CN103135363A - Device for producing projection photo-etching illumination mode - Google Patents

Device for producing projection photo-etching illumination mode Download PDF

Info

Publication number
CN103135363A
CN103135363A CN2013100376566A CN201310037656A CN103135363A CN 103135363 A CN103135363 A CN 103135363A CN 2013100376566 A CN2013100376566 A CN 2013100376566A CN 201310037656 A CN201310037656 A CN 201310037656A CN 103135363 A CN103135363 A CN 103135363A
Authority
CN
China
Prior art keywords
phase delay
micro mirror
theta
array
illumination mode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN2013100376566A
Other languages
Chinese (zh)
Other versions
CN103135363B (en
Inventor
张运波
曾爱军
陈明星
陈立群
王莹
黄惠杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Guowang Optical Technology Co., Ltd.
Original Assignee
Shanghai Institute of Optics and Fine Mechanics of CAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Institute of Optics and Fine Mechanics of CAS filed Critical Shanghai Institute of Optics and Fine Mechanics of CAS
Priority to CN201310037656.6A priority Critical patent/CN103135363B/en
Publication of CN103135363A publication Critical patent/CN103135363A/en
Application granted granted Critical
Publication of CN103135363B publication Critical patent/CN103135363B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

A device for producing a projection photo-etching illumination mode comprises a laser source. A beam expander, a polarizer, a first quarter wave plate, a phase delayer array, a second quarter wave plate, a micro-lens array and a Fourier lens are sequentially arranged along the output direction of the laser source. The phase delaying of a phase delaying unit of the phase delayer array is controlled by a phase delaying controller, and the micro-lens rotation of the micro-lens array is controlled by a micro-lens rotation controller. The device can obtain illumination required by a photo-etching machine in an intensity mode and a polarization mode, and has the advantages of being simple in structure and convenient to operate.

Description

Produce the device of projection lithography light illumination mode
Technical field
The present invention relates to field of lithography, particularly a kind of device of the generation projection lithography light illumination mode for the high-NA projection lithography system.
Background technology
The projection lithography technology is for the manufacture of large scale integrated circuit, MEMS (micro electro mechanical system) etc.High-NA projection mask aligner adopts high repetition deep ultraviolet lasers to shine mask plate as light source by illuminator, and the fine pattern in mask plate is projected on the photoresist that object lens are imaged onto silicon chip surface.Illuminator mainly realizes shaping, illumination homogenising, change coherence factor, Polarization Control and the visual field control etc. to laser beam.
First at technology 1 " Enabling the45nm node by hyper-NA polarized lithography " (Proc.of SPIE Vol.6154,2006) provided a kind of high-NA projection lithography illuminator, its basic functional principle is: the light beam that light source sends collimates through beam expander and is incident to diffraction optical device (DOE) surface after expanding.Light beam is divided into many beamlets under the effect of diffraction optical device, each beamlet is modulated into the angle different from optical axis according to the requirement of light illumination mode.All beamlets form required light intensity distributions and polarisation distribution, so-called intensity mode and polarization mode on the diffractive optical devices surface after through varifocal mirror groups, catoptron, conical mirror group and Polarization Control device.Diffractive optical devices surface strength pattern generally includes tradition, annular, two utmost points-X, two utmost points-Y, quadrupole illuminating etc. (respectively as shown in Figure 1A, 1B or 1C, 1D, 1E, 1F).Intensity mode forms by DOE, the corresponding DOE of each intensity mode, and all the realization of intensity mode needs tens DOE.Polarization mode comprises (respectively as shown in arrows in Figure 1B, 1C, 1D, 1E, 1F) such as radial polarisation, tangential polarization, X polarization, Y polarization, X-Y polarizations.This system adopts the polarization optics device of polarizer or different 1/2nd wave plate combined of several quick shaft directions that linearly polarized light is rotated and obtains the target polarisation distribution, realizes that whole polarization modes needs a plurality of polarization optics devices.All DOE and polarization optics device are arranged on two different rotating disks, as shown in Figure 2 and Figure 3.Corresponding DOE and polarization optics device are screwed in light path, realize required intensity mode and polarization mode.The manufacture craft of DOE and polarization optics device is very complicated, and simultaneously due to the restriction of technique, the polarization optics device can only be realized the tangential polarization pattern that is similar to; For intensity mode and the polarization mode of customization, need cost tailor-made DOE extra time and polarization optics device, waste time and energy.
First (US71714983B2) disclose a kind of illuminator for photoetching in technology 2 " Illumination system for a microlithography projection exposure installation ", thereby the angular spectrum that this illuminator utilizes a modulation device to change light beam distributes and forms required intensity mode.Modulation device used comprises many micro units that two-dimensional array distributes, not only can be divided into a plurality of beamlets to light beam, and each micro unit can both beamlet corresponding to separate modulation, make the different angle of its deflection, the deflection angle of beamlet is all controlled, thereby forms the desirable strength pattern at pupil plane.Adopt a modulation device to replace a plurality of diffraction optical devices in this illuminator, saved to a certain extent cost, reduced system complexity.But this system needs varifocal mirror group, conical mirror group etc., when wherein the removable optical device in the varifocal mirror group moves and the concentric alignment problem of other optical device be difficult to solve.
Summary of the invention
The present invention is intended to solve the problem that above-mentioned present technology exists, a kind of device that produces the projection lithography light illumination mode is provided, and this device can as required, make litho machine obtain the intensity mode of needs and the illumination of polarization mode, and it is simpler to have structure, controls characteristics easily.
Technical solution of the present invention is as follows:
A kind of device that produces the projection lithography light illumination mode, its characteristics are: the formation of this device comprises lasing light emitter, beam expander, the polarizer, the first quarter-wave plate, phase delay device array, the second quarter-wave plate, micro mirror array, fourier lense successively along this lasing light emitter Laser output direction, the phase delay of the phase delay cell of described phase delay device array is controlled by the phase delay controller, and the micromirror rotation of described micro mirror array is controlled by the micromirror rotation controller;
The fast axle of described the first quarter-wave plate and the angle theta between X-axis 1, the fast axle of described phase delay device array and the angle theta between X-axis 2And the fast axle of the second quarter-wave plate and the angle theta between X-axis 3Satisfy following relation:
θ 2 - θ 1 = k 1 π ± π / 4 θ 3 - θ 1 = k 2 π / 2 θ 1 + θ 3 = 2 θ 2 + k 3 π , k 1, k 2, k 3Be integer;
Described micro mirror array is positioned at the front focal plane of described fourier lense, the focal length of described fourier lense is the maximum two-dimentional corner (α of the micro mirror of f, described micro mirror array, β) with the front focal plane of described fourier lense on the size (L, W) of light illumination mode satisfy following relation: α ≤ L / f β ≤ W / f .
Described lasing light emitter is that wavelength is that the KrF laser instrument of 248nm, ArF excimer laser or the wavelength that wavelength is 193nm are the F of 157nm 2Laser instrument.
Described beam expander is made of lens or cylindrical mirror, is used for rectangle or square beam of light size are amplified.
The light transmission shaft direction of the described polarizer is pointed to and is expected the polarization direction.
Described phase delay device array comprises many small phase delay cells, and the ordinary optical axis of each phase delay cell and the direction of extraordinary axes are constant, and each phase delay cell carries out phase delay to E light independently.
Described phase delay controller is controlled the phase-delay quantity of each phase delay cell, and this retardation may be greater than or equal to 2 π.
Described micro mirror array is comprised of many small micro mirror unit, and each micro mirror unit has two orthogonal turning axles, and the reflecting surface of each micro mirror unit is coated with the polarization state maintenance film irrelevant with the beam incident angle degree.
Described micromirror rotation controller is controlled the Two Dimensional Rotating angle of each micro mirror unit on described micro mirror array, and this anglec of rotation is continuous, and rotation angle range is-10 ° ~+10 °.
Advantage of the present invention:
1, adopt micro mirror array to replace original a plurality of diffraction optical devices, varifocal mirror group and conical mirror group that light beam is modulated, realize any intensity mode; Adopt two quarter-wave plates and phase delay device array to replace original a plurality of polarization optics devices to realize the random polarization pattern.So native system is compared with original system, cost and complexity greatly reduce.
2, due to delayer array and micro mirror array employing programmed control, native system only need be changed programmed algorithm just can realize the switching of intensity mode and polarization mode, has replaced original rotating disk, convenient and swift.What is more important only needs again the coding algorithm just can realize any intensity mode and polarization mode, has saved the time that is used for design, makes diffraction optical device and polarization optics device, has accelerated research and development of products speed.
3, the present invention has saved varifocal mirror group and conical mirror group, make number of optical devices greatly reduce, and the energy loss when having reduced luminous energy and seeing through above-mentioned device surface and the absorption of optical material make the efficiency of light energy utilization be improved.
4, the present invention not only can make litho machine obtain intensity mode and the polarization mode that needs, and it is simpler to have structure, controls characteristics easily.
Description of drawings
Figure 1A-1F is respectively intensity and the polarization mode schematic diagram of tradition, annular-tangential polarization, annular-radial polarisation, two utmost points-X polarization, two utmost points-Y polarization, four utmost points.
Fig. 2 is existing diffraction optical device and rotating disk schematic diagram thereof.
Fig. 3 is existing polarization optics device and rotating disk schematic diagram.
Fig. 4 is the embodiment that the present invention produces projection lithography light illumination mode device.
Fig. 5 is an embodiment of the phase delay device array that adopts of the present invention.
Fig. 6 is the structural drawing of the micro mirror array that adopts of the present invention.
Fig. 7 is the first micro mirror unit two dimension corner and target light intensity corresponded manner.
Fig. 8 is the second micro mirror unit two dimension corner and target light intensity corresponded manner.
Fig. 9 is the third micro mirror unit two dimension corner and target light intensity corresponded manner.
Figure 10 is the 4th kind of micro mirror unit two dimension corner and target light intensity corresponded manner.
Embodiment
The invention will be further described below in conjunction with drawings and Examples, but should not limit protection scope of the present invention with this.
First see also Fig. 4, Fig. 4 is the index path that the present invention produces the embodiment of projection lithography light illumination mode device.As seen from Figure 4, the present invention produces the device of projection lithography light illumination mode, comprise lasing light emitter 1, Laser output direction along this lasing light emitter 1 is beam expander 2, the polarizer 3, the first quarter-wave plate 4, phase delay device array 5, the second quarter-wave plate 6, micro mirror array 7, fourier lense 8 successively, the phase-delay quantity of the phase delay cell of described phase delay device array 5 is controlled by phase delay controller 10, and the micromirror rotation of described micro mirror array 7 is controlled by micromirror rotation controller 11;
The fast axle of described the first quarter-wave plate 4 and the angle theta between X-axis 1, the fast axle of described phase delay device array 5 and the angle theta between X-axis 2And the fast axle of the second quarter-wave plate 6 and the angle theta between X-axis 3Satisfy following relation:
θ 2 - θ 1 = k 1 π ± π / 4 θ 3 - θ 1 = k 2 π / 2 θ 1 + θ 3 = 2 θ 2 + k 3 π , k 1, k 2, k 3Be integer; (1)
Described micro mirror array 7 is positioned at the front focal plane of described fourier lense 8, the focal length of described fourier lense 8 is the maximum two-dimentional corner (α of the micro mirror of f, described micro mirror array 7, β) with the back focal plane of described fourier lense 8 on the size (L, W) of light illumination mode satisfy following relation:
α ≤ L / f β ≤ W / f - - - ( 2 )
Described lasing light emitter 1 is that the KrF laser instrument of 248nm, ArF excimer laser or the wavelength that wavelength is 193nm are the F of 157nm for wavelength 2Laser instrument.
Described beam expander is made of lens or cylindrical mirror, is used for rectangle or square beam of light size are amplified.
Described polarizer light transmission shaft direction is pointed to and is expected the polarization direction.
Described phase delay device array comprises many small phase delay cells, and the ordinary optical axis of each phase delay cell and the direction of extraordinary axes are constant, and each phase delay cell carries out phase delay to E light independently.
Described phase delay controller 10 is controlled the phase-delay quantity of each phase delay cell, and this retardation may be greater than or equal to 2 π.
Described micro mirror array 7 is comprised of many small micro mirror unit, and each micro mirror unit has two orthogonal turning axles, and the reflecting surface of each micro mirror unit is coated with the polarization state maintenance film unglazed with the beam incident angle degree.
Described micromirror rotation controller 11 is controlled the Two Dimensional Rotating angle of each micro mirror unit on described micro mirror array 7, and this anglec of rotation is continuous, and rotation angle range is-10 ° ~+10 °.
Described lasing light emitter 1 gives off frequency stabilization and has the deep ultraviolet laser bundle of narrower spectrum width.Generally, this beam sizes is less, needs beam expander 2 to expand, and is rectangle if lasing light emitter 1 produces beam cross section, and beam expander 2 may comprise cylindrical mirror.Become linearly polarized light after the light beam of beam expander 2 is by the polarizer 3, this linearly polarized light is incident to phase delay device array 5 after by the first quarter-wave plate 4, and light beam carries out phase delay back reflection to the second quarter-wave plate 6 through phase delay device array 5.Phase delay device array 5 is comprised of many independent small phase delay cells, light beam is divided into a plurality of beamlets during by phase delay device array 5, phase delay controller 10 is controlled the phase-delay quantity of each phase delay cell, can change each beamlet by the polarization direction after the second quarter-wave plate 6.A plurality of beamlets with certain polarisation distribution are incident to described micro mirror array 7 surfaces, and micromirror rotation controller 11 is controlled the anglec of rotation of each micro mirror unit, changes the direction of propagation of each polariton beam.Each polariton beam forms certain light intensity pattern and polarization mode by after fourier lense 8 on fourier lense back focal plane 9.So the light intensity pattern on Fourier's back focal plane 9 and polarization mode are controlled by described phase delay controller 10 and micromirror rotation controller 11.
Fig. 5 is an embodiment of the phase delay device array that adopts of the present invention.This embodiment comprises many microfacies positions delay cell.Each microfacies position delay cell (for example phase delay cell 51) is comprised of opticator 51-1 and mechanical part 51-2,51-3.Opticator 51-1 is made by isotropy optical material (for example melting quartz), and one side is coated with reflectance coating, perhaps places reflective optical device near this face.Mechanical part 51-2,51-3 are made by piezoelectric device, and the deformation that piezoelectric device produces is accurately controlled by piezoelectric effect by phase delay controller 10.As mechanical part 51-2, when 51-3 is undeformed, the light beam polarization state by opticator 51-1 remains unchanged; When there is deformation in mechanical part, can produce certain effect of stress in opticator 51-1 side, the refractive index of material changes in this direction, and this direction is the E optical axis direction.When light beam passed through opticator 51-1, the refractive index of E optical axis direction caused the E light phase different from the O light phase from different in the refractive index of non-stress direction (O optical axis direction), affects the polarization state of light beam.
The fast axle of the first quarter-wave plate 4 and the angle theta between X-axis 1, the fast axle of phase delay device array 5 and the angle theta between X-axis 2, the fast axle of the second quarter-wave plate 6 and the angle theta between X-axis 3When satisfying relation (1), the Jones matrix of these three devices can be expressed as:
Wherein: δ is the phase-delay quantity of phase delay cell.
By phase delay cell and through the polarization direction of the beamlet of the second quarter-wave plate 6 and the angle theta of X-axis be:
Symbol is by θ 1, θ 2, θ 3Relations Among determines.(3)
Figure 6 shows that the micro mirror array structural drawing that the present invention adopts.Each micro mirror unit mainly is comprised of work micro mirror 71-1, rotary components 71-2, fixed support 71-3, work micro mirror rotating shaft 71-4 and rotary components rotating shaft 71-5.Work micro mirror 71-1 is arranged on by work micro mirror rotating shaft 71-4 on a pair of groove of rotary components 71-2 (having omitted groove in figure), and work micro mirror 71-1 can rotate around work micro mirror rotating shaft 71-4.Similarly, rotary components 71-2 also can rotate around rotary components rotating shaft 71-5.
Suppose that micro mirror array comprises M*N micro mirror, the angle of incident beam and optical axis 12 is γ, and micro-mirror array surfaces normal and optical axis 12 angles are γ/2, when the two-dimentional corner of micro mirror unit is (0,0) time, incident beam is parallel with optical axis 12 after the micro mirror array reflection.On micro mirror array 7, each micro mirror two dimension corner is determined by following steps:
1) the target strength pattern is divided into the L*S sub regions, wherein,
Figure BDA00002797189500063
A is natural number, and every sub regions is square or rectangle;
2) with each regional center coordinate (X m,n, Y m,n) divided by the focal distance f of fourier lense, obtain M*N two dimension angular coordinate and be: ( α m , n = arctan X m , n f , β m , n = arctan Y m , n f ) ,
Wherein m, n are integer, 1≤m≤M, 1≤n≤N;
3) according to step 2) M*N two dimension angular coordinate (α obtaining M, n, β M, n), calculate each micro mirror two-dimensional rotary angle (α ' M, n'β ' M, n)=(α M, n/ 2, β M, n/ 2);
The M*N that 4) step 3) is obtained two dimension angular coordinate (α ' M, n, β ' M, nBe input on the memory device of micromirror rotation controller 11, micromirror rotation controller 11 makes M*N micromirror rotation to above-mentioned M*N two dimension angular coordinate figure by the mode of controlling electrostatic force, just can obtain the target light strong mode on the back focal plane of fourier lense.
The below is with A=1, M=1, N=8, α ' M, n=0 (incident ray is on the YOZ plane) is the corresponded manner between each micro mirror unit of micro mirror array in example explanation the present invention and target light intensity zone.
With 8 micro mirrors called after 71,72 successively ..., 77,78, and the target strength mode region is divided into 8 sub regions, respectively called after 91,92 ..., 97,98.The centre coordinate of supposing 8 zones is respectively (0, Y 0,1), (0, Y 0,2) ..., (0, Y 0,7), (0, Y 0,8), the two-dimentional angle of the reflection ray of 8 micro mirror unit and optical axis is ( 0 , arctan Y 0,1 f ) , ( 0 , arctan Y 0,2 f ) , . . . , ( 0 , arctan Y 0,7 f ) , ( 0 , arctan Y 0,8 f ) . Successively at once, as shown in Figure 7,8 micro mirror corners of micro mirror unit are followed successively by when 8 micro mirror unit and 8 zones: ( 0 , 1 2 arctan Y 0,1 f ) , ( 0 , 1 2 arctan Y 0,2 f ) , . . . , ( 0 , 1 2 arctan Y 0,7 f ) , ( 0 , 1 2 arctan Y 0,8 f ) .
When the corresponding relation in micro-reflector and 8 zones such as Fig. 8, the two-dimentional corner of micro mirror 71 ~ 78 is followed successively by: ( 0 , 1 2 arctan Y 0 , 4 f ) , ( 0 , 1 2 arctan Y 0 , 3 f ) , . . . , ( 0 , 1 2 arctan Y 0 , 2 f ) , ( 0 , 1 2 arctan Y 0 , 1 f ) , ( 0 , 1 2 arctan Y 0,8 f ) , ( 0 , 1 2 arctan Y 0,7 f ) , ( 0 , 1 2 arctan Y 0,6 f ) , ( 0 , 1 2 arctan Y 0,5 f ) .
When the corresponding relation in micro-reflector and 8 zones such as Fig. 9, the two-dimentional corner of micro mirror 71 ~ 78 is followed successively by: ( 0 , 1 2 arctan Y 0 , 5 f ) , ( 0 , 1 2 arctan Y 0 , 6 f ) , . . . , ( 0 , 1 2 arctan Y 0 , 7 f ) , ( 0 , 1 2 arctan Y 0,8 f ) , ( 0 , 1 2 arctan Y 0,1 f ) , ( 0 , 1 2 arctan Y 0,2 f ) , ( 0 , 1 2 arctan Y 0,3 f ) , ( 0 , 1 2 arctan Y 0,4 f ) .
When the corresponding relation in micro-reflector and 8 zones such as Figure 10, the two-dimentional corner of micro mirror 71 ~ 78 is followed successively by: ( 0 , 1 2 arctan Y 0 , 8 f ) , ( 0 , 1 2 arctan Y 0 , 7 f ) , . . . , ( 0 , 1 2 arctan Y 0 , 6 f ) , ( 0 , 1 2 arctan Y 0.5 f ) , ( 0 , 1 2 arctan Y 0 , 4 f ) , ( 0 , 1 2 arctan Y 0 , 3 f ) , ( 0 , 1 2 arctan Y 0 , 2 f ) , ( 0 , 1 2 arctan Y 0 , 1 f ) .
For different micro mirror two dimension corner allocation scheme, the coordinate that corresponds to the target strength pattern due to different micro mirrors is different, and the phase-delay quantity of each phase delay cell of phase delay device array is also different, can determine by through type (3).

Claims (8)

1. device that is used for the generation projection lithography light illumination mode of high-NA projection lithography system, it is characterized in that: the formation of this device comprises lasing light emitter (1), beam expander (2) successively along this lasing light emitter (1) Laser output direction, the polarizer (3), the first quarter-wave plate (4), phase delay device array (5), the second quarter-wave plate (6), micro mirror array (7), fourier lense (8), the phase delay of the phase delay device of described phase delay device array (5) is controlled by phase delay controller (10), the rotation of the micro mirror of described micro mirror array (7) is controlled by micromirror rotation controller (11),
The fast axle of described the first quarter-wave plate (4) and the angle theta between X-axis 1, the fast axle of described phase delay device array (5) and the angle theta between X-axis 2And the fast axle of the second quarter-wave plate (6) and the angle theta between X-axis 3Satisfy following relation:
θ 2 - θ 1 = k 1 π ± π / 4 θ 3 - θ 1 = k 2 π / 2 θ 1 + θ 3 = 2 θ 2 + k 3 π , k 1, k 2, k 3Be integer;
Described micro mirror array (7) is positioned at the front focal plane of described fourier lense (8), the focal length of described fourier lense (8) is the maximum two-dimentional corner (α of the micro mirror of f, described micro mirror array (7), β) with the back focal plane of described fourier lense (8) on the size (L, W) of light illumination mode satisfy following relation: α ≤ L / f β ≤ W / f .
2. the device of generation projection lithography light illumination mode according to claim 1, is characterized in that described lasing light emitter (1) is that the KrF laser instrument of 248nm, ArF excimer laser or the wavelength that wavelength is 193nm are the F of 157nm for wavelength 2Laser instrument.
3. the device of generation projection lithography light illumination mode according to claim 1, is characterized in that described beam expander is made of lens or cylindrical mirror, is used for rectangle or square beam of light size are amplified.
4. the device of generation projection lithography light illumination mode according to claim 1, is characterized in that the polarization direction is expected in the light transmission shaft direction sensing of the described polarizer.
5. the device of generation projection lithography light illumination mode according to claim 1, it is characterized in that described phase delay device array comprises many small phase delay cells, the ordinary optical axis of each phase delay cell and the direction of extraordinary axes are constant, and each phase delay cell carries out phase delay to extraordinary ray independently.
6. the device of generation projection lithography light illumination mode according to claim 1 is characterized in that described phase delay controller (10) controls the phase-delay quantity of each phase delay cell, and this retardation is greater than or equal to 2 π.
7. the device of generation projection lithography light illumination mode according to claim 1, it is characterized in that described micro mirror array (7) is comprised of many small micro mirror unit, each micro mirror unit has two orthogonal turning axles, and the reflecting surface of each micro mirror unit is coated with the polarization state maintenance film irrelevant with the beam incident angle degree.
8. the device of generation projection lithography light illumination mode according to claim 1, it is characterized in that described micromirror rotation controller (11) controls the Two Dimensional Rotating angle of upper each micro mirror unit of described micro mirror array (7), this anglec of rotation is continuous, and rotation angle range is-10 ° ~+10 °.
CN201310037656.6A 2013-01-30 2013-01-30 Device for producing projection photo-etching illumination mode Active CN103135363B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310037656.6A CN103135363B (en) 2013-01-30 2013-01-30 Device for producing projection photo-etching illumination mode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310037656.6A CN103135363B (en) 2013-01-30 2013-01-30 Device for producing projection photo-etching illumination mode

Publications (2)

Publication Number Publication Date
CN103135363A true CN103135363A (en) 2013-06-05
CN103135363B CN103135363B (en) 2015-02-18

Family

ID=48495394

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310037656.6A Active CN103135363B (en) 2013-01-30 2013-01-30 Device for producing projection photo-etching illumination mode

Country Status (1)

Country Link
CN (1) CN103135363B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103869632A (en) * 2014-04-02 2014-06-18 中国科学院光电技术研究所 Illumination mode generation device for high numerical aperture projection lithography system
CN106933049A (en) * 2015-12-30 2017-07-07 上海微电子装备有限公司 A kind of exposure system and exposure method for semiconductor lithography
CN112241070A (en) * 2019-07-16 2021-01-19 苏州大学 Large-breadth optical polarization pattern generation device and generation method

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050179881A1 (en) * 2004-02-12 2005-08-18 Michio Kohno Exposure apparatus and method
EP1591833A2 (en) * 2004-04-27 2005-11-02 Canon Kabushiki Kaisha Exposure method and apparatus
CN1281980C (en) * 2002-01-31 2006-10-25 株式会社日立制作所 1/4 wavelength board and projection picture display device using same
CN100409045C (en) * 2004-02-06 2008-08-06 株式会社尼康 Polarization conversion element, lighting optical device, exposure system, and exposure method
EP2020679A1 (en) * 2006-05-25 2009-02-04 Nikon Corporation Illuminating optical apparatus, exposure apparatus, and device manufacturing method
JP2010145917A (en) * 2008-12-22 2010-07-01 Samsung Electronics Co Ltd Image projection apparatus
CN102132215A (en) * 2008-07-31 2011-07-20 康宁股份有限公司 Optimization of focused spots for maskless lithography

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1281980C (en) * 2002-01-31 2006-10-25 株式会社日立制作所 1/4 wavelength board and projection picture display device using same
CN100409045C (en) * 2004-02-06 2008-08-06 株式会社尼康 Polarization conversion element, lighting optical device, exposure system, and exposure method
US20050179881A1 (en) * 2004-02-12 2005-08-18 Michio Kohno Exposure apparatus and method
EP1591833A2 (en) * 2004-04-27 2005-11-02 Canon Kabushiki Kaisha Exposure method and apparatus
EP2020679A1 (en) * 2006-05-25 2009-02-04 Nikon Corporation Illuminating optical apparatus, exposure apparatus, and device manufacturing method
CN102132215A (en) * 2008-07-31 2011-07-20 康宁股份有限公司 Optimization of focused spots for maskless lithography
JP2010145917A (en) * 2008-12-22 2010-07-01 Samsung Electronics Co Ltd Image projection apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103869632A (en) * 2014-04-02 2014-06-18 中国科学院光电技术研究所 Illumination mode generation device for high numerical aperture projection lithography system
CN106933049A (en) * 2015-12-30 2017-07-07 上海微电子装备有限公司 A kind of exposure system and exposure method for semiconductor lithography
CN112241070A (en) * 2019-07-16 2021-01-19 苏州大学 Large-breadth optical polarization pattern generation device and generation method
CN112241070B (en) * 2019-07-16 2022-07-29 苏州大学 Large-breadth optical polarization pattern generation device and generation method

Also Published As

Publication number Publication date
CN103135363B (en) 2015-02-18

Similar Documents

Publication Publication Date Title
US20220099861A1 (en) Linearly polarized light conversion element, manufacturing method and linearly polarized light conversion system
US7053988B2 (en) Optically polarizing retardation arrangement, and microlithography projection exposure machine
US7511886B2 (en) Optical beam transformation system and illumination system comprising an optical beam transformation system
TWI485527B (en) Illumination system of a microlithographic projection exposure apparatus
JP6132119B2 (en) Illumination optical system, exposure apparatus, illumination method, exposure method, and device manufacturing method
TWI567502B (en) Illumination system of a microlithographic projection exposure apparatus
CN101359215B (en) Computer generated hologram, exposure apparatus, and device fabrication method
JP2006148115A (en) Pulse modulator, lithography equipment, and device manufacture method
US20050134825A1 (en) Polarization-optimized illumination system
JP6168187B2 (en) Illumination optical system, exposure apparatus, exposure method, and device manufacturing method
US10983389B2 (en) Wire grid polarizer manufacturing method
CN101916047B (en) Photolithography exposure device for implementing off-axis illumination by using free-form surface lens
US20160109806A1 (en) Illumination device and method for using the same in the projection lithography machine
CN103135363B (en) Device for producing projection photo-etching illumination mode
US8724080B2 (en) Optical raster element, optical integrator and illumination system of a microlithographic projection exposure apparatus
JP6114952B2 (en) Method for transferring a pattern onto a photosensitive surface by lithography and illumination system of a microlithographic projection exposure apparatus
EP2839343B1 (en) Optical system of a microlithographic projection exposure apparatus
WO2018212943A1 (en) Wire grid polarizer manufacturing methods using frequency doubling interference lithography
JP2008520084A (en) Polarization delay mechanism and microlithography projection exposure machine
CN107885040B (en) Off-axis illumination system
Zhang et al. Model of freeform illumination mode and polarization mode for 193nm immersion lithographic machine

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20190925

Address after: Room 601-10, 6th floor, No. 2, Jingyuan Beijie, Beijing Economic and Technological Development Zone, Daxing District, Beijing, 100176

Patentee after: Beijing Guowang Optical Technology Co., Ltd.

Address before: 800-211 201800 post office box, Shanghai, Jiading District

Patentee before: Shanghai Optical Precision Machinery Inst., Chinese Academy of Sciences