CN103138117A - Screening cover - Google Patents
Screening cover Download PDFInfo
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- CN103138117A CN103138117A CN 201210483463 CN201210483463A CN103138117A CN 103138117 A CN103138117 A CN 103138117A CN 201210483463 CN201210483463 CN 201210483463 CN 201210483463 A CN201210483463 A CN 201210483463A CN 103138117 A CN103138117 A CN 103138117A
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- braze
- raw material
- moistening
- difficult
- moistening raw
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- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention provides a screening cover which can prevent solder paste from entering an inner part and can be used for firmly soldering relative to a substrate. The screening cover consists of two screening parts which are an upper cover and a lower cover, wherein the upper cover covers an embedded connection part which is used for embedded connection of a connector, the upper cover and the lower cover are connected at a side face part of the embedded connection part, the connection part becomes a soldering part when being fixed to the substrate, an inner side face of the lower cover of the screening parts faces the embedded connection part is a raw material which is hard to be moisturized by a soldering material, and an outer side face is a raw material which is easy to be moisturized by a soldering material.
Description
Technical field
The radome of the socket that the present invention relates to consist of solder on substrate and use.
Background technology
In the situation that as being electrically connected to the chimeric of socket by connector according to terminal of HDMI specification etc., socket one side need to be fixed on substrate etc.At this moment, as the method that is fixed in substrate, sometimes utilize solder.Although solder is formed at pattern on substrate with electrical connection and the purpose of the conducting terminal in socket is carried out, simultaneously by consisting of the part of the radome of socket with respect to the substrate solder, thereby socket is fixed on substrate, this technology just adopts in the past.
Shown in Figure 1 meaning as the upper cover 11 of the structural element of radome 10 and the stereogram of lower cover 12 and the substrate 13 that is connected.The example of this Fig. 1 represents the example of the radome 10 that is made of two members.11 is upper cover, form for half chimeric recess 14 of the upside of the chimeric fitting portion of connector to be formed by the sheet material bending, and, be formed with at two sides' lateral parts the side plate 15 that flatly stretches out.Be formed with insertion groove 18 on this side plate 15, and, the further bending downwards and be formed with the foot 16 that is inserted into substrate 13 at its front end of the end of side plate 15.In addition, the rear end side in upper cover 11 also is formed with the foot 17 that is inserted into substrate 13.12 is lower cover, form for half chimeric recess 19 of the downside of the chimeric fitting portion of connector to be formed by the sheet material bending, and, be formed with at two sides' lateral parts the side plate 20 that flatly stretches out.On this side plate 20, be formed with the insertion sheet 21 that part cutting is erected.In addition, the part in the face of the plane of disruption of fitting portion becomes reflex part 22.
When engaging above-mentioned upper cover 11 and lower cover 12, overlapping each side plate 15 and side plate 20 and engage.At this moment, also will process (punching press) flattening by flattening from the part that side plate 15 stretches out at above-mentioned insertion groove 18 insertion sheets 21 fixes it.In addition, although reflex part 22 with the record of the state that turned back, is actually and turns back under upper cover 11 and the involutory state of lower cover 12 and make to engage and become firm in Fig. 1.By this joint, form radome 10.In addition, although omit detailed content, the contact section that certainly is formed in the inside of radome 10 playing a role as socket etc.Completed radome 10 inserts respectively insertion groove 23,24 and carry out solder and fix by the foot 16,17 with radome 10.Be coated with in advance the solder paste 25 that the Reflow Soldering operation is used on substrate 13.Solder paste 25 not only is coated in the position that is electrically connected to of insertion groove 23,24 parts and contact section and substrate, and in order to improve the connection Strong degree to substrate 13, also is coated in the position that the lower surface of side plate 20 contacts with substrate 13.
As the invention relevant to this radome, for example patent documentation 1,2 has had motion.The connection device of the band cover that patent documentation 1 is put down in writing is standby: the housing of insulating properties; Be installed on the contact of this housing; And be installed on metal cover on above-mentioned housing in the mode of the outer surface that covers above-mentioned housing, this shell has solder in the substrate connecting portion of circuit substrate, it is characterized in that, be formed with good solderability layer on the outer surface of above-mentioned cover, be formed with the coating of black at the inner surface of above-mentioned cover, thus, be formed with the coating of black due to the inner surface at cover, therefore, solid colour when product integral body is coated black, suitable and the outward appearance that can Meet Customer Requirements of outward appearance.
The purpose of the connector of patent documentation 2 records is to keep the function of shielding of connector, cut down simultaneously the needed cost of this shielding, proposed following example, between the first mask frame and secondary shielding frame, make the plating of enforcement different, thereby realize the reduction of the plating processing charges of mask frame.
Patent documentation 1: TOHKEMY 2010-92786 communique
Patent documentation 2: TOHKEMY 2008-41419 communique
At this, due to side plate 20 involutory engage of the side plate 15 that makes upper cover 11 with lower cover 12, therefore as shown in Figure 3, the involutory surface that sometimes produces two parts is exposed to outside part.About the part of this involutory surface, also utilize easily and implemented plating by the moistening material of solder paste, therefore, produce the solder paste 25 that has melted and partly enter the problem of the inside of radome 10 from involutory surface.As shown in Figure 6, this is due to the side plate 15 of the upper cover 11 that forms at bending sheets and the involutory surface of the side plate 20 of lower cover 12, its gap is tapered, therefore except easily by the moistening material of braze, capillarity also interacts, and flows to inside from the solder paste 25 of fusing from the end (plane of disruption) of involutory surface.
Be trace if enter the solder paste 25 of radome 10 inside, can not produce the insertion of the connector 26 of the other side's side and hinder, if but to enter the solder paste 25 of radome 10 inside more, as shown in Figure 6, compare with the insertion width of connector 26, solder paste 25 overflows sometimes.If will insert connector 26 under this state, produce chimeric and be difficult to plug, the problem that perhaps can not insert by force.
In order to eliminate this problem, if reduce the amount that is coated in the solder paste 25 on substrate, reduced the constant intensity to substrate 13, the torsion action when producing due to connector 26 plug is damaged the other problem that fixedly is stripped from.In addition, although think and be difficult to be formed radome 10 by the moistening material of braze if utilize, can reduce the solder paste 25 that enters to fitting portion inside, but the variation of adhering to due to solder paste 25, therefore the problem that exists radome 10 also to reduce with respect to the constant intensity of substrate 13, also there is the problem of the damage that causes due to torsion action in this method.
Summary of the invention
The present invention puts in view of the above problems and makes, and purpose is to provide a kind of can prevent that solder paste from entering inner and can be with respect to the substrate radome of solder securely.
Radome of the present invention is made of the shield member that covers for the chimeric fitting portion of connector, the bonding part of this shield member is becoming the part of carrying out solder fixedly the time to substrate, it is characterized in that: the medial surface in the face of above-mentioned fitting portion of above-mentioned shield member is to be difficult to by the moistening raw material of braze, and lateral surface is easily by the moistening raw material of braze.
above-mentioned shield member is processed to make easily to be attached to by the moistening raw material metal of braze by plating and is difficult to by on the lateral surface of the sheet material of the moistening raw material metal of braze, medial surface is become be difficult to by the moistening raw material of braze, lateral surface becomes easily by the moistening raw material of braze, perhaps, process to make by plating and be difficult to be attached to easily by on the medial surface of the sheet material of the moistening raw material metal of braze by the moistening raw material metal of braze, medial surface is become be difficult to by the moistening raw material of braze, lateral surface becomes easily by the moistening raw material of braze, thereby, the involutory surface of bonding part realize easily by the moistening raw material of braze be difficult to by the relative state of the moistening raw material of braze.And the plane of disruption of shield member also is preferably and is difficult to by the moistening raw material of braze.
In addition, radome of the present invention is made of upper cover and these two shield members of lower cover of covering for the chimeric fitting portion of connector, above-mentioned upper cover with under cover on above-mentioned fitting portion lateral parts engage, this bonding part is becoming the part of carrying out solder fixedly the time to substrate, it is characterized in that: consisting of the upper cover of above-mentioned shield member and the medial surface in the face of above-mentioned fitting portion of the side in lower cover is to be difficult to by the moistening raw material of braze, and lateral surface is easily by the moistening raw material of braze.
the upper cover that consists of above-mentioned shield member and the side in lower cover, process to make easily to be attached to by the moistening raw material metal of braze by plating and be difficult to by on the lateral surface of the sheet material of the moistening raw material metal of braze, medial surface is become be difficult to by the moistening raw material of braze, lateral surface becomes easily by the moistening raw material of braze, perhaps, process to make by plating and be difficult to be attached to easily by on the medial surface of the sheet material of the moistening raw material metal of braze by the moistening raw material metal of braze, medial surface is become be difficult to by the moistening raw material of braze, lateral surface becomes easily by the moistening raw material of braze.And the upper cover that consists of above-mentioned shield member and the side in lower cover, the plane of disruption of sheet material also is preferably and is difficult to by the moistening raw material of braze.
And, consist of the upper cover and the opposing party in lower cover of above-mentioned shield member, preferably whole is easily by the moistening raw material of braze, and this opposing party is formed be used to the foot that is inserted into substrate.
Effect of the present invention is as follows.
According to radome of the present invention, by make shield member in the face of the medial surface of above-mentioned fitting portion be difficult to by the moistening raw material of braze and lateral surface for easily by the moistening raw material of braze, thereby the involutory surface of bonding part realize easily by the moistening raw material of braze be difficult to by the relative state of the moistening raw material of braze, prevent that thus the braze that has melted from entering radome inside.
In addition, the plane of disruption of shield member is also for to be difficult to by the moistening raw material of braze, and raising prevents that the braze that has melted from rising to the effect of radome inside thus.
in addition, according to radome of the present invention, because radome is made of upper cover and these two shield members of lower cover of covering for the chimeric fitting portion of connector, above-mentioned upper cover with under cover on above-mentioned fitting portion lateral parts engage, this bonding part is becoming the part of carrying out solder fixedly the time to substrate, consisting of the upper cover of above-mentioned shield member and the medial surface in the face of above-mentioned fitting portion of the side in lower cover is to be difficult to by the moistening raw material of braze, lateral surface is easily by the moistening raw material of braze, therefore, the involutory surface of upper cover and the bonding part of lower cover realize easily by the moistening raw material of braze be difficult to by the relative state of the moistening raw material of braze, thus, prevent that the braze that has melted from entering radome inside.
In addition, by making the plane of disruption also for to be difficult to by the moistening raw material of braze, prevent that the braze that has melted from rising to the effect of radome inside thereby improve.
and, consist of the upper cover of above-mentioned shield member and the opposing party in lower cover, whole is easily by the moistening raw material of braze, and this opposing party is formed be used to the foot that is inserted into substrate, therefore have be used to the shield member of the opposing party's side of the foot that is connected to substrate for easily by the moistening raw material of braze, can make thus the connection to substrate become firm, but, with the involutory surface of the bonding part of a side shield member realize easily by the moistening raw material of braze be difficult to by the relative state of the moistening raw material of braze, prevent that thus the braze that has melted from entering radome inside.
Description of drawings
Fig. 1 means with the structural element of radome 10 to be the stereogram of the substrate 13 that is connected of upper cover 11 and lower cover 12.
Fig. 2 is after a side's who carries out only being difficult to the nickel sheet material moistening by braze face is implemented zinc-plated processing, the front view of the lower cover 12 that forms by Bending Processing.
Fig. 3 means in radome 10 after assembling, the stereogram of the part that the involutory surface of upper cover 11 and lower cover 12 these two parts exposes to the outside.
Fig. 4 means the figure of the result when carrying out braze in existing product and product of the present invention rises test, and wherein, * expression is to chimeric influential, and zero expression is on chimeric not impact, and ◎ represents not enter.
Fig. 5 means the stereogram that carries out solder radome 10 afterwards with respect to substrate 13.
Fig. 6 means that the solder paste 25 that melted partly enters the front view of the state of radome 10 inside from involutory surface.
In figure:
10-radome, 11-upper cover, 12-lower cover, 13-substrate, 14-chimeric recess, 15-side plate, 16-foot, 17-foot, 18-insertion groove, 19-chimeric recess, 20-side plate, 21-insertion sheet, 22-reflex part, 23-insertion groove, 24-insertion groove, 25-solder paste, 26-connector.
Embodiment
radome of the present invention is made of upper cover and these two shield members of lower cover of covering for the chimeric fitting portion of connector, lateral parts at above-mentioned fitting portion engages above-mentioned upper cover and lower cover, this bonding part is becoming the part of carrying out solder fixedly the time to substrate, it is characterized in that, the lower cover of above-mentioned shield member is processed to make easily to be attached to by the moistening raw material metal of braze by plating and is difficult to by on the lateral surface of the sheet material of the moistening raw material metal of braze, thus, medial surface becomes and is difficult to by the moistening raw material of braze and lateral surface becomes easily by the moistening raw material of braze, and, the whole face of the upper cover of above-mentioned shield member becomes easily by the moistening raw material of braze, and the foot that is formed for inserting substrate.Below, at length describe.
Embodiment 1
Embodiments of the present invention are described with reference to the accompanying drawings.Shown in Figure 1 meaning with the structural element of radome 10 is the stereogram of the substrate 13 that is connected of upper cover 11 and lower cover 12.The example of this Fig. 1 represents the example of the radome 10 that is made of two members.11 is upper cover, formed by the sheet material bending forming for half chimeric recess 14 of the upside of the chimeric fitting portion of connector, and, be formed with at two sides' lateral parts the side plate 15 that flatly stretches out.Be formed with insertion groove 18 on this side plate 15, and, the further bending downwards and be formed with the foot 16 that is inserted into substrate 13 at its front end of the end of side plate 15.In addition, the rear end side in upper cover 11 also is formed with the foot 17 that is inserted into substrate 13.12 is lower cover, formed by the sheet material bending forming for half chimeric recess 19 of the downside of the chimeric fitting portion of connector, and, be formed with at two sides' lateral parts the side plate 20 that flatly stretches out.On this side plate 20, be formed with the insertion sheet 21 that part cutting is erected.In addition, the part in the face of the plane of disruption of fitting portion becomes reflex part 22.
Above-mentioned upper cover 11 is appeared from the teeth outwards by the moistening raw material of braze in order to make easily, for example, carries out the zinc-plated processing of whole implementation after forming at Bending Processing nickel sheet material.On the other hand, above-mentioned lower cover 12 is for medial surface in the face of above-mentioned fitting portion being become be difficult to by the moistening raw material of braze and lateral surface becomes easily by the moistening raw material of braze, for example after a side's who only is being difficult to the nickel sheet material moistening by braze face is implemented zinc-plated processing, be processed into the shape of lower cover 12 by Bending Processing.At this, what is called is difficult to by the moistening raw material of braze, such as exemplifying nickel, zinc, chromium, stainless steel etc.
Shown in Figure 2 is after a side's who only is being difficult to the nickel sheet material moistening by braze face is implemented zinc-plated processing, the front view of the lower cover 12 that forms by Bending Processing.As shown in Figure 2, the lower cover 12 after Bending Processing is difficult to be manifested easily by the moistening tin coating of braze at lateral surface by the moistening nickel raw material of braze manifesting in the face of the medial surface of fitting portion.In addition, carry out molding after only a side face being carried out zinc-plated processing in stage of sheet material, so the part of the plane of disruption manifests also and is difficult to by the moistening nickel sheet material of braze.
When engaging upper cover 11 as above and lower cover 12, overlapping each side plate 15 and side plate 20 and engage.At this moment, insert sheet 21 and will process (punching press) flattening by flattening from the part that side plate 15 stretches out and fix at above-mentioned insertion groove 18.In addition, in Fig. 1 and Fig. 2, although put down in writing the state that reflex part 22 has turned back, be actually and turn back under upper cover 11 and the involutory state of lower cover 12 and make to engage and become firm.By this joint, form radome 10.In addition, although omitted detailed description, certainly be formed with for the contact section that plays a role as socket in the inside of radome 10 etc.
With regard to the radome 10 that forms as mentioned above, lateral surface manifests on the surface easily by moistening zinc-plated of braze, only has the medial surface of lower cover 12 and the plane of disruption to become the state that is difficult to be emerging in by the moistening nickel raw material of braze the surface.By this structure, in the tapered involutory surface part in the gap of upper cover shown in Figure 3 11 and lower cover 12, easily be in relative state with being difficult to by the moistening nickel raw material of braze by moistening zinc-plated of braze, this point is feature of the present invention.
Completed radome 10 is inserted into respectively the insertion groove 23,24 and carry out solder and fix of substrate 13 by the foot 16,17 with radome 10.On substrate 13, be coated with in advance the solder paste 25 that the Reflow Soldering operation is used.Solder paste 25 not only is coated in the position that is electrically connected to of insertion groove 23,24 part and contact section and substrate, and in order to improve the bonding strength of substrate 13 and also be coated in the position that the lower surface of side plate 20 contacts with substrate 13.
If carry out the reflux heating operation under above state, be coated in advance solder paste 25 fusing on substrate 13, play the effect that is electrically connected to of circuit pattern and contact on substrate 13, and, play the effect of fixed mask cover 10.At this, due at the lower surface of the side plate 20 that contacts with substrate 13, be inserted into and implemented in the foot 16,17 of substrate 13 easily by moistening zinc-plated of braze, therefore, the solder paste 25 that melts by heating successfully fuses together, and then, the solder paste 25 that has melted also rises on the lateral surface of side plate 15 and reflex part 22 and adheres to, and what make substrate 13 and radome 10 fixedly becomes more firm.
At this, although prior art has produced the problem that enters the inside of radome 10 from the solder paste 25 of the involutory surface fusing of the side plate 20 of the side plate 15 of upper cover 11 and lower cover 12, but in the present invention, by partly make at this involutory surface easily by braze moistening zinc-plated be difficult to be in relative state by the moistening nickel raw material of braze, thereby eliminated this problem.
At first, because being in to appear, the plane of disruption of lower cover 12 is difficult to by the raw-material state of the moistening nickel of braze, insoluble being combined of solder paste 25 of therefore having melted in this part, so solder paste 25 is from the amount minimizing mobile with respect to involutory surface of lower cover 12 sides.
On the other hand, implemented easily by moistening zinc-plated of soft solder because the side plate 15 of upper cover 11 also comprises the plane of disruption, the solder paste 25 that therefore flows to involutory surface from the top of side plate 15 still exists as prior art.; due to involutory surface part easily by braze moistening zinc-plated be difficult to be in relative state by the moistening nickel raw material of braze; thereby the suction effect that capillarity causes dies down terrifically, can prevent that therefore the solder paste 25 that has melted from flowing into the inside of radome 10.
The figure of the result that means braze rising test shown in Figure 4.This Fig. 4 represent to be coated in substrate 13 solder paste 25 shelter the rise figure of relation of (entering) of thickness and braze to radome 10 inside.About implementing the thickness of sheltering of test, except for to the substrate installing component and general use shelter thickness namely 100 μ m, in order to make wittingly the too much state of braze amount, also use the thickness of sheltering of 500 μ m, 600 μ m, 800 μ m.As shown in Figure 4, all in whole is implemented zinc-plated existing product, be the moment of 100 μ ms the entering of braze to occur sheltering thickness in upper cover 11 and lower cover 12.And, be 600 μ m when above when sheltering thickness, the amount of the braze that enters too much exerts an influence to the chimeric of connector.
On the other hand, as the present invention, at involutory surface partly when easily by moistening zinc-plated when being difficult to be in relative state by the moistening nickel raw material of braze of braze, be made as 800 μ m even will shelter thickness, there is no entering of braze yet, can confirm that the effect of inventing is very large.
In the above-described embodiments, upper cover 11 is zinc-plated whole enforcement, and lower cover 12 is only implemented zinc-plated at a face, but the invention is not restricted to this.In the example of Fig. 1, owing to being inserted into the foot 16,17 of substrate 13 in upper cover 11 side settings, and at the contact of the upper face center setting of upper cover 11 and connector 26 side contacts and the ground connection of realizing connector 26, so upper cover 11 has been implemented zinc-plated at whole., be inserted into the foot 16,17 or in the situation that the contact that lower cover 12 sides are formed for being grounded of substrate 13 in setting, certainly also can consider to make whole of lower cover 12 for zinc-plated, and to make only face of upper cover 11 be zinc-plated this embodiment.
In the above-described embodiments, by being implemented easily by moistening zinc-plated of braze by the face that the moistening material of braze is a side of nickel sheet material being difficult to, thus involutory surface partly realize easily by braze moistening zinc-plated be difficult to by the relative state of the moistening nickel raw material of braze.; the present invention is not limited to this; for example also can be by easily being processed with being difficult to be implemented plating by the moistening raw material of braze by the moistening raw-material side's of braze face, thus involutory surface partly realize easily by the moistening raw material of braze be difficult to by the relative state of the moistening raw material of braze.At this moment, even the plane of disruption is easily by the moistening raw material of braze, also have effect of the present invention, if also can process with being difficult to be implemented plating by the moistening raw material of braze for the plane of disruption, effect is higher.
In the above-described embodiments, consisting of radome 10 by upper cover 11 and lower cover 12 these two parts, and adopt and form the space that falls into radome 10 and be that example is illustrated in the situation of the fixing means of the fixing middle part Setup Type of periphery on substrate 13., the invention is not restricted to this, if be in the situation at solder junction surface, even load the Setup Type of radome integral body on substrate 13, also can be suitable for.In addition, be not only situation about forming with two parts, and, even the radome that is made of parts if there is the situation of gap and this part of solder and so at this junction surface, also can be expected effect of the present invention.
Claims (9)
1. radome is made of the shield member that covers for the chimeric fitting portion of connector, and the bonding part of this shield member is becoming the part of carrying out solder to substrate fixedly the time, it is characterized in that:
The medial surface in the face of above-mentioned fitting portion of above-mentioned shield member is to be difficult to by the moistening raw material of braze, and lateral surface is easily by the moistening raw material of braze.
2. radome according to claim 1 is characterized in that:
Above-mentioned shield member is processed to make easily to be attached to by the moistening raw material metal of braze by plating and is difficult to by on the lateral surface of the sheet material of the moistening raw material metal of braze, medial surface is become be difficult to by the moistening raw material of braze, lateral surface becomes easily by the moistening raw material of braze.
3. radome according to claim 1 is characterized in that:
Above-mentioned shield member is processed to make by plating and is difficult to be attached to easily by on the medial surface of the sheet material of the moistening raw material metal of braze by the moistening raw material metal of braze, medial surface is become be difficult to by the moistening raw material of braze, lateral surface becomes easily by the moistening raw material of braze.
4. according to claim 2 or 3 described radomes is characterized in that:
Above-mentioned shield member so that the plane of disruption of sheet material also become and be difficult to be carried out above-mentioned plating by the moistening raw-material mode of braze and process.
5. radome, consisted of by upper cover and these two shield members of lower cover of covering for the chimeric fitting portion of connector, above-mentioned upper cover with above-mentioned under cover on above-mentioned fitting portion lateral parts engage, this bonding part is becoming the part of carrying out solder to substrate fixedly the time, it is characterized in that:
Consisting of the upper cover of above-mentioned shield member and the medial surface in the face of above-mentioned fitting portion of the side in lower cover is to be difficult to by the moistening raw material of braze, and lateral surface is easily by the moistening raw material of braze.
6. radome according to claim 5 is characterized in that:
The upper cover that consists of above-mentioned shield member and the side in lower cover, process to make easily to be attached to by the moistening raw material metal of braze by plating and be difficult to by on the lateral surface of the sheet material of the moistening raw material metal of braze, medial surface is become be difficult to by the moistening raw material of braze, lateral surface becomes easily by the moistening raw material of braze.
7. radome according to claim 5 is characterized in that:
The upper cover that consists of above-mentioned shield member and the side in lower cover, process to make by plating and be difficult to be attached to easily by on the medial surface of the sheet material of the moistening raw material metal of braze by the moistening raw material metal of braze, medial surface is become be difficult to by the moistening raw material of braze, lateral surface becomes easily by the moistening raw material of braze.
8. according to claim 6 or 7 described radomes is characterized in that:
The upper cover that consists of above-mentioned shield member and the side in lower cover, so that also becoming, the plane of disruption of sheet material is difficult to be carried out above-mentioned plating processing by the moistening raw-material mode of braze.
9. the described radome of any one according to claim 5 to 8 is characterized in that:
Consisting of the upper cover of above-mentioned shield member and whole of the opposing party in lower cover is easily by the moistening raw material of braze, and this opposing party is formed be used to the foot that is inserted into substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011256773A JP2013115058A (en) | 2011-11-24 | 2011-11-24 | Shield case |
| JP2011-256773 | 2011-11-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103138117A true CN103138117A (en) | 2013-06-05 |
Family
ID=48497601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201210483463 Pending CN103138117A (en) | 2011-11-24 | 2012-11-23 | Screening cover |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2013115058A (en) |
| CN (1) | CN103138117A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102916290A (en) * | 2012-10-22 | 2013-02-06 | 昆山嘉华电子有限公司 | Electric connector |
| CN109818211A (en) * | 2019-04-09 | 2019-05-28 | 四川华丰企业集团有限公司 | Barricade, conducting end bluff piece, modular structure and electric connector |
| WO2022104950A1 (en) * | 2020-11-17 | 2022-05-27 | 深圳市得润电子股份有限公司 | Electrical connector and electronic product |
-
2011
- 2011-11-24 JP JP2011256773A patent/JP2013115058A/en active Pending
-
2012
- 2012-11-23 CN CN 201210483463 patent/CN103138117A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102916290A (en) * | 2012-10-22 | 2013-02-06 | 昆山嘉华电子有限公司 | Electric connector |
| CN109818211A (en) * | 2019-04-09 | 2019-05-28 | 四川华丰企业集团有限公司 | Barricade, conducting end bluff piece, modular structure and electric connector |
| CN109818211B (en) * | 2019-04-09 | 2024-04-19 | 四川华丰科技股份有限公司 | Shielding plate, conducting end protecting sheet, module structure and electric connector |
| WO2022104950A1 (en) * | 2020-11-17 | 2022-05-27 | 深圳市得润电子股份有限公司 | Electrical connector and electronic product |
| US11769957B2 (en) | 2020-11-17 | 2023-09-26 | Shenzhen Deren Electronic Co., Ltd. | Electrical connector with metal latch and grounding terminal brazing soldered to the shield and and product using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013115058A (en) | 2013-06-10 |
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Application publication date: 20130605 |