CN103146251B - Preparation method of nano gold-tin-copper alloy conductive ink - Google Patents
Preparation method of nano gold-tin-copper alloy conductive ink Download PDFInfo
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- CN103146251B CN103146251B CN201310066249.8A CN201310066249A CN103146251B CN 103146251 B CN103146251 B CN 103146251B CN 201310066249 A CN201310066249 A CN 201310066249A CN 103146251 B CN103146251 B CN 103146251B
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Abstract
The invention discloses a preparation method of nano gold-tin-copper alloy conductive ink, which sequentially comprises the following steps: (1) weighing 10 parts by weight of nano gold-tin-copper alloy powder of which the particle size distribution range is 20-100nm, 5 parts by weight of assistant and 85 parts by weight of solvent; (2) preparing the solvent: adding water, alcohol, ether and ester into a stirrer, and stirring to prepare the solvent; (3) preparing the assistant: adding surfactant and dispersant into a stirrer, and stirring to prepare the assistant; and (4) dispersing the nano gold-tin-copper alloy powder in the solvent, adding the assistant, and grinding and dispersing in ultrasonic oscillation equipment for 20 minutes to prepare the conductive ink.
Description
Technical field:
The invention belongs to printed-board technology field, particularly relate to a kind of preparation method of Nano gold-tin-copper alloy conductive ink.
Background technology:
In the printed circuit boards, the material forming circuit can adopt electrically conductive ink to be formed by typography.Common way is imprinted on tellite by electrically conductive ink, then makes ink at room temperature solidify, or oven for curing.
The electrically conductive ink forming printed circuit board circuitry in prior art is generally divided into gold system electrically conductive ink, silver system electrically conductive ink and copper system electrically conductive ink.Copper system conductive phase is the low price of electrically conductive ink than silver, but is easily oxidized, so the conductivity instability causing copper system to be conducted electricity due to copper.Although silver system electrically conductive ink conductivity is better, but the conducting wire that silver system electrically conductive ink is formed after drying is all softer, and the circuit that silver ink is formed is in the Working environment of D.C. high-current, owing to easily producing silver migration, therefore the electric property of circuit can not meet the Working environment demand of D.C. high-current completely, and the work function of silver is high, high work function, result in lower performance and poor efficiency.Compare with copper system ink with silver ink, the antioxidant property of gold system electrically conductive ink is best, moderate strength.
But because the cost of gold system ink is higher, if the electrically conductive particles of ink all adopts gold to make, its cost disadvantage can not be ignored.Therefore, be necessary that research one can be adapted at steady operation under D.C. high-current, the electrically conductive ink that can reduce costs as far as possible again, by the conducting wire adopting this electrically conductive ink to make printed circuit board (PCB), and be combined with circuit welding resistance technique, thus promote the performance and used life of printed circuit board (PCB).
Patent publication No. is: the Chinese invention patent of CN1783355A discloses a kind of copper-silver alloy conductor size and preparation method thereof, the component concentration of slurry is respectively in that patent: Kufil nanoparticle 35 ~ 50Wt%, Terpineol 350 30 ~ 45Wt%, glass powder 5 ~ 25Wt%, ethyl cellulose 1 ~ 5Wt%, dehydrated alcohol 2 ~ 5Wt%.The median size of described Kufil nanoparticle is 80 ~ 100 nanometers, and in particle, silver content is 5 ~ 20Wt%.But the sintering temperature of this nanometer copper-silver alloy conductive slurry still maintains 210 DEG C ~ 220 DEG C, still higher to some extent, this higher sintering temperature easily causes circuit card short circuit or inefficacy.
Summary of the invention:
For this reason; the invention provides a kind of method preparing electrically conductive ink; this electrically conductive ink has nano gold-tin-copper alloy; adopt this electrically conductive ink to form printed circuit board circuitry; not only sintering temperature can be reduced; and nano gold-tin-copper alloy resistance of oxidation is also relatively high, therefore do not need shielding gas during sintering.
The preparation method of the electrically conductive ink that the present invention proposes comprises the steps:
(1) by weight, taking 10 parts of particle size distribution ranges is the nano gold-tin-copper alloy powder body of 20nm ~ 100nm, the auxiliary agent of 2 parts and 88 parts of solvents;
(2) prepare solvent, water, alcohols, ethers and ester class are added in agitator to stir and prepare described solvent;
(3) prepare auxiliary agent, tensio-active agent and dispersion agent are added in agitator to stir and prepare described auxiliary agent;
(4) after described nano gold-tin-copper alloy powder being distributed to described solvent, add described auxiliary agent, and grinding distribution obtained described electrically conductive ink after 30 minutes in sonic oscillation equipment;
Wherein, in described nano gold-tin-copper alloy particulate, the content of silver, tin and copper by mass percentage, is respectively: gold: 2% ~ 5%, tin: 5% ~ 15%, copper: 80% ~ 95%;
Wherein, comprise 18 parts of water, 50 parts of alcohols, 10 ethers and 10 parts of ester classes in described 88 parts of solvents, described 2 parts of auxiliary agents comprise 1 part of tensio-active agent, 0.5 part of dispersion agent and 0.5 part of reductive agent.
Wherein, the preparation of solvent is by obtaining described 18 parts of water, 50 parts of alcohols, 10 parts of ethers and 10 parts of ester classes uniform stirring in agitator.
Wherein, described alcohols comprises: one or more in the group be made up of ethanol, Virahol, butanols, ethylene glycol, phenylcarbinol.Ethers comprises: one or more in the group be made up of butyl glycol ether, butyl, diethylene glycol dimethyl ether, diethylene glycol ether.Ester class comprises: N-BUTYL ACETATE or vinyl acetic monomer.
Wherein, auxiliary agent comprises one or more in tensio-active agent, dispersion agent, reductive agent;
Wherein, tensio-active agent comprises: one or more in the group be made up of stearic acid, oleic acid, lauric acid, trolamine, sodium laurylsulfate, pectic acid sodium, hydroxymethyl starch etc.;
Wherein, dispersion agent comprises: one or more in the group be made up of alkyl sulfhydryl, alkyl acid, alkylamine, alkylphosphonic acid carboxylic acid; Reductive agent comprises: one or more in the group be made up of xitix, hydrazine hydrate, formic acid and formaldehyde;
Preferably, in described nano gold-tin-copper alloy particulate, the content of gold, tin and copper by mass percentage, is respectively: 3%, 7%, 90%.
Embodiment:
Below by embodiment, the preparation method to nano gold-tin-copper alloy ink of the present invention is described in detail.
Embodiment 1:
The preparation method of electrically conductive ink comprises the steps:
(1) by weight, taking 10 parts of particle size distribution ranges is the nano gold-tin-copper alloy powder body of 20nm ~ 100nm, the auxiliary agent of 2 parts and 88 parts of solvents; Wherein, in described nano gold-tin-copper alloy particulate, the content of silver, tin and copper by mass percentage, is respectively: gold: 2% ~ 5%, tin: 5% ~ 15%, copper: 80% ~ 95%
(2) prepare solvent, 18 parts of water, 50 parts of alcohols, 10 ethers and 10 parts of ester classes are added to stirring in agitator and prepared described solvent; The not special restriction of described alcohols, ethers and ester class, as long as position is liquid at normal temperatures.In the present invention, preferably, described alcohols comprises: one or more in the group be made up of ethanol, Virahol, butanols, ethylene glycol, phenylcarbinol.Ethers comprises: one or more in the group be made up of butyl glycol ether, butyl, diethylene glycol dimethyl ether, diethylene glycol ether.Ester class comprises: N-BUTYL ACETATE or vinyl acetic monomer.
(3) prepare auxiliary agent, one or more in tensio-active agent, dispersion agent, reductive agent are added in agitator to stir and prepare described auxiliary agent.Concrete, described 2 parts of auxiliary agents comprise 1 part of tensio-active agent, 0.5 part of dispersion agent and 0.5 part of reductive agent.
Wherein, tensio-active agent, dispersion agent, reductive agent have no particular limits, but in the present invention, preferably, tensio-active agent comprises: one or more in the group be made up of stearic acid, oleic acid, lauric acid, trolamine, sodium laurylsulfate, pectic acid sodium, hydroxymethyl starch etc.;
Dispersion agent comprises: one or more in the group be made up of alkyl sulfhydryl, alkyl acid, alkylamine, alkylphosphonic acid carboxylic acid;
Reductive agent comprises: one or more in the group be made up of xitix, hydrazine hydrate, formic acid and formaldehyde;
(4) after described nano gold-tin-copper alloy powder being distributed to described solvent, add described auxiliary agent, and grinding distribution obtained described electrically conductive ink after 30 minutes in sonic oscillation equipment.
Embodiment 2:
The preparation method of electrically conductive ink comprises the steps:
(1) by weight, taking 10 parts of particle size distribution ranges is the nano gold-tin-copper alloy powder body of 20nm ~ 100nm, the auxiliary agent of 2 parts and 88 parts of solvents; Wherein, in described nano gold-tin-copper alloy particulate, the content of silver, tin and copper by mass percentage, is respectively: 3%, 7%, 90%.
(2) prepare solvent, 18 parts of water, 50 parts of alcohols, 10 ethers and 10 parts of ester classes are added to stirring in agitator and prepared described solvent; The not special restriction of described alcohols, ethers and ester class, as long as position is liquid at normal temperatures.In the present invention, preferably, described alcohols comprises: one or more in the group be made up of ethanol, Virahol, butanols, ethylene glycol, phenylcarbinol.Ethers comprises: one or more in the group be made up of butyl glycol ether, butyl, diethylene glycol dimethyl ether, diethylene glycol ether.Ester class comprises: N-BUTYL ACETATE or vinyl acetic monomer.
(3) prepare auxiliary agent, one or more in tensio-active agent, dispersion agent, reductive agent are added in agitator to stir and prepare described auxiliary agent.Concrete, described 2 parts of auxiliary agents comprise 1 part of tensio-active agent, 0.5 part of dispersion agent and 0.5 part of reductive agent.
Wherein, tensio-active agent, dispersion agent, reductive agent have no particular limits, but in the present invention, preferably, tensio-active agent comprises: one or more in the group be made up of stearic acid, oleic acid, lauric acid, trolamine, sodium laurylsulfate, pectic acid sodium, hydroxymethyl starch etc.;
Dispersion agent comprises: one or more in the group be made up of alkyl sulfhydryl, alkyl acid, alkylamine, alkylphosphonic acid carboxylic acid;
Reductive agent comprises: one or more in the group be made up of xitix, hydrazine hydrate, formic acid and formaldehyde;
(4) after described nano gold-tin-copper alloy powder being distributed to described solvent, add described auxiliary agent, and grinding distribution obtained described electrically conductive ink after 30 minutes in sonic oscillation equipment.
Nano gold-tin-copper alloy conductive ink prepared by the present invention reduces the sintering temperature of electrically conductive ink, compares nanometer copper-silver alloy conductive ink simultaneously, improves the resistance of oxidation of electrically conductive ink when sintering.On the other hand, the price due to copper, tin is compared silver and is all wanted cheap many, adopts nano-Ag particles as conductive filler material, reduce raw materials cost so compare.
Above embodiment is to invention has been detailed introduction, but above-mentioned embodiment is not intended to limit scope of the present invention, and protection scope of the present invention is defined by the appended claims.
Claims (1)
1. a preparation method for Nano gold-tin-copper alloy conductive ink, comprises the steps: in order
(1) by weight, taking 10 parts of particle size distribution ranges is the nano gold-tin-copper alloy powder body of 20nm ~ 100nm, the auxiliary agent of 2 parts and 88 parts of solvents;
(2) prepare solvent, water, alcohols, ethers and ester class are added in agitator to stir and prepare described solvent;
(3) prepare auxiliary agent, tensio-active agent, dispersion agent and reductive agent are added in agitator to stir and prepare described auxiliary agent;
(4) after described nano gold-tin-copper alloy powder being distributed to described solvent, add described auxiliary agent, and grinding distribution obtained described electrically conductive ink after 30 minutes in sonic oscillation equipment;
Wherein, in described nano gold-tin-copper alloy particulate, the content of gold, tin and copper by mass percentage, is respectively: 3%, 7%, 90%;
Wherein, comprise 18 parts of water, 50 parts of alcohols, 10 ethers and 10 parts of ester classes in described 88 parts of solvents, described alcohols comprises: one or more in the group be made up of ethanol, Virahol, butanols, ethylene glycol, phenylcarbinol; Ethers comprises: one or more in the group be made up of butyl glycol ether, butyl, diethylene glycol dimethyl ether, diethylene glycol ether; Ester class comprises: N-BUTYL ACETATE or vinyl acetic monomer; Wherein, the preparation of 88 parts of solvents is by obtaining described 18 parts of water, 50 parts of alcohols, 10 parts of ethers and 10 parts of ester classes uniform stirring in agitator;
Described 2 parts of auxiliary agents comprise 1 part of tensio-active agent, 0.5 part of dispersion agent and 0.5 part of reductive agent;
Wherein, auxiliary agent comprises one or more in tensio-active agent, dispersion agent, reductive agent;
Wherein, tensio-active agent comprises: one or more in the group be made up of stearic acid, oleic acid, lauric acid, trolamine, sodium laurylsulfate, pectic acid sodium, hydroxymethyl starch;
Wherein, dispersion agent comprises: one or more in the group be made up of alkyl sulfhydryl, alkyl acid, alkylamine, alkylphosphonic acid carboxylic acid; Reductive agent comprises: one or more in the group be made up of xitix, hydrazine hydrate, formic acid and formaldehyde.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101010388A (en) * | 2005-03-04 | 2007-08-01 | 韩商英泰股份有限公司 | Conductive inks and manufacturing method thereof |
| CN101560349A (en) * | 2009-04-22 | 2009-10-21 | 北京印刷学院 | Jet conductive ink |
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| CA2359347A1 (en) * | 2001-10-18 | 2003-04-18 | Cesur Celik | Laminated ceramic capacitor internal electrode material |
| KR101007326B1 (en) * | 2008-08-11 | 2011-01-13 | 삼성전기주식회사 | Alloy Nano Particle of Sn-Cu-Ag, Preparation Method Thereof and Ink or Paste Using The Alloy Nano Particle |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101010388A (en) * | 2005-03-04 | 2007-08-01 | 韩商英泰股份有限公司 | Conductive inks and manufacturing method thereof |
| CN101560349A (en) * | 2009-04-22 | 2009-10-21 | 北京印刷学院 | Jet conductive ink |
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