heat conduction body of paste material can be heat-conducting glue or thermal grease conduction.
Described microcapsule are with shell, and described shell is thickness is 1-2 μm; Described capsule maximum diameter is between 1 μm to 500 μm.The phase change material that described microcapsule use is a kind of phase change material, or the mixture of more than one phase change materials.In addition, the phase change material loaded in all capsules can adopt same phase change material, also can adopt different phase change materials.
As can be seen from above, heat-sink material provided by the invention, the multiple material used in digital electronic device, as carrier, adds the capsule containing phase change material.The carrier adopted can be selected according to the requirement of concrete digital device, not only by the restriction of environment, space and concrete equipment, need not adjust the structure of digital electronic device in the process used, thus on the work of digital electronic device itself without any impact with disturb.Because described phase-change microcapsule can use the structured material of digital electronic device itself as medium, there is no complicated configuration design, thus it manufactures industry very simply, can promote the use of in the equipment of many types.Heat-sink material provided by the present invention, adopts the material that multiple volume easily adjusts, and as foam, as carrier, only needs cutting simply or is processed into suitable size, just can be arranged on the position of each needs heat radiation of digital electronic device.Meanwhile, thickness, volume, shape and the microcapsule concentration in heat conduction carrier can also be regulated according to absorbing the how many difference of heat.Thus heat-sink material provided by the invention can for digital electronic device transient heat rise and fall feature, absorb the heat of instantaneous rising, to digital electronic device transient heat peak value more effectively control.
Heat-sink material provided by the present invention, thermally conductive material in digital electronic device also can be selected as carrier, and be connected with radiating element, auxiliary heat dissipation device dispels the heat, and improves radiating efficiency.
Accompanying drawing explanation
Fig. 1 is heat-sink material structural representation of the present invention.
Embodiment
For making the object, technical solutions and advantages of the present invention clearly understand, below in conjunction with specific embodiment, and with reference to accompanying drawing, the present invention is described in more detail.
Heat-sink material of the present invention, comprise carrier and the microcapsule containing at least one phase change material, described uniform microcapsule is distributed in described carrier.This carrier can adopt foam material, solid-state material, liquid material, body of paste material etc.This solid support material can be heat conduction, and the solid-state cushioning material of such as heat conduction, as the rubber gasket in mobile phone; Or the heat conductive elastomeric material of entity, as calking pad or the colloid of heat conduction; Or heat conduction liquid elastomer, as heat conduction liquid rubber; Or heat conduction body of paste, as heat-conducting glue or thermal grease conduction.In addition, solid support material also can be athermanous, such as: foam material, as bipeltate or other foaming polymer material.
Heat-sink material provided by the present invention, can individually as heat-sink material, cutting or be applied to the position that digital electronic device needs heat radiation after being processed into suitable shape; Also (as cushion blocking, conducting-heat elements etc.) can be used as the parts with certain function original in digital electronic device.
Fig. 1 is the schematic diagram of heat-sink material embodiment of the present invention, comprises carrier 1, microcapsule 2.Wherein, described carrier 1 is at least one in following material: foam material, solid-state material, liquid material, body of paste material.Simultaneously carrier material can be made up of single a kind of material, also can be formed by the material mixing of two kinds or more.Described microcapsule 2 are particulate state, with crust 3, are inside surrounded by phase change material.Described microcapsule 2, its maximum diameter is between 1 μm to 500 μm.Microcapsule inside can be made up of a kind of phase change material, also can be made up of the mixture of the phase change material of two kinds or more.Described shell 3 can protect described microcapsule 2 stuctures and properties in the process of mixing carrier 1 not change.Described microcapsule 2 are mixed the mode of described carrier 1, can, according to the suitable mode of the selection of carrier 1, as stirred, opening refining, ultrasonic disperse etc., microcapsule 2 are uniformly distributed in carrier 1.
When the temperature of heating elements in digital electronic device is normal working temperature, the phase change material in microcapsule 2 does not undergo phase transition.When the instantaneous raised temperature of Heating element is higher than natural running temperature, the phase change material in described microcapsule starts phase transformation (being generally fusing), absorbs a part of heat, thus reaches the object controlling transient heat and raise.
As can be seen from above, the performance of management temperature of phase change material and the heat conductivility of thermally conductive material combine by heat-sink material provided by the present invention, the temperature controlled ability that heat-sink material is possessed is certain, thus the feature that can raise for digital electronic device transient heat well manages heat, auxiliary heat dissipation device controls instantaneous heat quantity effectively, simultaneously on the function of the original parts of digital electronic device without any impact.
Below in conjunction with structure shown in Fig. 1, several embodiment of the present invention is described in detail.
Embodiments of the invention 1 comprise carrier 1, microcapsule 2 and shell 3.Carrier 1 is foam material.Microcapsule 2 are particulate state, and its maximum diameter is 20 μm to 50 μm, use the phase change material of 32 DEG C of transformation temperatures to make.Shell 3 thickness is between 1 μm to 2 μm.Manufacture, can adopt the mode of original position ultrasonic disperse to be dispersed in foam material by microcapsule 2.Described microcapsule 2 are combined with foam homogenize material by the chemical reaction process participating in whole foaming.After described heat-sink material is made, be cut to required shape, be installed in digital electronic device by form contacts such as physical bond or use gums the position needing to dispel the heat.
It should be noted that at this, the foam material described in embodiment 1 can be the foaming polymer materials such as polyurathamc, foamed silastic, foaming ethylene propylene diene rubber (EPDM), and its internal structure can be perforate, also can be closed pore; Its outer surface features can be the epidermis with surface-closed, also can be open surface.Due to the volume compressible character of foam material, after the thermally conductive material described in the present embodiment is shaping, can be applied in the digital electronic device that after chip is filled, space is irregular or the rear space of chip filling is larger.
As can be seen from above, because heat-sink material provided by the present invention can select foam material as carrier, do not need when in use to carry out complicated processing to its profile, make simple.If the material that shell 3 is selected participates in the chemical reaction of foaming, then microcapsule 2 can be combined with carrier 1 more closely.When digital electronic device heat dissipation capacity is larger time, in very large range can adjust the density of microcapsule 2, there is very strong practicality.
Embodiments of the invention 2 comprise carrier 1, microcapsule 2 and shell 3.Wherein, carrier 1 is solids elastomeric material.Described solids elastomeric material can be use in digital electronic device resilient material, as rubber (heat-conducting silicon rubber, EPDM or heat conduction particle doping heat conductive rubber etc.).Microcapsule 2 maximum diameter is 20 μm to 50 μm, uses the phase change material of 32 DEG C of transformation temperatures to make.Shell 3 uses impervious sealing material to make, and its thickness is between 1 μm to 2 μm.Microcapsule 2 are added in the raw material of described heat conductive elastomeric material, make shaping together by manufacture.If described resilient material adopts silicon rubber, then when described silicon rubber is plasticated, described microcapsule 2 can be opened refining together with rubber, microcapsule 2 are dispersed among silicon rubber.After silicon rubber curing molding, be processed as desired shape, or the form contacts such as gum can be used to be installed between heating element and radiating element by physical bond.Other rubber such as the heat conductive rubber that in the present embodiment, the resilient material of carrier 1 also can be adulterated by terpolymer EP rubber (EPDM) or heat conduction particle substitute.
Embodiments of the invention 3 comprise carrier 1, microcapsule 2 and shell 3.Described carrier 1 is liquid material.Described liquid material can be heat conduction liquid rubber or liquid polymer.Described microcapsule 2 are particulate state, and its maximum diameter is 20 μm to 50 μm, use the phase change material of 32 DEG C of transformation temperatures to make.Described shell 3 uses impervious sealing material, and its thickness is between 1 μm to 2 μm.Manufacture, can adopt the mode of stirring that described microcapsule 2 are evenly spread in described carrier 1.
In addition, the carrier 1 described in embodiment 3 also can use body of paste material, as body of paste material, Silica hydrogel or other cream gel that heat conduction particle adulterates.If use body of paste material to do carrier, as Silica hydrogel, it mixes, production method is identical with embodiment 3.
Carrier 1, microcapsule 2 and shell 3 is comprised according to the actual embodiments of the invention 4 of heating element.Described carrier 1 can be one or more the mixture in the solid support material of aforementioned 3 embodiments.Described microcapsule 2 are particulate state, and its maximum diameter is 20 μm to 50 μm, and use the mixture of two kinds of phase change materials to make, the mixture of described phase change material comprises the phase change material of 32 DEG C of transformation temperatures and the phase change material of 90 DEG C of transformation temperatures.Described shell 3 thickness is between 1 μm to 2 μm.Adopt as stir, open refining, ultrasonic disperse or other applicable mode by as described in microcapsule 2 be evenly mixed in as described in carrier 1.It is in the digital electronic device of 90 DEG C that above-mentioned processing and fabricating method makes described heat-sink material can be applied to thermal peak.When the heating element temperature of digital electronic device is higher than 32 DEG C and lower than 90 DEG C, 32 DEG C of phase change materials in microcapsule undergo phase transition, and absorb heat, play certain cooling effect; When the temperature of heating element reaches thermal peak 90 DEG C, the phase change material of 90 DEG C of transformation temperatures in described microcapsule 2 undergoes phase transition, and becomes liquid state, control peak heat from solid-state.
Equally, according to the real work situation of heating element, the phase change material that microcapsule 2 use also can use the mixture of two or more phase change materials.In embodiment 4, the phase change material adopted due to the described microcapsule 2 when making simply can be mixed by multiple phase change material, makes the management of described heat-sink material to heat more flexible.
In addition, different phase change materials can mix and load microcapsule 2, also can load different microcapsule separately, then according to the mode processing and fabricating of embodiment 1-4.
In above-described embodiment 1,2,4, heat-sink material can be made into sheet, cuts out as required, is arranged between heating element and radiating element.In each embodiment above-mentioned, the concentration that microcapsule 2 mix in carrier 1 can adjust according to the size of heating element shed heat.
The various embodiments described above of the present invention are by suitably introducing solid phase change material in the carrier, when such as the electronics such as mobile phone works long hours, when built-in temperature exceedes phase change material critical temperature, phase change material is liquid by solid state transformation, progressively absorption portion waste heat, maintains phone housing homo(io)thermism constant in stagnation point.After mobile phone communication terminates, phase change material is become solid-state from liquid state, the excess energy of storage is discharged in the form of heat.In this way, when solving accidental extended telephone conversation, there is hand set machine shell superheating phenomenon.Beyond the applicable equally mobile phone of this method, other mobile electronic devices are as manuscript copy, notebook computer etc.
Describedly above can to find out, heat-sink material provided by the present invention, carrier can be the thermally conductive material in various digital electronic device, seldom by the restriction in the space, shape sensitivity etc. in digital electronic device during application.Heat-sink material of the present invention not only can control heat by auxiliary heat dissipation device effectively, effectively for the feature that digital electronic device transient heat rises and falls, can also control thermal peak, thus can improve radiating efficiency significantly, improve radiating effect.
In addition; those of ordinary skill in the field are to be understood that: the foregoing is only specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all; any amendment of making, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (5)
1. a heat-sink material, comprise carrier and the microcapsule containing two kinds of phase change materials, described uniform microcapsule is distributed in described carrier;
Described carrier is at least one in following material: foam material, liquid material, body of paste material;
Described foam material is foaming polymer material; The internal structure of described foam material is perforate or closed pore; Its outer surface features be with surface-closed epidermis or open surface; Described liquid material is liquid rubber or liquid gel; Described body of paste material is Silica hydrogel;
The phase change material that described microcapsule use for transformation temperature be the mixture of the phase change material of 32 DEG C and the phase change material of 90 DEG C.
2. heat-sink material according to claim 1, is characterized in that, described solid support material is thermally conductive material.
3. heat-sink material according to claim 1 and 2, is characterized in that, the thickness of described microcapsule shell is 1-2 μm.
4. heat-sink material according to claim 2, is characterized in that, the maximum diameter of described microcapsule is between 1 μm to 500 μm.
5. heat-sink material according to claim 3, is characterized in that, the maximum diameter of described microcapsule is 20-50 μm.
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| CN201110403877.1A CN103146355B (en) | 2011-12-07 | 2011-12-07 | A kind of heat-sink material |
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| CN201110403877.1A CN103146355B (en) | 2011-12-07 | 2011-12-07 | A kind of heat-sink material |
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| CN103146355B true CN103146355B (en) | 2016-02-10 |
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| US9952317B2 (en) | 2016-05-27 | 2018-04-24 | Uber Technologies, Inc. | Vehicle sensor calibration system |
| US10281923B2 (en) | 2016-03-03 | 2019-05-07 | Uber Technologies, Inc. | Planar-beam, light detection and ranging system |
| US10338225B2 (en) | 2015-12-15 | 2019-07-02 | Uber Technologies, Inc. | Dynamic LIDAR sensor controller |
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| CN104227958A (en) * | 2013-06-17 | 2014-12-24 | 英业达科技有限公司 | Heat-insulation shell forming method |
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